CN201274603Y

CN201274603Y - Soft and hard composite board

Info

Publication number: CN201274603Y
Application number: CNU2008201294905U
Authority: CN
Inventors: 张志敏; 洪久雯
Original assignee: Xinxing Electronics Co Ltd
Current assignee: UNIMICRON-FPC TECHNOLOGY (KUNSHAN) CORP.
Priority date: 2008-08-18
Filing date: 2008-08-18
Publication date: 2009-07-15
Anticipated expiration: 2018-08-18

Abstract

The utility model discloses a soft-hard composite board, which comprises a soft-type circuit board, at least an adhesive layer and at least a semi-solidification film. The adhesive layer is attached to one surface of the soft-type circuit board. The semi-solidification film is pressed on the adhesive layer. The semi-solidification film is provided with a notch that exposes the exposure part of the soft-type circuit board, and the edge of the notch is burned and solidified by the laser. With the soft-hard composite board, the prior situation of the powder pollution and the overflow of the glue can be improved.

Description

Soft-hard composite board

Technical field

This creation relates to a kind of circuit board, and is particularly related to a kind of soft-hard composite board (flex-rigid board).

Background technology

Soft-hard composite board is the printed circuit board (PCB) that is combined by soft circuit board and hard circuit board, and it is with the pliability of soft circuit board and the intensity of rigid circuit board.On manufacture method, soft-hard composite board is that the soft circuit board with existing line is a core layer, and the circuit of making rigid circuit board with the circuit technique thereof of similar Layer increasing method or overlay technique is on soft circuit board.The portion of exposing of soft circuit board is revealed in the breach of rigid circuit board, carries out external form processing (routing) step by the cutting forming machine again, to obtain required external form and the quantity of soft-hard composite board.The manufacture method of relevant known soft-hard composite board can be with reference to the diagram and the explanation of No. the 200630006th, TaiWan, China patent disclosure.

Figure 1A and Figure 1B illustrate before the pressing and pressing after the schematic appearance of soft-hard composite board.In Figure 1A, semi-solid preparation film 130 combines with soft circuit board 100 via adhesion coating 110 and forms a soft-hard composite board 10.Soft circuit board 100 has one and exposes the P of portion, and it is corresponding to the breach 132 of semi-solid preparation film 130, so that soft-hard composite board 10 is by exposing the characteristic that the P of portion possesses deflection.

Known semi-solid preparation film 130 is to form breach 132 in the stamping mode, and the area of breach 132 is identical haply with the area of the P of the portion of exposing of soft circuit board 100.But in the pressing process, semi-solid preparation film 130 pressurizeds and being out of shape, cause part glue material overflow into breach 132 in and cover the P of the portion of exposing of soft circuit board 100, shown in Figure 1B.Dwindle owing to the area that exposes the P of portion is covered by excessive glue, thereby the pliability of soft circuit board 100 also obviously descends.In addition, in the pressing process, be covered in the excessive glue that exposes on the P of portion and be difficult for being eliminated, and be easy to generate the break flour pollution, thereby influence the yield of subsequent technique.

The utility model content

This creation provides a kind of soft-hard composite board, and the area that exposes portion in order to the improvement glue that overflow covers and dwindles.

This creation proposes a kind of soft-hard composite board, and it comprises a soft circuit board, at least one adhesion coating and at least one semi-solid preparation film.Adhesion coating is attached at a surface of soft circuit board.The semi-solid preparation film is pressed on the adhesion coating.The semi-solid preparation film has a breach, appears the portion of exposing of flexible circuit board, and wherein the edge of breach solidifies through laser ablation.

In an embodiment of this creation, the semi-solid preparation film is solidified forming via being heated.

In an embodiment of this creation, the edge of breach forms an annular and solidifies wall through laser ablation.The sidewall thickness that annular is solidified wall is 5～100 microns.

In an embodiment of this creation, soft-hard composite board also comprises at least one circuit pattern, is formed on the film of semi-solid preparation.

In an embodiment of this creation, circuit pattern is formed with direct spray printing or plating.

This creation forms breach because of adopting laser ablation process to replace known stamping mode, therefore after the moulding, is difficult for producing the break flour pollution problems through pressing at soft-hard composite board.Simultaneously, owing to the edge of breach solidifying through laser ablation, thus the situation of known excessive glue can not take place, and the area that exposes portion also can not covered by excessive glue and diminish, and then improve the yield of subsequent technique.

For the above-mentioned feature and advantage of this creation can be become apparent, preferred embodiment cited below particularly, and cooperate appended diagram, be described in detail below.

Description of drawings

Figure 1A and Figure 1B illustrate before the pressing and the schematic appearance of the soft-hard composite board after the pressing.

Fig. 2 A～Fig. 2 E illustrates the flow chart of the manufacture method of this a kind of soft-hard composite board of creating an embodiment respectively.

Fig. 3 illustrates the schematic diagram that the semi-solid preparation film forms a breach.

Description of reference numerals

10,20: soft-hard composite board

100: soft circuit board

110: adhesion coating

130: the semi-solid preparation film

132: breach

200: soft circuit board

210: adhesion coating

220: rigid circuit board

Embodiment

Fig. 2 A～Fig. 2 C illustrates the flow chart of the manufacture method of this a kind of soft-hard composite board of creating an embodiment respectively, and Fig. 3 illustrates the schematic diagram that the semi-solid preparation film forms a breach.What need explanation in advance is, in order to clearly demonstrate the feature of this creation, the semi-solid preparation film of Fig. 3 presents in the mode of vertical view, and cooperate the laser ablation step of this creation to illustrate in the lump, wherein the edge of the breach of semi-solid preparation film presents with oblique line, the edge of indication notch to solidify through laser ablation.Those of ordinary skills can know the quantity of breach by inference by Fig. 3 can be one or more, and present embodiment is an example with single breach only, but not as limit.Simultaneously, the order of Fig. 2 A～Fig. 2 C only reaches understanding for convenience of description, is not in order to limit the aspect that this creation is implemented.

Please refer to Fig. 2 A, the first step of this creation provides soft circuit board 200 and at least one adhesion coating 210.Soft circuit board 200 can be single-layer wire base board or double-deck circuit base plate, and adhesion coating 210 is according to individual layer or double-deck circuit and selectivity is attached to a surface or two surfaces of soft circuit board 200.In the present embodiment, two surfaces that are attached to soft circuit board 200 with two adhesion coatings 210 are example, and those of ordinary skills can be known by inference the enforcement aspect of single adhesion coating by Fig. 2 A, in this no longer detailed showing.

Then, please refer to Fig. 2 B, second step of this creation provides at least one semi-solid preparation film 230.The material of semi-solid preparation film 230 can be policapram or epoxy resin, and its polymer is uncrosslinked to be the shape that can flow as the time spent, has the deformation behavior of fluid and the particle coacervation characteristic of solid at normal temperatures simultaneously.When semi-solid preparation film 230 is heated, then no longer include the deformation behavior of fluid, but thermoset forming.

It should be noted that this creation forms a breach 232 with laser ablation technology on semi-solid preparation film 230.Breach 232 is corresponding to the A of the portion of exposing of soft circuit board 200, shown in Fig. 2 B.When laser light was ablated to a surface of semi-solid preparation film 230, part glue material Yin Gaowen melted and is removed, and the edge of breach 232 is also because of high thermal ablation polymerization and curing.Under the preferable case, the edge of breach 232 forms an annular and solidifies wall 234 through laser ablation, and as shown in Figure 3, so the semi-curing glue material is solidified wall 234 by annular and stops and be difficult for slime flux.In the present embodiment, the sidewall thickness (from inside to outside) that annular is solidified wall 234 is about 5～100 microns, and preferred sidewall thickness is about 50～100 microns, can be adjusted by the area of laser ablation.

Then, please refer to Fig. 2 C, the next step of this creation is to carry out the pressing step, forms a soft-hard composite board 20 so that semi-curing glue material 230 combines with soft circuit board 200 by adhesion coating 210.In the process of pressing, semi-solid preparation film 230 is squeezed and is out of shape, but semi-solid preparation film 230 can not produce the problem of the glue that overflows after via its breach 232 of laser ablation, thus can the residual known glue material that overflows through pressing in the breach 232, and then the yield of raising subsequent technique.

In an embodiment of this creation, the pressing step also can be included in coating one Copper Foil on the semi-solid preparation glue material 230, and by forming a soft-hard composite board 20 with an adhesion coating 210 and soft circuit board 200 pressings simultaneously.

In Fig. 2 C, when carrying out the pressing step, also can carry out curing schedule simultaneously, under predetermined pressure and temperature so that soft-hard composite board 20 is subjected to hot curing to form shape.After being shaped, semi-solid preparation film 230 is heated and solidifies, and the area of the breach 232 after solidifying is remained unchanged by the area of laser ablation before with pressing.Therefore, the area of the A of the portion of exposing of soft circuit board 200 also can be controlled in the desirable scope, dwindles and influences its flexual defective so can overcome area that known soft circuit board exposes portion.

Then, please refer to Fig. 2 D, form a circuit pattern 240 on the film 230 ' that has solidified.Circuit pattern 240 for example is coated on the film 230 of semi-solid preparation with Copper Foil, and by forming a soft-hard composite board 20 with adhesion coating 210 and soft circuit board 200 pressings simultaneously,, remove the part Copper Foil in the etched mode of photoetching again, and form required circuit and joint sheet.In addition, on the film 230 ' after the pressing that circuit pattern 240 also can be directly be formed at not coating Copper Foil in the mode of spray printing or plated conductive material is solidified, has the hard circuit board 220 of individual layer circuit with formation.If need to form the multilayer line layer,, can finish hard circuit board with multilayer line as long as repeat above-mentionedly to provide technologies such as Copper Foil coating, semi-solid preparation film, laser ablation process and pressing step at least once.

At last, please refer to Fig. 2 E, wait to finish after all circuit technique thereofs and the surface weldering cover technology, soft-hard composite board 20 also can required in regular turn external form carry out the external form procedure of processing, to cut into a plurality of soft-hard composite boards unit 250.Expose between these soft-hard composite board unit 250 with the breach 232 of Fig. 3 is corresponding and expose the A of portion, and each soft-hard composite board unit 250 can come transmission signals by the circuit of soft circuit board 200.

In sum, this creation is adopted laser ablation process to replace known stamping mode and is formed breach, therefore after the moulding, is difficult for producing the break flour pollution problems through pressing at soft-hard composite board, and then improves the yield of technology.Simultaneously, owing to the edge of breach solidifying through laser ablation, thus the situation of known excessive glue can not take place, and the area that exposes portion also can not covered by excessive glue and diminish, and then improve the pliability of soft circuit board.

Though this creation discloses as above with preferred embodiment; so it is not in order to limit this creation; those of ordinary skill in the technical field under any; in the spirit and scope that do not break away from this creation; when can doing a little change and retouching, so the protection range of this creation is as the criterion when looking appended the claim person of defining.

Claims

1. soft-hard composite board is characterized in that comprising:

One soft circuit board;

At least one adhesion coating is attached at a surface of this soft circuit board; And

At least one semi-solid preparation film is pressed on this adhesion coating, and this semi-solid preparation film has a breach, appears the portion of exposing of this flexible circuit board, and wherein the edge of this breach solidifies through laser ablation.

2. soft-hard composite board as claimed in claim 1, it is characterized in that this semi-solid preparation film via being heated solidified forming.

3. soft-hard composite board as claimed in claim 1 is characterized in that the edge of this breach forms an annular curing wall through laser ablation.

4. soft-hard composite board as claimed in claim 3 is characterized in that it is 5～100 microns that this annular is solidified the sidewall thickness of wall.

5. soft-hard composite board as claimed in claim 1 is characterized in that also comprising at least one circuit pattern, is formed on the film of this semi-solid preparation.

6. soft-hard composite board as claimed in claim 5 is characterized in that this circuit pattern is formed with direct spray printing or plating.