CN110913586B - Manufacturing method of semi-flexible printed circuit board - Google Patents
Manufacturing method of semi-flexible printed circuit board Download PDFInfo
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- CN110913586B CN110913586B CN201911089125.5A CN201911089125A CN110913586B CN 110913586 B CN110913586 B CN 110913586B CN 201911089125 A CN201911089125 A CN 201911089125A CN 110913586 B CN110913586 B CN 110913586B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Abstract
The invention relates to the technical field of printed circuit board processing, and provides a manufacturing method of a semi-flexible printed circuit board, which comprises the following steps: s1, preprocessing; s2: pressing; s3, outer layer graphics; s4, carrying out depth control groove milling for the second time; and S5, post-processing. According to the manufacturing method of the semi-flexible printed circuit board, in the preprocessing process, the depth control core plate is subjected to depth control groove milling for the first time to obtain the blind groove, then the depth control core plate is subjected to depth control groove milling for the second time after lamination to obtain the through groove communicated with the blind groove, the requirement on depth control precision of equipment during depth control groove milling can be reduced through the depth control groove milling for two times, the problem that the depth control core plate is sunken after lamination can be avoided, the upper and lower alignment degree of the depth control groove milling for two times is good, and the problems of burrs and unevenness caused by dislocation are avoided, so that the yield of the semi-flexible printed circuit board is improved, and the quality standard requirement of the circuit board industry is met.
Description
Technical Field
The invention relates to the technical field of printed circuit board processing, in particular to a manufacturing method of a semi-flexible printed circuit board.
Background
The semi-flexible printed circuit board is a printed board which can be partially bent and is manufactured on the basis of a rigid printed board, the process technology belongs to a soft-hard combined board process technology, and is also called as a semi-flexible board, FR4 material is mainly adopted, the part needing to be bent is milled to be thin, the semi-flexible printed circuit board has certain flexibility, the supporting effect of the rigid printed board can be provided, the local bending can be realized according to the product requirements, including 45 degrees, 90 degrees and 180 degrees, and the mounting performance requirements of various types of three-dimensional assembly are met. Compared with a rigid-flexible half board, the semi-flexible printed circuit board has low manufacturing cost and high reliability. The common conventional manufacturing methods of the semi-flexible printed circuit board include a depth-controlled milling method, a windowing method and a groove-milling cover-uncovering method. The groove milling cover opening method is suitable for semi-flexible plates with conductor patterns on two surfaces of a flexible area, and the bending resistance times of the processed plates are high. However, the existing groove milling and cover uncovering method has the following problems that slight depression can be generated after the windowing region is pressed, glue overflow of the prepreg during pressing can affect the appearance and the bending degree of the board, the requirement of uncovering on the depth control precision of equipment in the processing method is too high, and the yield is low.
Disclosure of Invention
The invention aims to overcome the defects that slight depression is easily generated after a windowing region is pressed in the manufacturing process of the existing semi-flexible printed circuit board by adopting a groove milling cover opening method, and simultaneously, the appearance and the flexibility of a finished board are influenced by pressing overflow glue, the requirement on the depth control precision of equipment is overhigh, and the yield is lower.
The technical scheme adopted by the invention for solving the technical problems is as follows: a manufacturing method of a semi-flexible printed circuit board is characterized by comprising the following steps: s1, preprocessing: respectively preprocessing a semi-cured sheet, a bent core plate and a depth control core plate, wherein the preprocessing comprises prepreg preprocessing, bent core plate preprocessing and depth control core plate preprocessing, the bent core plate preprocessing is to carry out pattern transfer on the bent core plate to manufacture an inner layer circuit, the depth control core plate preprocessing is to carry out pattern transfer on the depth control core plate to manufacture an inner layer circuit and carry out first depth control groove milling processing on a depth control area, and a blind groove extending from a bottom surface to a top surface is obtained on the depth control core plate; s2: and (3) laminating: pressing the bent core plate, the depth control core plate and the prepreg to form a laminated plate; s3, outer layer pattern: processing an outer layer graph of the laminated plate; s4, second depth control groove milling: carrying out secondary depth control milling on the depth control core plate on the laminated plate, wherein the secondary depth control milling is carried out from the top surface of the depth control core plate to the bottom surface to form a through groove communicated with the blind groove; s5, post-processing: and post-processing the laminated board with the through groove to obtain the semi-flexible printed circuit board.
Further, the sum of the depth of the milling groove during the first depth control milling groove and the depth of the second depth control milling groove is larger than the thickness of the depth control core plate.
Further, the prepreg preprocessing comprises the following steps: cutting: obtaining a needed prepreg; drilling: manufacturing a positioning hole required by laser cutting on the prepreg; laser cutting: cutting the windowing area of the prepreg; punching: and manufacturing alignment holes required by the pressing on the prepreg.
Specifically, in the laser cutting step, the size of the windowing region is larger than the size of the blind groove or the through groove in the depth control core plate.
Further, the depth control core plate preprocessing further comprises a dust removal process of the depth control core plate after the depth control milling groove is milled for the first time.
Further, before the pressing step, performing expansion-shrinkage stacking: and performing expansion and contraction stacking treatment on the bent core plate and the depth control core plate, and stacking the bent core plate and the depth control core plate according to actually measured expansion and contraction values of the bent core plate and the depth control core plate.
Specifically, the expansion and contraction values of the bending core plate and the depth control core plate are controlled to be +/-0.03 mm.
Further, the pressing step includes: and (3) laminating pretreatment: performing brown oxidation treatment on the curved core plate and the depth control core plate; plate stacking: sequentially layering and pre-placing the depth control core plate, the prepreg and the bent core plate to obtain a plate blank; laminating: and carrying out compression molding on the plate blank to obtain the laminated plate.
Specifically, when the thickness of the depth control core plate is greater than 2.0mm, the stacking step is preceded by filling: and filling materials are placed in the blind grooves of the depth control core plate.
The manufacturing method of the semi-flexible printed circuit board provided by the invention has the beneficial effects that: in the preprocessing process, the depth control milling groove processing is firstly carried out on the depth control core plate for the first time to obtain a blind groove, then the depth control milling groove processing is carried out on the depth control core plate for the second time after the pressing to obtain a through groove communicated with the blind groove, the requirement on the depth control precision of equipment during the depth control milling groove can be reduced through the depth control milling groove processing for two times, the processing quality of the through groove can be ensured, the problem that the depth control core plate is sunken after the pressing can be avoided, the upper and lower alignment degree of the depth control milling grooves for two times is good, and the problem that burrs and unevenness are generated due to dislocation is avoided, the yield of the semi-flexible printed circuit board is improved, and the semi-flexible printed circuit board manufactured through the blind groove depth control technology can meet the quality standard requirement of the circuit board industry.
Drawings
Fig. 1 is a flowchart of a method for manufacturing a semi-flexible printed circuit board according to a first embodiment of the present invention;
FIG. 2 is a cross-sectional view of a semi-flexible printed circuit board assembly according to a first embodiment of the present invention;
fig. 3 is a front view of a semi-flexible printed circuit board in which a prepreg is cut by laser according to a first embodiment of the present invention;
fig. 4 is a bottom view of a depth control core board of a semi-flexible printed circuit board after a first depth control milling groove according to a first embodiment of the present invention;
FIG. 5 is a partial cross-sectional view A-A of FIG. 4;
FIG. 6 is a flow chart of a method for manufacturing a semi-flexible printed circuit board according to a second embodiment of the present invention;
fig. 7 is a flow chart illustrating a pressing step in a method for manufacturing a semi-flexible printed circuit board according to a second embodiment of the present invention.
In the figure: 100-semi-flexible printed circuit board, 10-prepreg, 11-windowing region, 20-depth control core board, 21-blind groove, 22-through groove, 30-bending core board, L1-windowing region of prepreg, L2-blind groove width, H1-blind groove depth and H2-depth control core board thickness.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1 to 7, a method for manufacturing a semi-flexible printed circuit board and a semi-flexible printed circuit board manufactured by the method are provided.
The first embodiment is as follows:
fig. 1 is a process flow chart of a method for manufacturing a semi-flexible printed circuit board according to a first embodiment of the present invention. Fig. 2 is a cross-sectional view of a semi-flexible printed circuit board manufactured by a method for manufacturing a semi-flexible printed circuit board according to a first embodiment of the invention. As shown in fig. 1 to 5, a method for manufacturing a semi-flexible printed circuit board according to a first embodiment of the present invention includes the steps of:
s1, preprocessing; the semi-cured sheet 10, the curved core plate 30 and the depth control core plate 20 are pretreated separately.
The preprocessing step comprises three procedures of prepreg preprocessing, bent core plate preprocessing and depth control core plate preprocessing.
Specifically, the prepreg preprocessing in the preprocessing step is mainly to perform windowing on the prepreg 10, and includes the following steps:
cutting: obtaining the required prepreg 10;
drilling: manufacturing a positioning hole required by laser cutting on the prepreg 10;
laser cutting: cutting is carried out in the windowing area 11 of the prepreg 10;
punching: and manufacturing alignment holes required by the pressing on the prepreg 10.
As shown in fig. 3, the prepreg 10 obtained in the preprocessing step provided by the present invention is shown. In the step of prepreg preprocessing, the size of the prepreg 10 required by the application is obtained by cutting, and the prepreg 10 provided by the invention is manufactured and processed by adopting a PP material. Then, in order to perform laser cutting on the prepreg 10 at the windowed area 11, a positioning hole (not shown) is drilled in the prepreg 10, the position of the windowed area 11 on the prepreg 10 is accurately determined through the positioning hole, and the windowed area 11 is cut by laser cutting. The windowed area 11 of the prepreg 10 corresponds to the position of the blind groove 21 or the through groove 22 of the depth control core plate 20 pressed with the same. In this embodiment, in order to ensure the quality and performance stability of the semi-flexible printed circuit board 100 after the prepreg 10 is subjected to lamination, and avoid excessive glue overflow or a glue filling cavity of the prepreg 10, the size of the windowing region 11 is larger than the size of the blind groove 21 or the through groove 22 in the depth control core board 20. As shown in fig. 3 and 4, the width of the windowed area 11 on the prepreg 10 is L1, and the width of the blind groove 21 on the depth control core plate 20 is L2, wherein the width L1 of the windowed area 11 is greater than the width L2 of the blind groove 21. Preferably, the size of the windowed area 11 is 0.15-0.25mm larger than the size of the blind slot 21. In the present embodiment, the width L1 of the window area 11 is 0.15mm greater than the width L2 of the blind groove 21. By the operation, the glue overflow amount of the non-glue prepreg during pressing can be effectively controlled to be less than or equal to 0.1 mm. Therefore, the quality of the prepreg 10 in the subsequent pressing operation process can be ensured, and the cost rate of the semi-flexible printed circuit board 100 is improved. Finally, a hole (not shown) is punched in the prepreg that is finished with the laser cutting. The alignment holes are used for aligning the prepreg 10 with the depth control core board 20 and the curved core board 30 in the laminating step, so that the superposed position size in the laminating step is ensured.
Specifically, in the preprocessing step, a curved core board preprocessing is further included, in which the inner layer circuit is manufactured by performing pattern transfer on the curved core board 30. The bending core plate 30 provided by the invention is manufactured by processing an FR4 substrate, and the thickness of the bending core plate is 0.1mm, so that the bending effect can be realized. The curved core plate preprocessing comprises the following steps: cutting, drilling, drying the film, etching, stripping the film and punching. The curved core board preprocessing step is a pattern transfer step which is common in the art and is not described herein again. After the curved core board preparation, a curved core board 30 having an inner layer wiring which can be subjected to lamination is produced.
Specifically, in the preprocessing step, depth control core board preprocessing is further included, where the depth control core board preprocessing is to perform first depth control groove milling processing on a depth control area after the depth control core board 20 is subjected to pattern transfer to obtain an inner layer circuit. After the first depth-control milling groove processing, a blind groove 21 extending from the bottom surface to the top surface is obtained on the depth-control core plate 20. The depth control core plate preprocessing comprises the following steps:
cutting: the depth control core plate 20 is manufactured by processing a FR4 material substrate, and the thickness of the depth control core plate 20 is 1.2 mm;
pattern transfer: preparing an inner layer circuit on the depth control core plate 20, wherein the inner layer circuit specifically comprises drilling, dry film, etching, film stripping and punching;
depth control groove milling for the first time: carrying out depth control groove milling on the depth control core plate 20 by adopting a depth control milling machine, wherein the depth control groove milling is carried out from the bottom surface to the top surface of the depth control core plate 20, and a blind groove 21 is obtained by reversely milling the depth control groove;
dust removal: and cleaning the depth control core plate 20, cleaning dust generated by the first depth control groove milling by using cleaning agents such as clear water and the like, and baking the depth control core plate 20 to remove residual moisture on the depth control core plate 20.
Specifically, in the manufacturing method of the semi-flexible printed circuit board provided by the present invention, as shown in fig. 5, in the preprocessing step, the depth control core board 20 is subjected to the first depth control groove milling. The depth H1 of the blind groove 21 obtained by the first controlled depth milling. The blind groove 21 obtained by the first depth-control groove milling makes a distance between the blind groove and the curved core plate 30 for the second depth-control groove milling in the subsequent processing process, so that the damage to the curved core plate 30 caused in the subsequent second depth-control groove milling processing process can be effectively avoided, and the integrity of the curved core plate 30 is ensured. The sum of the depth H1 of the first depth-control milling groove and the depth of the second depth-control milling groove is greater than the thickness H2 of the depth-control core plate 20, so that the depth of the two milling grooves can meet the requirement of depth-control milling groove. Meanwhile, if the depth H1 of the first depth-control milling groove is less than half of the thickness H2 of the depth-control core plate 20, the depth H1 of the first depth-control milling groove is smaller, the curved core plate is easily damaged during the second depth-control milling groove, the requirement on the precision of the second depth-control milling groove is too high, and the purpose of two-way milling grooves cannot be achieved. If the depth H1 of the first depth-control milling groove is greater than half of the thickness of the depth-control milling groove 20, the depth of the first depth-control milling groove is too large, and during the pressing step, due to the control of the pressing force and time, indentation marks are likely to occur at the bent core plate 30, and the depth-control core plate 20 is also likely to break during pressing, thereby affecting the circuit conduction functionality of the depth-control core plate 20.
The three processes of prepreg preprocessing, bent core board preprocessing and depth control core board preprocessing related in the preprocessing step of the manufacturing method of the semi-flexible printed circuit board provided by the invention can freely select the processing front and back, thereby respectively obtaining the prepreg 10, the depth control core board 20 and the bent core board 30 which can be used in the subsequent laminating step.
S2, pressing: pressing the bent core plate, the depth control core plate and the prepreg to form a laminated plate; the pressing comprises the following steps:
and (3) laminating pretreatment: performing brown oxidation treatment on the bent core plate and the depth control core plate; the purpose of the press-fit pretreatment is to generate an oxide film on the copper surface to increase the contact area of the remaining copper surface of the prepreg 10 and enhance the bonding strength between copper and resin in the press-fit process so as to meet the requirements of thermal impact and mechanical impact in the subsequent process of the semi-flexible printed circuit board 100, and the browning treatment specifically includes acid washing, oil removal, pre-dipping and browning, which is a common process operation process in the printed circuit board and is not described herein again.
Plate stacking: sequentially layering and pre-placing the depth control core plate 20, the prepreg 10 and the bent core plate 30 to obtain a slab; as shown in fig. 2, in this embodiment, the depth control core plates 20 and the curved core plates 30, which are subjected to inner layer patterning and browning, are respectively disposed on two sides of the prepreg 10 for lamination. The sequence of the laminated boards and the number of the laminated boards are determined according to the designed structure of the semi-flexible printed circuit board. The laminated plate is generally laminated by a pin positioning method or two positioning modes of riveting and fusing.
Laminating: and pressing and forming the plate blank to obtain the laminated plate. In this embodiment, the lamination is performed by using a no-flow prepreg dedicated lamination program, which includes 10 lamination steps, and the temperature, time and pressure in the different steps have different requirements. The curing temperature in the pressing program needs to be controlled to be higher than 180 ℃, and the pressing time is longer than 60 minutes. The laminated board manufactured by the laminating program has better quality and less glue overflow.
S3, outer layer pattern: the method for processing the outer layer graph of the laminated board specifically comprises the following steps: drilling, copper deposition/electroplating, outer layer pattern, outer layer AOI, first anti-welding treatment (the bending area needs to be windowed and developed out during silk-screen printing), inner layer pretreatment and second anti-welding treatment (silk-screen bending area). The outer layer pattern operation step is a manufacturing step in a conventional printed circuit board, and is not described herein again.
S4, second depth control groove milling: and (3) carrying out second depth control milling on the depth control core plate 20 on the laminated plate, wherein the second depth control milling is carried out to form a through groove 22 communicated with the blind groove 21 from the top surface of the depth control core plate 20 to the bottom surface. The depth control milling groove processing for the second time adopts a depth control gong machine to gong and groove the depth control area of the depth control core plate 20 from the front surface to the bottom surface, and a through groove 22 communicated with a blind groove obtained by the depth control milling groove processing for the first time is obtained. The through grooves 22 and the blind grooves 21 form depth control regions of the depth control core plate 20. The depth of the milled groove in the second depth control milling is greater than half of the thickness H2 of the depth control core plate 20. The required depth control area can be obtained by communicating the through groove 22 with the blind groove 21 only when the depth of the depth control milling groove of the second time is greater than half of the thickness H2 of the depth control core plate 20. In this embodiment, the depth of the second depth-control milling groove is half of the thickness of the depth-control core plate 20 and is further increased by 0.1 mm.
S5, post-processing: the laminated board having the through-groove 22 is post-processed to obtain the semi-flexible printed circuit board 100. The post-processing comprises the following steps: chemical pretreatment (removing a browning die of a bending area), surface treatment, forming, testing and FQC. The post-processing step is a conventional operation of the printed circuit board, so that the semi-flexible printed circuit board 100 manufactured by the processing meets the production requirements and reaches the shipment quality, and details are not repeated herein.
A method for manufacturing a semi-flexible printed circuit board 100 according to a first embodiment of the present invention, in the preprocessing process, firstly, the depth-control core plate 20 is subjected to first depth-control groove milling to obtain a blind groove 21, then, after lamination, the depth-control core plate 20 is subjected to second depth-control groove milling to obtain a through groove 22 communicated with the blind groove 21, and through twice depth-control groove milling processes, can reduce the requirement on the precision of the equipment when the depth control milling groove is carried out, can also ensure the processing quality of the through groove 22, moreover, the first depth-control milling groove can avoid the problem that the depth-control core plate 20 is sunken after being pressed, the upper and lower alignment degrees of the two depth-control milling grooves are good, and the problems of burrs and unevenness caused by dislocation are avoided, the yield of the semi-flexible printed circuit board 100 is improved, the semi-flexible printed circuit board 100 manufactured by introducing the blind groove reverse control depth process can meet the quality standard requirement of the circuit board industry.
Example two:
referring to fig. 6, a method for manufacturing a semi-flexible printed circuit board according to a second embodiment of the present invention is provided. The manufacturing method differs in that, in S2: an expansion and shrinkage stacking step is added before the pressing step. The expansion-contraction split is to actually measure the expansion-contraction values of the curved core plate 30 and the depth control core plate 20 which have been subjected to the preprocessing, and to split the curved core plate 30 and the depth control core plate 20 after the measurement. In this step, the expansion and contraction values of the curved core plate 30 and the depth control core plate 20 need to be controlled within ± 0.03mm, so that the depth control position of the depth control core plate 20 can be ensured to be matched with the bending connection position of the curved core plate 30 after lamination.
Meanwhile, at S4: and before the second depth control groove milling step, performing the step of expanding and contracting and stacking again, performing actual measurement on the laminated plate subjected to the outer layer graphic processing, and stacking the measured laminated plate. After the expanding and contracting piling is carried out before the second depth control milling groove step, the depth control milling groove operation for the second time can be carried out on the pressing plate by using the depth control gong machine with the CCD alignment function and the automatic expanding and contracting function in the second depth control milling groove step, so that the accuracy of the upper and lower milling groove alignment can be ensured.
Also, as shown in fig. 7, in the second embodiment provided by the present invention, at S2: a judging step is added in the pressing step, and when the thickness of the depth control core plate 20 is less than 2mm, the plate stacking step is directly carried out after the pressing pretreatment step; when the thickness of the depth control core plate 20 is larger than or equal to 2mm, filling is carried out before the plate stacking step in the pressing step, and fillers are placed in the blind grooves 21 of the depth control core plate 20. The filler is used for preventing the depth control core board 20 from sinking in the depth control area caused by the overlarge laminating time or pressure in the laminating step, and improving the yield of the semi-flexible printed circuit board 100 finished product. The filler can be core board particles made of FR4 material, and the height of the filler is less than or equal to the depth of the first depth control milling groove, namely the depth of the blind groove 21.
In the second embodiment of the present invention, the step of expanding and contracting and stacking is added in the method for manufacturing the semi-flexible printed circuit board provided in the first embodiment, so that the alignment accuracy between the deep core board 20 and the curved core board 30 during pressing can be effectively controlled, and the alignment accuracy of the upper and lower milling grooves during the second depth-controlled milling can also be effectively controlled. Meanwhile, when the depth control core board 20 is thick, a filling step is added, and the filler is filled in the blind groove 21, so that the problem that the depth control area of the depth control core board 20 is sunken in the laminating step of pressing is solved, the quality of a finished product of the semi-flexible printed circuit board 100 can be effectively guaranteed, the board thickness of each area of the semi-flexible printed circuit board 100 meets the design requirement, the semi-flexible printed circuit board is resistant to multiple bending, and the bending angle meets the installation requirements of 90 degrees and 180 degrees.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. A manufacturing method of a semi-flexible printed circuit board is characterized by comprising the following steps:
s1, preprocessing: respectively preprocessing a semi-solidified sheet, a bent core plate and a depth control core plate, wherein the preprocessing comprises prepreg preprocessing, bent core plate preprocessing and depth control core plate preprocessing, the prepreg with a windowing area is obtained in the prepreg preprocessing step, the bent core plate preprocessing is to carry out pattern transfer on the bent core plate to manufacture an inner layer circuit, the depth control core plate preprocessing is to carry out pattern transfer on the depth control core plate to manufacture the inner layer circuit and carry out first depth control groove milling processing on the depth control area, a blind groove extending from the bottom surface to the top surface is obtained on the depth control core plate, and the blind groove is located at the edge of the windowing area;
s2: and (3) laminating: pressing the bent core plate, the depth control core plate and the prepreg to form a laminated plate; the pressing step comprises: and (3) laminating pretreatment: performing brown oxidation treatment on the curved core plate and the depth control core plate; plate stacking: sequentially layering and pre-placing the depth control core plate, the prepreg and the bent core plate to obtain a plate blank; laminating: carrying out compression molding on the plate blank to obtain the laminated plate; the depth control core plate is thicker than 2.0mm, and filling is performed before the plate stacking step: placing fillers in the blind grooves of the depth control core plate;
s3, outer layer pattern: processing an outer layer graph of the laminated plate;
s4, second depth control groove milling: carrying out depth control milling on the depth control core plate on the laminated plate for the second time, wherein the depth control milling for the second time is to form a through groove communicated with the blind groove by milling the groove from the top surface to the bottom surface of the depth control core plate, and the sum of the depth of the milling groove during the first depth control milling and the depth of the depth control milling groove for the second time is greater than the thickness of the depth control core plate;
s5, post-processing: and post-processing the laminated board with the through groove to obtain the semi-flexible printed circuit board.
2. The method for manufacturing a semi-flexible printed circuit board according to claim 1, wherein the pre-processing of the prepreg comprises the steps of:
cutting: obtaining a needed prepreg;
drilling: manufacturing a positioning hole required by laser cutting on the prepreg;
laser cutting: cutting the windowing area of the prepreg;
punching: and manufacturing alignment holes required by the pressing on the prepreg.
3. The method for manufacturing a semi-flexible printed circuit board according to claim 2, wherein the size of the opening region in the laser cutting step is larger than the size of the blind groove or the through groove in the depth control core board.
4. The method of claim 1, wherein the pre-processing of the depth control core further comprises a dust removal process for the depth control core after the first depth control milling.
5. The method for manufacturing a semi-flexible printed circuit board according to claim 1, wherein a flood-and-shrink stacking is performed before the press-fitting step: and performing expansion and contraction stacking treatment on the bent core plate and the depth control core plate, and stacking the bent core plate and the depth control core plate according to actually measured expansion and contraction values of the bent core plate and the depth control core plate.
6. The method of claim 5, wherein the expansion and contraction values of the bending core board and the depth control core board are controlled to be +/-0.03 mm.
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| CN113301736A (en) * | 2021-05-21 | 2021-08-24 | 山东英信计算机技术有限公司 | Rigid-flex board, manufacturing method thereof and electronic product |
| CN113923900B (en) * | 2021-10-12 | 2023-10-13 | 中国电子科技集团公司第十四研究所 | Method for preparing microwave multilayer board by using thermoplastic bonding sheet |
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