CN113923900B - Method for preparing microwave multilayer board by using thermoplastic bonding sheet - Google Patents
Method for preparing microwave multilayer board by using thermoplastic bonding sheet Download PDFInfo
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- CN113923900B CN113923900B CN202111186238.4A CN202111186238A CN113923900B CN 113923900 B CN113923900 B CN 113923900B CN 202111186238 A CN202111186238 A CN 202111186238A CN 113923900 B CN113923900 B CN 113923900B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a method for preparing a microwave multilayer board by using a thermoplastic bonding sheet, which comprises the following steps: determining the number of layers of the multilayer board, the number and the positions of metal holes on each layer and the positions of in-layer output pieces of each layer according to the design diagram of the target microwave multilayer board; measuring the gumming quantity; calculating the grooving depth of the to-be-grooved; milling annular blind grooves around the periphery of the target metallization areas on the two sides of the inner laminate; the multi-layer microwave board is pressed and bonded by the bonding sheet; reversely milling blind grooves from the outer side of the microwave plate in the target metallization area on the inner layer plate in the multilayer microwave plate; hole metallization is performed on the microwave plate.
Description
Technical Field
The invention relates to the field of electricity, in particular to a method for preparing a microwave multilayer board by using a thermoplastic bonding sheet.
Background
At present, the conventional glue blocking of the microwave multilayer board with steps or ports is realized by adopting a mode of singly milling through grooves, blocking glue by a gasket or blocking glue by a high-temperature adhesive tape in the multi-time lamination process, removing excessive ports by laser, and the like. However, for the microwave multilayer printed board pressed by the thermoplastic bonding sheets, the bonding sheets can be pressed only once, and meanwhile, the problems of low glue content, uneven pressing thickness, high thermal expansion coefficient of materials, large deformation and the like of the bonding sheets exist, and the glue blocking cannot be performed by adopting a conventional method.
According to the invention, peripheral slotting is performed in the reverse direction, then milling is performed in the widening mode, and then uncovering is performed from the position outside the slotting, so that other problems caused by glue blocking of a thermoplastic bonding sheet for a microwave multilayer board and multilayer lamination are effectively solved.
Disclosure of Invention
The invention provides a method for manufacturing a microwave multilayer printed board by using a thermoplastic bonding sheet, which aims to solve the problems that a microwave multilayer printed board pressed by the thermoplastic bonding sheet can be pressed only once, and meanwhile, the bonding sheet has low glue content, uneven pressing thickness, high thermal expansion coefficient of materials, large deformation and the like, and can not adopt conventional glue blocking pads, adhesive tape protection and other methods to realize port glue blocking.
Specifically, the invention provides a method for preparing a microwave multilayer board by using a thermoplastic bonding sheet, which is characterized by comprising the following steps of:
step 1, determining the number of layers of a multilayer board, the number and positions of metal holes on each layer and the positions of in-layer output pieces of each layer according to a design drawing of a target microwave multilayer board;
step 2, measuring the gummosis amount of the unit length of the adhesive piece to be used at the target temperature and pressure;
step 3, calculating the grooving depth to be grooved according to the diameter of the milling cutter;
step 4, for each inner layer plate, milling annular blind grooves around the periphery of the target metallization areas on the two side surfaces of the inner layer plate;
step 5, arranging an adhesive sheet at a position between any two layers of plates, which is required to be bonded, wherein the adhesive sheet mills a corresponding through groove at a target metallization area, and the size of the through groove is matched with the periphery of the annular blind groove;
step 6, laminating the multi-layer microwave board and bonding by using the bonding sheet;
step 7, reversely milling blind grooves from the outer side of the microwave plate in the target metallized area on the inner layer plate in the multilayer microwave plate;
and 8, carrying out hole metallization on the microwave plate.
In a preferred implementation manner, the step 2 further includes determining the glue containing amount of the annular groove according to the glue flowing amountThe glue containing amount is made to be larger than the glue flowing amount, and the glue containing groove volume of the annular blind groove is calculated based on the following formula by substituting the glue density and the glue containing amount: m is m Glue containing amount ＝ρ Glue density ×V Volume of the glue containing groove 。
In another preferred implementation, the step 3 further includes calculating a grooving depth to be grooved according to the volume of the glue containing groove of the annular blind groove and the diameter of the milling cutter.
In another preferred implementation, the method further comprises removing port burrs and glue residues after the step 7.
In another preferred implementation, the method further comprises removing the unwanted area at the step in the microwave plate according to the blind slot position after milling the blind slot in step 7.
In another preferred implementation, the method further comprises, after said step 8, milling a blind slot at the port and uncovering the dead zone at the port.
In another preferred implementation, the step 7 includes: for the whole multi-layer board, determining whether reverse annular blind grooves exist on each single-layer board from outside to inside from two sides respectively, calculating blind milling depth from outside to inside for the single-layer board with the reverse annular blind grooves, and carrying out blind milling, wherein the blind milling width is equal to the width of the outer edge of the annular blind grooves, carrying out depth calculation reversely, and the depth is equal to Z 2 ＝N 1 *H 1 +N 2 *H 2 +H 1 -Z D Wherein N is 1 Indicating the number of single sheets contained in the annular blind groove, N 2 The number N of the bonding sheets with reverse annular blind grooves on the upper surface 2 ，H 1 Representing the full thickness of each individual sheet and H 2 And (3) removing redundant single-piece materials on the inner side of the annular blind groove by utilizing the cutting effect of the milled blind groove and the annular blind groove and exposing the corresponding conductive patterns of the ports according to the thickness of each bonding sheet after lamination.
The method comprises the following steps: firstly, determining a reverse annular blind groove from top to bottom, performing blind milling depth calculation from the upper part of the determined reverse annular blind groove, and firstly calculating the number N of single chips contained above the blind milling depth calculation 1 Then calculate the package above itThe number N of the adhesive sheets 2 Determining the complete thickness H of each individual sheet 1 Thickness H of each bonding sheet after lamination 2 Blind milling depth Z 2 ＝N 1 *H 1 +N 2 *H 2 +H 1 -Z D ，Z D Is the blind groove depth on the current monolith.
Based on the calculated blind groove depth Z 2 The blind groove is milled from top to bottom with the same or slightly wider width as the two sides of the reverse annular blind groove, and after the blind groove is milled, the single sheet on the inner side of the annular blind groove can be uncovered to expose the copper foil on the middle single sheet.
Next, the determination and blind milling of the reverse annular blind groove is continued downwards, and the above steps are repeated.
And after the searching and the blind milling of the reverse blind groove are performed from one side, the searching and the blind milling of the reverse blind groove are performed from the other side.
Technical effects
The method adopts the modes of double-sided reverse opening of the glue containing groove, reverse milling of the groove after lamination, uncovering and the like, and can achieve the purposes of low cost, high reliability and high efficiency of the microwave multilayer board by using the thermoplastic bonding sheet.
Drawings
Fig. 1 is a front view of the structural design of a microwave multiwall sheet (multiwall sheet overall configuration).
FIG. 2 is a schematic diagram of an 8-layer microwave printed board manufacturing process in an embodiment of the invention;
FIG. 3 is a schematic diagram of processing a single-piece glue-holding blind groove;
FIG. 4 is a schematic cross-sectional view of a laminated board (multi-layer board part) after single-chip number milling of blind slots;
FIG. 5 is a schematic cross-sectional view of a double-sided step-by-step milling depth-control blind groove after lamination;
FIG. 6 is a schematic diagram of a cross section of a double-sided step + port number milling depth control blind slot after hole metallization
Detailed Description
The present invention will be described in further detail with reference to examples and drawings, but embodiments of the present invention are not limited thereto.
Example 1:
the preparation method of the microwave multilayer board comprises the following steps:
step 1: and determining the number of layers of the multilayer board, the number and the positions of metal holes on each layer and the setting positions of the in-layer output pieces of each layer according to the design drawing of the multilayer board, and processing corresponding holes on each layer board at corresponding positions. In this example, a description of multilayer board preparation was made taking 8-layer boards as an example. The 8-layer board in the invention refers to a microwave multi-layer board which is composed of four single sheets, metal layers on two sides of the four single sheets and 3 bonding layers between the four single sheets.
And 2, measuring the gummosis amount of the unit length of the adhesive piece to be used at the target temperature and pressure. In this example, the adhesive sheet used was a 6700 adhesive sheet, which had a gummosis amount of 0.05g and a ρ density of 2.1g/cc.
Step 3, calculating the grooving depth to be grooved according to the diameter of the milling cutter; the milling cutter used in this example was 1.0mm or 2.0mm in diameter, with 1.0mm being used for this step and 2.0mm for the subsequent step.
The size design requirement of the blind groove: the cavity needs to hold the colloid that the bonding piece flowed to the port under pressure and high temperature effect in the lamination process down, avoids causing glue overflow to pollute the leading-out end, and simultaneously the cavity should not be too big, avoids port local crowded glues too much to influence the interlayer bonding, according to the formula: m is m Glue containing amount ＝ρ Glue density ×V Volume of the glue containing groove The 6700 adhesive sheet has a glue flow of 0.05g and a ρ density of 2.1g/cc, the diameter of the milling cutter is the groove width, the groove length is the circumference of the pre-blocking glue port, and the depth Z of the lower cutter is changed 1 The optimal size of the glue containing groove is obtained, and the schematic diagram of the glue containing groove is shown in figure 3.
Step 4: for each inner laminate, a circumferential blind groove is milled around the periphery of the targeted metallized area on both sides of the inner laminate. By milling the blind grooves around the periphery of the target area in a circumferential manner, excess glue of the adhesive sheet is introduced into the vacuum chamber adjacent to the blind grooves by means of the siphon principle when lamination is performed. In addition, in addition to the annular blind grooves around the target metallization region, for other edges where the adhesive sheet is located, if the edge is located inside the multilayer board, separate adhesive-containing blind grooves, such as the leftmost and rightmost blind grooves of the single sheet 3 in fig. 4, may be provided.
Step 5: and arranging adhesive sheets at positions where bonding is required between any two layers of plates, wherein corresponding through grooves are milled at the target metallization areas, and the sizes of the through grooves are matched with the peripheries of the annular blind grooves.
Step 6: after the step 4, laminating the processed single sheet and the bonding sheet according to the design requirement, and bonding by using the bonding sheet to form a microwave multilayer board, as shown in fig. 4;
step 7: after the step 6, the blind milling depth Z is calculated by calculating the depth difference value of the single chip and the annular blind groove 2 And reversely and blindly milling the glue containing groove corresponding to the subsequent port (milling through to reach the upper edge of the annular blind groove), and uncovering the redundant single-piece material on the inner side of the annular blind groove by utilizing the cutting effect of the milled blind groove and the annular blind groove to expose the corresponding conductive pattern of the port. Specifically, for the entire multi-layer board, it is determined from the outside to the inside whether or not a reverse annular blind groove exists on each single layer board, and for a single layer board with a reverse annular blind groove, the blind milling depth is calculated from the outside to the inside. More specifically, in this embodiment, the determination of the reverse annular blind groove is performed from top to bottom. With respect to the reverse annular blind groove on the left side of the single chip 2 in fig. 4, since the annular blind groove opening is at the lower side in fig. 4, depth calculation is performed reversely, i.e., blind milling depth calculation is performed from the upper side, and the number N of single chips contained above is calculated first 1 Then, the number N of the bonding sheets contained above the adhesive sheet is calculated 2 Determining the complete thickness H of each individual sheet 1 Thickness H of each bonding sheet after lamination 2 (in this embodiment, a uniform thickness calculation is used for all individual pieces and adhesive sheets), the blind milling depth Z 2 ＝N 1 *H 1 +N 2 *H 2 +H 1 -Z D ，Z D Is the blind groove depth on the current monolith.
Based on the calculated blind groove depth Z 2 From the slaveThe blind groove is milled with the width which is equal to the width of the two sides of the reverse annular blind groove downwards, after the blind groove is milled, as the two sides of the target area are cut through the annular blind groove, the upper part is also cut through the blind groove at the time, and the single piece at the inner side of the annular blind groove can be uncovered, so that the copper foil on the middle single piece 3 shown in figure 5 is exposed.
In addition, the left and right sides of the single sheets 3 and 4 in fig. 5 are blind milled to expose the lower copper foil on the single sheet 2 according to the design size requirements.
Next, the determination and blind milling of the reverse annular blind groove continues downward.
As shown in FIG. 5, there is another reverse blind groove on chip 3, this time N, since the material on chips 1 and 2 has been removed above it 1 And N 2 Equal to 0, Z 3 ＝H 1 -Z D 。
Based on the calculated blind groove depth Z 3 The blind groove is milled from top to bottom in the same width as the two sides of the reverse annular blind groove on the single sheet 3 and aligned with the annular blind groove, after the blind groove is milled, as the two sides of the target area are cut through the annular blind groove, the upper part is also cut through the blind groove at the time, the single sheet on the inner side of the annular blind groove can be torn off, and the copper foil on the middle single sheet 4 shown in fig. 6 is exposed.
On the basis of milling the blind grooves in fig. 5, further milling blind grooves with smaller sizes into the blind grooves, so that steps are formed in the microwave multilayer board. In order to realize such a configuration, it is necessary to design a small target area in the lower layer, align the target area with a larger-sized target area of the upper layer, and provide a small annular blind groove around the small target area, and provide a large annular blind groove around the large target area, so that the large annular blind groove of the upper layer is nested outside the annular blind groove of the lower layer. The upper layer and the lower layer of the present invention are opposite, and the blind grooves may be nested in a partial region with reference to the vertical direction shown in the figure, and in other regions, reverse blind grooves and target regions may be nested, and when the reverse nesting is performed, the annular blind grooves and the subsequent blind grooves for exposing the conductive regions are opened from the reverse direction.
And after the searching and the blind milling of the reverse blind groove are performed from one side, the searching and the blind milling of the reverse blind groove are performed from the other side. When designing, the conflict of target areas at two sides is avoided, namely, the blind grooves counted from one side are prevented from being staggered with the blind grooves at the other side.
In this embodiment, next, the reverse blind groove is searched from bottom to top, and because the left and right sides of the bottom have been blind milled due to design requirements, the reverse blind groove on the right side of the single chip 2 is first searched (where the reverse direction is opposite, the blind groove on the left side of the single chip 2 is reverse when seen from top to bottom, and the blind groove on the right side of the single chip 2 is reverse when seen from bottom to top).
Step 8: and carrying out hole metallization on the microwave board, removing port burrs and residual glue, and completing the preparation of the microwave multilayer board.
After said step 8, the blind slots are milled at the ports and the dead areas at the ports are uncovered.
The invention can adopt the thermoplastic bonding sheet to realize the one-step molding and bonding of the multi-layer board. The technology of the invention is suitable for realizing the microwave multilayer board pressed by the multilayer multi-blind-groove structure, the dense hole design, the low dielectric constant, the low loss factor substrate material and the low loss thermoplastic bonding sheet. Has the advantages of high gain, ultra wideband, low profile and light weight.
While the principles of the invention have been described in detail in connection with the preferred embodiments thereof, it should be understood by those skilled in the art that the foregoing embodiments are merely illustrative of the implementations of the invention and are not intended to limit the scope of the invention. The details of the embodiments are not to be taken as limiting the scope of the invention, and any obvious modifications based on equivalent changes, simple substitutions, etc. of the technical solution of the invention fall within the scope of the invention without departing from the spirit and scope of the invention.
Claims (5)
1. A method for preparing a microwave multilayer board by using a thermoplastic bonding sheet, which is characterized by comprising the following steps:
step (a)1. Determining the number of layers of the multilayer board, the number and the positions of metal holes on each layer and the positions of in-layer output pieces of each layer according to the design diagram of the target microwave multilayer board; step 2, measuring the glue flow amount of the unit length of the adhesive sheet to be used at the target temperature and pressure, determining the glue containing amount of the annular groove according to the glue flow amount, so that the glue containing amount is larger than the glue flow amount, and substituting the glue density and the glue containing amount to calculate the glue containing groove volume of the annular blind groove based on the following formula: m is m Glue containing amount =ρ Glue density ×V Volume of the glue containing groove The method comprises the steps of carrying out a first treatment on the surface of the Step 3, calculating the grooving depth of the to-be-grooved according to the diameter of the milling cutter, wherein the diameter of the milling cutter is the groove width, the groove length is the circumference of the pre-photoresist port, and the cutting depth Z is changed 1 Obtaining the size of the glue containing groove; step 4, for each inner layer plate, milling annular blind grooves around the periphery of the target metallization areas on the two side surfaces of the inner layer plate, and introducing redundant colloid of the bonding sheet into a vacuum cavity adjacent to the blind grooves by utilizing a siphon principle when lamination is carried out; step 5, arranging an adhesive sheet at a position between any two layers of plates, which is required to be bonded, wherein the adhesive sheet mills a corresponding through groove at a target metallization area, and the size of the through groove is matched with the periphery of the annular blind groove; step 6, laminating the multi-layer microwave board and bonding by using the bonding sheet; step 7, reversely milling blind grooves from the outer side of the microwave board in the target metallization area on the inner layer board in the multi-layer microwave board, wherein the method comprises the steps of respectively determining whether reverse annular blind grooves exist on each single layer board from the outside to the inside for the whole multi-layer board, calculating blind milling depth from the outside to the inside for a single piece with reverse annular blind grooves, carrying out blind milling, wherein the blind milling width is equal to the width of the outer edge of the annular blind grooves, reversely carrying out depth calculation, and the depth is equal to Z 2 =N 1 *H 1 +N 2 *H 2 + H 1 - Z D Wherein N is 1 Indicating the number of monoliths contained above the annular blind groove, N 2 Indicating the number of reverse bonding sheets above the annular blind groove, H 1 Representing the full thickness of each individual sheet and H 2 Indicating the thickness of each bonding sheet after lamination, Z D Indicating the depth of the annular blind groove on the single chip, and using the sameMilling the cutting effect of the blind groove and the annular blind groove, uncovering redundant single-piece materials on the inner side of the annular blind groove, and exposing the corresponding conductive pattern of the port; and 8, carrying out hole metallization on the microwave plate.
2. The method for preparing a microwave multi-layer board using a thermoplastic bonding sheet according to claim 1, wherein the step 3 further comprises calculating a grooving depth to be grooved according to a glue groove volume and a milling cutter diameter of the annular blind groove.
3. The method of microwave multilayer board production using thermoplastic bonding sheets according to claim 2, further comprising removing port burrs and remnants after step 7.
4. The method of microwave multilayer board manufacture using thermoplastic bonding sheets according to claim 1, further comprising removing the dead zone at the step in the microwave board according to the blind slot position after milling the blind slot in step 7.
5. The method of microwave multilayer board production using thermoplastic bonding sheets according to claim 1, further comprising, after step 8, milling blind slots at the ports and uncovering dead areas at the ports.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111186238.4A CN113923900B (en) | 2021-10-12 | 2021-10-12 | Method for preparing microwave multilayer board by using thermoplastic bonding sheet |
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| CN202111186238.4A CN113923900B (en) | 2021-10-12 | 2021-10-12 | Method for preparing microwave multilayer board by using thermoplastic bonding sheet |
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| CN113923900B true CN113923900B (en) | 2023-10-13 |
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