CN111741618A - Processing method for depositing nickel and gold on bottom of PCB step groove - Google Patents
Processing method for depositing nickel and gold on bottom of PCB step groove Download PDFInfo
- Publication number
- CN111741618A CN111741618A CN202010815413.0A CN202010815413A CN111741618A CN 111741618 A CN111741618 A CN 111741618A CN 202010815413 A CN202010815413 A CN 202010815413A CN 111741618 A CN111741618 A CN 111741618A
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- core plate
- core
- gold
- electric milling
- groove
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/146—By vapour deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Abstract
The invention discloses a processing method for depositing nickel and gold at the bottom of a PCB step groove, which comprises the steps of performing selective gold deposition treatment on a first core plate and performing pre-control deep electric milling blind groove treatment on a second core plate; respectively carrying out brown oxidation treatment on the first core plate and the second core plate; carrying out electric milling through groove treatment on the pp composite layer; enabling the through grooves of the gold immersion PAD and pp composite layers of the first core board and the blind grooves of the second core board to correspond in position; laminating and laminating the first core plate, the pp composite layer and the second core plate in sequence to obtain a PCB inner plate; carrying out post-treatment on the PCB inner plate; and carrying out depth-controlled uncovering electric milling treatment on the second core plate to expose the gold immersion PAD of the first core plate. The advantage lies in, the degree of depth to the step groove is controlled to the accuracy, avoids the problem of step tank bottom cull, satisfies the PAD of PCB step tank bottom and does the demand of chemistry nickel gold. According to the detailed steps of the invention, the processing has no requirement on equipment with a high standard, is suitable for the existing conditions of a common factory, and can realize batch production without adding other equipment.
Description
Technical Field
The invention relates to a PCB processing technology, in particular to a processing method for depositing nickel and gold at the bottom of a PCB stepped groove.
Background
To do heavy nickel gold to PCB step groove bottom, different in industry different producers processing technology is different: the other type is a mechanical depth control milling plate, and the step plate manufactured by the depth control milling plate mainly depends on the step groove depth control requirement and manufacturing capability. The other major type is a filling/embedding gasket pressing plate, and for the control method that the stepped plate manufactured by the filling/embedding gasket pressing plate mainly depends on the glue flow amount and the reliability of the patterns and holes near the stepped groove, the two processing modes can realize the shape of the stepped groove, but cannot meet the requirement that PAD at the bottom of the stepped groove of the PCB is made into electroless nickel and gold.
Disclosure of Invention
The invention aims to provide a processing method for depositing nickel and gold on the bottom of a PCB step slot, which aims to solve the problems in the prior art.
The invention relates to a processing method for depositing nickel and gold at the bottom of a PCB step groove, which comprises the following steps of firstly respectively manufacturing inner layer patterns of a first core plate and a second core plate: carrying out selective gold immersion treatment on the first core plate, and carrying out pre-control deep electric milling blind slot treatment on the second core plate; the first core plate and the second core plate are respectively subjected to brown oxidation treatment; carrying out electric milling through groove treatment on the pp composite layer; enabling the through grooves of the gold immersion PAD and pp composite layers of the first core board and the blind grooves of the second core board to correspond in position; laminating and laminating the first core plate, the pp composite layer and the second core plate in sequence to obtain a PCB inner plate; carrying out post-treatment on the PCB inner plate; and carrying out depth-controlled uncovering electric milling treatment on the second core plate to expose the gold immersion PAD of the first core plate.
The step of carrying out selective gold immersion treatment on the first core plate comprises the following steps: sequentially carrying out silk-screen wet film selection, pre-baking, selective exposure and development on the first core plate to obtain a PAD to be subjected to gold deposition; the part outside the PAD is covered with selective ink; carrying out chemical nickel gold precipitation and film stripping drying on the PAD in sequence; obtaining the first core board with gold immersion PAD.
The step of performing pre-control deep electric milling blind slot treatment on the second core plate comprises the following steps: and shooting the second core plate, measuring the expansion and contraction data, pre-discharging blind groove electric milling data on one side of the second core plate facing the first core plate according to the expansion and contraction data of the second core plate, and performing mirror image depth control electric milling of blind grooves according to the blind groove electric milling data.
The pp composite layer is subjected to electric milling through groove treatment, and the steps are as follows: performing FR4 light plate separation treatment on multiple pp, and positioning and laminating; performing electric milling on the pp composite layer pre-discharge through groove according to the expansion and contraction data of the second core plate, and pre-discharging and increasing the size of the through groove according to the glue overflow amount of pp; adjusting down electric milling parameters to control the temperature of the electric milling process to be lower than the pp resin curing temperature; and performing electric milling according to the through groove electric milling data.
Before the first core board, the pp composite layer and the second core board are sequentially laminated and pressed to obtain the PCB inner board, the expansion and shrinkage data of the first core board are measured, and the expansion and shrinkage data of the first core board and the second core board are confirmed to be matched.
The step of carrying out depth-controlled uncovering electric milling treatment on the second core plate comprises the following steps: measuring harmomegathus data of the PCB inner plate after post-processing, issuing uncovering electric milling data at a position, corresponding to the gold immersion PAD, on one side, far away from the first core plate, of the second core plate according to the harmomegathus data of the PCB inner plate, and carrying out electric milling according to the uncovering electric milling data.
The processing method for depositing nickel and gold on the bottom of the PCB stepped groove has the advantages that the depth of the stepped groove is accurately controlled, the problem of residual glue at the bottom of the stepped groove is avoided, and the requirement of making chemical nickel and gold on PAD at the bottom of the stepped groove of the PCB is met. According to the detailed steps of the invention, the processing has no requirement on equipment with a high standard, is suitable for the existing conditions of a common factory, and can realize batch production without adding other equipment.
Drawings
FIG. 1 is a schematic flow diagram of a process according to the present invention;
FIG. 2 is a schematic diagram of the structure of a PCB inner plate produced by the processing method of the present invention.
10-first core board, 11-immersion gold PAD; 20-pp composite layer, 21-through groove electric milling data; 30-second core plate, 31-uncovering electric milling data, 32-blind slot electric milling data; 40-through holes.
Detailed Description
According to the processing method for performing nickel and gold immersion on the bottom of the PCB step groove, before the multilayer board is pressed, the first core board corresponding to the bottom of the step groove is subjected to selective nickel and gold immersion, the second core board corresponding to the step groove body is subjected to mirror image pre-depth electric milling blind groove, and meanwhile, PP with low flow rate is prepared and the electric milling through groove is positioned to obtain a PP composite layer. And then, stacking the plates, placing a PP composite layer between the first core plate and the second core plate, and producing according to a conventional process after laminating. And after the surface treatment is finished, performing depth-controlled uncovering electric milling and electric milling appearance, and finally forming a step groove on a finished product to realize PAD nickel gold immersion at the bottom of the PCB step groove. The first core board and the second core board are inner core boards of the PCB.
The specific flow and the product structure are shown in fig. 1 and fig. 2.
Firstly, inner layer graph manufacturing: and 3 groups of X-RAY targets are designed on the inner layer graph for later processing and positioning. The first core board 10 and the second core board 20 with the etched inner layers are manufactured according to the design.
Carrying out selective gold deposition treatment on the first core plate: and (3) pre-baking the silk-screen selective wet film on the surface of the first core plate after the inner layer is etched, carrying out selective exposure, and exposing the PAD needing gold deposition after developing. Covering selective ink at other positions of the board surface, chemically depositing nickel and gold, and drying the leg membrane to obtain the first core board provided with the gold-deposited PAD 11.
Pre-controlling the depth of the blind slot of the electric milling of the second core plate: and (5) performing target shooting after etching the inner layer of the second core plate, and measuring the expansion and contraction data. And pre-discharging blind groove electric milling data 32 on one side of the second core plate facing the first core plate according to the expansion and contraction data of the second core plate, and after the flatness of the electric milling machine and the Z-axis progress are confirmed to be OK, carrying out mirror image depth control on the second core plate to electrically mill blind grooves to obtain the second core plate with the blind grooves.
And (3) performing electric milling through groove treatment on the pp composite layer: and (4) performing FR4 light plate separation treatment by using a plurality of cut PPs, and then drilling plate edge positioning holes. According to the harmomegathus data of the second core board, the through groove electric milling data 21 is pre-discharged, the size of the electric milling through groove needs to be pre-discharged and enlarged according to the glue overflow amount of the PP, and PAD on the glue overflow during pressing is avoided. And the electric milling parameters are reduced, so that the high temperature generated during electric milling is avoided for curing the PP groove edge resin. A thicker FR4 light plate is used as a bottom plate on an electric milling machine table, and an FR4 light plate is also used as an electric milling cover plate. Auxiliary materials such as cardboard and aluminum sheets cannot be used in this process, and paper scraps and aluminum scraps generated in electric milling are prevented from sticking to PP. And finishing the plate to be laminated of the PP composite layer 20 by the electric milling through groove.
And then respectively making the first core plate and the second core plate into brown oxidation plates to be stacked.
And measuring the expansion and contraction data of the first core board, and matching the first core board with the second core board after confirming that the expansion and contraction data of the first core board is matched with the expansion and contraction data of the second core board. And then, the first core plate, the PP composite layer and the second core plate are stacked in a hot melting and riveting mode. Before the lamination, the positions of the through grooves of the gold immersion PAD and the pp composite layer of the first core plate and the blind grooves of the second core plate are corresponding.
And pressing the stacked boards, shooting after pressing, and milling edges to obtain the PCB inner board.
And finally, sequentially carrying out conventional post-processing operations such as through hole drilling 40, copper deposition, electroplating, outer layer circuit, outer layer etching, solder resistance, character and surface treatment on the PCB inner plate.
After the surface of the PCB inner plate is treated, the target shooting is firstly carried out, and the expansion and contraction data are measured. And issuing cover uncovering electric milling data 31 at the position, corresponding to the gold immersion PAD, on one side of the second core board far away from the first core board according to the expansion and contraction data of the PCB inner board. Before depth control cover uncovering electric milling, smoothness of an electric milling machine table and Z-axis precision need to be confirmed, excessive damage to PAD at the bottom of a step caused by depth control is avoided, and then depth control cover uncovering electric milling and electric milling appearance are carried out. And finally obtaining a finished product of the step PCB inner plate, and realizing a PAD nickel gold immersion process at the bottom of the step groove.
The method of the invention is to make nickel and gold on the PAD at the bottom of the step groove of the PCB, and the finished product has no abnormity after various reliability tests such as a cold and hot shock test, a high temperature test, a low temperature test, a high temperature and high humidity test, a mechanical vibration test and the like. The invention not only accurately controls the depth of the step groove, but also avoids the problem of residual glue at the bottom of the step groove, and simultaneously meets the requirement of using PAD at the bottom of the step groove of the PCB as chemical nickel and gold; according to the detailed steps of the invention, the processing has no requirement on equipment with a high standard, is suitable for the existing conditions of a common factory, and can realize batch production without adding other equipment.
It will be apparent to those skilled in the art that various other changes and modifications may be made in the above-described embodiments and concepts and all such changes and modifications are intended to be within the scope of the appended claims.
Claims (6)
1. A processing method for depositing nickel and gold at the bottom of a PCB step groove is characterized in that inner layer graph manufacturing is respectively carried out on a first core board and a second core board, and the processing method comprises the following steps: carrying out selective gold immersion treatment on the first core plate, and carrying out pre-control deep electric milling blind slot treatment on the second core plate; the first core plate and the second core plate are respectively subjected to brown oxidation treatment; carrying out electric milling through groove treatment on the pp composite layer; enabling the through grooves of the gold immersion PAD and pp composite layers of the first core board and the blind grooves of the second core board to correspond in position; laminating and laminating the first core plate, the pp composite layer and the second core plate in sequence to obtain a PCB inner plate; carrying out post-treatment on the PCB inner plate; and carrying out depth-controlled uncovering electric milling treatment on the second core plate to expose the gold immersion PAD of the first core plate.
2. The processing method for depositing nickel and gold on the bottom of the PCB step groove as claimed in claim 1, wherein the step of performing selective gold deposition on the first core board comprises: sequentially carrying out silk-screen wet film selection, pre-baking, selective exposure and development on the first core plate to obtain a PAD to be subjected to gold deposition; the part outside the PAD is covered with selective ink; carrying out chemical nickel gold precipitation and film stripping drying on the PAD in sequence; obtaining the first core board with gold immersion PAD.
3. The processing method for performing nickel-gold immersion on the bottom of the PCB step groove as recited in claim 1, wherein the step of performing pre-controlled deep electric milling blind groove processing on the second core plate comprises the following steps: and shooting the second core plate, measuring the expansion and contraction data, pre-discharging blind groove electric milling data on one side of the second core plate facing the first core plate according to the expansion and contraction data of the second core plate, and performing mirror image depth control electric milling of blind grooves according to the blind groove electric milling data.
4. The method for processing the nickel/gold immersion on the bottom of the PCB step slot as claimed in claim 3, wherein the step of processing the pp composite layer by an electric milling through slot comprises: performing FR4 light plate separation treatment on multiple pp, and positioning and laminating; performing electric milling on the pp composite layer pre-discharge through groove according to the expansion and contraction data of the second core plate, and pre-discharging and increasing the size of the through groove according to the glue overflow amount of pp; adjusting down electric milling parameters to control the temperature of the electric milling process to be lower than the pp resin curing temperature; and performing electric milling according to the through groove electric milling data.
5. The method of claim 4, wherein before laminating the first core board, the pp composite layer, and the second core board in sequence to obtain the PCB inner board, the expansion and shrinkage data of the first core board is measured, and it is determined that the expansion and shrinkage data of the first core board matches with the expansion and shrinkage data of the second core board.
6. The processing method for performing nickel and gold immersion on the bottom of the PCB step groove as recited in claim 1, wherein the step of performing depth-controlled uncovering electric milling on the second core plate comprises the following steps: measuring harmomegathus data of the PCB inner plate after post-processing, issuing uncovering electric milling data at a position, corresponding to the gold immersion PAD, on one side, far away from the first core plate, of the second core plate according to the harmomegathus data of the PCB inner plate, and carrying out electric milling according to the uncovering electric milling data.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010815413.0A CN111741618B (en) | 2020-08-14 | 2020-08-14 | Processing method for depositing nickel and gold on bottom of PCB step groove |
| PCT/CN2021/105724 WO2022033256A1 (en) | 2020-08-14 | 2021-07-12 | Processing method for electroless nickel immersion gold at bottom of step slot of pcb |
| KR1020227005083A KR20220035453A (en) | 2020-08-14 | 2021-07-12 | Processing method to deposit nickel/gold on the bottom of the PCB step groove |
| JP2022510819A JP7256927B2 (en) | 2020-08-14 | 2021-07-12 | Processing method for electroless nickel displacement gold plating on the bottom of PCB stepped grooves |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010815413.0A CN111741618B (en) | 2020-08-14 | 2020-08-14 | Processing method for depositing nickel and gold on bottom of PCB step groove |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111741618A true CN111741618A (en) | 2020-10-02 |
| CN111741618B CN111741618B (en) | 2020-11-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010815413.0A Active CN111741618B (en) | 2020-08-14 | 2020-08-14 | Processing method for depositing nickel and gold on bottom of PCB step groove |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7256927B2 (en) |
| KR (1) | KR20220035453A (en) |
| CN (1) | CN111741618B (en) |
| WO (1) | WO2022033256A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112752443A (en) * | 2020-12-05 | 2021-05-04 | 深圳市强达电路有限公司 | Processing method of printed circuit board with step position containing bonding structure |
| CN112770540A (en) * | 2020-12-05 | 2021-05-07 | 深圳市辉煌线路板有限公司 | Processing method of thick copper PCB with step position containing bonding structure |
| WO2022033256A1 (en) * | 2020-08-14 | 2022-02-17 | 博敏电子股份有限公司 | Processing method for electroless nickel immersion gold at bottom of step slot of pcb |
| CN114375092A (en) * | 2021-12-27 | 2022-04-19 | 珠海杰赛科技有限公司 | Blind slot plate with salt spray test requirement and manufacturing method thereof |
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- 2020-08-14 CN CN202010815413.0A patent/CN111741618B/en active Active
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- 2021-07-12 JP JP2022510819A patent/JP7256927B2/en active Active
- 2021-07-12 KR KR1020227005083A patent/KR20220035453A/en not_active Application Discontinuation
- 2021-07-12 WO PCT/CN2021/105724 patent/WO2022033256A1/en active Application Filing
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| WO2022033256A1 (en) * | 2020-08-14 | 2022-02-17 | 博敏电子股份有限公司 | Processing method for electroless nickel immersion gold at bottom of step slot of pcb |
| CN112752443A (en) * | 2020-12-05 | 2021-05-04 | 深圳市强达电路有限公司 | Processing method of printed circuit board with step position containing bonding structure |
| CN112770540A (en) * | 2020-12-05 | 2021-05-07 | 深圳市辉煌线路板有限公司 | Processing method of thick copper PCB with step position containing bonding structure |
| CN112770540B (en) * | 2020-12-05 | 2022-10-04 | 深圳市辉煌线路板有限公司 | Processing method of thick copper PCB with bonding structure at step position |
| CN114375092A (en) * | 2021-12-27 | 2022-04-19 | 珠海杰赛科技有限公司 | Blind slot plate with salt spray test requirement and manufacturing method thereof |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2022547264A (en) | 2022-11-11 |
| JP7256927B2 (en) | 2023-04-12 |
| CN111741618B (en) | 2020-11-24 |
| KR20220035453A (en) | 2022-03-22 |
| WO2022033256A1 (en) | 2022-02-17 |
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