JP2022547264A - Processing method for electroless nickel displacement gold plating on the bottom of PCB stepped grooves - Google Patents
Processing method for electroless nickel displacement gold plating on the bottom of PCB stepped grooves Download PDFInfo
- Publication number
- JP2022547264A JP2022547264A JP2022510819A JP2022510819A JP2022547264A JP 2022547264 A JP2022547264 A JP 2022547264A JP 2022510819 A JP2022510819 A JP 2022510819A JP 2022510819 A JP2022510819 A JP 2022510819A JP 2022547264 A JP2022547264 A JP 2022547264A
- Authority
- JP
- Japan
- Prior art keywords
- core board
- board
- pcb
- electric milling
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 46
- 238000007747 plating Methods 0.000 title claims abstract description 32
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 29
- 239000010931 gold Substances 0.000 title claims abstract description 29
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 28
- 229910052759 nickel Inorganic materials 0.000 title claims abstract description 23
- 238000003672 processing method Methods 0.000 title claims abstract description 16
- 238000006073 displacement reaction Methods 0.000 title claims abstract description 13
- 238000003801 milling Methods 0.000 claims abstract description 62
- 239000002131 composite material Substances 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 9
- 229920005989 resin Polymers 0.000 claims abstract description 9
- 238000012545 processing Methods 0.000 claims abstract description 8
- 239000011248 coating agent Substances 0.000 claims abstract 2
- 238000000576 coating method Methods 0.000 claims abstract 2
- 239000000463 material Substances 0.000 claims description 19
- 238000005520 cutting process Methods 0.000 claims description 15
- 230000008602 contraction Effects 0.000 claims description 13
- 238000002788 crimping Methods 0.000 claims description 6
- 238000012805 post-processing Methods 0.000 claims description 5
- 238000000059 patterning Methods 0.000 claims description 4
- 230000008685 targeting Effects 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims description 3
- 238000012216 screening Methods 0.000 claims 1
- 238000006467 substitution reaction Methods 0.000 abstract description 9
- 238000012360 testing method Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 150000002343 gold Chemical class 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/146—By vapour deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
本発明は、ＰＣＢ段差溝底部に無電解ニッケル置換金メッキを行う加工方法である。本方法では、第１コアボード（１０）に選択的金メッキ処理を行い、第２コアボード（３０）に盲溝の事前深度制御電気フライス切削処理を行い、第１及び第２コアボードにそれぞれ褐色化処理を行い、ｐｐ複合層（２０）に貫通溝の電気フライス切削処理を行い、第１コアボードの金メッキＰＡＤ（１１）、ｐｐ複合層の貫通溝及び第２コアボードの盲溝の位置を対応させ、第１コアボード、ｐｐ複合層及び第２コアボードをこの順に積層圧着してＰＣＢインナーボードを取得し、該ＰＣＢインナーボードの後処理を行い、第２コアボードに対して深度制御除覆電気フライス切削処理を行って金メッキＰＡＤを露出させる。本方法は、段差溝の深度を精確に制御し、段差溝の底部に樹脂が残留する問題を回避し、ＰＣＢ段差溝底部のＰＡＤに無電解ニッケル置換金メッキを行う需要を満足させる。【選択図】図１The present invention is a processing method for performing electroless nickel displacement gold plating on the bottom of a PCB stepped groove. In the method, a first core board (10) is subjected to a selective gold plating process, a second core board (30) is subjected to a blind slot pre-depth controlled electric milling process, and the first and second core boards are each subjected to a brown coating. The pp composite layer (20) is subjected to electric milling processing for through grooves, and the positions of the gold-plated PAD (11) of the first core board, the through grooves of the pp composite layer and the blind grooves of the second core board are determined. Correspondingly, the first core board, the pp composite layer and the second core board are stacked and pressed in this order to obtain a PCB inner board, the PCB inner board is post-processed, and the depth control removal is performed on the second core board. A cover electro-milling process is performed to expose the gold-plated PAD. The method precisely controls the depth of the stepped groove, avoids the problem of resin residue at the bottom of the stepped groove, and satisfies the demand of electroless nickel substitution gold plating on the PAD at the bottom of the PCB stepped groove. [Selection drawing] Fig. 1
Description
本発明はＰＣＢ加工工程に関し、特にＰＣＢ段差溝底部に無電解ニッケル置換金メッキを行う加工方法に関する。 BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a PCB processing process, and more particularly to a processing method for performing electroless nickel displacement gold plating on the bottom of a PCB stepped groove.
ＰＣＢ段差溝の底部に対する無電解ニッケル置換金メッキについては、業界内でもメーカーによって加工技術が異なっており、大きな分類の一つとしては機械深度制御フライス板があり、深度制御フライス板方式でステップボードを作成する場合は、主に段差溝の深度制御要求及び作成能力に依存している。もう一つの大きな分類としては、ガスケットクランプの充填／埋込があり、ガスケットクランプの充填／埋込方式でステップボードを作成する場合は、主に樹脂流し込み量の制御方法、段差溝付近のパターン及び孔の信頼性に依存している。上記の２種類の加工方式は、段差溝の形状を実現することはできるが、ＰＣＢ段差溝底部のＰＡＤに無電解ニッケル置換金メッキを行うという需要を満たしているわけではない。 Regarding the electroless nickel-immersion gold plating on the bottom of the PCB stepped groove, the processing technology differs depending on the manufacturer within the industry. When it is created, it mainly depends on the stepped groove depth control requirements and creation capability. Another major classification is the filling/embedding of gasket clamps. When creating a step board using the filling/embedding method of gasket clamps, mainly the control method of the amount of resin poured, the pattern near the stepped groove, and the Depends on hole reliability. Although the above two processing methods can achieve the shape of the stepped groove, they do not meet the demand of electroless nickel substitution gold plating on the PAD at the bottom of the PCB stepped groove.
本発明の目的は、ＰＣＢ段差溝底部に無電解ニッケル置換金メッキを行う加工方法を提供することにより、上記の従来技術に存在する問題（課題）を解決することにある。 SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems (problems) existing in the prior art by providing a processing method for performing electroless nickel displacement gold plating on the bottom of a PCB stepped groove.
本発明の前記ＰＣＢ段差溝底部に無電解ニッケル置換金メッキを行う加工方法は、まず第１コアボード及び第２コアボードに対してそれぞれ内層パターニングを行い、さらに、第１コアボードに選択的金メッキ処理を行い、第２コアボードに盲溝の事前深度制御電気フライス切削処理を行うステップと、前記第１コアボード及び第２コアボードにそれぞれ褐色化処理を行うステップと、ｐｐ複合層に貫通溝の電気フライス切削処理を行うステップと、第１コアボードの金メッキＰＡＤ、ｐｐ複合層の貫通溝及び第２コアボードの盲溝の位置を対応させるステップと、前記第１コアボード、ｐｐ複合層及び第２コアボードをこの順に積層圧着してＰＣＢインナーボードを得るステップと、前記ＰＣＢインナーボードに対して後処理を行うステップと、第２コアボードに対して深度制御除覆電気フライス切削処理を行って、第１コアボードの金メッキＰＡＤを露出させるステップと、を行う。 The processing method of the present invention for performing electroless nickel substitution gold plating on the bottom of the PCB stepped groove first performs inner layer patterning on the first core board and the second core board, and then selectively gold-plating the first core board. and subjecting a second core board to a blind groove pre-depth controlled electric milling process; subjecting the first core board and the second core board to a browning process respectively; and performing a through groove on the pp composite layer performing an electric milling process, matching the positions of the gold-plated PAD of the first core board, the through groove of the pp composite layer and the blind groove of the second core board, the first core board, the pp composite layer and the second The steps of stacking and crimping two core boards in this order to obtain a PCB inner board, performing post-processing on the PCB inner board, and performing depth-controlled uncovering electric milling cutting on the second core board. , and exposing the gold-plated PAD of the first core board.
前記第１コアボードに選択的金メッキ処理を行うステップとは、第１コアボードに、選択的ウェットフィルムのシルクスクリーン印刷、事前乾燥、選択的露光、現像をこの順で施して金メッキされていないＰＡＤを取得し、前記ＰＡＤ以外の部位を選択的インクで被覆し、前記ＰＡＤに無電解ニッケル置換金メッキ、脱膜乾燥をこの順で行い、金メッキＰＡＤを有する第１コアボードを得るというものである。 The step of selectively gold-plating the first core board includes silk-screen printing a selective wet film, pre-drying, selective exposure, and development in this order to form a non-gold-plated PAD on the first core board. is obtained, a portion other than the PAD is selectively coated with an ink, the PAD is subjected to electroless nickel substitution gold plating, and the film is removed and dried in this order to obtain the first core board having the gold-plated PAD.
前記第２コアボードに盲溝の事前深度制御電気フライス切削処理を行うステップとは、第２コアボードに対してターゲッティングを行い、かつ膨張収縮データを測定し、第２コアボードの膨張収縮データに基づいて第２コアボードの第１コアボードに対向する側に盲溝電気フライス切削材料を予備配置し、前記盲溝電気フライス切削材料に基づいて盲溝の鏡像深度制御電気フライス切削を行うというものである。 The step of subjecting the second core board to a blind groove pre-depth controlled electric milling process includes: targeting the second core board; measuring expansion and contraction data; pre-arranging a blind groove electric milling material on the side of the second core board facing the first core board according to the method, and performing mirror image depth control electric milling of the blind groove based on the blind groove electric milling material. is.
前記ｐｐ複合層に貫通溝の電気フライス切削処理を行うステップとは、複数枚のｐｐにＦＲ４光プレート分離処理、位置決め積層を行い、第２コアボードの膨張収縮データに基づいてｐｐ複合層に対して貫通溝電気フライス切削材料を予備配置し、かつｐｐのオーバーフロー量に基づいて貫通溝のサイズを予め拡大し、電気フライス切削パラメータを下げて電気フライス切削過程の温度をｐｐの樹脂硬化温度より低くなるよう制御し、貫通溝電気フライス切削材料に基づいて電気フライス切削を行うというものである。 The step of performing electric milling processing of through grooves on the pp composite layer includes performing FR4 optical plate separation processing and positioning lamination on a plurality of pp, and based on the expansion and contraction data of the second core board, the pp composite layer pre-position the through-groove electric milling material, and pre-enlarge the size of the through-groove according to the overflow amount of pp, reduce the electric milling cutting parameters to make the temperature of the electric milling process lower than the resin curing temperature of pp and perform electric milling based on the through-groove electric milling material.
前記第１コアボード、ｐｐ複合層及び第２コアボードをこの順に積層圧着してＰＣＢインナーボードを得る前に、まず前記第１コアボードの膨張収縮データを測定し、かつ第１コアボードと第２コアボードの膨張収縮データが整合していることを確認する。 Before obtaining a PCB inner board by stacking and crimping the first core board, the pp composite layer and the second core board in this order, first measure the expansion and contraction data of the first core board, and Confirm that the expansion/shrinkage data of the 2-core board is consistent.
第２コアボードに対して深度制御除覆電気フライス切削処理を行うステップとは、後処理を経たＰＣＢインナーボードの膨張収縮データを測定し、ＰＣＢインナーボードの膨張収縮データに基づいて、第２コアボードの第１コアボードから遠い方の側の、金メッキＰＡＤに対応する位置に除覆電気フライス切削材料を配置し、前記除覆電気フライス切削材料に基づいて電気フライス切削を行うというものである。 The step of performing a depth-controlled uncovering electric milling cutting process on the second core board includes measuring expansion and contraction data of the PCB inner board that has undergone post-processing, and based on the expansion and contraction data of the PCB inner board, the second core board An uncovered electric milling material is placed on the side of the board remote from the first core board, corresponding to the gold-plated PAD, and electric milling is performed based on the uncovered electric milling material.
本発明の前記ＰＣＢ段差溝底部に無電解ニッケル置換金メッキを行う加工方法の長所は、段差溝の深度を精確に制御するだけでなく、段差溝の底部に樹脂が残存する問題も回避しており、それと同時に、ＰＣＢ段差溝底部のＰＡＤに無電解ニッケル置換金メッキを行うというニーズも満たしているという点にある。本発明の詳細なステップに基づく加工では、設備に対して特に高い基準の要求はなく、一般的な工場の既存の条件に合っているので、他の設備を増設することなく大量生産を実現することができる。 The advantage of the processing method of performing electroless nickel substitution gold plating on the bottom of the PCB stepped groove according to the present invention is not only to precisely control the depth of the stepped groove, but also to avoid the problem of resin remaining at the bottom of the stepped groove. At the same time, it also satisfies the need to perform electroless nickel substitution gold plating on the PAD at the bottom of the PCB stepped groove. The processing based on the detailed steps of the present invention does not require particularly high standards for the equipment, and is suitable for the existing conditions of the general factory, so mass production can be achieved without adding other equipment. be able to.
本発明の前記ＰＣＢ段差溝底部に無電解ニッケル置換金メッキを行う加工方法では、多層ボードを圧着する前に、段差溝底部に対応する第１コアボードにまず選択的無電解ニッケル置換金メッキを行い、段差溝本体に対応する第２コアボードには盲溝の鏡像事前深度制御電気フライス切削を行い、同時に低流動樹脂のＰＰを準備し、かつ先に貫通溝を位置決めして電気フライス切削を行い、ＰＰ複合層を得る。その後、ボードの積層を行い、第１コアボードと第２コアボードの間にＰＰ複合層を配置し、圧着した後、通常のプロセスにより生産を行う。表面処理の完了後、深度制御除覆電気フライス切削、外形の電気フライス切削を行い、最終製品に段差溝を形成し、ＰＣＢ段差溝底部のＰＡＤの無電解ニッケル置換金メッキを実現する。そのうち、第１コアボード及び第２コアボードはいずれもＰＣＢボードの内層コアボードである。 In the processing method of performing electroless nickel displacement gold plating on the bottom of the PCB stepped groove according to the present invention, the first core board corresponding to the bottom of the stepped groove is first selectively electroless nickel substituted gold plated before crimping the multilayer board; The second core board corresponding to the stepped groove main body is subjected to blind groove mirror image pre-depth control electric milling, at the same time preparing low-flow resin PP, and first positioning the through groove and performing electric milling, A PP composite layer is obtained. After that, the boards are laminated, the PP composite layer is arranged between the first core board and the second core board, and after being pressed, the production is carried out by the normal process. After the surface treatment is completed, carry out depth-controlled stripping electric milling, outline electric milling, form the step groove in the final product, and realize the electroless nickel substitution gold plating of the PAD at the bottom of the PCB step groove. Among them, both the first core board and the second core board are the inner layer core boards of the PCB board.
具体的なプロセス及び製品構造は、図１および図２の通りである。 The specific process and product structure are shown in FIGS. 1 and 2.
まず、内層パターニングを作成する。内層パターニングでは、後続の加工位置決めに使用するために、３組のＸ－ＲＡＹターゲットを設定する。設定に基づいて、内層がエッチングされた第１コアボード１０及び第２コアボード３０を作成する。
First, inner layer patterning is created. Inner layer patterning sets up three sets of X-RAY targets for use in subsequent process positioning. Based on the settings, the
第１コアボードに選択的金メッキ処理を行う。選択的ウェットフィルムを内層がエッチングされた第１コアボード表面にシルクスクリーン印刷し、予備乾燥を経て選択的露光を行うと、現像後、金メッキが必要なＰＡＤが露出する。ボード面の他の位置を選択的インクで被覆し、無電解ニッケル置換金メッキを行い、さらに脱膜乾燥を行い、金メッキＰＡＤ１１が設けられた第１コアボードを得る。
A selective gold plating process is performed on the first core board. A selective wet film is silk-screen printed on the surface of the first core board with the etched inner layer, pre-dried, and selectively exposed to light. After development, the PADs requiring gold plating are exposed. Other positions on the board surface are coated with selective ink, electroless nickel displacement gold plating is performed, and the film is removed and dried to obtain the first core board provided with the gold-plated
第２コアボードに盲溝の事前深度制御電気フライス切削処理を行う。第２コアボードの内層エッチング後、ターゲッティングを行い、かつ膨張収縮データを測定する。第２コアボードの膨張収縮データに基づいて、第２コアボードの第１コアボードに対向する側に盲溝電気フライス切削材料３２を配置し、電気フライス盤の平坦性とＺ軸の進度を確認してＯＫであれば、第２コアボードに盲溝の鏡像深度制御電気フライス切削を行って、盲溝が設けられた第２コアボードを得る。
The second core board is subjected to a blind slot pre-depth controlled electric milling process. After etching the inner layer of the second core board, targeting is performed and expansion/shrinkage data is measured. Based on the expansion and contraction data of the second core board, place the blind groove electric
ｐｐ複合層に貫通溝の電気フライス切削処理を行う。切断後の複数のＰＰを利用してＦＲ４光プレート分離処理を行った後、ボードの縁に位置決め孔を開ける。第２コアボードの膨張収縮データに基づいて、貫通溝電気フライス切削材料２１を予備配置する。電気フライス切削する貫通溝の寸法は、圧着時に樹脂がＰＡＤに溢れないよう、ＰＰのオーバーフロー量に基づいて予め拡大しておかなければならない。電気フライス切削パラメータを下げることにより、電気フライス切削時に高温が発生してＰＰ溝辺縁の樹脂が硬化することを防止する。電気フライス盤上では比較的厚いＦＲ４光プレートを用いて底板とし、カバーボードの電気フライス切削にもＦＲ４光プレートを使用する。この過程では、電気フライス切削時に生じた紙屑やアルミ屑がＰＰ上に付着することを防止するために、ボール紙やアルミシートといった補助材料を使用することはできない。以上の貫通溝の電気フライス切削が完了すると、ＰＰ複合層２０の未積層ボードを得ることができる。
The pp composite layer is subjected to electric milling of through grooves. After FR4 optical plate separation process using multiple PPs after cutting, locating holes are drilled on the edge of the board. Based on the expansion/shrinkage data of the second core board, the through-slot
その後、第１コアボード及び第２コアボードをそれぞれ褐色化し、ボードの積層に備える。 The first core board and the second core board are then each browned in preparation for lamination of the boards.
第１コアボードの膨張収縮データを測定し、第２コアボードの膨張収縮データと整合することを確認した上で、第１コアボード、第２コアボードを組み合わせる。さらに、第１コアボード、ｐｐ複合層、第２コアボードをホットメルト及びリベットの方式で積層する。ボードの積層前に、第１コアボードの金メッキＰＡＤ、ｐｐ複合層の貫通溝及び第２コアボードの盲溝の位置を対応させる。 After measuring the expansion/shrinkage data of the first core board and confirming that they match the expansion/shrinkage data of the second core board, the first core board and the second core board are combined. Furthermore, the first core board, the pp composite layer and the second core board are laminated by hot melt and riveting. Before stacking the boards, the positions of the gold-plated PAD of the first core board, the through grooves of the pp composite layer and the blind grooves of the second core board are matched.
積層したボードを圧着し、圧着後、ターゲッティングを行い、縁をフライス切削してＰＣＢインナーボードを得る。 The laminated boards are crimped, and after crimping, the targeting is performed and the edges are milled to obtain the PCB inner board.
最後に、ＰＣＢインナーボードに対して、貫通孔４０の開設、銅メッキ、電気メッキ、外層配線、外層エッチング、抵抗溶接、キャラクタリゼーション、表面処理などの通常の後処理操作を行う。
Finally, the PCB inner board is subjected to normal post-processing operations such as opening through-
ＰＣＢインナーボードは、表面処理の後、まずターゲッティングを行い、かつ膨張収縮データを測定する。ＰＣＢインナーボードの膨張収縮データに基づいて、第２コアボードの第１コアボードに対向する側で、かつ金メッキＰＡＤに対応する位置に、除覆電気フライス切削材料３１を配置する。深度制御除覆電気フライス切削の前には、過度の深度制御により段差底部のＰＡＤを損傷しないよう、電気フライス盤の平坦性及びＺ軸の精度を確認してから、深度制御除覆電気フライス切削及び外形の電気フライス切削を行わなければならない。最終的に、段差ＰＣＢインナーボードの完成品を得て、段差溝底部ＰＡＤの無電解ニッケル置換金メッキ工程が実現される。
After surface treatment, the PCB inner board is first targeted and measured for expansion and contraction data. Based on the expansion and contraction data of the PCB inner board, place the uncovered electric
本発明の方法は、ＰＣＢ基板の段差溝底部のＰＡＤ上に無電解ニッケル置換金メッキを施すというものであり、その完成品は、冷熱衝撃テスト、高温テスト、低温テスト、高温高湿テスト、機械振動テストなど様々な信頼性テストにおいて異常が見られない。本発明は、段差溝の深度を精確に制御するばかりでなく、段差溝の底部に樹脂が残留する問題を回避しており、それと同時に、ＰＣＢ段差溝底部のＰＡＤに無電解ニッケル置換金メッキを行うという需要も満足させている。本発明の詳細なステップに基づく加工では、設備に対して特に高い基準の要求はなく、一般的な工場の既存の条件に合っているので、他の設備を増設することなく大量生産を実現することができる。 The method of the present invention is to apply electroless nickel displacement gold plating on the PAD at the bottom of the stepped groove of the PCB substrate, and the finished product is subjected to thermal shock test, high temperature test, low temperature test, high temperature and high humidity test, mechanical vibration test. No abnormalities are found in various reliability tests such as tests. The present invention not only precisely controls the depth of the stepped groove, but also avoids the problem of resin residue at the bottom of the stepped groove, and at the same time performs electroless nickel substitution gold plating on the PAD at the bottom of the PCB stepped groove. It also satisfies that demand. The processing based on the detailed steps of the present invention does not require particularly high standards for the equipment, and is suitable for the existing conditions of the general factory, so mass production can be achieved without adding other equipment. be able to.
当業者であれば、上記の技術手法及び構想に基づいて、他の各種の相応の変更や変形を行うことができるが、これらの変更及び変形は、すべて本発明の特許請求の範囲の保護範囲内に属するものとする。 Persons skilled in the art can make various other corresponding changes and modifications based on the above technical methods and concepts, which are all covered by the protection scope of the claims of the present invention. shall belong within
１０ 第１コアボード
１１ 金メッキＰＡＤ
２０ ｐｐ複合層
２１ 貫通溝電気フライス切削材料
３０ 第２コアボード
３１ 除覆電気フライス切削材料
３２ 盲溝電気フライス切削材料
４０ 貫通孔
10
20 pp
Claims (5)
さらに、第１コアボードに選択的金メッキ処理を行い、第２コアボードに盲溝の事前深度制御電気フライス切削処理を行うステップと、
前記第１コアボード及び第２コアボードにそれぞれ褐色化処理を行うステップと、
ｐｐ複合層に貫通溝の電気フライス切削処理を行うステップと、を行い、
前記第１コアボードに選択的金メッキ処理を行うステップは、第１コアボードに、選択的ウェットフィルムのシルクスクリーン印刷、事前乾燥、選択的露光、現像をこの順で施して金メッキされていないＰＡＤを取得し、前記ＰＡＤ以外の部位を選択的インクで被覆し、前記ＰＡＤに対して無電解ニッケル置換金メッキ、脱膜乾燥をこの順で行い、金メッキＰＡＤを有する第１コアボードを取得するものであり、
第１コアボードの金メッキＰＡＤ、ｐｐ複合層の貫通溝及び第２コアボードの盲溝の位置を対応させ、前記第１コアボード、ｐｐ複合層及び第２コアボードをこの順に積層圧着してＰＣＢインナーボードを取得し、
前記ＰＣＢインナーボードに対して後処理を行い、
第２コアボードに対して深度制御除覆電気フライス切削処理を行って、第１コアボードの金メッキＰＡＤを露出させることを特徴とする、ＰＣＢ段差溝底部に無電解ニッケル置換金メッキを行う加工方法。 First, in the processing method in which inner layer patterning is performed on the first core board and the second core board, respectively, and electroless nickel displacement gold plating is performed on the bottom of the PCB stepped groove,
further subjecting the first core board to a selective gold plating process and the second core board to a blind slot pre-depth controlled electric milling process;
browning the first core board and the second core board;
electro-milling the pp-composite layer with through grooves;
The step of selectively gold-plating the first core board includes: silk-screening a selective wet film, pre-drying, selectively exposing, and developing the first core board in this order to form a non-gold-plated PAD; A first core board having a gold-plated PAD is obtained by coating a portion other than the PAD with a selective ink, performing electroless nickel displacement gold plating on the PAD, and removing and drying the PAD in this order. ,
The positions of the gold-plated PAD of the first core board, the through groove of the pp composite layer and the blind groove of the second core board are aligned, and the first core board, the pp composite layer and the second core board are laminated and pressed in this order to form a PCB. get the inner board,
post-processing the PCB inner board,
A processing method for electroless nickel displacement gold plating on the bottom of a PCB stepped groove, wherein the second core board is subjected to a depth-controlled stripping electric milling cutting process to expose the gold-plated PAD of the first core board.
第２コアボードに対してターゲッティングを行い、かつ膨張収縮データを測定し、第２コアボードの膨張収縮データに基づいて第２コアボードの第１コアボードに対向する側に盲溝電気フライス切削材料を予備配置し、前記盲溝電気フライス切削材料に基づいて盲溝の鏡像深度制御電気フライス切削を行うものであることを特徴とする、請求項１に記載のＰＣＢ段差溝底部に無電解ニッケル置換金メッキを行う加工方法。 subjecting the second core board to a blind groove pre-depth controlled electric milling process comprising:
Targeting a second core board and measuring expansion/shrinkage data, blind groove electric milling cutting material on the side of the second core board opposite the first core board based on the expansion/shrinkage data of the second core board. is pre-arranged to carry out blind groove mirror image depth control electric milling cutting based on the blind groove electric milling cutting material. A processing method for gold plating.
複数枚のｐｐにＦＲ４光プレート分離処理、位置決め積層を行い、第２コアボードの膨張収縮データに基づいてｐｐ複合層に対して貫通溝電気フライス切削材料を予備配置し、かつｐｐのオーバーフロー量に基づいて貫通溝のサイズを予め拡大し、電気フライス切削パラメータを下げて電気フライス切削過程の温度をｐｐの樹脂硬化温度より低くなるよう制御し、貫通溝電気フライス切削材料に基づいて電気フライス切削を行うものであることを特徴とする、請求項２に記載のＰＣＢ段差溝底部に無電解ニッケル置換金メッキを行う加工方法。 The step of performing an electric milling process for through grooves in the pp composite layer includes:
FR4 optical plate separation processing, positioning lamination for multiple pp, pre-arrangement of through-groove electric milling cutting material for the pp composite layer according to the expansion and contraction data of the second core board, and the overflow amount of pp Based on the pre-enlargement of the size of the through-groove, reduce the electric milling cutting parameters to control the temperature of the electric milling process to be lower than the resin curing temperature of pp, and perform the electric milling according to the through-groove electric milling cutting material. 3. The processing method for performing electroless nickel displacement gold plating on the bottom of the PCB stepped groove according to claim 2, wherein:
後処理を経たＰＣＢインナーボードの膨張収縮データを測定し、ＰＣＢインナーボードの膨張収縮データに基づいて、第２コアボードの第１コアボードから遠い方の側の、金メッキＰＡＤに対応する位置に除覆電気フライス切削材料を配置し、前記除覆電気フライス切削材料に基づいて電気フライス切削を行うことを特徴とする、請求項１に記載のＰＣＢ段差溝底部に無電解ニッケル置換金メッキを行う加工方法。 The step of performing a depth controlled stripping electric milling process on the second core board comprises:
The expansion and contraction data of the PCB inner board after post-processing is measured, and based on the expansion and contraction data of the PCB inner board, the second core board is removed to the position corresponding to the gold-plated PAD on the far side from the first core board. 2. The processing method for performing electroless nickel displacement gold plating on the bottom of a PCB stepped groove according to claim 1, wherein a covering electric milling cutting material is arranged, and electric milling is performed based on the uncovering electric milling cutting material. .
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010815413.0A CN111741618B (en) | 2020-08-14 | 2020-08-14 | Processing method for depositing nickel and gold on bottom of PCB step groove |
| CN202010815413.0 | 2020-08-14 | ||
| PCT/CN2021/105724 WO2022033256A1 (en) | 2020-08-14 | 2021-07-12 | Processing method for electroless nickel immersion gold at bottom of step slot of pcb |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2022547264A true JP2022547264A (en) | 2022-11-11 |
| JP7256927B2 JP7256927B2 (en) | 2023-04-12 |
Family
ID=72658463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022510819A Active JP7256927B2 (en) | 2020-08-14 | 2021-07-12 | Processing method for electroless nickel displacement gold plating on the bottom of PCB stepped grooves |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7256927B2 (en) |
| KR (1) | KR20220035453A (en) |
| CN (1) | CN111741618B (en) |
| WO (1) | WO2022033256A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111741618B (en) * | 2020-08-14 | 2020-11-24 | 博敏电子股份有限公司 | Processing method for depositing nickel and gold on bottom of PCB step groove |
| CN112770540B (en) * | 2020-12-05 | 2022-10-04 | 深圳市辉煌线路板有限公司 | Processing method of thick copper PCB with bonding structure at step position |
| CN112752443A (en) * | 2020-12-05 | 2021-05-04 | 深圳市强达电路有限公司 | Processing method of printed circuit board with step position containing bonding structure |
| CN114375092B (en) * | 2021-12-27 | 2023-04-07 | 珠海杰赛科技有限公司 | Blind slot plate with salt spray test requirement and manufacturing method thereof |
| CN114585152A (en) * | 2022-03-30 | 2022-06-03 | 生益电子股份有限公司 | Printed circuit board and preparation method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60200968A (en) * | 1984-03-27 | 1985-10-11 | Toshiba Corp | Electroless plating method |
| JPH04188697A (en) * | 1990-11-19 | 1992-07-07 | Mitsubishi Electric Corp | Manufacture of multilayer printed wiring board |
| JPH0794628A (en) * | 1993-09-20 | 1995-04-07 | Eastern:Kk | Manufacture of multilayer printed wiring board for mounting semiconductor thereon |
| JPH08130373A (en) * | 1994-10-31 | 1996-05-21 | Elna Co Ltd | Manufacture of electronic part mounting board |
| JP2009158815A (en) * | 2007-12-27 | 2009-07-16 | Fujitsu Ltd | Method of manufacturing multilayer wiring board, and multilayer wiring board structure |
| CN103929884A (en) * | 2013-01-16 | 2014-07-16 | 深圳市牧泰莱电路技术有限公司 | Method for manufacturing printed circuit board with step slotted hole |
| CN109413893A (en) * | 2018-10-30 | 2019-03-01 | 珠海杰赛科技有限公司 | A kind of the lamination resistance gluing method and printed circuit board of blind slot printed circuit board |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10116235A1 (en) | 2001-03-31 | 2002-10-17 | Hydac Technology Gmbh | Hydropneumatic pressure accumulator |
| CN101662888B (en) * | 2009-09-28 | 2011-02-16 | 深南电路有限公司 | Preparation method for PCB plate with step trough |
| CN101845622B (en) * | 2010-06-01 | 2012-11-14 | 深南电路有限公司 | Immersion Ni/Au method of blind hole plate |
| CN102469689B (en) * | 2010-11-15 | 2013-05-08 | 深南电路有限公司 | Manufacturing process for PCB (Printed Circuit Board) step board |
| US9161461B2 (en) * | 2012-06-14 | 2015-10-13 | Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. | Multilayer electronic structure with stepped holes |
| CN103517560B (en) * | 2012-06-27 | 2017-02-15 | 深南电路有限公司 | Processing method of PCB stepped groove |
| CN104363720B (en) * | 2014-10-21 | 2017-08-11 | 深圳崇达多层线路板有限公司 | A kind of method for making deep blind slot in the pcb |
| CN104507261B (en) * | 2014-12-18 | 2017-10-27 | 安徽四创电子股份有限公司 | A kind of preparation method of the microwave printed board containing step groove |
| CN105657976A (en) * | 2016-01-19 | 2016-06-08 | 深圳崇达多层线路板有限公司 | Manufacturing method of entire-board nickel gold plating stepped board |
| CN105813393B (en) * | 2016-03-21 | 2019-05-21 | 东莞美维电路有限公司 | Selective turmeric board manufacturing method |
| KR101822849B1 (en) * | 2016-06-01 | 2018-01-30 | 주식회사 디에이피 | Accumulator |
| CN111741618B (en) * | 2020-08-14 | 2020-11-24 | 博敏电子股份有限公司 | Processing method for depositing nickel and gold on bottom of PCB step groove |
-
2020
- 2020-08-14 CN CN202010815413.0A patent/CN111741618B/en active Active
-
2021
- 2021-07-12 JP JP2022510819A patent/JP7256927B2/en active Active
- 2021-07-12 KR KR1020227005083A patent/KR20220035453A/en not_active Application Discontinuation
- 2021-07-12 WO PCT/CN2021/105724 patent/WO2022033256A1/en active Application Filing
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60200968A (en) * | 1984-03-27 | 1985-10-11 | Toshiba Corp | Electroless plating method |
| JPH04188697A (en) * | 1990-11-19 | 1992-07-07 | Mitsubishi Electric Corp | Manufacture of multilayer printed wiring board |
| JPH0794628A (en) * | 1993-09-20 | 1995-04-07 | Eastern:Kk | Manufacture of multilayer printed wiring board for mounting semiconductor thereon |
| JPH08130373A (en) * | 1994-10-31 | 1996-05-21 | Elna Co Ltd | Manufacture of electronic part mounting board |
| JP2009158815A (en) * | 2007-12-27 | 2009-07-16 | Fujitsu Ltd | Method of manufacturing multilayer wiring board, and multilayer wiring board structure |
| CN103929884A (en) * | 2013-01-16 | 2014-07-16 | 深圳市牧泰莱电路技术有限公司 | Method for manufacturing printed circuit board with step slotted hole |
| CN109413893A (en) * | 2018-10-30 | 2019-03-01 | 珠海杰赛科技有限公司 | A kind of the lamination resistance gluing method and printed circuit board of blind slot printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20220035453A (en) | 2022-03-22 |
| WO2022033256A1 (en) | 2022-02-17 |
| CN111741618A (en) | 2020-10-02 |
| JP7256927B2 (en) | 2023-04-12 |
| CN111741618B (en) | 2020-11-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7256927B2 (en) | Processing method for electroless nickel displacement gold plating on the bottom of PCB stepped grooves | |
| CN110139505B (en) | Manufacturing method of rigid-flex board with local flexible board layering | |
| TWI233771B (en) | Flexible rigid printed circuit board and method of fabricating the board | |
| CN110519912B (en) | PCB manufacturing method with embedded heat conductor and PCB | |
| CN110996503B (en) | Manufacturing method of high-heat-dissipation metal substrate | |
| CN104869764B (en) | A kind of preparation method of large scale precise circuit board | |
| CN108040430B (en) | Manufacturing method of copper-buried circuit board slotted hole | |
| CN110708859A (en) | Embedded copper block and manufacturing method for enhancing bonding force of embedded copper block | |
| CN102892257A (en) | Method for locally burying PCB (Printed Circuit Board) daughter board in PCB | |
| WO2017217138A1 (en) | Multilayer wiring board for inspection of electronic components | |
| CN111741615B (en) | Method for pressing and filling glue of blind hole with high thickness-diameter ratio | |
| CN110831350A (en) | Method for manufacturing bottomless copper circuit board | |
| CN111182743A (en) | Manufacturing method of ceramic-based circuit board | |
| JP6099902B2 (en) | Wiring board manufacturing method | |
| KR20030085211A (en) | Method for manufacturing a flexible printed circuit board with double side | |
| CN112752443A (en) | Processing method of printed circuit board with step position containing bonding structure | |
| CN104640345B (en) | Printed circuit board (PCB) and board, printed circuit board manufacturing method | |
| CN106604577A (en) | HDI circuit board manufacturing process capable of realizing accurate alignment | |
| CN101321436A (en) | Method of producing printed circuit board incorporating resistance element | |
| US9521754B1 (en) | Embedded components in a substrate | |
| CN113873764A (en) | Method for manufacturing resin jack panel with precise line | |
| CN109640520B (en) | Manufacturing method of buried resistance circuit board | |
| CN106132090B (en) | A kind of method of conductive pattern leveling in PCB | |
| CN112788851A (en) | Processing method of blind groove with plug-in hole | |
| CN115038253B (en) | Method for manufacturing multiple types of PADs (PAD area data) on circuit board accurately and equally |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20220308 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220308 |
|
| RD01 | Notification of change of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7426 Effective date: 20220308 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230314 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230331 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7256927 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |