CN110366310A - Soft-hard composite board and its preparation method - Google Patents
Soft-hard composite board and its preparation method Download PDFInfo
- Publication number
- CN110366310A CN110366310A CN201810286907.7A CN201810286907A CN110366310A CN 110366310 A CN110366310 A CN 110366310A CN 201810286907 A CN201810286907 A CN 201810286907A CN 110366310 A CN110366310 A CN 110366310A
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- Prior art keywords
- circuit
- substrate
- hardened
- soft
- layer
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- 239000002131 composite material Substances 0.000 title claims abstract description 30
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 91
- 239000000463 material Substances 0.000 claims abstract description 37
- 238000003384 imaging method Methods 0.000 claims abstract description 16
- 230000035807 sensation Effects 0.000 claims abstract description 16
- 239000010410 layer Substances 0.000 claims description 62
- 238000009713 electroplating Methods 0.000 claims description 32
- 238000009413 insulation Methods 0.000 claims description 17
- 239000002344 surface layer Substances 0.000 claims description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- 238000010276 construction Methods 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 239000010931 gold Substances 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910052763 palladium Inorganic materials 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 30
- 229910052802 copper Inorganic materials 0.000 description 30
- 239000010949 copper Substances 0.000 description 30
- 238000007747 plating Methods 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- UIFOTCALDQIDTI-UHFFFAOYSA-N arsanylidynenickel Chemical compound [As]#[Ni] UIFOTCALDQIDTI-UHFFFAOYSA-N 0.000 description 2
- 239000000976 ink Substances 0.000 description 2
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 2
- 239000010956 nickel silver Substances 0.000 description 2
- 239000003504 photosensitizing agent Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 206010034960 Photophobia Diseases 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 208000013469 light sensitivity Diseases 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 238000006552 photochemical reaction Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
Abstract
It includes the hardened structure of a first line, one second circuit board structure and the hardened structure of a tertiary circuit that the present invention, which provides a kind of soft-hard composite board, the hardened structure of first line includes first base material and the first circuit structure, second circuit board structure includes the second substrate and second circuit structure, and the hardened structure of tertiary circuit includes third connection substrate, third laminated substrate and tertiary circuit structure；Third connection substrate is made of light sensation imaging dielectric and pliability is much larger than the first, second substrate, it is to be mechanically connected to the first, second circuit board structure that third, which connects substrate, the hardened structure of tertiary circuit has a bendable trisection between the hardened structure of first line and the second circuit board structure, and tertiary circuit structure is just formed after third connection substrate is mechanically connected to the first, second circuit board structure.The present invention also provides a kind of preparation methods of soft-hard composite board.
Description
Technical field
The present invention is a kind of related circuit board structure, especially with regard to a kind of soft-hard composite board and its preparation method.
Background technique
Wiring board can divide into rigid wiring board (abbreviation hardboard), flexible circuit board according to the hardness difference of dielectric medium
(soft board) and soft-hard composite board, wherein soft-hard composite board is usually to be composed of soft board and hardboard, and have both the flexible of soft board
The intensity of property and hardboard, thus often it is applied to the part carrier of electronic product.
The soft-hard composite board of the prior art is usually after soft board and hardboard are respectively formed circuit, then again by soft, hardboard
It presses together, wherein hardboard is pre-formed fluting, and make soft-hard composite board that there is pliability in slot area, and hardboard position is then
It can assembly surface Mounted Device (surface mounted devices).
The soft-hard composite board processing procedure of the prior art was both complicated and expensive, and the assembling process of its Surface Mounted Device is equally
Seem complex.It is made in addition, previous soft board generallys use FR-4 or PI material, the usual non-refractory of these materials, shadow
Ring the design freedom of follow-up process.
Summary of the invention
In view of this, the main purpose of the present invention is to provide a kind of soft-hard composite boards and its preparation method convenient for production.
In order to reach above and other purpose, the present invention provides a kind of soft-hard composite board comprising a first line is hardened
Structure, one second circuit board structure and the hardened structure of a tertiary circuit, the hardened structure of first line have a first surface and one reversed
Second surface, the hardened structure of first line include that the first base material of at least one insulation and one are formed in the first of an at least first base material
Circuit structure, the second circuit board structure have a third surface and a 4th reversed surface, and the second circuit board structure includes one
The second substrate and one of insulation are formed in the second circuit structure of at least one second substrate, and the hardened structure of tertiary circuit has one the 5th
Surface and a 6th reversed surface, the hardened structure of tertiary circuit include the third connection substrate of an insulation, at least one insulation the
Three laminated substrates and one be formed in third connection substrate and an at least third laminated substrate tertiary circuit structure, third linker
Material is located at the 5th surface of the hardened structure of tertiary circuit；Wherein, the pliability of third connection substrate is much larger than first base material and second
Substrate, and third connection substrate is as made by light sensation imaging dielectric；Wherein, third connection substrate is to be mechanically connected to first
The third surface of the first surface of circuit board structure and the second circuit board structure, tertiary circuit structure are electric with first, second respectively
Line structure be electrically connected, the hardened structure of tertiary circuit have one between the hardened structure of first line and the second circuit board structure can
Bending segment；Wherein, tertiary circuit structure is only distributed between the 5th surface and the 6th surface, and at least the one of tertiary circuit structure
Part is just formed after third connection substrate is mechanically connected to the first, second circuit board structure.
In order to reach above and other purpose, the present invention provides a kind of preparation method of soft-hard composite board, including the following steps:
The hardened structure of one first line and one second circuit board structure be provided, the hardened structure of first line have a first surface and
One reversed second surface, the hardened structure of first line include that the first base material of at least one insulation and one are formed at least one first base
First circuit structure of material, the second circuit board structure have a third surface and a 4th reversed surface, the second route hardened
Structure includes that at least one the second substrate to insulate and one are formed in the second circuit structure of at least one second substrate；
The first surface and the second circuit board structure of first line hardened structure are mechanically connected to third connection substrate
Third surface, the pliability that third connects substrate is much larger than first base material and the second substrate, and third connection substrate is by light sensation
Made by imaging dielectric；
Multiple the first circuit structure or exposed vacancy sections of second circuit structure of allowing are formed on third connection substrate；
The third laminated substrate and a tertiary circuit structure of at least one insulation, tertiary circuit are formed on third connection substrate
The some of structure be filled at third connection substrate vacancy section, make tertiary circuit structure respectively with the first, second circuit structure
It is electrically connected；
Wherein, third connection substrate, at least set of a third laminated substrate and tertiary circuit structure constitute a third line
The hardened structure in road, the hardened structure of tertiary circuit are bent between the hardened structure of first line and the second circuit board structure with one
Section, and there is the hardened structure of tertiary circuit one the 5th surface and a 6th reversed surface, tertiary circuit structure to be only distributed in the 5th
Between surface and the 6th surface.
Since third connection substrate is made of light sensation imaging dielectric, tertiary circuit structure can be in third linker
Material is just formed after being mechanically connected to the first, second circuit board structure, this needs to form circuit on soft board in advance with the prior art
The production method of structure is different, it is contemplated that for the present invention by therefore yield with higher, production capacity, process design freedom degree can also
To increase.
The detailed content of other effects and embodiment for the present invention, cooperation Detailed description of the invention are as follows.
Detailed description of the invention
In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The some embodiments recorded in application, for those of ordinary skill in the art, without creative efforts,
It can also be obtained according to these attached drawings other attached drawings.
Fig. 1 is the diagrammatic cross-section of a soft-hard composite board of the present invention wherein embodiment；
Fig. 2 to Figure 21 is the diagrammatic cross-section of the soft-hard composite board of the present invention wherein manufacturing process of an embodiment.
Symbol description
Hardened 11 first surface of structure of 10 first line
12 second surface 13a, 13b first base materials
14 first circuit structure 14a chemical plating copper layers
14b, 14c copper electroplating layer 14d electroplating surface layer
20 second circuit board structure, 21 third surface
22 the 4th second substrate of surface 23a, 23b
24 second circuit structure 24a chemical plating copper layers
24b, 24c copper electroplating layer 24d electroplating surface layer
Hardened the 5th surface of structure 31 of 30 tertiary circuits
32 the 6th surface, 33 third connects substrate
34 third laminated substrate of the vacancy section 33a
35 tertiary circuit structure 35a copper electroplating layers
The two-sided Copper base material of 36 bendable trisection 100
101 via hole, 102 copper electroplating layer
103 anti-solder inks 104,105 copper electroplating layers
106 soldermask layer, 107 light sensation imaging dielectric layer
Specific embodiment
Referring to FIG. 1, illustrated is the soft-hard composite board of a wherein embodiment of the invention, which includes one
The hardened structure 10 of first line, one second circuit board structure 20 and the hardened structure 30 of a tertiary circuit.
The hardened structure 10 of first line has a first surface 11 and a reversed second surface 12, and the hardened structure of first line
10 include first base material 13a, 13b of two insulation and the first circuit structure 14 for being formed in first base material 13a, 13b, wherein first
Substrate 13a is for example made of PP, and the second substrate 13b is for example made of anti-welding material, and the first circuit structure 14 illustratively includes
It is layered the chemical plating copper layer 14a, copper electroplating layer 14b, 14c and electroplating surface layer 14d of production, wherein electroplating surface layer 14d can be
But it is not limited to nickel layer, layer gold, silver layer, palladium layers one of them or its stepped construction, such as plating nickel-gold layer stack structure, plating nickeline
Layer gold stack structure, electronickelling silver layer stack structure, chemical nickel gold stepped construction, chemical nickel silver layer stack structure or NiPdAu stacking knot
Structure.
Second circuit board structure 20 has a third surface 21 and a 4th reversed surface 22, the second circuit board structure 20
Second substrate 23a, 23b with two insulation and it is formed in the second circuit structure 24 of second substrate 23a, 23b, wherein the second base
Material 23a is for example made of PP, and the second substrate 23b is, for example, to be made of anti-welding material, and second circuit structure 24 illustratively includes
It is layered the chemical plating copper layer 24a, copper electroplating layer 24b, 24c and electroplating surface layer 24d of production, wherein electroplating surface layer 24d can be
But it is not limited to nickel layer, layer gold, silver layer, palladium layers one of them or its stepped construction, such as plating nickel-gold layer stack structure, plating nickeline
Layer gold stack structure, electronickelling silver layer stack structure, chemical nickel gold stepped construction, chemical nickel silver layer stack structure or NiPdAu stacking knot
Structure, these electroplating surface layers 14d, 24d for example can be used to amplexiform with Surface Mounted Device or connectivity port.Wherein, first, second
Circuit board structure 10,20 is in mechanism and is not attached to (mechanical ly separated).
The hardened structure 30 of tertiary circuit has one the 5th surface 31 and a 6th reversed surface 32, and tertiary circuit plate 30 wraps
The third laminated substrate 34 and one for including the third connection insulation of substrate 33, one of an insulation are formed in third connection substrate 33 and third
The tertiary circuit structure 35 of laminated substrate 34.Wherein, third connection substrate 33 is by light sensation imaging dielectric
(photoimageable dielectric) is made, and the light sensation imaging dielectric is (such as purple to the light of particular range of wavelengths
Outside line) there is light sensitivity, the emulsion (for example, sensing optical activity polymer) in the light sensation imaging dielectric has photosensitizer
When being irradiated by the light of particular range of wavelengths photochemical reaction can occur for group, these photosensitizer groups；The light sensation imaging electricity
Medium can be positive light sensation imaging dielectric, and photosensitive area is dissolvable in water in developer solution；The light sensation imaging dielectric can also be with
It is solarising imaging dielectric, non-photo-sensing area is dissolvable in water in developer solution；Third laminated substrate 34 can be situated between for light sensation imaging electricity
Matter or it is other there is flexible dielectric or isolation material to be made, wherein third connection substrate 33 and third laminated substrate 34
Pliability is preferably much larger than first base material 13a, 13b and second substrate 23a, 23b, therefore the hardened structure 30 of tertiary circuit has one
Bendable trisection 36 between the hardened structure 10 of first line and the second circuit board structure 20, thus, the hardened structure 30 of tertiary circuit
Characteristic with soft board, and the first, second circuit board structure 10,20 characteristics with hardboard, the first, second circuit board structure
It 10,20 can be with relative displacement.
In addition, third connection substrate 33 is located at the 5th surface 31 of the hardened structure 30 of tertiary circuit, and third connects substrate 33
It is the first surface 11 and the second line for being mechanically connected to (mechanical ly connected to) the hardened structure 10 of first line
The third surface 21 of the hardened structure 20 in road.On the other hand, the 6th surface 32 of the hardened structure 30 of tertiary circuit not with other wiring boards
Structure (especially hardboard) connection.
Tertiary circuit structure 35 is formed in third connection substrate 33 and third laminated substrate 34, and tertiary circuit structure 35 illustrates
Property include a copper electroplating layer 35a, some of tertiary circuit structure 35 extends bendable trisection 36, preferably, tertiary circuit
At least a part of circuit in first circuit structure 14 is electrically connected at least one in second circuit structure 24 by structure 35
Part circuit.
Fig. 2 to Figure 21 discloses a kind of manufacturing process of soft-hard composite board, is described as follows:
As shown in Fig. 2, taking a two-sided Copper base material 100 first, bore operation is then carried out as shown in Figure 3, two-sided copper-based
Via hole 101 is formed on material 100, copper facing operation is then carried out as shown in Figure 4, in two-sided 100 surface of Copper base material and via hole 101
Interior formation copper electroplating layer 102, then consent operation is carried out as shown in Figure 5, it insulate in clogging anti-solder ink 103 etc. in via hole 101
Material.
Then, fluting operation is carried out as shown in Figure 6, and the two-sided Copper base material 100 is made substantially to have aforementioned first line hardened
The blank of structure 10 and the second circuit board structure 20.Then, as shown in Figure 7 to 10, sequentially carry out pressing dry film, exposure, development and
Stripping operation is etched, forms one patterned circuit layer in two-sided Copper base material 100.
So far, the structure in two-sided 100 left side of Copper base material is the basis configuration of the hardened structure 10 of first line, two-sided Copper base material
The structure on 100 right sides is the basis configuration of the second circuit board structure 20, that is, provides the hardened structure 10 of first line and the second line
The hardened structure 20 in road.
Then, as shown in figure 11, press mold operation is carried out again, and third connection substrate 33 is mechanically connected to first line plate
The third surface 21 of the first surface 11 of structure 10 and the second circuit board structure 20, wherein third connection substrate 33 is imaged by light sensation
Made by dielectric.
Then, as shown in Figure 12 and Figure 13, it is sequentially exposed, operation of developing, is formed on third connection substrate 33 multiple
It can allow the first circuit structure or the exposed vacancy section 33a of second circuit structure.
As shown in figure 14, copper facing operation is carried out, in second surface 12, the 4th table of the first, second circuit board structure 10,20
Face 22 forms copper electroplating layer 104, and also forms copper electroplating layer 105 on the surface of third connection substrate 33, and the one of copper electroplating layer 105
Part is filled at the vacancy section 33a of third connection substrate 33, is electrically connected copper electroplating layer 105 and the first, second circuit structure.
Then, as shown in FIG. 15 to 18, copper electroplating layer 104,105 is sequentially carried out pressing dry film, exposure, development and etching
Copper electroplating layer 104,105 is fabricated to one patterned circuit layer by stripping operation.
Then, as shown in Figure 19 to Figure 21, anti-welding insulation operation, exposure, development operation are carried out, respectively in copper electroplating layer
104,105 surfaces re-form a soldermask layer 106 and light sensation imaging dielectric layer 107, and are formed and opened a window in soldermask layer 106, finally
Electroplating surface processing is carried out at the windowing of soldermask layer 106, obtains soft-hard composite board as shown in Fig. 1.In the present embodiment, the
The entirety of three-circuit structure is just formed after third connection substrate is mechanically connected to the first, second circuit board structure.
It should be noted that the first, second circuit board structure can be two laminates or multi-layer board, first base material, the second base
The number of plies of material is depending on wiring demand；Likewise, the number of plies of third stepped construction also regards the circuit of the hardened structure of tertiary circuit
Wiring requirements and can adjust.It should also be noted that herein referred tertiary circuit structure, which refers to, is fully located at the five, the 6th tables
For the circuit structure in face, (such as to extend first, tertiary circuit hardened for other circuit structures extended to other than the 5th surface
The conductive layer on via hole and via hole between structure) then non-herein referred tertiary circuit structure.
Embodiment described above and/or embodiment are only the preferred embodiments to illustrate to realize the technology of the present invention
And/or embodiment, not the embodiment of the technology of the present invention is made any form of restriction, any those skilled in the art
Member changes or is revised as other equivalent when can make a little in the range for not departing from technological means disclosed in the content of present invention
Embodiment, but still should be regarded as and the substantially identical technology or embodiment of the present invention.
Claims (12)
1. a kind of soft-hard composite board characterized by comprising
The hardened structure of one first line, has a first surface and a reversed second surface, and the hardened structure of the first line includes extremely
The first base material of a few insulation and one be formed in an at least first base material the first circuit structure；
One second circuit board structure, with a third surface and a 4th reversed surface, which includes extremely
Second substrate of a few insulation and one be formed at least one second substrate second circuit structure；And
The hardened structure of one tertiary circuit, with one the 5th surface and a 6th reversed surface, the hardened structure of the tertiary circuit includes one
Insulation third connection substrate, at least one insulation third laminated substrate and one be formed in the third connection substrate and this at least one
The tertiary circuit structure of third laminated substrate, third connection substrate are located at the 5th surface of the hardened structure of the tertiary circuit；
Wherein, the pliability of third connection substrate is much larger than the first base material and second substrate, and the third connects substrate
It is as made by light sensation imaging dielectric；
Wherein, third connection substrate is the first surface and the second circuit board structure for being mechanically connected to the hardened structure of the first line
Third surface, which is electrically connected with first, second circuit structure respectively, the tertiary circuit hardened structure tool
There is a bendable trisection between the hardened structure of the first line and second circuit board structure；
Wherein, which is only distributed between the 5th surface and the 6th surface, and the tertiary circuit structure
At least some is just formed after third connection substrate is mechanically connected to first, second circuit board structure.
2. soft-hard composite board as described in claim 1, which is characterized in that the pliability of an at least third laminated substrate is long-range
In the first base material and second substrate.
3. soft-hard composite board as described in claim 1, which is characterized in that first circuit structure have at least one be located at this
The electroplating surface layer on two surfaces, the electroplating surface layer are nickel layer, layer gold, silver layer, palladium layers one of them or its stepped construction.
4. soft-hard composite board as described in claim 1, which is characterized in that the second circuit structure have at least one be located at this
The electroplating surface layer on four surfaces, the electroplating surface layer are nickel layer, layer gold, silver layer, palladium layers one of them or its stepped construction.
5. soft-hard composite board as described in claim 1, which is characterized in that some of first circuit structure is in the third
Connection substrate is just formed after being mechanically connected to first, second circuit board structure.
6. soft-hard composite board as described in claim 1, which is characterized in that some of the second circuit structure is in the third
Connection substrate is just formed after being mechanically connected to first, second circuit board structure.
7. a kind of preparation method of soft-hard composite board, characterized in that it comprises the following steps:
The hardened structure of a first line and one second circuit board structure are provided, the hardened structure of the first line has a first surface and one
Reversed second surface, the hardened structure of the first line include at least one insulation first base material and one be formed in this at least one first
First circuit structure of substrate, second circuit board structure have a third surface and a 4th reversed surface, second line
The hardened structure in road includes that at least one the second substrate to insulate and one are formed in the second circuit structure of at least one second substrate；
The first surface and second circuit board structure of the first line hardened structure are mechanically connected to third connection substrate
Third surface, the pliability which connects substrate is much larger than the first base material and second substrate, and the third connects substrate
It is as made by light sensation imaging dielectric；
Multiple first circuit structure or exposed vacancy sections of the second circuit structure of allowing are formed on third connection substrate；
The third laminated substrate and a tertiary circuit structure of at least one insulation, the tertiary circuit are formed on third connection substrate
The some of structure be filled at the third connection substrate vacancy section, make the tertiary circuit structure respectively with this first, second electricity
Line structure is electrically connected；
Wherein, the third connection substrate, this at least the set of a third laminated substrate and the tertiary circuit structure constitute a third
Circuit board structure, the hardened structure of the tertiary circuit is with one between the hardened structure of the first line and second circuit board structure
Bendable trisection, and the hardened structure of the tertiary circuit has one the 5th surface and a 6th reversed surface, the tertiary circuit structure is only
It is distributed between the 5th surface and the 6th surface.
8. the preparation method of soft-hard composite board as claimed in claim 7, which is characterized in that the pliability of an at least third laminated substrate
Much larger than the first base material and second substrate.
9. the preparation method of soft-hard composite board as claimed in claim 7, which is characterized in that first circuit structure has at least one to be located at
The electroplating surface layer of the second surface, the electroplating surface layer are nickel layer, layer gold, silver layer, palladium layers one of them or its stepped construction.
10. the preparation method of soft-hard composite board as claimed in claim 7, which is characterized in that the second circuit structure has at least one
Electroplating surface layer in the 4th surface, the electroplating surface layer are nickel layer, layer gold, silver layer, palladium layers one of them or its stacking knot
Structure.
11. the preparation method of soft-hard composite board as claimed in claim 7, which is characterized in that some of first circuit structure be
Third connection substrate is just formed after being mechanically connected to first, second circuit board structure.
12. the preparation method of soft-hard composite board as claimed in claim 7, which is characterized in that some of the second circuit structure be
Third connection substrate is just formed after being mechanically connected to first, second circuit board structure.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107110355 | 2018-03-26 | ||
| TW107110355A TWI649016B (en) | 2018-03-26 | 2018-03-26 | Soft and hard composite board and its preparation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110366310A true CN110366310A (en) | 2019-10-22 |
| CN110366310B CN110366310B (en) | 2022-06-17 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820458650.4U Withdrawn - After Issue CN208047005U (en) | 2018-03-26 | 2018-04-03 | Soft and hard composite board |
| CN201810286907.7A Active CN110366310B (en) | 2018-03-26 | 2018-04-03 | Soft and hard composite board and its making method |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820458650.4U Withdrawn - After Issue CN208047005U (en) | 2018-03-26 | 2018-04-03 | Soft and hard composite board |
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| Country | Link |
|---|---|
| CN (2) | CN208047005U (en) |
| TW (1) | TWI649016B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI708532B (en) * | 2019-06-05 | 2020-10-21 | 李蕙如 | Rigid-flex board and method for making the same |
| CN112087863A (en) * | 2019-06-13 | 2020-12-15 | 李蕙如 | Soft and hard composite board and its making method |
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| EP2768294A2 (en) * | 2013-01-08 | 2014-08-20 | Carl Freudenberg KG | Assembly having a flexible circuit board |
| CN107613639A (en) * | 2017-08-01 | 2018-01-19 | 深圳明阳电路科技股份有限公司 | One kind partly scratches pcb board and preparation method thereof |
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| TWI345432B (en) * | 2007-07-26 | 2011-07-11 | Nan Ya Printed Circuit Board Corp | Method for manufacturing a rigid-flex circuit board |
| TW200944078A (en) * | 2008-04-09 | 2009-10-16 | Compeq Mfg Co Ltd | A manufacturing method for a soft-hard board |
| TWI367710B (en) * | 2009-08-11 | 2012-07-01 | Unimicron Technology Corp | Fabrication method of rigid-flex circuit board |
| CN103124472B (en) * | 2011-11-18 | 2015-12-16 | 北大方正集团有限公司 | A kind of rigid/flexible combined printed circuit board manufacture method and rigid/flexible combined printed circuit board |
| CN103987207B (en) * | 2013-02-07 | 2017-03-01 | 欣兴电子股份有限公司 | Flexible and hard composite circuit board and manufacturing method thereof |
| TWM568019U (en) * | 2018-03-26 | 2018-10-01 | 同泰電子科技股份有限公司 | Rigid-flex circuit board |
-
2018
- 2018-03-26 TW TW107110355A patent/TWI649016B/en active
- 2018-04-03 CN CN201820458650.4U patent/CN208047005U/en not_active Withdrawn - After Issue
- 2018-04-03 CN CN201810286907.7A patent/CN110366310B/en active Active
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| WO2005122657A1 (en) * | 2004-06-11 | 2005-12-22 | Ibiden Co., Ltd. | Rigid-flex wiring board and method for producing same |
| US20060019075A1 (en) * | 2004-07-26 | 2006-01-26 | Samsung Electro-Mechanics Co., Ltd. | Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereof |
| JP2006148127A (en) * | 2004-11-22 | 2006-06-08 | Valeo Vision | Manufacturing method of support of light emitting diode interconnected in three-dimensional environment |
| CN102159021A (en) * | 2010-02-12 | 2011-08-17 | 揖斐电株式会社 | Flex-rigid wiring board and method for manufacturing the same |
| EP2768294A2 (en) * | 2013-01-08 | 2014-08-20 | Carl Freudenberg KG | Assembly having a flexible circuit board |
| CN107613639A (en) * | 2017-08-01 | 2018-01-19 | 深圳明阳电路科技股份有限公司 | One kind partly scratches pcb board and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201941671A (en) | 2019-10-16 |
| CN208047005U (en) | 2018-11-02 |
| CN110366310B (en) | 2022-06-17 |
| TWI649016B (en) | 2019-01-21 |
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