CN110831350A - Method for manufacturing bottomless copper circuit board - Google Patents

Method for manufacturing bottomless copper circuit board Download PDF

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Publication number
CN110831350A
CN110831350A CN201911115288.6A CN201911115288A CN110831350A CN 110831350 A CN110831350 A CN 110831350A CN 201911115288 A CN201911115288 A CN 201911115288A CN 110831350 A CN110831350 A CN 110831350A
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CN
China
Prior art keywords
copper
free substrate
plate
grinding
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201911115288.6A
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Chinese (zh)
Inventor
胡小义
黄明安
何小国
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sihui Fu Shi Electronic Polytron Technologies Inc
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Sihui Fu Shi Electronic Polytron Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by Sihui Fu Shi Electronic Polytron Technologies Inc filed Critical Sihui Fu Shi Electronic Polytron Technologies Inc
Priority to CN201911115288.6A priority Critical patent/CN110831350A/en
Publication of CN110831350A publication Critical patent/CN110831350A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025Abrading, e.g. grinding or sand blasting
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Abstract

The invention discloses a method for manufacturing a bottomless copper circuit board, which comprises the following steps: cutting a copper-free substrate according to the size of the jointed board, and annealing the copper-free substrate; then sequentially grinding, sand blasting and volcanic ash plate grinding treatment are carried out on the copper-free substrate; sequentially carrying out copper deposition and full-plate electroplating to plate a copper layer on the surface of the copper-free substrate to form a copper-clad plate; manufacturing inner and outer layer circuits on the copper-clad plate by adopting a negative film process or a positive film process; and then sequentially manufacturing a solder mask layer, surface treatment and molding on the copper-clad plate to obtain the circuit board. The method improves the adhesive force of the surface of the copper-free substrate by a physical and chemical roughening method, and ensures that the electroplated copper layer is firmly combined with the base material.

Description

Method for manufacturing bottomless copper circuit board
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a method for manufacturing a bottomless copper circuit board.
Background
With the increasing requirements of circuit boards for manufacturing fine circuits, particularly when laser drilling boards with line widths and pitches less than or equal to 2mil/2mil are used for manufacturing fine circuits, a bottomless copper manufacturing method is one of the key technologies for realizing the process, but the existing bottomless copper circuit board manufacturing method has the problem of poor bonding force between copper and a base material.
In the prior art, a semi-additive method for thinning treatment by adopting a common copper foil is adopted, the copper foil with the thickness of 12 microns is required to be thinned to 7-9 microns at least, a plate grinding and micro etching before electroplating are required, and the thickness of copper is difficult to control; the substrate after drilling can not be thinned, hole copper can not be guaranteed, and the loss of copper is very large.
Also, the metallization of the substrate surface by high-tech methods, such as sputtering, requires the purchase of vacuum sputtering equipment, which is very costly and inefficient.
If the binding force between the electroplating copper deposition and the base material can be improved to manufacture the bottomless copper circuit board, the semi-additive production process can be well realized, the raw material purchasing cost can be greatly reduced, and the production efficiency is improved.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a method for manufacturing a bottomless copper circuit board, which improves the adhesive force of the surface of the bottomless copper circuit board and ensures that an electroplated copper layer is firmly combined with a base material by a physical and chemical roughening method.
In order to solve the technical problem, the invention provides a method for manufacturing a bottomless copper circuit board, which comprises the following steps of:
s1, cutting a copper-free substrate according to the size of the jointed board, and annealing the copper-free substrate;
s2, sequentially grinding, sand blasting and volcanic ash plate grinding treatment are carried out on the copper-free substrate;
s3, sequentially carrying out copper deposition and full-plate electroplating on the surface of the copper-free substrate to plate a copper layer to form a copper-clad plate;
s4, manufacturing an outer layer circuit on the copper-clad plate by adopting a negative film process or a positive film process;
and S5, sequentially manufacturing a solder mask layer on the copper-clad plate, and performing surface treatment and molding to obtain the circuit board.
Further, in step S1, the temperature during the annealing treatment was higher than the TG temperature of the copper-free substrate for 2 hours.
Further, in step S2, the copper-free substrate was polished with a 600-mesh abrasive belt.
Further, in step S2, the pressure for grinding, sand blasting and volcanic ash plate processing is 2.5 + -0.5 kg/cm2
Further, the following steps are included between steps S2 and S3:
and S21, performing glue removing treatment on the copper-free substrate.
Further, in step S3, the copper-free substrate is first subjected to three times of copper deposition and then to full-plate electroplating.
Further, the following steps are included between steps S4 and S5:
and S41, annealing the copper-clad plate with the manufactured outer layer circuit.
Further, in step S41, the temperature during the annealing treatment is controlled to 180. + -. 5 ℃ for 2 hours.
Further, in step S1, before the annealing process, a hole is drilled in the copper-free substrate.
Further, the copper-free substrate is an FR-4 plate.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, the copper-free substrate is annealed to eliminate the internal stress of the substrate and dry moisture, and then the surface of the substrate is fully roughened through a plurality of roughening procedures of grinding, sand blasting and volcanic ash grinding, so that the binding force between the substrate and the copper layer is enhanced, and the adhesion of the copper-free substrate is improved and the electroplated copper layer is firmly bound with the substrate by the physical and chemical roughening method; and annealing treatment is carried out again after the outer layer circuit is manufactured, so that the electroplated copper crystal lattice is improved, the internal stress matching degree of two different materials is improved, and moisture is removed. The binding force between the electroplated copper and the base material can be further increased; the invention adopts the method of directly electroplating copper on the copper-free substrate as the conducting layer, thereby realizing the thinning of the conducting layer and the manufacture of a refined circuit.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to specific embodiments.
Example 1
The method for manufacturing the bottomless copper circuit board shown in the embodiment sequentially comprises the following processing procedures:
(1) cutting: a copper-free substrate, preferably FR-4 board, is cut out in panel sizes of 520mm by 620 mm.
(2) Drilling: according to the existing drilling technology, holes are drilled on a copper-free substrate according to design requirements.
(3) Annealing: annealing the copper-free substrate for eliminating the internal stress of the base material and drying moisture; and the temperature during the annealing treatment is higher than the TG temperature of the copper-free substrate, and the time is 2 h.
(4) Grinding: grinding the annealed copper-free substrate by using a 600-mesh abrasive belt, and grinding the annealed copper-free substrate twice in a transverse and vertical manner respectively so as to fully coarsen the resin surface of the copper-free substrate and form strip scratches; the pressure during grinding is controlled to be 2.5 +/-0.5 kg/cm2
(5) Grinding a plate: carrying out sand blasting and volcanic ash plate grinding treatment on the copper-free substrate subjected to abrasive belt grinding in sequence, so that the surface of the copper-free substrate is further roughened on the basis of grinding marks after abrasive belt grinding, and the binding force is improved; the pressure during the sand blasting and the volcanic ash plate grinding is controlled to be 2.5 +/-0.5 kg/cm2
(6) Copper deposition: and (3) depositing a layer of thin copper on the plate surface and the hole wall by using an electroless copper plating method, and testing the backlight to 10 grades, wherein the thickness of the deposited copper in the hole is 0.5 mu m.
(7) Electroplating the whole plate: and carrying out full-board electroplating at the current density of 18ASF, and thickening the thicknesses of the hole copper and the board copper layer to form the copper-clad plate.
(8) Outer layer circuit manufacturing (negative film process): transferring outer layer pattern, coating photosensitive wet film or pasting dry film, and completing outer layer circuit exposure by 6-8 grids of exposure ruler (21 grids of exposure ruler) by adopting a full-automatic exposure machine; etching the outer layer, namely etching the exposed and developed copper-clad plate to form an outer layer circuit, wherein the line width of the outer layer is measured to be 2 mil; and (4) performing AOI on the outer layer, then checking the defects of open short circuit, line gap, line pinhole and the like of the inner layer line, performing scrapping treatment on the defects, and discharging the defect-free product to the next flow.
(9) Annealing: annealing the copper-clad plate with the manufactured outer layer circuit, and improving the crystal lattice of the electroplated copper, the internal stress matching degree of two different materials and removing moisture, so that the binding force between the electroplated copper and the base material can be further increased; and the temperature during the annealing treatment is controlled to be 180 +/-5 ℃ and the time is 2 h.
(10) Solder resist and silk screen printing of characters: after the solder resist ink is silk-screened on the surface of the copper-clad plate, the solder resist ink is cured into a solder resist layer through pre-curing, exposure, development and thermocuring treatment in sequence; specifically, TOP surface solder resist ink is printed by a white screen, and the TOP surface characters are added with UL marks, so that a protective layer which prevents bridging between circuits during welding and provides a permanent electrical environment and chemical corrosion resistance is coated on the circuits and the base materials which do not need to be welded, and the effect of beautifying the appearance is achieved.
(11) Surface treatment (nickel-gold deposition): the copper surface of the welding pad at the solder stop windowing position is communicated with a chemical principle, a nickel layer and a gold layer with certain required thickness are uniformly deposited, and the thickness of the nickel layer is as follows: 3-5 μm; the thickness of the gold layer is as follows: 0.05-0.1 μm.
(12) Electrical testing: testing the electrical conduction performance of the finished board, wherein the board use testing method comprises the following steps: flying probe test or jig test.
(13) Molding: according to the prior art, the shape is milled according to the design requirement, and the tolerance of the shape is +/-0.05mm, so that the circuit board is manufactured.
(14) FQC: according to the customer acceptance standard and the inspection standard of my department, the appearance of the circuit board is inspected, if a defect exists, the circuit board is repaired in time, and the excellent quality control is guaranteed to be provided for the customer.
(15) FQA: and (5) measuring whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the circuit board meet the requirements of customers or not again.
(16) Packaging: and hermetically packaging the circuit boards according to the packaging mode and the packaging quantity required by customers, putting a drying agent and a humidity card, and then delivering.
Example 2
The method for manufacturing the bottomless copper circuit board shown in the embodiment sequentially comprises the following processing procedures:
(1) cutting: a copper-free substrate, preferably FR-4 board, is cut out in panel sizes of 520mm by 620 mm.
(2) Drilling: according to the existing drilling technology, holes are drilled on a copper-free substrate according to design requirements.
(3) Annealing: annealing the copper-free substrate for eliminating the internal stress of the base material and drying moisture; and the temperature during the annealing treatment is higher than the TG temperature of the copper-free substrate, and the time is 2 h.
(4) Grinding: grinding the annealed copper-free substrate by using a 600-mesh abrasive belt, and grinding the annealed copper-free substrate twice in a transverse and vertical manner respectively so as to fully coarsen the resin surface of the copper-free substrate and form strip scratches; the pressure during grinding is controlled to be 2.5 +/-0.5 kg/cm2
(5) Grinding a plate: carrying out sand blasting and volcanic ash plate grinding treatment on the copper-free substrate subjected to abrasive belt grinding in sequence, so that the surface of the copper-free substrate is further roughened on the basis of grinding marks after abrasive belt grinding, and the binding force is improved; the pressure during the sand blasting and the volcanic ash plate grinding is controlled to be 2.5 +/-0.5 kg/cm2
(6) Removing glue: and (3) carrying out glue removal treatment on the copper-free substrate after the volcanic ash grinding plate is treated, and removing loose resin ground during abrasive belt grinding, sand blasting and volcanic ash grinding to form a firm microporous layer (a copper tooth forming layer) on the surface of the copper-free substrate.
(7) Copper deposition: a layer of thin copper is deposited on the plate surface and the hole wall by using an electroless copper plating method, and when copper is deposited, the copper-free substrate is subjected to three copper deposition procedures, so that the binding force between bottom copper and a base material is improved.
(8) Manufacturing an outer layer circuit (positive process): transferring an outer layer pattern, completing outer layer line exposure by using a full-automatic exposure machine and a positive film line film with 5-7 exposure rulers (21 exposure rulers), and forming an outer layer line pattern on the copper-clad plate through development; electroplating an outer layer pattern, then plating copper on the copper-clad plate, setting electroplating parameters according to the required finished copper thickness, wherein the copper plating is carried out for 60min by using the current density of 1.8 ASD; then sequentially stripping and etching, and etching (by using a differential etching mode, namely micro-position type flash etching) an outer layer circuit on the copper-clad plate; and the outer layer AOI uses an automatic optical detection system to detect whether the outer layer circuit has the defects of open circuit, gap, incomplete etching, short circuit and the like by comparing with CAM data.
(9) Annealing: annealing the copper-clad plate with the manufactured outer layer circuit, and improving the crystal lattice of the electroplated copper, the internal stress matching degree of two different materials and removing moisture, so that the binding force between the electroplated copper and the base material can be further increased; and the temperature during the annealing treatment is controlled to be 180 +/-5 ℃ and the time is 2 h.
(10) Solder resist and silk screen printing of characters: after the solder resist ink is silk-screened on the surface of the copper-clad plate, the solder resist ink is cured into a solder resist layer through pre-curing, exposure, development and thermocuring treatment in sequence; specifically, TOP surface solder resist ink is printed by a white screen, and the TOP surface characters are added with UL marks, so that a protective layer which prevents bridging between circuits during welding and provides a permanent electrical environment and chemical corrosion resistance is coated on the circuits and the base materials which do not need to be welded, and the effect of beautifying the appearance is achieved.
(11) Surface treatment (nickel-gold deposition): the copper surface of the welding pad at the solder stop windowing position is communicated with a chemical principle, a nickel layer and a gold layer with certain required thickness are uniformly deposited, and the thickness of the nickel layer is as follows: 3-5 μm; the thickness of the gold layer is as follows: 0.05-0.1 μm.
(12) Electrical testing: testing the electrical conduction performance of the finished board, wherein the board use testing method comprises the following steps: and testing the flying probe or the jig.
(13) Molding: according to the prior art, the shape is milled according to the design requirement, and the tolerance of the shape is +/-0.05mm, so that the circuit board is manufactured.
(14) FQC: according to the customer acceptance standard and the inspection standard of my department, the appearance of the circuit board is inspected, if a defect exists, the circuit board is repaired in time, and the excellent quality control is guaranteed to be provided for the customer.
(15) FQA: and (5) measuring whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the circuit board meet the requirements of customers or not again.
(16) Packaging: and hermetically packaging the circuit boards according to the packaging mode and the packaging quantity required by customers, putting a drying agent and a humidity card, and then delivering.
Example 3
The method for manufacturing the bottomless copper circuit board shown in the embodiment sequentially comprises the following processing procedures:
(1) cutting: a copper-free substrate, preferably FR-4 board, is cut out in panel sizes of 520mm by 620 mm.
(2) Drilling: according to the existing drilling technology, holes are drilled on a copper-free substrate according to design requirements.
(3) Annealing: annealing the copper-free substrate for eliminating the internal stress of the base material and drying moisture; and the temperature during the annealing treatment is higher than the TG temperature of the copper-free substrate, and the time is 2 h.
(4) Grinding: grinding the annealed copper-free substrate by using a 600-mesh abrasive belt, and grinding the annealed copper-free substrate twice in a transverse and vertical manner respectively so as to fully coarsen the resin surface of the copper-free substrate and form strip scratches; the pressure during grinding is controlled to be 2.5 +/-0.5 kg/cm2
(5) Grinding a plate: carrying out sand blasting and volcanic ash plate grinding treatment on the copper-free substrate subjected to abrasive belt grinding in sequence, so that the surface of the copper-free substrate is further roughened on the basis of grinding marks after abrasive belt grinding, and the binding force is improved; the pressure during the sand blasting and the volcanic ash plate grinding is controlled to be 2.5 +/-0.5 kg/cm2
(6) Removing glue: and (3) carrying out glue removal treatment on the copper-free substrate after the volcanic ash grinding plate is treated, and removing loose resin ground during abrasive belt grinding, sand blasting and volcanic ash grinding to form a firm microporous layer (a copper tooth forming layer) on the surface of the copper-free substrate.
(7) Copper deposition: and (3) depositing a layer of thin copper on the plate surface and the hole wall by using an electroless copper plating method, and testing the backlight to 10 grades, wherein the thickness of the deposited copper in the hole is 0.5 mu m.
(8) Electroplating the whole plate: and carrying out full-board electroplating at the current density of 18ASF, and thickening the thicknesses of the hole copper and the board copper layer to form the copper-clad plate.
(9) Resin hole plugging: and (4) plugging holes in the inner layer hole position with resin, and removing redundant resin on the surface of the board by using a water grinding abrasive belt machine.
(10) Plating covering copper: the full-plate electroplating is carried out with the current density of 18ASF, and the copper covering of the plug hole position is increased.
(11) Inner layer circuit manufacturing (negative film process): transferring the inner layer pattern, and completing inner layer circuit exposure by using a 6-8-grid exposure ruler (21-grid exposure ruler) by using a full-automatic exposure machine by coating a photosensitive wet film or a dry film; etching the inner layer, etching the exposed and developed copper-clad plate to form an inner layer circuit, wherein the line width of the inner layer is measured to be 2 mil; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
(12) Annealing: annealing the copper-clad plate with the manufactured outer layer circuit, and improving the crystal lattice of the electroplated copper, the internal stress matching degree of two different materials and removing moisture, so that the binding force between the electroplated copper and the base material can be further increased; and the temperature during the annealing treatment is controlled to be 180 +/-5 ℃ and the time is 2 h.
(13) And (3) laminating: the copper surface is coarsened through browning or blackening, so that the copper surface is conveniently and better combined with the prepreg; pre-assembling a copper-clad plate and an outer-layer prepreg in sequence according to requirements, and placing the number and the number of the prepregs required by design on two sides of the copper-clad plate to ensure the thickness of a dielectric layer; and then placing a release film outside the assembled prepreg, pressing a plate, detaching the plate, shooting a target position hole, routing edges and then sending to the next flow according to the program requirement to form the production plate.
(14) Grinding: grinding the production plate by using a 600-mesh abrasive belt, and grinding the production plate twice in a transverse and vertical manner respectively, so that the resin surface of the production plate is fully roughened to form strip-shaped scratches; the pressure during grinding is controlled to be 2.5 +/-0.5 kg/cm2
(15) Grinding a plate: sequentially carrying out sand blasting and volcanic ash plate grinding treatment on the production plate ground by the abrasive belt, further roughening the surface of the production plate on the basis of the grinding marks ground by the abrasive belt, and improving the binding force; the pressure during the sand blasting and the volcanic ash plate grinding is controlled to be 2.5 +/-0.5 kg/cm2。。
(16) Drilling: all through holes and tool holes are drilled according to prior art requirements.
(17) Laser hole drilling: using CO2And the laser machine grabs the alignment target hole according to the requirement to process a laser micropore.
(18) Removing glue: and (3) carrying out glue removing treatment on the production plate, and removing glue residues generated in the processes of pressing and drilling on the plate.
(19) Copper deposition: and (3) depositing a layer of thin copper on the plate surface and the hole wall by using an electroless copper plating method, and testing the backlight to 10 grades, wherein the thickness of the deposited copper in the hole is 0.5 mu m.
(20) Hole filling and electroplating: the via-filling plating was performed at a current density of 10ASF for the purpose of filling up the micro-holes.
(21) Whole plate thickening and electroplating: and (4) thickening and electroplating the whole plate, and thickening the thickness of the hole copper and the plate surface copper layer.
(22) Manufacturing an outer layer circuit (positive process): transferring an outer layer pattern, completing outer layer line exposure by using a full-automatic exposure machine and a positive film line film with 5-7 exposure rulers (21 exposure rulers), and forming an outer layer line pattern on a production board through development; electroplating an outer layer pattern, then plating copper on the production board, setting electroplating parameters according to the required finished copper thickness, wherein the copper plating is performed for 60min m by full-board electroplating at the current density of 1.8 ASD; then sequentially removing the film and etching to etch an outer layer circuit on the production board; and the outer layer AOI uses an automatic optical detection system to detect whether the outer layer circuit has the defects of open circuit, gap, incomplete etching, short circuit and the like by comparing with CAM data.
(23) Annealing: annealing the production board with the manufactured outer circuit for improving the electroplated copper crystal lattice, the internal stress matching degree of two different materials and removing moisture, and further increasing the binding force between the electroplated copper and the base material; and the temperature during the annealing treatment is controlled to be 180 +/-5 ℃ and the time is 2 h.
(24) Solder resist and silk screen printing of characters: after the solder resist ink is silk-screened on the surface of the copper-clad plate, the solder resist ink is cured into a solder resist layer through pre-curing, exposure, development and thermocuring treatment in sequence; specifically, TOP surface solder resist ink is printed by a white screen, and the TOP surface characters are added with UL marks, so that a protective layer which prevents bridging between circuits during welding and provides a permanent electrical environment and chemical corrosion resistance is coated on the circuits and the base materials which do not need to be welded, and the effect of beautifying the appearance is achieved.
(25) Surface treatment (nickel-gold deposition): the copper surface of the welding pad at the solder stop windowing position is communicated with a chemical principle, a nickel layer and a gold layer with certain required thickness are uniformly deposited, and the thickness of the nickel layer is as follows: 3-5 μm; the thickness of the gold layer is as follows: 0.05-0.1 μm.
(26) And electrical test: testing the electrical conduction performance of the finished board, wherein the board use testing method comprises the following steps: and testing the flying probe or the jig.
(27) And forming: according to the prior art, the shape is milled according to the design requirement, and the tolerance of the shape is +/-0.05mm, so that the circuit board is manufactured.
(28) FQC: according to the customer acceptance standard and the inspection standard of my department, the appearance of the circuit board is inspected, if a defect exists, the circuit board is repaired in time, and the excellent quality control is guaranteed to be provided for the customer.
(29) FQA: and (5) measuring whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the circuit board meet the requirements of customers or not again.
(30) And packaging: and hermetically packaging the circuit boards according to the packaging mode and the packaging quantity required by customers, putting a drying agent and a humidity card, and then delivering.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.

Claims (10)

1. A method for manufacturing a bottomless copper circuit board is characterized by comprising the following steps:
s1, cutting a copper-free substrate according to the size of the jointed board, and annealing the copper-free substrate;
s2, sequentially grinding, sand blasting and volcanic ash plate grinding treatment are carried out on the copper-free substrate;
s3, sequentially carrying out copper deposition and full-plate electroplating on the surface of the copper-free substrate to plate a copper layer to form a copper-clad plate;
s4, manufacturing inner and outer layer circuits on the copper-clad plate by adopting a negative film process or a positive film process;
and S5, sequentially manufacturing a solder mask layer on the copper-clad plate, and performing surface treatment and molding to obtain the circuit board.
2. The method of claim 1, wherein the annealing is performed at a temperature higher than the TG temperature of the copper-free substrate for 2h in step S1.
3. The method for manufacturing a bottomless copper circuit board according to claim 1, wherein in step S2, a 600-mesh abrasive belt is used to grind the copper-free substrate.
4. The method of claim 3, wherein the pressures of the grinding, sand blasting and volcanic ash plate polishing in step S2 are all 2.5 ± 0.5kg/cm2
5. The method of claim 1, further comprising the steps of, between steps S2 and S3:
and S21, performing glue removing treatment on the copper-free substrate.
6. The method of claim 1, wherein in step S3, the copper-free substrate is first subjected to three times of copper deposition and then to full-plate electroplating.
7. The method of claim 1, further comprising the steps of, between steps S4 and S5:
and S41, annealing the copper-clad plate with the manufactured outer layer circuit.
8. The method of claim 7, wherein in step S41, the temperature of the annealing process is controlled to 180 ± 5 ℃ for 2 hours.
9. The method of claim 1, wherein in step S1, the copper-free substrate is drilled before the annealing process.
10. The method of claim 1, wherein the copper-free substrate is an FR-4 board.
CN201911115288.6A 2019-11-14 2019-11-14 Method for manufacturing bottomless copper circuit board Pending CN110831350A (en)

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CN113056100A (en) * 2021-02-26 2021-06-29 惠州市金百泽电路科技有限公司 Manufacturing method of high-precision buried conductive carbon oil resistor printed circuit board
CN113573486A (en) * 2021-09-28 2021-10-29 广东科翔电子科技股份有限公司 RF-IC carrier plate manufacturing device and manufacturing method

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CN113573486A (en) * 2021-09-28 2021-10-29 广东科翔电子科技股份有限公司 RF-IC carrier plate manufacturing device and manufacturing method
CN113573486B (en) * 2021-09-28 2021-12-14 广东科翔电子科技股份有限公司 RF-IC carrier plate manufacturing device and manufacturing method

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Application publication date: 20200221