CN112770540B - Processing method of thick copper PCB with bonding structure at step position - Google Patents
Processing method of thick copper PCB with bonding structure at step position Download PDFInfo
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- CN112770540B CN112770540B CN202011406253.0A CN202011406253A CN112770540B CN 112770540 B CN112770540 B CN 112770540B CN 202011406253 A CN202011406253 A CN 202011406253A CN 112770540 B CN112770540 B CN 112770540B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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Abstract
The invention provides a method for processing a thick copper PCB with a bonding structure at a step position, which comprises the following steps: the laminated structure comprises a first core plate, auxiliary filler and a second core plate; cutting the first core board, the second core board and the auxiliary core board according to the same longitude and latitude; the first core plate is divided into two surfaces, one surface is an L1 layer, the other surface is an L2 layer, the second core plate is divided into two surfaces, one surface is an L3 layer, and the other surface is an L4 layer; pressing corresponding upper line circuit manufacturing, auxiliary glue filling: a hollow bonding structure area; sequentially laminating the first core plate, the no-flow glue PP sheet, the first auxiliary glue body, the auxiliary core plate, the second auxiliary glue body, the no-flow glue PP sheet and the second core plate, fixing through rivet holes and then pressing; then drilling, copper deposition, outer layer pattern plating, pattern electroplating, etching, solder resistance, character, surface treatment, molding, testing and final inspection flow; the accuse is deeply gong to L1 aspect upwards, and accuse deep fretwork bonding position exposes bonding pad.
Description
Technical Field
The invention relates to a manufacturing method of a multilayer printed circuit board, in particular to a processing method of a thick copper PCB with a bonding structure at a step position.
Background
With the continuous development of electronic technology, printed circuit boards which have bonding structures and are used for storing functional requirements are more and more, bonding positions are generally regular rectangular arrays, most of the bonding pads are square and round, and the SMT technology is characterized by small spacing between the bonding pads and the bonding pads, dense bonding pads and difficult surface treatment manufacturing. Therefore, a new processing method is needed to meet the requirement of manufacturing the plate.
Disclosure of Invention
In order to solve the problems, the invention provides a method for firstly performing electric gold plating on a bonding pad of an inner core board, forming a step position as a requirement of the bonding pad by routing a prepreg above the bonding pad and molding an auxiliary core board, and routing a bonding structure position to improve the processing capacity of a PCB circuit after finishing routing.
In order to solve the above problems, the technical scheme provided by the invention is as follows: a processing method of a thick copper PCB with a bonding structure at a step position comprises the following steps:
s1: designing a lamination; designing a reasonable laminated structure according to the position of the bonding structure, wherein the laminated structure comprises a first core plate, auxiliary glue filling and a second core plate;
s2, cutting; the cutting comprises a first core plate, a second core plate and an auxiliary core plate, and the first core plate, the second core plate and the auxiliary core plate are cut according to the same longitude and latitude; the first core plate is divided into two surfaces, one surface is an L1 layer, the other surface is an L2 layer, the second core plate is divided into two surfaces, one surface is an L3 layer, and the other surface is an L4 layer;
s3: manufacturing a corresponding surface circuit layer; an L1 layer of the first core plate is protected by using an auxiliary film, a layer of photosensitive material is pasted on an L2 layer, and an L2 layer circuit is formed through exposure, development and etching;
the inner-layer circuit of the second core plate is characterized in that a layer of photosensitive material is pasted on the L3 layer of the second core plate, bonding pads are exposed through exposure and development, the photosensitive material at the rest positions is solidified and is subjected to covering treatment, the exposed bonding pads are plated with gold in an electroplating mode, the photosensitive material is removed through film removal after the gold plating, a layer of photosensitive material is pasted again after the film removal, the L3 layer circuit is manufactured through exposure, development and etching, and an auxiliary film is used for protecting the L4 layer when the L3 layer circuit is manufactured;
s4, auxiliary glue filling, wherein the auxiliary glue filling comprises etching of a die, cutting of a no-flow glue PP sheet, and manufacturing of a first auxiliary glue body and a second auxiliary glue body;
the etching mould is used for manufacturing a negative film circuit corresponding to the glue filling circuit, the negative film circuit is matched with the corresponding circuit in a convex-concave mode, and the two non-flowing glue PP sheets are fixed on the two sides of the auxiliary core plate in an aligned mode;
silk-printing heat curing glue on the surface of the auxiliary core plate fixed with the no-flow glue PP sheet, quickly pressing the auxiliary core plate with an etching mould after the heat curing glue is silk-printed, extruding redundant heat curing glue by the etching mould to form a first auxiliary glue body, and impressing the other no-flow glue PP sheet to form a second auxiliary glue body;
s5: and the hollow bonding structure area is arranged on the first core plate, the auxiliary core plate, the first auxiliary colloid and the second auxiliary colloid.
S6: manufacturing a rivet hole; the glue filling device comprises a first core plate, a second core plate, an auxiliary core plate, a first auxiliary glue body and a second auxiliary glue body, wherein a rivet hole is formed in a no-flow glue PP sheet, and the size of the rivet hole in the no-flow glue PP sheet is larger than that of the rivet hole in the first core plate, the second core plate, the auxiliary core plate, the first auxiliary glue body and the second auxiliary glue body;
s7: rivet pressing; sequentially laminating the first core plate, the no-flow glue PP sheet, the first auxiliary glue body, the auxiliary core plate, the second auxiliary glue body, the no-flow glue PP sheet and the second core plate, fixing through rivet holes and then pressing;
s8, pressing the laminated board into a multilayer board, and performing normal procedure processing: drilling, copper deposition, outer layer pattern plating, pattern electroplating, etching, solder resistance, character, surface treatment, molding, testing and final inspection; the shaping is still including controlling dark gong, control dark gong position L1 aspect upwards, and control dark fretwork nation position exposes nation and decides the pad.
In a preferred technical scheme, the first core board and the second core board are copper-containing core boards or press-fit core boards, and the press-fit core boards are double-sided boards formed by pressing a plurality of core boards.
In an optimal technical scheme, the thickness of copper of a circuit layer buried after the first core board and the second core board are correspondingly pressed is not less than 2OZ.
According to the preferable technical scheme, the electrogilding in the step S3 is local line electrogilding, an L3 layer line is manufactured through a secondary line after electrogilding, and a binding line is etched at the same time.
In a preferred technical scheme, the electrogilding in the step S3 is L3 layer full-page line electrogilding, and the L3 layer line is etched after electrogilding.
In an optimal technical scheme, the position, corresponding to the bonding structure, of the first core board in the press-fit core board is a substrate area, and an inner layer does not include a circuit.
In a preferred technical scheme, the auxiliary core plate is a light plate.
According to the preferable technical scheme, the thickness of the non-flowing glue PP sheet, the first auxiliary colloid, the auxiliary core plate, the second auxiliary colloid and the non-flowing glue PP sheet after lamination and lamination is larger than 0.2mm.
Compared with the prior art, the invention has the following effects:
1. the bonding pad is subjected to electro-gold treatment on the inner core plate, so that the surface treatment difficulty is reduced, and the plate processing capacity is improved.
2. Bonding pad design can effectively reduce the protruding height of components and parts in the step position, and the organic material precision that will special protect function after the bonding covers, accomplishes later stage encapsulation, has practiced thrift the space.
3. The bonding pads are small in distance and dense in pad, and the bonding pads are designed at the step positions of the plate, so that the problem of scratching of the plate surface in the operation process can be effectively reduced, and the product yield is improved.
4. The problem of excessive gluey or scarce gluey of pressfitting process kind is solved, the promotion by a wide margin of production quality has been realized.
5. The bonding of high-power electric equipment components is realized, and the technical problems of glue overflow, depth control drilling and the like are solved.
Drawings
For a clearer explanation of the embodiments or technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the invention, and it is obvious for a person skilled in the art that other drawings can be obtained from the drawings without creative efforts.
FIG. 1 is a schematic diagram illustrating a first chip etching process;
FIG. 2 is a schematic diagram of gold making of a second core board;
FIG. 3 is a schematic diagram illustrating etching of a second core plate;
FIG. 4 is a schematic view of an auxiliary underfill structure;
FIG. 5 is a schematic view of a press-fit process;
FIG. 6 is a schematic view of borehole creation;
FIG. 7 is a schematic diagram of a depth-control gong structure;
fig. 8 is a picture of the effect of the finished product after bonding.
Detailed Description
In order to facilitate an understanding of the invention, the invention is described in more detail below with reference to the accompanying drawings and specific examples. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
One embodiment of the present invention is: according to a design file, carrying out laminated structure design, carrying out cutting manufacture after the laminated design and optimization, finally forming a first core board 1 and a second core board 6 which are complete, simultaneously determining an auxiliary filler 5 structure, and further forming a complete laminated structure, wherein the first core board 1, the auxiliary filler 5 and the second core board 6 are respectively sequentially arranged, the first core board 1 is divided into the following types, namely, the first type, the first core board 1 is a laminated product of a multi-layer printed circuit board, the first core board 1 at least comprises three layers of circuits, one surface of the two layers of circuits outside is an L1 layer 2, and the other surface of the two layers of circuits outside is an L2 layer 3; secondly, the first core plate 1 is a double-sided copper-containing core plate, one surface of each of two sides of the double-sided copper-containing core plate is an L1 layer 2, and the other surface of each of the two sides of the double-sided copper-containing core plate is an L2 layer 3; thirdly, the first core board 1 is a single-sided copper-containing core board, the copper-containing surface of the single-sided copper-containing core board is an L1 layer 2, and the other surface of the light board layer is an L2 layer 3.
The second core board 6 and the sample board contain the following components, wherein the first component is a laminated product of a multilayer printed circuit board, the second core board 6 at least comprises three layers of circuits, one surface of the outer two layers of circuits is an L3 layer 7, and the other surface is an L4 layer 8; secondly, the second core board 6 is a double-sided copper-containing core board, one surface of each of the two sides of the double-sided copper-containing core board is an L3 layer 7, and the other surface of each of the two sides of the double-sided copper-containing core board is an L4 layer 8; thirdly, the second core board 6 is a single-sided copper-containing core board, the copper-containing surface of the single-sided copper-containing core board is an L3 layer 7, and the other surface of the light board layer is an L4 layer 8.
The auxiliary glue filling 5 comprises an etching mould and a non-flowing glue PP sheet, and a first auxiliary glue body 11 and a second auxiliary glue body 13 are manufactured;
the etching mould is used for manufacturing a negative film circuit corresponding to the glue filling circuit, the negative film circuit is matched with the corresponding circuit in a convex-concave mode, and the two no-flow PP sheets 12 are fixed on two surfaces of the auxiliary core plate in an aligned mode;
silk-printing heat curing glue on the surface of an auxiliary core plate fixed with a non-flowing glue PP sheet, quickly pressing the auxiliary core plate with the heat curing glue by using an etching mould after the heat curing glue is silk-printed, extruding redundant heat curing glue by using the etching mould to form a first auxiliary glue body 11, and impressing a second auxiliary glue body 13 on another non-flowing glue PP sheet 12; the thermal curing glue is solidified after being printed, and the solidified thermal curing glue cannot be melted again at high temperature. The first auxiliary colloid 11 and the second auxiliary colloid 13 form a specific structure.
Pressing corresponding surface circuits, as shown in fig. 1, attaching a layer of photosensitive material 9 to the L1 layer 2 of the first core board 1, and exposing, developing and etching to obtain an L2 layer pattern 4, wherein the L1 layer 2 is an auxiliary film; as shown in fig. 2, in the inner circuit of the second core board 6, a layer of photosensitive material 9 is attached to the L3 layer 7 of the second core board 6, the bonding pads are exposed through exposure and development, the photosensitive material 9 at the rest positions is cured to perform covering treatment, the exposed bonding pads are plated with gold in an electroplating manner, the photosensitive material 9 is stripped after the gold plating, a layer of photosensitive material 9 is attached again after the membrane stripping, an L3 layer pattern 10 is formed through exposure, development and etching, and the L4 layer 8 is an auxiliary film.
The first auxiliary colloid 11 corresponds to the L2 layer pattern 4, and the second auxiliary colloid 13 corresponds to the L3 layer pattern 10;
when the first core board 1 is a single-sided copper-containing core board, performing CNC depth control routing on the L2 layer 3 of the first core board 1 with the pattern in the area corresponding to the bonding pad, wherein the L2 layer 3 faces upwards during depth control routing, and the depth control is 1/2 of the thickness of the first core board 1.
As shown in fig. 3, a layer of photosensitive material 9 is attached to the layer 7 of the second core board 6L3 after cutting, the bonding pad is exposed by exposure and development after the second core board 6 is cut, the photosensitive material 9 at the rest positions is cured to be covered, the exposed bonding pad is plated with a layer of gold by electroplating, and the photosensitive material 9 is removed by stripping after gold plating; sticking a layer of photosensitive material 9 again after stripping, making an L3 layer pattern 10 through exposure, development and etching, and binding pad electrogold and etching; an L4 layer 8 is provided with an auxiliary film; the same properties as the L1 layer 2.
Because first supplementary colloid 11 corresponds 3 circuit layers on L2 layer and is the worn-out fur layer, need not use first supplementary colloid 11, and the supplementary colloid 13 of second and a prepreg, the rivet hole is drilled out through CNC mode, and the prepreg region that bonding pad corresponds adopts CNC gong out. And the second auxiliary colloid 13 and the prepregs are sequentially laminated to form an auxiliary filling 5 structure. The thickness of the auxiliary colloid structure after pressing is larger than 0.2mm.
As shown in fig. 4, when the first core board 1 is a laminated product of a multilayer printed circuit board or a double-sided copper-containing core board, since the copper thickness is greater than 35um, the prepreg cannot fix the flow state and fill the paste with an accurate thickness, and an auxiliary core board is added to ensure the overall thickness; and the hollow bonding structure area is arranged on the first core plate 1, the auxiliary core plate, the first auxiliary colloid 11, the second auxiliary colloid 13 and the non-flowing glue PP sheet 12 corresponding to the increased first auxiliary colloid 11 and the second auxiliary colloid 13.
Manufacturing a rivet hole; first core 1, second core 6, supplementary core 10, first supplementary colloid 11, the rivet hole is made on the supplementary colloid 13 of second on the no-flow adhesive PP piece 12, the rivet hole size is greater than on the no-flow adhesive PP piece 12 first core 1, second core 6, supplementary core, first supplementary colloid 11, the size of rivet hole on the supplementary colloid 13 of second.
As shown in fig. 5, the first core board 1, the second core board 6 and the auxiliary filler 5 are manufactured according to a multi-layer board, the auxiliary filler 5 is placed between the first core board 1 and the second core board 6 for bonding, the routing area 14 of the prepreg and the bonding pad are aligned, the prepreg and the bonding pad are riveted by using a rivet hole and then pressed, and the multi-layer board is obtained after the lamination.
As shown in fig. 6, after pressing, the multilayer board is obtained, and the outer layer is processed by the normal procedure: drilling 15, copper deposition, outer layer pattern, pattern electroplating, etching, solder resistance, characters and surface treatment.
As shown in fig. 7, outer surface treatment is back to do the deep gong of CNC accuse with first core plate 1 in the region that the nation decides the pad and corresponds, and L1 layer 2 is up during the deep gong of accuse, and the deep degree of accuse is according to preceding process preparation flow, gong out and corresponds nation and decide pad position formation step, exposes L3 layer binding structure, carries out normal back process processing behind the deep gong of accuse: forming, testing and finally inspecting.
As shown in fig. 8, after final inspection, bonding operation on the bonding pad of the bonding IC re-bonding structure is realized, and in order to realize fixation of the IC assembly and neatness of the surface, organic materials are coated in the step and on the bonding IC, so that fixation of the bonding IC is realized, and meanwhile, on the step, welding of the component 16 is not affected, so that effective utilization of the surface is realized.
The technical features mentioned above are combined with each other to form various embodiments which are not listed above, and all of them are regarded as the scope of the present invention described in the specification; also, modifications and variations may be suggested to those skilled in the art in light of the above teachings, and it is intended to cover all such modifications and variations as fall within the true spirit and scope of the invention as defined by the appended claims.
Claims (8)
1. A processing method of a thick copper PCB with a bonding structure at a step position is characterized by comprising the following steps:
s1: designing a lamination; designing a reasonable laminated structure according to the position of the bonding structure, wherein the laminated structure comprises a first core plate, auxiliary glue filling and a second core plate;
s2, cutting; the cutting comprises a first core plate, a second core plate and an auxiliary core plate, and the first core plate, the second core plate and the auxiliary core plate are cut according to the same longitude and latitude; the first core plate is divided into two surfaces, one surface is an L1 layer, the other surface is an L2 layer, the second core plate is divided into two surfaces, one surface is an L3 layer, and the other surface is an L4 layer;
s3: manufacturing a corresponding surface circuit layer; an L1 layer of the first core plate is protected by using an auxiliary film, a layer of photosensitive material is pasted on an L2 layer, and an L2 layer circuit is formed through exposure, development and etching;
the inner-layer circuit of the second core plate is characterized in that a layer of photosensitive material is pasted on the L3 layer of the second core plate, bonding pads are exposed through exposure and development, the photosensitive material at the rest positions is solidified and is subjected to covering treatment, the exposed bonding pads are plated with gold in an electroplating mode, the photosensitive material is removed through film removal after the gold plating, a layer of photosensitive material is pasted again after the film removal, the L3 layer circuit is manufactured through exposure, development and etching, and an auxiliary film is used for protecting the L4 layer when the L3 layer circuit is manufactured;
s4, auxiliary glue filling; the auxiliary glue filling comprises an etching die, a non-flowing glue PP sheet is cut, and a first auxiliary glue body and a second auxiliary glue body are manufactured;
the etching mould is used for manufacturing a negative film circuit corresponding to the glue filling circuit, the negative film circuit is matched with the corresponding circuit in a convex-concave mode, and the two non-flowing glue PP sheets are fixed on the two sides of the auxiliary core plate in an aligned mode;
silk-printing heat-curing glue on the surface of an auxiliary core plate fixed with a non-flowing glue PP sheet, quickly pressing the auxiliary core plate with the heat-curing glue after silk-printing, extruding redundant heat-curing glue by using an etching mould to form a first auxiliary glue body, and stamping the other non-flowing glue PP sheet to form a second auxiliary glue body;
s5: a hollow bonding structure area; hollowing out a bonding structure area on the first core plate, the auxiliary core plate, the first auxiliary colloid and the second auxiliary colloid;
s6: manufacturing a rivet hole; the glue filling device comprises a first core plate, a second core plate, an auxiliary core plate, a first auxiliary glue body, a second auxiliary glue body and a non-flowing glue PP sheet, wherein a rivet hole is formed in the non-flowing glue PP sheet, and the size of the rivet hole in the non-flowing glue PP sheet is larger than that of the rivet hole in the first core plate, the rivet hole in the second core plate, the rivet hole in the auxiliary core plate, the rivet hole in the first auxiliary glue body and that in the second auxiliary glue body;
s7: pressing the rivets; sequentially laminating the first core plate, the no-flow glue PP sheet, the first auxiliary glue body, the auxiliary core plate, the second auxiliary glue body, the no-flow glue PP sheet and the second core plate, fixing through rivet holes and then pressing;
s8, forming a multilayer board after pressing; and carrying out normal procedure processing: drilling, copper deposition, outer layer circuit, pattern electroplating, etching, solder resistance, character, surface treatment, molding, testing and final inspection; the shaping is still including controlling dark gong, control dark gong is L1 aspect upwards, and control dark fretwork nation decides the position and exposes nation and decides the pad.
2. The method for processing the thick copper PCB with the bonding structure at the step position according to claim 1, wherein the method comprises the following steps: the first core board and the second core board are copper-containing core boards or press-fit core boards, and the press-fit core boards are double-sided boards formed by pressing a plurality of core boards.
3. The method for processing the thick copper PCB with the bonding structure at the step position according to claim 2, wherein the method comprises the following steps: and the copper thickness of the circuit layer buried after the first core board and the second core board are correspondingly pressed is not less than 2OZ.
4. The method for processing the thick copper PCB with the bonding structure at the step position according to claim 1, wherein the method comprises the following steps: and the electrogilding in the step S3 is local line electrogilding, an L3 layer line is manufactured by a secondary line after electrogilding, and a binding line is etched at the same time.
5. The method for processing the thick copper PCB with the bonding structure at the step position according to claim 1, wherein the method comprises the following steps: and the electrogilding in the step S3 is L3 layer full-page line electrogilding, and the L3 layer line is etched after electrogilding.
6. The method for processing the thick copper PCB with the bonding structure at the step position according to claim 2, wherein the method comprises the following steps: the position, corresponding to the bonding structure, of the pressed core board, corresponding to the first core board is a base material area, and the inner layer does not comprise a circuit.
7. The method for processing the thick copper PCB with the bonding structure at the step position according to claim 1, wherein the method comprises the following steps: the auxiliary core plate is a light plate.
8. The method for processing the thick copper PCB with the bonding structure at the step position according to claim 1, wherein the method comprises the following steps: the thickness of the non-flowing glue PP sheet, the first auxiliary glue body, the auxiliary core plate, the second auxiliary glue body and the non-flowing glue PP sheet after lamination and lamination is larger than 0.2mm.
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| CN113382546A (en) * | 2021-06-02 | 2021-09-10 | 深圳市辉煌星电子有限公司 | Manufacturing method of PCB with convex-shaped side surface |
| CN114286510B (en) * | 2021-12-28 | 2024-01-19 | 武汉天马微电子有限公司 | Circuit board, display module and display device |
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| CN101662888A (en) * | 2009-09-28 | 2010-03-03 | 深南电路有限公司 | Preparation method for PCB plate with step trough |
| CN104363720A (en) * | 2014-10-21 | 2015-02-18 | 深圳崇达多层线路板有限公司 | Method of forming deep blind groove in printed circuit board (PCB) |
| CN105472886A (en) * | 2015-11-13 | 2016-04-06 | 惠州市金百泽电路科技有限公司 | Manufacturing method of PCB board internally provided with active device |
| CN111741618A (en) * | 2020-08-14 | 2020-10-02 | 博敏电子股份有限公司 | Processing method for depositing nickel and gold on bottom of PCB step groove |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014067975A (en) * | 2012-09-27 | 2014-04-17 | Hitachi Chemical Co Ltd | Method for manufacturing multilayer wiring board |
| CN107592735A (en) * | 2017-08-22 | 2018-01-16 | 深圳崇达多层线路板有限公司 | Thick desired ladder board manufacturing method more than a kind of high accuracy |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101662888A (en) * | 2009-09-28 | 2010-03-03 | 深南电路有限公司 | Preparation method for PCB plate with step trough |
| CN104363720A (en) * | 2014-10-21 | 2015-02-18 | 深圳崇达多层线路板有限公司 | Method of forming deep blind groove in printed circuit board (PCB) |
| CN105472886A (en) * | 2015-11-13 | 2016-04-06 | 惠州市金百泽电路科技有限公司 | Manufacturing method of PCB board internally provided with active device |
| CN111741618A (en) * | 2020-08-14 | 2020-10-02 | 博敏电子股份有限公司 | Processing method for depositing nickel and gold on bottom of PCB step groove |
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