CN101090606A - Manufacturing method of circuit board - Google Patents
Manufacturing method of circuit board Download PDFInfo
- Publication number
- CN101090606A CN101090606A CNA2006100918818A CN200610091881A CN101090606A CN 101090606 A CN101090606 A CN 101090606A CN A2006100918818 A CNA2006100918818 A CN A2006100918818A CN 200610091881 A CN200610091881 A CN 200610091881A CN 101090606 A CN101090606 A CN 101090606A
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- CN
- China
- Prior art keywords
- circuit board
- copper foil
- type material
- separated type
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
This invention relates to a manufacturing method for circuit board, which utilizes a base board as the support to set hollow parting material with parting effect at its either side, and a back pressure copper foil is set at each outside of the parting material and an adhesive sheet is set at the outside of the copper foil forming a circuit sheet body with the copper layer and the back-pressure copper foil, after the circuit is finished, the edge of the circuit sheet body and the parting material are removed to separate the body and the base board.
Description
Technical field
The present invention relates to a kind of manufacture method of circuit board, refer in particular to and a kind ofly need not carry out the manufacture method of pressing plate pre-treatment with cost-effective circuit board.
Background technology
Because present electronic product volume is gradually towards the evolution of microminiaturization development trend, the electron product circuit that traditional hard printed circuit thin plate also can't meet small size fully is provided with demand, and therefore soft and thin circuits thin plate just is used on the electronic product widely.
Owing to will be convenient to the follow-up processing of circuit board, the substrate of must arranging in pairs or groups in the circuit moulding to be being used as support usefulness, according to the difference of forming method shaping circuit thin plate on substrate in regular turn.
Manufacture method (shown in Fig. 5,6) with present known circuit board includes: a hard substrate 60; One with the measure-alike tool double-sided adhesive of this hard substrate 60 and respectively be pasted with the sticking together on the sheet 61 of separated type material 62, on the separated type material 62 of the one side of sticking together sheet 61, cut out separated type material middle section 621 and the separated type material fringe region 622 that cuts out mutual separation in the hemisection mode;
In be provided with stick together sheet 61, separated type material 62 substrate 60 above and below in regular turn lamination multilayer circuit thin plate body 70 (multilayer circuit thin plate body 70 has copper foil plate 71) is arranged; The fringe region that will stick together sheet 61, separated type material 62 and 70 bondings of multilayer circuit thin plate body cuts removal, makes to lose stickiness between multilayer circuit thin plate body 70 and the substrate 60; Multilayer circuit thin plate body 70 can be separated with substrate 60.
Its shortcoming is: because copper foil plate 71 has the shortcoming that must carry out the pressing plate pre-treatment, need make etch processes to produce the concave, convex shape, produce tackness to increase with sticking together sheet 61, the separated type material fringe region 622 with separated type material 62 tears off again, the problem that can cause cost to increase.
An other shortcoming is: because follow-up processing, because of sticking together sheet 61 and copper foil plate 71 after sticking together mutually, can make the glue that sticks together on the sheet 61 attached on the circuit board, because of glue etc. is impurity, the dealer who makes circuit board must be removed impurity such as glue again, and the tank liquor in the meeting pollution groove causes puzzlement for the dealer who makes circuit board.
Summary of the invention
Main purpose of the present invention is to provide a kind of manufacture method that need not carry out the circuit board of pressing plate pre-treatment and escapable cost.
In order to reach the foregoing invention purpose, the manufacture method of circuit board of the present invention includes following steps:
One hard substrate is provided;
Combining the separated type material that central authorities form hollow with two outsides of hard substrate;
The outside at each separated type material is provided with the back-pressure Copper Foil respectively;
Each back-pressure Copper Foil outside is provided with the two-sided sheet that sticks together of all having a tackness respectively;
Respectively stick together the sheet outside copper metal layer is set respectively, form the circuit board body to stick together sheet, copper metal layer and back-pressure Copper Foil, above-mentioned structure pressing;
Cut vacancy in the formation in circuit board body edges zone and separated type material, the circuit board body is separated with substrate.
The present invention mainly is the setting by the back-pressure Copper Foil, because its surface roughness is that directly pressing forms, and need not carry out the pressing plate pre-treatment greater than the surface roughness of general copper foil plate, saves the cost purpose to reach.
Description of drawings
Fig. 1 is a manufacture method schematic diagram of the present invention.
Fig. 2 is the combination back schematic diagram of manufacture method of the present invention.
Fig. 3 is the plan view from above of the separated type material of tool through hole among the present invention.
Fig. 4 is the profile of the separated type material of tool through hole among the present invention.
Fig. 5 is the schematic diagram of the manufacture method of known circuit board.
Fig. 6 is the face upwarding view of known separated type material.
10 substrates
11 separated type materials
12 form hollow
20 back-pressure Copper Foils
30 stick together sheet
40 copper metal layers
50 circuit board bodies
51 cut
60 substrates
61 stick together sheet
62 separated type materials
621 separated type material middle sections
622 separated type material fringe regions
70 multilayer circuit thin plate bodies
71 copper foil plates
Embodiment
Please referring to shown in Fig. 1,2, the present invention is the manufacture method of circuit board, includes following steps:
One hard substrate 10 is provided;
Combining the separated type material 11 (shown in Fig. 1,3,4) that measure-alike central authorities form hollow 12 with two outsides of this hard substrate 10;
Measure-alike back-pressure Copper Foil 20 (rugosity of back-pressure Copper Foil 20 wherein is greater than the surface roughness of general copper foil plate) is set respectively in the outside of each separated type material 11;
Each back-pressure Copper Foil 20 outside be provided with respectively measure-alike and two-sided all have a tackness stick together sheet 30;
Respectively stick together sheet 30 outsides copper metal layer 40 is set respectively,, above-mentioned structure is laminated to stick together sheet 30, copper metal layer 40 and back-pressure Copper Foil 20 formation circuit board bodies 50;
Cut 51 formation hollow 12 places (as shown in Figure 2) in circuit board body 50 fringe regions and separated type material 11, circuit board body 50 and substrate 10 are separated from each other.
In addition, above-mentioned circuit board body 50 required processing method of carrying out in addition when moulding is identical with general existing circuit board fabrication and processing method, its detailed description of Therefore, omited.
In the present invention, owing to be setting by back-pressure Copper Foil 20, because its surface roughness is greater than the surface roughness of general known copper foil plate, thereby, need not do the pressing plate pre-treatment and can direct pressing form sandwich construction, need not to buy in addition copper foil plate, and the present invention is because of carrying out the pressing plate pre-treatment fully and not needing to buy in addition copper foil plate, thereby, can reach cost-effective purpose.
Above-mentioned embodiment is only in order to explanation the present invention, and non-limiting the present invention.
Claims (2)
1. the manufacture method of a circuit board is characterized in that, includes following steps:
One hard substrate is provided;
Combining the separated type material that central authorities form hollow with two outsides of hard substrate;
The back-pressure Copper Foil is established in the outside of each separated type material respectively;
Each back-pressure Copper Foil outside is provided with the two-sided sheet that sticks together of all having a tackness respectively;
Respectively stick together the sheet outside copper metal layer is set respectively, form the circuit board body to stick together sheet, copper metal layer and back-pressure Copper Foil, and above-mentioned structure is laminated;
Cut vacancy in the formation in circuit board body edges zone and separated type material, the circuit board body is separated with substrate.
2. the manufacture method of circuit board as claimed in claim 1 is characterized in that, the surface roughness of described back-pressure Copper Foil is greater than the surface roughness of general copper foil plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006100918818A CN101090606A (en) | 2006-06-13 | 2006-06-13 | Manufacturing method of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006100918818A CN101090606A (en) | 2006-06-13 | 2006-06-13 | Manufacturing method of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101090606A true CN101090606A (en) | 2007-12-19 |
Family
ID=38943694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006100918818A Pending CN101090606A (en) | 2006-06-13 | 2006-06-13 | Manufacturing method of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101090606A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101742820B (en) * | 2008-11-12 | 2011-10-12 | 厦门弘信电子科技有限公司 | Productive technology of flexible printed circuit board |
| CN104113996B (en) * | 2014-06-30 | 2017-03-08 | 江苏博敏电子有限公司 | A kind of method improving double-sided copper-clad core substrate interlayer harmomegathus and a kind of double-sided copper-clad core substrate |
| CN108200737A (en) * | 2017-12-22 | 2018-06-22 | 深圳市景旺电子股份有限公司 | A kind of production method of high frequency mixed pressure HDI plates |
| CN113038718A (en) * | 2021-01-27 | 2021-06-25 | 红板（江西）有限公司 | Ultra-thin PCB laminating process |
-
2006
- 2006-06-13 CN CNA2006100918818A patent/CN101090606A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101742820B (en) * | 2008-11-12 | 2011-10-12 | 厦门弘信电子科技有限公司 | Productive technology of flexible printed circuit board |
| CN104113996B (en) * | 2014-06-30 | 2017-03-08 | 江苏博敏电子有限公司 | A kind of method improving double-sided copper-clad core substrate interlayer harmomegathus and a kind of double-sided copper-clad core substrate |
| CN108200737A (en) * | 2017-12-22 | 2018-06-22 | 深圳市景旺电子股份有限公司 | A kind of production method of high frequency mixed pressure HDI plates |
| CN108200737B (en) * | 2017-12-22 | 2019-11-22 | 深圳市景旺电子股份有限公司 | A kind of production method of high frequency mixed pressure HDI plate |
| CN113038718A (en) * | 2021-01-27 | 2021-06-25 | 红板（江西）有限公司 | Ultra-thin PCB laminating process |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |