CN110430674A - A kind of preparation method of electroplating deposition circuit board - Google Patents
A kind of preparation method of electroplating deposition circuit board Download PDFInfo
- Publication number
- CN110430674A CN110430674A CN201910617595.8A CN201910617595A CN110430674A CN 110430674 A CN110430674 A CN 110430674A CN 201910617595 A CN201910617595 A CN 201910617595A CN 110430674 A CN110430674 A CN 110430674A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- preparation
- insulated part
- electroplating deposition
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
Abstract
The present invention discloses a kind of preparation method of electroplating deposition circuit board, a kind of preparation method of electroplating deposition circuit board, the following steps are included: (1) obtains the insulated part structure for having cavity using 3D drawing software, the structure of the cavity is identical as circuit wiring structure；(2) the insulated part structure is printed using 3D printing technique；(3) insulated part, which is placed in electroplanting device, carries out electroplating deposition, and metal ion deposition is in cavity structure；Not only technical difficulty of operation is small for the preparation method of the circuit board, and equipment is simpler and cheap, while being also avoided that insulating layer and conductive layer in layer-by-layer printing because of the bending of the difference in material properties such as thermal expansion coefficient appearance, the defect for being not connected firmly or burning.
Description
Technical field
The present invention relates to wiring board technology fields, more particularly to a kind of preparation method of electroplating deposition circuit board.
Background technique
The title of circuit board has: ceramic circuit board, aluminium oxide ceramics circuit board, aluminium nitride ceramics circuit board, wiring board,
Pcb board, aluminum substrate, high frequency plate, thick copper sheet, impedance plate, PCB, ultra-thin wiring board, ultrathin circuit board print (copper lithographic technique)
Circuit board etc..Circuit board makes circuit miniaturization, intuitiveization, and the batch production and optimization electrical appliance for fixed circuit are laid out lifting
It acts on.Circuit board can be described as printed wiring board or printed circuit board, and English name is (Printed Circuit Board)
PCB, (Flexible Printed Circuit board) (FPC wiring board is also known as flexible circuitry board flexible circuit to FPC wiring board
Plate is that have height reliability, excellent pliable printed circuit using polyimides or polyester film as one kind made of substrate
Plate.Have the characteristics that Distribution density is high, light-weight, thickness is thin, bending is good.) and Rigid Flex (reechas, Soft and
Hard combination plate)-FPC and PCB birth and development, expedited the emergence of this new product of Rigid Flex.Therefore,
Rigid Flex is exactly that flexible circuit board and rigid wiring board are combined by related process requirement one by processes such as pressings
It rises, the wiring board with FPC characteristic and PCB characteristic of formation；3D printing is usually that digital technology file printing machine is used to come in fact
Existing.Often be used for modeling in fields such as mold manufacture, industrial designs, after be gradually available for the direct manufactures of some products,
Have using components made of the printing of this technology.The technology is in jewelry, footwear, industrial design, building, engineering and construction
(AEC), automobile, aerospace, dentistry and medical industries, education, GIS-Geographic Information System, civil engineering, gun and other necks
It is all applied in domain.
Existing circuit board can also use 3D printing technique in the process of production, at present in the 3D printing technique system of use
When standby circuit board, usually using the method printing conductive layer or insulating layer successively printed, but not only time-consuming for this method,
It is at high cost, equipment is expensive, while needing to print a variety of heterogeneity materials, so that the insulating layer and conductive layer of circuit board
The defects of bending of the difference in material properties such as thermal expansion coefficients appearance in layer-by-layer printing, being not connected firmly or burn.
Summary of the invention
A kind of system of electroplating deposition circuit board is provided it is an object of the invention to avoid shortcoming in the prior art
Preparation Method, not only technical difficulty of operation is small for the preparation method of the circuit board, and equipment is simpler and cheap, while can also keep away
Exempt from bending that insulating layer and conductive layer occur in layer-by-layer printing by difference in material properties such as thermal expansion coefficients, be not connected firmly or burn
Burnt defect.
The purpose of the present invention is achieved through the following technical solutions:
A kind of preparation method of electroplating deposition circuit board, comprising the following steps:
(1) the insulated part structure for having cavity, the structure and circuit wiring structure of the cavity are obtained using 3D drawing software
It is identical；
(2) the insulated part structure is printed using 3D printing technique；
(3) insulated part, which is placed in electroplanting device, carries out electroplating deposition, and metal ion deposition is in cavity structure.
Further, in step (1), the 3D drawing software is any one drawing software in SolidWorks, VG.
Further, it in step (2), after the insulated part structure passes through 3D printing technique printing shaping, needs successively
Insulated part is solidified, is surface-treated and covering treatment.
Further, the curing method is any method in photocuring, heat cure and cooling.
Further, the surface treatment method is any method in chemical polishing, sensitization and activation.
Further, the method for the covering is exposure mask or pasting protective film.
Further, in step (2), the 3D printing technique is any technology in SLA, DLP and FDM.
The utility model has the advantages that having the insulation of cavity by 3D printing technique printing in due to the preparation process of the circuit board
Part, and 3D printing resin is smaller than the technical difficulty for printing metal, so that equipment is simpler and cheap, is conducive to push away
It is wide to use, at the same avoid insulating layer and conductive layer in layer-by-layer printing because the difference in material properties such as thermal expansion coefficient occur it is curved
Bent, the defects of being not connected firmly or burning, and also can be completed manufacture using existing electroplating device, while metal ion sinks
Product than electrically conductive ink solidification more evenly, also faster.
Detailed description of the invention
Invention is described further using attached drawing, but the embodiments in the accompanying drawings do not constitute any limitation to the present invention,
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to the following drawings
Its attached drawing.
Fig. 1 is a kind of process flow chart of the preparation method of electroplating deposition circuit board of the invention.
Specific embodiment
As shown in Figure 1, a kind of preparation method of electroplating deposition circuit board, comprising the following steps:
(1) the insulated part structure for having cavity, the structure and circuit wiring structure of the cavity are obtained using 3D drawing software
It is identical；
(2) the insulated part structure is printed using 3D printing technique；
(3) insulated part, which is placed in electroplanting device, carries out electroplating deposition, and metal ion deposition is in cavity structure.
In a preferred embodiment, in step (1), the 3D drawing software is any one picture in SolidWorks, VG
Figure software.
In preferred embodiment, in step (2), after the insulated part structure passes through 3D printing technique printing shaping, need
Successively carrying out curing process, surface treatment and covering treatment, curing process to insulated part is so that insulated part structure obtains
Effective molding, surface treatment is the bond strength in order to improve insulating resin and electrically conductive ink, and covering treatment is not need
Conductive position pad pasting is covered, and electrically conductive ink is excessive in order to prevent leads to route deformation or short circuit, guarantees that route is complete.
In a preferred embodiment, the curing method is any method in photocuring, heat cure and cooling.
In a preferred embodiment, the surface treatment method is any method in chemical polishing, sensitization and activation.
In a preferred embodiment, the method for the covering is exposure mask or pasting protective film.
In a preferred embodiment, in step (2), the 3D printing technique is any technology in SLA, DLP and FDM,
The printing effect is best.
Embodiment 1
As shown in Figure 1, a kind of preparation method of electroplating deposition circuit board, comprising the following steps:
(1) the insulated part structure for having cavity, the structure and circuit of the cavity are obtained using SolidWorks drawing software
Wire structures are identical；Concrete technology is: the Software for producing data of the insulated part threedimensional model with cavity are obtained from software,
Its cavity structure requires identical as the wire structures of circuit diagram；
(2) the insulated part structure is printed using 3D printing technique；Concrete technology is: the software data in step (1) is defeated
Enter into SLA printing, while there is by SLA printing technique using photosensitive resin printing the insulated part of cavity, then in light
Photocuring is carried out in curing so that insulated part structure is effectively formed, then using activator to cavity surface into
Row is activated, in order to improve the bond strength of insulating resin and electrically conductive ink, next to not needing attachment electrically conductive ink
Protective film is sticked in position, covers to the position pad pasting for not needing be conductive, electrically conductive ink is excessive in order to prevent causes route to become
Shape or short circuit guarantee that route is complete, are finally immersed in Nano silver conductive ink；
(3) insulated part, which is placed in electroplanting device, carries out electroplating deposition, and metal ion deposition is in cavity structure；Concrete technology
It is: insulated part is placed in electroplanting device and carries out electroplating deposition, metal ion deposition finally tears guarantor in cavity structure
Cuticula.
Embodiment 2
As shown in Figure 1, a kind of preparation method of electroplating deposition circuit board, comprising the following steps:
(1) the insulated part structure for having cavity, the structure and circuit of the cavity are obtained using SolidWorks drawing software
Wire structures are identical；Concrete technology is: the Software for producing data of the insulated part threedimensional model with cavity are obtained from software,
Its cavity structure requires identical as the wire structures of circuit diagram；
(2) the insulated part structure is printed using 3D printing technique；Concrete technology is: the software data in step (1) is defeated
Enter to DLP printing in, while by DLP printing technique using photosensitive resin printing have cavity insulated part, then into
Row heat cure then carries out at activation cavity surface using chemical polishing so that insulated part structure is effectively formed
Reason, in order to improve the bond strength of insulating resin and electrically conductive ink, next to do not need attachment electrically conductive ink position exposure mask,
The position exposure mask for not needing be conductive is covered, electrically conductive ink is excessive in order to prevent leads to route deformation or short circuit, guarantees line
Road is complete, is finally immersed in Nano silver conductive ink；
(3) insulated part, which is placed in electroplanting device, carries out electroplating deposition, and metal ion deposition is in cavity structure；Concrete technology
It is: insulated part is placed in electroplanting device and carries out electroplating deposition, metal ion deposition finally tears guarantor in cavity structure
Cuticula.
Embodiment 3
As shown in Figure 1, a kind of preparation method of electroplating deposition circuit board, comprising the following steps:
(1) the insulated part structure for having cavity, the structure and circuit wiring structure of the cavity are obtained using VG drawing software
It is identical；Concrete technology is: the Software for producing data of the insulated part threedimensional model with cavity, hollow cavity are obtained from software
Structural requirement is identical as the wire structures of circuit diagram；
(2) the insulated part structure is printed using 3D printing technique；Concrete technology is: the software data in step (1) is defeated
Enter into FDM printing, while there is by FDM printing technique using photosensitive resin printing the insulated part of cavity, then in light
Photocuring is carried out in curing so that insulated part structure is effectively formed, then using activator to cavity surface into
Row is activated, in order to improve the bond strength of insulating resin and electrically conductive ink, next to not needing attachment electrically conductive ink
Protective film is sticked in position, covers to the position pad pasting for not needing be conductive, electrically conductive ink is excessive in order to prevent causes route to become
Shape or short circuit guarantee that route is complete, are finally immersed in Nano silver conductive ink；
(3) insulated part, which is placed in electroplanting device, carries out electroplating deposition, and metal ion deposition is in cavity structure；Concrete technology
It is: insulated part is placed in electroplanting device and carries out electroplating deposition, metal ion deposition finally tears guarantor in cavity structure
Cuticula.
The utility model has the advantages that having the insulation of cavity by 3D printing technique printing in due to the preparation process of the circuit board
Part, and 3D printing resin is smaller than the technical difficulty for printing metal, so that equipment is simpler and cheap, is conducive to push away
It is wide to use, at the same avoid insulating layer and conductive layer in layer-by-layer printing because the difference in material properties such as thermal expansion coefficient occur it is curved
Bent, the defects of being not connected firmly or burning, and also can be completed manufacture using existing electroplating device, while metal ion sinks
Product than electrically conductive ink solidification more evenly, also faster.
Finally it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than the present invention is protected
The limitation of range is protected, although explaining in detail referring to preferred embodiment to the present invention, those skilled in the art are answered
Work as understanding, it can be with modification or equivalent replacement of the technical solution of the present invention are made, without departing from the reality of technical solution of the present invention
Matter and range.
Claims (7)
1. a kind of preparation method of electroplating deposition circuit board, it is characterised in that: the following steps are included:
(1) the insulated part structure for having cavity, the structure and circuit wiring structure of the cavity are obtained using 3D drawing software
It is identical；
(2) the insulated part structure is printed using 3D printing technique；
(3) insulated part, which is placed in electroplanting device, carries out electroplating deposition, and metal ion deposition is in cavity structure.
2. a kind of preparation method of electroplating deposition circuit board as described in claim 1, it is characterised in that: described in step (1)
3D drawing software is any one drawing software in SolidWorks, VG.
3. a kind of preparation method of electroplating deposition circuit board as described in claim 1, it is characterised in that: described in step (2)
After insulated part structure passes through 3D printing technique printing shaping, need successively to solidify insulated part, be surface-treated and hidden
Lid processing.
4. a kind of preparation method of electroplating deposition circuit board as claimed in claim 2, it is characterised in that: the curing method is
Any method in photocuring, heat cure and cooling.
5. a kind of preparation method of electroplating deposition circuit board as claimed in claim 2, it is characterised in that: the surface treatment side
Method is any method in chemical polishing, sensitization and activation.
6. a kind of preparation method of electroplating deposition circuit board as claimed in claim 2, it is characterised in that: the method for the covering
For exposure mask or pasting protective film.
7. a kind of preparation method of electroplating deposition circuit board as described in claim 1, it is characterised in that: described in step (2)
3D printing technique is any technology in SLA, DLP and FDM.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910617595.8A CN110430674A (en) | 2019-07-10 | 2019-07-10 | A kind of preparation method of electroplating deposition circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910617595.8A CN110430674A (en) | 2019-07-10 | 2019-07-10 | A kind of preparation method of electroplating deposition circuit board |
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| Publication Number | Publication Date |
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| CN110430674A true CN110430674A (en) | 2019-11-08 |
Family
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910617595.8A Pending CN110430674A (en) | 2019-07-10 | 2019-07-10 | A kind of preparation method of electroplating deposition circuit board |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113194622A (en) * | 2021-04-27 | 2021-07-30 | 江门市德众泰工程塑胶科技有限公司 | Circuit board and manufacturing method thereof |
| WO2022006787A1 (en) * | 2020-07-08 | 2022-01-13 | 广东工业大学 | 3d printed circuit board manufacturing method |
| WO2022006792A1 (en) * | 2020-07-08 | 2022-01-13 | 广东工业大学 | Preparation method for electroplated circuit board |
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| CN102014589A (en) * | 2009-09-04 | 2011-04-13 | 揖斐电株式会社 | Method of manufacturing printed wiring board |
| CN103392386A (en) * | 2010-12-27 | 2013-11-13 | Lg伊诺特有限公司 | Method for manufacturing printed circuit board |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2022006787A1 (en) * | 2020-07-08 | 2022-01-13 | 广东工业大学 | 3d printed circuit board manufacturing method |
| WO2022006792A1 (en) * | 2020-07-08 | 2022-01-13 | 广东工业大学 | Preparation method for electroplated circuit board |
| CN113194622A (en) * | 2021-04-27 | 2021-07-30 | 江门市德众泰工程塑胶科技有限公司 | Circuit board and manufacturing method thereof |
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Application publication date: 20191108 |