1290815 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種電路薄板之製造方法，尤其係指一 種無須進行壓板前處理以節省成本的電路薄板之製造方 法0 【先前技術】 由於現在的電子產品體積已逐漸朝微小化發展趨勢演 進，傳統的硬質印刷電路薄板並無法完全符合小體積之電 子產品電路設置需求，因此軟且薄電路薄板便廣泛的被使 用於電子產品上。 田於要方便於電路薄板後續的加工，在線路成型上必 須要搭配基板以當作支撑用，依成型方法之不同依序在基 板上成型電路薄板。 土 以目前習用的電路薄板之製造方法（如第五、六圖所 (6〇)包括有一 Ή基板（6Q);在—與該硬質基板 尺寸相同之具雙面㈣性且各貼附有 :)的黏著片（6以半切方式在黏著片(6 之—面的離型材料（62)±裁割出相互 61) 中央區域（6 2 1 )及離型材料邊緣區域（6 2 2 )材抖 ^設置有黏著片（61)、離型材料（6 ’ (6 〇)上、下面依序層積有多層電路薄 之基板 (多層電路薄板本體（7 to ' 7〇) 2者片（61)、離型材料（”… 彳）’將 (7〇)#合之邊緣區域裁 路薄板本體 裁刀去除’使得多層電路 1290815 _ (7〇)與基板（6 〇) 路薄板本體（7 n ^ 間失去點性；即可將多層電 本體（70)與基板（6〇)分離。 "缺點在於·由於銅笛 板前處理的缺點，需要作-二(7 1 )具有必須要進行塵 增加與黏著片（6 " 產生凹、凸形狀，俾 的離型材料黏著性’再將離型材料（62) 的問題。°°5 2 2)撕離’’會造成成本增加 另外-缺點在於：由於後續 與銅箔；te r 7 1、 口黏者片（6 1 ) 上沾g ( 7 1 )於相互黏著之後，會使黏著片（6工） 的勝附著在電路薄板上，因牌蓉 的業本 /寻板1因膝寻為雜質，製造電路薄板 液:、必:頁再將膠等雜質予以清除，且會污染槽内的槽 、於製造電路薄板的業者造成困擾。 【發明内容】 、 本發明人有鑑於上述電路薄板在製造時所遇到的種種 1 ，73積極的著手從事研^，以_可改進上述習知製程 之缺點，經過不斷的研究及努力，終於開發出本發明。 ^發明之主要目的在於提供一種無須進行壓板前處理 、’可節省成本之電路薄板之製造方法。 ^爲了達到上述發明目的，本發明係採取以下之技術手 段予以達成，其中本發明係包括有以下製程·· 一硬質基板； 在與該硬質基板之兩外側結合中央形成中空的離型 料； 可 在各離型材料的外側分別設置反壓銅箱； 1290815 各反壓銅箔外側分別設置雙面皆具黏著性的黏著片； 厣各黏著片外側分別設置銅金屬層，以黏著片、鋼金屬 一、反壓銅箔形成電路薄板本體，將上述構造壓合· ★裁切於電路薄板本體邊緣區域及離型材料内的形成中 二處’使電路薄板本體與基板分離。1290815 IX. Description of the Invention: [Technical Field] The present invention relates to a method for manufacturing a circuit board, and more particularly to a method for manufacturing a circuit board which does not require pre-pressing to save cost. [Prior Art] Due to the present The volume of electronic products has gradually evolved toward a trend of miniaturization. Traditional rigid printed circuit boards cannot fully meet the requirements of small-sized electronic circuit installations. Therefore, soft and thin circuit boards are widely used in electronic products. Tian Yu should be convenient for the subsequent processing of the thin circuit board. In the circuit forming, the substrate must be matched for the support, and the circuit board is formed on the substrate in order according to the different molding methods. The method of manufacturing the current thin circuit board (such as the fifth and sixth figures (6〇) includes a substrate (6Q); the same size as the hard substrate is double-sided (four) and each attached: Adhesive sheet (6 in a half-cut manner on the adhesive sheet (6-side release material (62) ± cut out from each other 61) Central region (6 2 1 ) and release material edge region (6 2 2 ) Shake ^ provided with adhesive sheet (61), release material (6 ' (6 〇) on the top and bottom of the substrate with multiple layers of thin film (multilayer circuit board body (7 to '7〇) 2 pieces (61 ), release material ("... 彳) 'will remove the (7 〇) # 边 edge area cutting thin plate body cutter 'making multi-layer circuit 1290815 _ (7 〇) and substrate (6 〇) road sheet body (7 n ^ Loss point; can separate the multilayer electric body (70) from the substrate (6〇). The disadvantage is that due to the shortcomings of copper flute pre-treatment, it is necessary to make -2 (7 1 ) with dust increase With the adhesive sheet (6 " creates a concave, convex shape, the release of the release material of the crucible' and then peels off the problem of the release material (62). ° ° 5 2 2) 'It will cause an increase in cost. The other disadvantage is that it will cause adhesive sheets (6 workers) after the adhesion to the copper foil; te r 7 1 and the adhesive sheet (6 1 ). Sheng is attached to the thin circuit board. Because the brand of the brand is found to be an impurity due to the knee, the circuit board liquid is made: and the sheet will be cleaned of impurities such as glue, which will contaminate the groove in the tank and be manufactured. The invention has caused problems for the manufacturer of the circuit board. SUMMARY OF THE INVENTION The present inventors have actively pursued various researches in the manufacture of the above-mentioned circuit sheets in order to improve the shortcomings of the above-mentioned conventional processes. Through continuous research and efforts, the present invention has finally been developed. The main object of the invention is to provide a method for manufacturing a circuit board which can save cost without pre-pressing the plate. ^ In order to achieve the above object, the present invention adopts the following The technical means is achieved, wherein the invention comprises the following process: a rigid substrate; forming a hollow release material at the center of the outer side of the rigid substrate; The outer side is respectively provided with a back pressure copper box; 1290815 each of the outer side of the back pressure copper foil is provided with adhesive sheets on both sides; 铜 each of the adhesive sheets is respectively provided with a copper metal layer for bonding sheets, steel metal one, back pressure copper foil The circuit board body is formed, and the above structure is pressed and cut into ★ in the edge region of the circuit board body and in the formation of the release material to separate the circuit board body from the substrate.
本發明主要係II由反壓銅箱的設置，由於其表面粗度 糸大2 一般銅箔板的表面粗度，可以直接壓合而成，無須 進仃壓板前處理，以達到節省成本目的。 【實施方式】 。月參看第一、二圖所示，本發明係為電路薄板之製造 方法，包括有以下製程： 一硬質基板（1 0 ); /在與該硬質基板（X 〇 )之兩外側結合尺寸相同之中 央形成中空（12)的離型材料（11)(如第一、三、 四圖所示）；The invention mainly comprises the setting of the back pressure copper box, and the surface roughness of the copper foil board can be directly pressed by the surface roughness of the copper foil, so that it is not required to be processed before the pressure plate to achieve cost saving. [Embodiment] Referring to the first and second figures, the present invention is a method for manufacturing a thin circuit board, comprising the following processes: a rigid substrate (10); / the same size as the outer side of the hard substrate (X 〇) Forming a hollow (12) release material (11) in the center (as shown in the first, third, and fourth figures);
在各離型材料（1 1 )㈣側分別言免置尺寸相同的反 壓銅泊（20)(其中之反壓銅箔（2〇)的粗度大於一 般銅箔板的表面粗度）； 各反壓銅馆（20)外側分別設置尺寸相同且雙面皆 具黏著性的黏著片（3 〇 ); 各黏著片（3 0 )外側分別設置銅金屬層（4 〇 )， 、^占著片（30)、鋼金屬層（4〇)與反壓鋼箔（2〇) 形成電路薄板本體（5〇)，將上述構造相互壓合； 裁刀（5 1 )於電路薄板本體（5 〇 )邊緣區域及離 1290815 型材料（1 1 )内的形成中空（1 2 )處（如第二圖所示）， 將電路薄板本體（5 〇 )與基板（1 〇 )相互分離。 此外’上述之電路薄板本體（5 〇 )於成型時所需另 外進行的加工方法與一般既有之電路薄板製作加工方法相 同，故省略其詳細說明。 於本發明中，由於係藉由反壓銅箔（2 〇 )之設置， 由於其表面粗度大於一般習知銅箔板的表面粗度，因而， 不需作壓板前處理即可直接壓合而成三明治構造，無需另 外購買銅箔板，且本發明因完全無須進行壓板前處理與不 需另外購買銅箔板，因而，可以達到節省成本之目的。 【圖式簡單說明】 第一圖係本發明之製造方法示意圖。 第二圖係本發明之製造方法的結合後示意圖。 第三圖係本發明中具通孔之離型材料的俯視平面圖。 第四圖係本發明中具通孔之離型材料的剖面圖。 :五圖係習知電路薄板之製造方法的示意圖。 第六圖係習知之離型材料的仰視平面圖。 【主要元件符號說明】 (1〇)基板 (1 1 )離型材料 (1 2 )形成中空 (2 〇)反壓銅箔 (3 0)黏著片 (4 〇)銅金屬層 8 1290815 (5 0 )電路薄板本體 (51)裁切 (6 0 )基板 (6 1 )黏著片 (6 2 )離型材料 ( 6 2 1 )離型材料中央區域 (6 2 2 )離型材料邊緣區域 (70)多層電路薄板本體 鲁 （7 1 )銅结板On the side of each release material (1 1 ) (4), the back pressure copper (20) of the same size is respectively removed (the thickness of the back pressure copper foil (2〇) is larger than the surface roughness of the general copper foil board); Adhesive sheets (3 〇) of the same size and adhesive on both sides of each back pressure copper pavilion (20) are respectively provided; copper metal layers (4 〇) are respectively disposed on the outer sides of each adhesive sheet (30), and The sheet (30), the steel metal layer (4〇) and the back pressure steel foil (2〇) form a circuit board body (5〇), and the above structures are pressed together; the cutter (5 1 ) is on the circuit sheet body (5 〇 The edge region and the hollow (1 2 ) from the 1290815 type material (1 1 ) (as shown in the second figure) separate the circuit board body (5 〇) from the substrate (1 〇). Further, the above-mentioned circuit sheet main body (5 〇 ) requires a different processing method at the time of molding, and the conventional method for manufacturing a thin circuit board is the same, and detailed description thereof will be omitted. In the present invention, since the surface roughness is larger than that of the conventional copper foil sheet by the back pressure copper foil (2 〇), it can be directly pressed without pre-treatment of the pressure plate. The sandwich structure has no need to purchase a copper foil board, and the invention can achieve cost saving because it does not need to be pre-pressed and does not need to purchase a copper foil board. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a schematic view of the manufacturing method of the present invention. The second drawing is a schematic view of the combination of the manufacturing method of the present invention. The third figure is a top plan view of the release material with through holes in the present invention. The fourth drawing is a cross-sectional view of the release material with through holes in the present invention. : Figure 5 is a schematic diagram of a method of manufacturing a conventional thin circuit board. The sixth figure is a bottom plan view of a conventional release material. [Main component symbol description] (1〇) substrate (1 1 ) release material (1 2 ) forms hollow (2 〇) counter-pressure copper foil (30) adhesive sheet (4 〇) copper metal layer 8 1290815 (5 0 ) The thin film body (51) is cut (60) the substrate (6 1 ) the adhesive sheet (6 2 ) the release material ( 6 2 1 ) the central region of the release material (6 2 2 ) the edge region of the release material (70) Multilayer circuit sheet body Lu (7 1 ) copper junction board