CN107613639A - One kind partly scratches pcb board and preparation method thereof - Google Patents
One kind partly scratches pcb board and preparation method thereof Download PDFInfo
- Publication number
- CN107613639A CN107613639A CN201710646543.4A CN201710646543A CN107613639A CN 107613639 A CN107613639 A CN 107613639A CN 201710646543 A CN201710646543 A CN 201710646543A CN 107613639 A CN107613639 A CN 107613639A
- Authority
- CN
- China
- Prior art keywords
- layers
- layer
- semi
- pcb board
- solid preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention discloses one kind partly to scratch pcb board, and the pcb board is disposed with the first FR4 layers, semi-solid preparation layer and the 2nd FR4 layers from top to bottom, and the PCB substrate is provided with region of destroying or force to yield, the semi-solid preparation layer and the first FR4 layer hollow outs in the region of destroying or force to yield.The preparation method for partly scratching pcb board, methods described include：FR4 layers and semi-solid preparation layer are distinguished sawing sheet, bore positioning hole by step；Two layers of FR4 layers are fitted on two faces of semi-solid preparation layer respectively, wherein one layer of FR4 layer and semi-solid preparation layer are cut, hollow out are formed, as region of destroying or force to yield；Brown, pairing and pressing are carried out to the FR4 layers after sawing sheet and semi-solid preparation layer.The present invention can meet that only needs possess static state and destroyed or force to yield performance PCB client, greatly reduce cost of manufacture, make simple, have a wide range of application, can meet the different order requirements of different clients, there is wide market prospects.
Description
Technical field
The present invention relates to similar rigid-flex combined board technical field, more particularly to one kind partly to scratch pcb board and preparation method thereof.
Background technology
PP is Polypropylene abbreviation, and Chinese is polypropylene, is commonly called as polypropylene (PP).
As PCB industries continue to develop, some rigid PCB of customer requirement are also required to possess certain bending performance now,
Meet its three-dimensional installation requirement, i.e., similar rigid-flex combined board static state bending performance.If using with the soft of performance of well destroying or force to yield
Plate material cost of manufacture is higher, and common FR4 materials can not meet the demand of destroying or force to yield.
The content of the invention
In order to solve the above-mentioned technical problem, it is an object of the invention to provide a kind of low fabrication cycle that reduces of cost partly to scratch PCB
Plate.
In order to solve the above-mentioned technical problem, the present invention also provides a kind of pcb board of partly scratching simple, that fabrication cycle is short and prepared
Method.
The technical solution adopted in the present invention is：One kind partly scratches pcb board, and the pcb board is disposed with the from top to bottom
One FR4 layers, semi-solid preparation layer and the 2nd FR4 layers, the PCB substrate are provided with region of destroying or force to yield, described in the region of destroying or force to yield
Semi-solid preparation layer and the first FR4 layer hollow outs.
Further, the thickness of the first FR4 layers is more than the thickness of the 2nd FR4 layers.
Further, the thickness of the first FR4 layers is 0.71 ± 0.064mm, the thickness of the 2nd FR4 layers for 0.10 ±
0.018mm。
Further, the material of the semi-solid preparation layer is without gummosis PP.
Further, the material of the first FR4 layers and the 2nd FR4 layers is model SB120 FR4 plates.
A kind of preparation method for partly scratching pcb board, methods described include：By FR4 layers and semi-solid preparation layer difference sawing sheet, bore positioning
Hole；Two layers of FR4 layers are fitted on two faces of semi-solid preparation layer respectively, wherein one layer of FR4 layer and semi-solid preparation layer are cut,
Hollow out is formed, as region of destroying or force to yield；Brown, pairing and pressing are carried out to the FR4 layers after sawing sheet and semi-solid preparation layer.The pressing
Process includes：The FR4 layers and semi-solid preparation layer worked good are pressed using two steel plates, increase by one on a FR4 layers wherein
FR4 tabula rasas, make the consistency of thickness of 2 layers of FR4 layers.
Further, the bonding processes also include：By adjusting pressure and heating rate, semi-solid preparation laminar flow glue overflow is prevented
To region of destroying or force to yield.
Further, also include after pressing gong side, drilling, nog plate, plasma cleaning, heavy copper, full plate copper facing, outer graphics,
Figure electrolytic copper, figure electricity tin, outer layer erosion copper, photosensitive green oil, lead-free tin spray, big plate electrical measurement, big plate V-CUT, blind gong, at numerical control mill
Reason.
Further, the active particle for also including passing through in plasma caused by vacuum chamber after the drilling removes plank table
Bored in face and hole dirty.
The beneficial effects of the invention are as follows：The present invention is combined as substrate with FR4 sheet materials and semi-solid preparation body phase, in semi-solid preparation layer
With position hollow out of the FR4 layers in the region of destroying or force to yield, formation is destroyed or force to yield region, to meet that only needs possess static state and destroyed or force to yield performance client
PCB, cost of manufacture is greatly reduced, make simply, have a wide range of application, the different order requirements of different clients can be met, had wide
Wealthy market prospects.
Brief description of the drawings
The embodiment of the present invention is described further below in conjunction with the accompanying drawings：
Fig. 1 is a kind of sectional view for partly scratching pcb board of the present invention；
Fig. 2 is that one kind of the invention partly scratches pressing stack sectional view in pcb board method.
Embodiment
It should be noted that in the case where not conflicting, the feature in embodiment and embodiment in the application can phase
Mutually combination.
As shown in figure 1, it illustrates one kind partly to scratch pcb board, the pcb board be disposed with from top to bottom the first FR4 layers 1,
The FR4 layers 3 of semi-solid preparation layer 2 and the 2nd, the PCB substrate are provided with region 4 of destroying or force to yield, the semi-solid preparation in the region 4 of destroying or force to yield
Layer 2 and the hollow out of the first FR4 layers 1.The thickness of first FR4 layers 1 is 0.71 ± 0.064mm, and the thickness of the 2nd FR4 layers 3 is 0.10
±0.018mm.The material of 2nd FR4 layers 3 is model SB120 FR4 plates, and it has certain bending performance.Semi-solid preparation
The material of layer 2 is without gummosis PP.
The present invention is combined as substrate with FR4 sheet materials and semi-solid preparation body phase, in semi-solid preparation layer and FR4 layers in the flexable-broken area
The position hollow out in domain, formation are destroyed or force to yield region, to meet that only needs possess static state and destroyed or force to yield performance PCB client, greatly reduce making
Cost, have a wide range of application, the different order requirements of different clients can be met, there are wide market prospects.
The preparation method that the present invention partly scratches pcb board is as follows：
By FR4 layers and semi-solid preparation layer difference sawing sheet, bore positioning hole；Two layers of FR4 layers are fitted in the two of semi-solid preparation layer respectively
On individual face, wherein one layer of FR4 layer and semi-solid preparation layer are cut, hollow out is formed, as region of destroying or force to yield；To the FR4 after sawing sheet
Layer and semi-solid preparation layer carry out brown, pairing, pressing, gong side, drilling, nog plate, plasma cleaning, heavy copper, full plate copper facing, outer layer figure
Shape, figure electrolytic copper, figure electricity tin, outer layer erosion copper, photosensitive green oil, lead-free tin spray, big plate electrical measurement, big plate V-CUT, at numerical control mill
Reason.
As preferred embodiment, bonding processes include：Using two steel plates to the first FR4 layers 1, second worked good
FR4 layers 3 and semi-solid preparation layer are pressed.By adjusting pressure and heating rate, prevent semi-solid preparation laminar flow glue from overflowing to flexable-broken area
Domain.
As preferred embodiment, the drilling also includes passing through the active particle in plasma caused by vacuum chamber
Remove and dirt is bored in plate surfaces and hole.
Embodiment 1
Because 3 two core plate thickness of slab of the first FR4 layers 1 and the 2nd FR4 layers differ greatly, pressing structure is completely asymmetric, pressure
Slab warping will occur after conjunction, have a strong impact on follow-up making；Plank warpage seriousness can be more aggravated in manufacturing process afterwards.
As shown in Fig. 2 improving this exception to give, we are superimposed with release by designing pressing stack, the last time of the first FR4 layers 1
Film layer 5, steel plate 6, release film layer 5, FR4 tabula rasas 4, release film layer 5, steel plate 6 have been sequentially overlapped on the 2nd FR4 layers 3, second
FR4 layers 3 increase by one and the FR4 tabula rasas 4 of L2 layer consistency of thickness above, and it is symmetrical to reach whole pressing structure, avoids due to difference
Core plate thickness of slab have big difference pressing after cause slab warping.
Embodiment 2
The PP gummosis of semi-solid preparation layer can not overflow to region of destroying or force to yield during pressing, so just can guarantee that finished product bending performance makes
With.Destroy or force to yield region gummosis control key be the setting, i.e. pressure and heating rate that press parameter setting, design parameter is as follows
Shown in table：
Embodiment 3
Due to not pressing PP pieces when being pressed for region of destroying or force to yield, finished product can be influenceed using chemical medicinal liquid method Drill dirt cleaning
FR4 bad orders.Given for this using physical method except brill is dirty, i.e. plasma cleaning method：Plasma cleaning is produced by vacuum chamber
" activation " of active particle in raw plasma, which reaches to remove, bores dirty purpose in plate surfaces and hole.Specific cleaning
Generally include procedure below：Inorganic gas is activated into plasma state；Gaseous substance is attracted on plate surfaces and hole wall；Quilt
Adsorption group and the molecule reaction generation product molecule in plate face and hole wall；Product molecule parses to form gas phase；Reaction residue
Depart from plate surfaces and hole wall.Plasma cleaning parameter is as shown in the table：
Above is the preferable implementation to the present invention is illustrated, but the invention is not limited to the implementation
Example, those skilled in the art can also make a variety of equivalent variations on the premise of without prejudice to spirit of the invention or replace
Change, these equivalent deformations or replacement are all contained in the application claim limited range.
Claims (10)
1. one kind partly scratches pcb board, it is characterised in that the pcb board is disposed with the first FR4 layers, semi-solid preparation layer from top to bottom
And the 2nd FR4 layer, the PCB substrate are provided with region of destroying or force to yield, the semi-solid preparation layer and first in the region of destroying or force to yield
FR4 layer hollow outs.
2. according to claim 1 partly scratch pcb board, it is characterised in that：The thickness of the first FR4 layers is more than described second
The thickness of FR4 layers.
3. according to claim 2 partly scratch pcb board, it is characterised in that：The thickness of the first FR4 layers be 0.71 ±
0.064mm, the thickness of the 2nd FR4 layers is 0.10 ± 0.018mm.
4. according to claim 1 partly scratch pcb board, it is characterised in that：The material of the semi-solid preparation layer is without gummosis PP.
5. according to claim 1 partly scratch pcb board, it is characterised in that：The material of the first FR4 layers and the 2nd FR4 layers
For model SB120 FR4 plates.
6. a kind of preparation method for partly scratching pcb board, it is characterised in that methods described includes：
By FR4 layers and semi-solid preparation layer difference sawing sheet, bore positioning hole；Two layers of FR4 layers are fitted in two faces of semi-solid preparation layer respectively
On, wherein one layer of FR4 layer and semi-solid preparation layer are cut, hollow out is formed, as region of destroying or force to yield；To the FR4 layers after sawing sheet and
Semi-solid preparation layer carries out brown, pairing and pressing.
7. the preparation method according to claim 6 for scratching pcb board, it is characterised in that the bonding processes include：Use two
Individual steel plate presses to the FR4 layers and semi-solid preparation layer worked good, increases by a FR4 tabula rasas on a FR4 layers wherein, makes 2 layers of FR4
The consistency of thickness of layer.
8. the preparation method according to claim 7 for scratching pcb board, it is characterised in that the bonding processes also include：Pass through
Pressure and heating rate are adjusted, prevents semi-solid preparation laminar flow glue from overflowing to region of destroying or force to yield.
9. the preparation method according to claim 6 for scratching pcb board, it is characterised in that：After pressing also include gong side, drilling,
Nog plate, plasma cleaning, heavy copper, full plate copper facing, outer graphics, figure electrolytic copper, figure electricity tin, outer layer erosion copper, photosensitive green oil, nothing
Lead spray tin, big plate electrical measurement, big plate V-CUT, blind gong, numerical control mill processing.
10. the preparation method according to claim 9 for scratching pcb board, it is characterised in that：Also include by true after the drilling
Active particle in plasma caused by empty room, which removes, bores dirt in plate surfaces and hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710646543.4A CN107613639A (en) | 2017-08-01 | 2017-08-01 | One kind partly scratches pcb board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710646543.4A CN107613639A (en) | 2017-08-01 | 2017-08-01 | One kind partly scratches pcb board and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107613639A true CN107613639A (en) | 2018-01-19 |
Family
ID=61064007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710646543.4A Pending CN107613639A (en) | 2017-08-01 | 2017-08-01 | One kind partly scratches pcb board and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107613639A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110366310A (en) * | 2018-03-26 | 2019-10-22 | 同泰电子科技股份有限公司 | Soft-hard composite board and its preparation method |
| CN110446353A (en) * | 2019-08-20 | 2019-11-12 | 珠海崇达电路技术有限公司 | A kind of production method and plate-laying structure improving PCB bow |
| CN110493956A (en) * | 2018-05-14 | 2019-11-22 | 胜宏科技（惠州）股份有限公司 | A kind of PCB plate production method of bending |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202503812U (en) * | 2012-03-20 | 2012-10-24 | 宜兴硅谷电子科技有限公司 | Semi-flexible printed circuit board used for static bending |
| JP2015162626A (en) * | 2014-02-28 | 2015-09-07 | エルナー株式会社 | Printed wiring board and manufacturing method of the same |
| CN205648225U (en) * | 2016-03-03 | 2016-10-12 | 深圳市景旺电子股份有限公司 | PCB cavity pressfitting structure |
-
2017
- 2017-08-01 CN CN201710646543.4A patent/CN107613639A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202503812U (en) * | 2012-03-20 | 2012-10-24 | 宜兴硅谷电子科技有限公司 | Semi-flexible printed circuit board used for static bending |
| JP2015162626A (en) * | 2014-02-28 | 2015-09-07 | エルナー株式会社 | Printed wiring board and manufacturing method of the same |
| CN205648225U (en) * | 2016-03-03 | 2016-10-12 | 深圳市景旺电子股份有限公司 | PCB cavity pressfitting structure |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110366310A (en) * | 2018-03-26 | 2019-10-22 | 同泰电子科技股份有限公司 | Soft-hard composite board and its preparation method |
| CN110366310B (en) * | 2018-03-26 | 2022-06-17 | 同泰电子科技股份有限公司 | Soft and hard composite board and its making method |
| CN110493956A (en) * | 2018-05-14 | 2019-11-22 | 胜宏科技（惠州）股份有限公司 | A kind of PCB plate production method of bending |
| CN110446353A (en) * | 2019-08-20 | 2019-11-12 | 珠海崇达电路技术有限公司 | A kind of production method and plate-laying structure improving PCB bow |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9713261B2 (en) | Fabrication process of stepped circuit board | |
| CN107613639A (en) | One kind partly scratches pcb board and preparation method thereof | |
| CN103648240B (en) | A kind of preparation method of symmetric form rigid-flex combined board | |
| TWI819320B (en) | Temporary load-bearing board and method of manufacturing coreless substrate using same | |
| WO2007104171A3 (en) | Uv-liga process for fabricating a multilayer metal structure having adjacent layers that are not entirely superposed, and structure obtained | |
| CN103096645A (en) | Lamination positioning method of multilayer circuit board | |
| EP3675604B1 (en) | Method for producing ceramic substrate, and ceramic substrate | |
| JP2013082612A5 (en) | ||
| CN103813658B (en) | The manufacture method of multi-layer thick copper circuit board and the manufacture method of two-sided heavy copper circuit board | |
| CN106231814A (en) | The process for pressing of the multilamellar Rigid Flex that a kind of light-sensitive surface thickens | |
| CN103144378B (en) | Copper-clad plate (CCL) and printed circuit board (PCB) of phenol novolac (PN) curing system and manufacturing method thereof | |
| CN101883473B (en) | Double-faced electricity conductive composite board and manufacture method thereof | |
| CN103203982B (en) | A kind of printing Three-dimensional mask plate | |
| CN103552392A (en) | Production method of large transaction card with internal stamping metal foils | |
| CN107911957A (en) | A kind of compression method for the printed circuit board (PCB) for preventing core plate warpage | |
| CN101090606A (en) | Manufacturing method of circuit board | |
| CN100505992C (en) | Vacuum and lamination dry film method for multiple layers flexible circuit board | |
| CN205430765U (en) | PCB operatic tunes structure | |
| CN202685579U (en) | Three-dimensional stereoscopic mask plate for printing | |
| CN103203976B (en) | A kind of printing Three-dimensional mask plate | |
| CN103204013B (en) | A kind of printing Three-dimensional mask plate with figure opening | |
| CN100505983C (en) | Circuit board manufacturing method | |
| CN102595797B (en) | Method for making multilayer rigid-flexible board by utilizing yin-yang board copper plating method | |
| CN113411965A (en) | Manufacturing method of embedded fine circuit | |
| CN102638948B (en) | Manufacturing method of printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information |
Inventor after: Zhang Yonghui Inventor after: Sun Wenbing Inventor before: Zhang Yonghui |
|
| CB03 | Change of inventor or designer information | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20181107 Address after: 332000 Jiangxi Jiujiang economic and Technological Development Zone Chengxi port area Hong Kong Avenue Applicant after: JIUJIANG MINGYANG CIRCUIT TECHNOLOGY CO., LTD. Address before: 518125 B, 32 South Ring Road, Second Star Industrial Zone, Baoan District Xinqiao street, Shenzhen, Guangdong. Applicant before: Shenzhen Mingyang circuit Polytron Technologies Inc |
|
| TA01 | Transfer of patent application right | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180119 |
|
| RJ01 | Rejection of invention patent application after publication |