CN112788851A - Processing method of blind groove with plug-in hole - Google Patents
Processing method of blind groove with plug-in hole Download PDFInfo
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- CN112788851A CN112788851A CN202011581589.0A CN202011581589A CN112788851A CN 112788851 A CN112788851 A CN 112788851A CN 202011581589 A CN202011581589 A CN 202011581589A CN 112788851 A CN112788851 A CN 112788851A
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
Abstract
The application relates to a method for machining a blind groove with an insert hole. The method comprises the following steps: drilling a plug-in hole on the press-fit PCB; carrying out depth control back drilling on the plug-in holes to form a back drilling hole area; and carrying out integral blind gong on the back drilling hole area to form a plug-in hole blind groove. The scheme that this application provided can avoid because the filler clears away the bad phenomenon of welding that leads to unclean. Meanwhile, the problem that the quality of holes is reduced due to the fact that hole opening burrs appear on the direct blind gong of the plug-in hole or the blind gong pulls the hole is avoided.
Description
Technical Field
The application relates to the technical field of printed circuit boards, in particular to a method for machining blind grooves with plug-in holes.
Background
Along with PCB electronic product technical development and multi-functional demand, the blind slot design for installing components and parts or fixed product comes into force, and its main function has: the integral performance of the product is improved, the assembly density of the product is increased, signals are shielded, and the requirements of high speed and high information content of communication products are met.
The simple processing flow of the existing blind slot is divided into four steps: firstly, cutting, inner layer circuit and browning are carried out on the daughter board of the non-connecting layer; secondly, cutting the connecting laminated board, performing inner layer circuit-browning, pressing, drilling, plating holes, pasting red adhesive tape for protection, baking, grinding the board, filling filler (blue glue or green oil) for protecting plug holes, and performing browning; thirdly, drilling a mother board formed by pressing the daughter boards, depositing copper/board electricity, transferring an outer layer diagram, etching, welding resistance, character uncovering, forming, testing and FQC; finally, the filling material for the protective plug hole in the second step is removed by soaking and mechanical drilling.
According to the processing technology, the daughter board of the connecting layer is punched firstly, then the hole is filled with the filler, the daughter board is protected from being blocked by epoxy resin in the pressing process, and finally the filler in the hole is removed through the mechanical drill and the soaking method, but the filler in the compression joint hole cannot be completely removed in the soaking and mechanical drill mode, so that poor welding can be caused.
Disclosure of Invention
In order to overcome the problems in the related art, the application provides a processing method for blind grooves with plug-in holes, which can avoid bad welding caused by unclean filler removal and avoid the quality reduction of holes caused by the fact that hole apertures are burred or blind gongs are pulled to the holes due to the direct blind gongs of the plug-in holes.
The application provides a method for processing a blind slot with an insert hole in a first aspect, which comprises the following steps:
drilling a plug-in hole on the press-fit PCB;
carrying out depth control back drilling on the plug-in hole to form a back drilling hole area;
and carrying out integral blind gong on the back drilling hole area to form a plug-in hole blind groove.
In a first possible implementation method of the first aspect, the depth-control back drilling the insert hole includes:
and starting the full plate thickness detection height function, confirming drilling depth of the plug-in hole back drill, and performing depth control back drill according to the positive depth tolerance.
In a second possible implementation method of the first aspect, the performing an integral blind gong on the back-drilled hole area includes:
and (4) carrying out blind gong on the back drilling area by using a double-edge flat-head milling cutter, confirming the blind gong depth, and carrying out integral blind gong according to the depth negative tolerance.
In a third possible implementation method of the first aspect, before drilling the plug-in hole on the press-fit type PCB, the method further includes:
cutting, namely cutting the original copper-clad plate into plates which can be manufactured on a production line;
an inner layer circuit, the inner layer circuit comprising: inner layer grinding plate, inner layer film pasting, inner layer exposure, inner layer development, inner layer etching and inner layer film stripping;
browning, wherein chemical treatment is carried out to form microscopic rough and organic metal layers on the inner copper surface and enhance the bonding force among layers;
and (4) pressing, namely bonding the lines of each layer into a whole by means of the adhesiveness of the prepreg.
In combination with the third possible implementation of the method of the first aspect, in a fourth possible implementation of the method,
the inner layer grinding plate is used for removing oxidation of the copper-clad plate, increasing the roughness of the copper surface and facilitating the attachment of a film on the copper surface;
the inner layer film pasting is a step of pasting a dry film or a wet film on the processed substrate in a hot pressing or coating mode;
the inner layer exposure is a step of aligning a negative film on a substrate pressed with a dry film, and transferring the negative film pattern to a photosensitive dry film by using ultraviolet irradiation on an exposure machine;
the inner layer development is a step of dissolving and washing an unexposed dry film or wet film by using a developing solution and reserving an exposed part;
the inner layer etching is a step of dissolving and corroding the exposed copper surface by using etching liquid medicine to obtain a required circuit;
the inner layer stripping is a step of stripping the exposed dry film or wet film protecting the copper surface by using strong alkali to expose the circuit pattern.
In a fifth possible implementation method of the first aspect, before the step of performing depth-controlled backdrilling on the insert hole after the step of drilling the insert hole on the press-fit-type PCB to form the backdrilled blind slot region, the method further includes:
depositing copper, wherein the copper deposition is to perform oxidation-reduction reaction on the PCB after drilling in a copper deposition cylinder to form a copper layer so as to metallize holes, so that copper is deposited on the surface of the original insulating base material to achieve electrical communication between layers;
an outer layer map, the outer layer map comprising: outer layer film pasting, outer layer exposure and outer layer development.
With reference to the fifth possible implementation method of the first aspect, in a sixth possible implementation method,
the outer layer film pasting is a step of pasting a dry film or a wet film on the processed substrate in a hot pressing or coating mode;
the outer layer exposure is a step of aligning a negative film with a substrate pressed with a dry film, and transferring the negative film pattern to a photosensitive dry film by using ultraviolet irradiation on an exposure machine;
the outer layer development is a step of dissolving and washing away an unexposed dry film or wet film using a developing solution to leave an exposed portion.
In a seventh possible implementation method of the first aspect, the depth-control back drilling is performed on the plug-in hole, after a back-drilled hole blind groove region is formed, the back-drilled hole region is subjected to integral blind milling, and before a plug-in hole blind groove is formed, the method further includes:
etching the outer layer, wherein the etching of the outer layer is to dissolve and corrode the exposed copper surface by using etching liquid medicine to obtain a required circuit;
the outer layer solder mask is formed by coating solder mask ink on a board surface through screen printing or coating, exposing a disc to be welded to a hole through exposure and development, and covering a solder mask layer at other places to prevent short circuit during welding;
the outer layer character is formed by printing the required characters, trademarks or part symbols on the board surface in a screen printing mode and then exposing the characters on the board surface in an ultraviolet mode.
In an eighth possible implementation method of the first aspect, after the integrally blind milling the back-drilled hole area to form the blind slot of the plug-in hole, the method further includes:
forming, namely cutting the PCB into required external dimensions through a forming machine;
testing, namely testing the electrical property by simulating the state of the PCB and electrifying;
FQC, which is the last comprehensive inspection and testing of the product.
The technical scheme provided by the application can comprise the following beneficial effects: according to the scheme, the plug-in hole is drilled in the laminated PCB, then depth control back drilling is carried out on the plug-in hole, a back drilling hole area is formed, then integral blind milling is carried out on the back drilling hole area, and a plug-in blind groove is formed. The improved processing method comprises the steps of performing primary plug-in hole drilling operation on the PCB after primary press-forming, milling the unconnected layer to form a plug-in blind groove by using a blind gong, and not needing to drill plug-in holes independently on the daughter boards of the connected layer, so that the plug-in hole is not needed to be filled with fillers for protection, and poor welding caused by unclean filler removal is avoided. Meanwhile, the depth-controlled back drilling is carried out on the plug-in hole before the blind gong, and the problem that the hole quality is reduced due to the fact that an orifice is burred or the blind gong is pulled to the hole when the direct blind gong of the plug-in hole is generated is avoided.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
The foregoing and other objects, features and advantages of the application will be apparent from the following more particular descriptions of exemplary embodiments of the application, as illustrated in the accompanying drawings wherein like reference numbers generally represent like parts throughout the exemplary embodiments of the application.
Fig. 1 is a schematic flow chart of a plug-in hole blind groove machining method according to an embodiment of the present application;
FIG. 2 is another schematic flow chart of a blind slot machining method for an insert hole according to an embodiment of the present disclosure;
FIG. 3 is another schematic flow chart of a blind slot machining method for an insert hole according to an embodiment of the present disclosure;
Detailed Description
Preferred embodiments of the present application will be described in more detail below with reference to the accompanying drawings. While the preferred embodiments of the present application are shown in the drawings, it should be understood that the present application may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
It should be understood that although the terms "first," "second," "third," etc. may be used herein to describe various information, these information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present application. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
According to the existing PCB processing method with the plug-in hole blind slot, firstly, a daughter board of a connecting layer is punched, then, filler is filled in the hole, the daughter board is protected from being blocked by epoxy resin in the pressing process, finally, the filler in the hole is removed through a mechanical drill and a soaking method, but the filler in a crimping hole cannot be completely removed through the soaking and mechanical drill method, and the poor welding phenomenon can be caused.
In view of the above problems, the embodiment of the application provides a processing method with a blind groove of a plug-in hole, which can avoid bad welding caused by unclean filler removal, and can avoid hole burrs caused by direct blind gongs of the plug-in hole or hole pull caused by the blind gongs.
The technical solutions of the embodiments of the present application are described in detail below with reference to the accompanying drawings.
Fig. 1 is a schematic flow chart of a blind slot processing method with an insert hole according to an embodiment of the present application.
Referring to fig. 1 and 3, an embodiment of a blind groove processing method with an insert hole in an embodiment of the present application includes:
101. drilling a plug-in hole on the press-fit PCB;
pcb (printed Circuit board), which is called printed Circuit board in chinese, is an important electronic component, is a support for electronic components, and is a carrier for electrical connection of electronic components. It is called a "printed" circuit board because it is made using electronic printing.
And (3) classifying according to the circuit layer number: it is divided into single-sided boards, double-sided boards and multi-layer boards. The single panel is arranged on the most basic PCB, parts are concentrated on one surface, the wires are concentrated on the other surface, the single panel and the wires are the same surface when the surface mounted components exist, and the plug-in components are arranged on the other surface; the wiring is arranged on both sides of the double-sided board, but the wires on both sides are used, and proper circuit connection is needed between the two sides; to increase the area of a multilayer board that can be wired, more single-sided or double-sided wiring boards have been used. The multilayer board is produced through making inner layer pattern, printing and etching to form single or double sided base board, setting the base board between layers, and heating and pressurizing to adhere the single or double sided base board together.
In the embodiment of the application, the plug-in holes 301 corresponding to the pins of the plug-in devices are drilled at the corresponding positions of the multi-layer PCB which is bonded well and in which the plug-in devices need to be inserted, wherein the drilled plug-in holes are through holes penetrating through the whole circuit board.
102. Carrying out depth control back drilling on the plug-in holes to form a back drilling hole area;
the back drilling is a special depth control drilling, and both the back drilling and the depth control drilling utilize the drilling depth control function of a mechanical drilling machine to drill holes with certain depth so as to realize partial layer communication. For example, in the fabrication of a multilayer board, 12 layers are fabricated, which requires connecting layer 1 to layer 9, and usually we drill vias directly, but in this case, layer 1 is connected directly to layer 12, while in practice we only require connecting layer 1 to layer 9, and since there is no wire connection between layers 10 to 12, copper vias can affect signal integrity when communicating signals. The copper plated through holes of the layers without line connections are drilled away from the reverse side, ensuring signal integrity.
In the embodiment of the present application, the back-drilling drill 302 for the plug-in hole drilled in step 101 is subjected to depth control back drilling once to obtain a back-drilled hole 303, so as to form a back-drilled hole region.
103. And carrying out integral blind gong on the back drilling hole area to form a plug-in hole blind groove.
The blind gong is controlled deeply and mills, control deeply and mill and mean that PCB is through controlling CNC lower tool depth on its assigned position when the type preparation, mill out the dovetail groove that accords with the assembly demand, make PCB just the holding when can be through bayonet card on equipment or make plug-in components install PCB in the in-process of installation play fixed effect, its characteristics are when guaranteeing not to reduce panel thickness, practice thrift the space, make PCB and plug-in components or equipment be connected more stably.
In the embodiment of the present application, blind milling is performed on the back-drilled hole region generated by back drilling in step 102 by using a milling cutter 304 to form a blind slot 305 of the plug-in hole adapted to the corresponding plug-in device.
According to the scheme, the plug-in hole is drilled in the laminated PCB, then the plug-in hole is subjected to depth control back drilling, a back drilling area is formed, then the back drilling area is subjected to integral blind milling, and a plug-in hole blind groove is formed. The improved processing method comprises the steps of performing primary plug-in hole drilling operation on the PCB after primary press-forming, milling the unconnected layer to form a plug-in blind groove by using a blind gong, and not needing to drill plug-in holes independently on the daughter boards of the connected layer, so that the plug-in hole is not needed to be filled with fillers for protection, and poor welding caused by unclean filler removal is avoided. Meanwhile, the depth-controlled back drilling is carried out on the plug-in hole before the blind gong, and the problem that the hole quality is reduced due to the fact that an orifice is burred or the blind gong is pulled to the hole when the direct blind gong of the plug-in hole is generated is avoided.
For convenience of understanding, an application example of the insert hole blind groove machining method is provided below, and referring to fig. 2, an example of the insert hole blind groove machining method in the application example includes:
in embodiment 1, only the processing method of the PCB related to the blind slot portion of the plug-in hole is briefly described, and in the embodiment of the present application, a detailed complete processing method of the blind slot PCB of the plug-in hole will be shown.
201. Cutting, inner layer circuit, browning and pressing;
cutting, namely cutting the original copper-clad plate into plates which can be manufactured on a production line;
an inner layer line including: inner layer grinding plate, inner layer film pasting, inner layer exposure, inner layer development, inner layer etching and inner layer film stripping;
browning, wherein browning is chemical treatment to form microscopic rough and organic metal layers on the inner copper surface and enhance the interlayer bonding force;
and pressing, namely bonding the circuits of all layers into a whole by means of the adhesiveness of the prepreg.
In the embodiment of the application, the original copper-clad plate is firstly cut into the plate which can be manufactured on the production line, and then the inner layer is manufactured by the cut plate: removing oxidation of the cut copper-clad-plate removing plate and increasing the roughness of a copper surface; sticking a dry film on the copper-clad plate subjected to oxidation removal in a hot pressing mode; aligning an inner layer circuit diagram negative plate with the copper-clad plate pressed with the dry film, wherein the inner layer negative plate is a negative plate, and transferring a circuit pattern on the negative plate to the dry film by utilizing the ultraviolet irradiation of an exposure machine through the principle that the white light-transmitting part of the negative plate generates photopolymerization reaction and the black light-transmitting part does not generate photopolymerization reaction; dissolving and washing away the dry film of the part which does not generate photopolymerization reaction by using a developing solution, and allowing the part which generates photopolymerization reaction to remain on the substrate as a corrosion-resistant protective layer during etching; by utilizing the chemical reaction principle of CUcl2+ CU 2CUcl, copper which is not covered by a dry film on the copper-clad plate is corroded away by copper chloride, and a part which is covered and protected by the dry film is left, so that a circuit pattern is obtained; and finally, stripping the dry film covered on the circuit pattern by using a sodium oxide solution to expose the copper surface circuit pattern. Each inner layer is processed according to the flow to realize the printing of the corresponding electric circuit, and the electric circuits of the layers are different, so the used bottom sheets are different. After the printed circuit is finished, in order to coarsen the copper surface, the contact surface area of the copper surface and the resin is increased, and the wettability of the copper surface to flowing resin is increased, so that the blackening liquid medicine is used for blackening the circuit on the copper surface; in order to laminate the copper foil, the pp and the inner layer circuit board after oxidation treatment into a multilayer board, the inner layer boards processed according to the processing method are nailed together by rivets according to the design requirements, so that interlayer slippage caused by subsequent processing is avoided, then the pre-laminated boards are laminated into a multilayer board to be laminated, epoxy resin on the inner layer is melted at high temperature, and then the inner layer is laminated and bonded into a whole, thus preliminarily obtaining the laminated PCB.
202. Drilling a plug-in hole on the press-fit PCB;
in the embodiment of the present application, the specific content of step 201 is similar to that of step 101 in embodiment 1, and is not described herein again.
203. Copper deposition and outer layer pattern conversion;
copper deposition, wherein the copper deposition is that the PCB after drilling is subjected to oxidation-reduction reaction in a copper deposition cylinder to form a copper layer so as to carry out hole metallization on holes, so that copper is deposited on the surface of the original insulating base material to achieve electrical communication between layers;
the outer layer map comprises: outer layer film pasting, outer layer exposure and outer layer development.
In the embodiment of the application, the PCB with the punched plug-in hole is placed in a copper deposition cylinder after an uncut copper wire, uncut glass cloth and removed glue residues on the edge of the hole are removed after drilling, resin and glass fibers on a non-conduction part on the wall of the hole are metalized, so that chemical copper with the thickness of 20-40micro inch is deposited on the surface of the wall of the hole, and then the chemical copper with the thickness of 0.6-1mil is plated to protect the chemical copper with the thickness of 20-40micro inch from being damaged in the subsequent manufacturing process, so that the electrical property of each inner layer isolated by insulating materials can be the same; then, the outermost layer of the laminated PCB is printed with an electric circuit, and the specific printing steps are as follows: removing pollutants on the copper surface, increasing the roughness of the copper surface, sticking a dry film on an outer layer substrate of the PCB by a hot pressing method, and aligning a circuit negative film corresponding to the outer layer with the PCB, wherein the outer layer negative film is a white bottom black line, the negative film black line is a circuit, and the white bottom plate is a bottom plate. After contraposition, an exposure machine is used for exposure, the circuit pattern on the negative film is transferred to a dry film of the PCB, a developing solution is used for washing away the area which does not generate polymerization reaction, and the photosensitive part is not washed away because of the polymerization reaction and is remained on the copper surface to be an etching or electroplating barrier film.
204. Carrying out depth control back drilling on the plug-in holes to form a back drilling hole area;
and starting the full plate thickness detection function, confirming drilling depth of the plug-in hole back drill, and then performing depth control back drill according to the positive depth tolerance.
In the embodiment of the application, mechanical drilling machine is transferred into to corresponding back drilling procedure, beat the pin operation, beat the back after the pin, the PCB that will bore plug-in components hole is placed and is fixed in the corresponding position of processing mesa, open the thick detection function of full board of mechanical drilling machine, carry out the back drilling according to the positive tolerance of the degree of depth that the customer gave to one of them plug-in components hole earlier, carry out the back drilling according to the positive tolerance of the degree of depth and be greater than blind gong degree of depth for the back drilling degree of depth, just can not cause the drill way to appear and drape over one's hair when carrying out blind gong like this, whether the plug-in components hole after the test back drilling satisfies the demand, if satisfy the requirement, then carry out same accuse deep back drilling to other plug-in.
205. Etching the outer layer, welding the outer layer and character of the outer layer;
etching the outer layer, wherein the etching of the outer layer is to dissolve and corrode the exposed copper surface by using acid copper chloride to obtain a required circuit;
outer layer resistance welding, wherein the outer layer resistance welding is to coat a layer of resistance welding on the board surface through screen printing or resistance welding ink coating, expose a disc to be welded in a hole through exposure and development, and cover a resistance welding layer at other places to prevent short circuit during welding;
the outer layer characters are the characters, trademarks or part symbols required by the method of screen printing and then are exposed on the board surface in the mode of ultraviolet rays.
In the embodiment of the application, by using the chemical reaction principle of CUcl2+ CU ═ 2CUcl, copper which is not covered by the dry film in the step 203 is corroded by copper chloride, an electric circuit with a dry film protection part is left, and a corrosion resistant layer for protecting the copper surface is stripped by using strong alkali to expose an outer layer circuit pattern; the method comprises the steps of coating a layer of ink on the outer layer surface of the PCB through screen printing or solder resist ink coating, exposing and developing to expose a disc to be welded to a hole, covering a solder resist layer on other places, printing required characters, trademarks or part marks on a board surface through a screen printing mode, and exposing the board surface in an ultraviolet mode.
206. Carrying out integral blind gong on the back drilling hole area to form a plug-in hole blind groove;
and (4) carrying out blind gong on the back drilling area by using a double-edge flat-head milling cutter, confirming the blind gong depth, and carrying out integral blind gong according to the depth negative tolerance.
In the embodiment of the application, install the flat head sword of twolip earlier, call into blind gong machine to corresponding blind gong procedure, beat the pin operation, beat the pin after, change plastics pressure pad, place the PCB of back drilling good back drilling hole and fix in the corresponding position of processing mesa, carry out whole blind gong according to the degree of depth negative tolerance control that the customer gives, measure the blind groove of plug-in components hole that forms behind the blind gong, if reach customer's degree of depth demand, then carry out same whole blind gong to other PCBs that need processing.
207. Molding, testing and FQC;
molding, namely cutting the PCB into required overall dimensions through a molding machine;
testing, namely testing the electrical property by simulating the state of the PCB and electrifying;
FQC, FQC is the last comprehensive inspection and testing of the product.
In this application embodiment, with make-up machine PCB behind the blind gong cut into the required overall dimension of customer, then through the actual application condition of simulation PCB, carry out the detection of each electrical property for PCB circular telegram. After the PCB finishes all the manufacturing procedures and working procedures, the appearance, the size, the aperture and the performance of the PCB are comprehensively and once checked and tested by the first household, and the product is ensured to meet the use requirement.
The scheme shows a whole set of improved plug-in hole blind slot processing method: cutting, inner layer circuit, brown oxidation, pressing, plug hole drilling, copper precipitation, outer layer diagram turning, depth control back drilling, outer layer etching, outer layer resistance welding, outer layer characters, blind gong, molding, testing and FQC. The processing method ensures that poor welding caused by incomplete removal of fillers can not occur by drilling the plug-in hole after pressing; the back drilling with the positive depth tolerance is carried out before the blind groove, so that the phenomenon that the opening is burred or the hole is strained due to direct blind gong is avoided; meanwhile, the improved processing method only needs one-step drilling and one-step pressing, so that the processing flow is shortened, the processing method is easy to control, and the overall processing cost is reduced.
The aspects of the present application have been described in detail hereinabove with reference to the accompanying drawings. In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments. Those skilled in the art should also appreciate that the acts and modules referred to in the specification are not necessarily required in the present application. In addition, it can be understood that the steps in the method of the embodiment of the present application may be sequentially adjusted, combined, and deleted according to actual needs, and the modules in the device of the embodiment of the present application may be combined, divided, and deleted according to actual needs.
Having described embodiments of the present application, the foregoing description is intended to be exemplary, not exhaustive, and not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen in order to best explain the principles of the embodiments, the practical application, or improvements made to the technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.
Claims (9)
1. A blind slot processing method with an insert hole is characterized by comprising the following steps:
drilling a plug-in hole on the press-fit PCB;
carrying out depth control back drilling on the plug-in holes to form a back drilling hole area;
and carrying out integral blind gong on the back drilling hole area to form a plug-in hole blind groove.
2. The method for machining the blind slot with the insert hole as claimed in claim 1, wherein the depth-control back drilling of the insert hole comprises the following steps:
and starting the full plate thickness detection height function, confirming drilling depth of the plug-in hole back drill, and performing depth control back drill according to the positive depth tolerance.
3. The method for processing the blind slot with the plug-in hole according to claim 1, wherein the integrally milling the back drilling area comprises:
and (4) carrying out blind gong on the back drilling area by using a double-edge flat-head milling cutter, confirming the blind gong depth, and carrying out integral blind gong according to the depth negative tolerance.
4. The method for processing the blind slot with the plug-in hole according to claim 1, wherein before drilling the plug-in hole on the press-fit type PCB, the method further comprises the following steps:
cutting, wherein the cutting is to cut the original copper-clad plate into plates which can be manufactured on a production line;
an inner layer circuit, the inner layer circuit comprising: inner layer grinding plate, inner layer film pasting, inner layer exposure, inner layer development, inner layer etching and inner layer film stripping;
browning, wherein chemical treatment is carried out to form microscopic rough and organic metal layers on the inner copper surface and enhance the bonding force among layers;
and (4) pressing, wherein the pressing is a process of bonding the lines of all layers into a whole by means of the adhesiveness of the prepreg.
5. The processing method of the blind slot with the plug-in hole according to claim 4, wherein the inner grinding plate is used for removing oxidation of the copper-clad plate, increasing the roughness of the copper surface and facilitating the attachment of a film on the copper surface;
the inner layer film pasting is a step of pasting a dry film or a wet film on the processed substrate in a hot pressing or coating mode;
the inner layer exposure is a step of aligning a negative film with the substrate pressed with the dry film, and transferring the negative film pattern to the photosensitive dry film by using ultraviolet irradiation on an exposure machine;
the inner layer development is a step of dissolving and washing an unexposed dry film or wet film by using a developing solution and reserving an exposed part;
the inner layer etching is a step of dissolving and corroding the exposed copper surface by using etching liquid medicine to obtain a required circuit;
and the inner layer film stripping is a step of stripping the exposed dry film or wet film for protecting the copper surface by using strong alkali to expose the circuit pattern.
6. The method for processing the blind slot with the plug-in hole according to claim 1, wherein the depth-control back drilling of the plug-in hole after the drilling of the plug-in hole on the press-fit molded PCB is performed to form the back-drilled blind slot region, further comprising:
depositing copper, wherein the copper deposition is that the PCB after drilling is subjected to oxidation-reduction reaction in a copper deposition cylinder to form a copper layer so as to metallize holes, so that copper is deposited on the surface of the original insulating base material to achieve interlayer electrical communication;
an outer layer map, the outer layer map comprising: outer layer film pasting, outer layer exposure and outer layer development.
7. The method for processing the blind slot with the plug-in hole according to claim 6, wherein the outer layer is coated with a dry film or a wet film by hot pressing or coating;
the outer layer exposure is a step of aligning the negative film with the substrate pressed with the dry film, and transferring the negative film pattern to the photosensitive dry film by using ultraviolet irradiation on an exposure machine;
the outer layer development is a step of dissolving and washing away an unexposed dry film or wet film by using a developing solution to retain an exposed part.
8. The processing method of the blind slot with the plug-in hole according to claim 1, wherein the depth-controlled back drilling is performed on the plug-in hole, after the blind slot area of the back drilling hole is formed, the blind milling is performed on the whole blind slot area of the back drilling hole, and before the blind slot of the plug-in hole is formed, the processing method further comprises:
etching the outer layer, wherein the etching of the outer layer is to dissolve and corrode the exposed copper surface by using etching liquid medicine to obtain a required circuit;
the outer layer solder mask is formed by coating solder mask ink on the surface of the board through screen printing or coating, exposing a disc to be welded to a hole through exposure and development, and covering a solder mask layer at other places to prevent short circuit during welding;
the outer layer characters are characters of required characters, trademarks or part symbols printed on the board surface in a screen printing mode and then exposed on the board surface in an ultraviolet mode.
9. The processing method of the blind slot with the plug-in hole according to claim 1, wherein after the blind slot with the plug-in hole is formed by integrally milling the back drilling area, the method further comprises:
molding, wherein the molding is to cut the PCB into required external dimensions through a molding machine;
testing, wherein the test is to carry out electrical property inspection by simulating the state of the PCB and electrifying;
final quality control of FQC, which is the last comprehensive inspection and testing of a product.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011581589.0A CN112788851A (en) | 2020-12-28 | 2020-12-28 | Processing method of blind groove with plug-in hole |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011581589.0A CN112788851A (en) | 2020-12-28 | 2020-12-28 | Processing method of blind groove with plug-in hole |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113766769A (en) * | 2021-11-09 | 2021-12-07 | 四川英创力电子科技股份有限公司 | Manufacturing method of multilayer trapezoidal blind slot printed board |
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| US20160150653A1 (en) * | 2013-08-02 | 2016-05-26 | Peking University Founder Group Co., Ltd. | Manufacturing method for back drilling hole in pcb and pcb |
| CN107979922A (en) * | 2017-11-21 | 2018-05-01 | 生益电子股份有限公司 | A kind of production method and PCB of the PCB for being suitable for crimping device |
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2020
- 2020-12-28 CN CN202011581589.0A patent/CN112788851A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160150653A1 (en) * | 2013-08-02 | 2016-05-26 | Peking University Founder Group Co., Ltd. | Manufacturing method for back drilling hole in pcb and pcb |
| CN107979922A (en) * | 2017-11-21 | 2018-05-01 | 生益电子股份有限公司 | A kind of production method and PCB of the PCB for being suitable for crimping device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113766769A (en) * | 2021-11-09 | 2021-12-07 | 四川英创力电子科技股份有限公司 | Manufacturing method of multilayer trapezoidal blind slot printed board |
| CN113766769B (en) * | 2021-11-09 | 2022-02-01 | 四川英创力电子科技股份有限公司 | Manufacturing method of multilayer trapezoidal blind slot printed board |
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