TWI367710B - Fabrication method of rigid-flex circuit board - Google Patents

Fabrication method of rigid-flex circuit board

Info

Publication number
TWI367710B
TWI367710B TW098127026A TW98127026A TWI367710B TW I367710 B TWI367710 B TW I367710B TW 098127026 A TW098127026 A TW 098127026A TW 98127026 A TW98127026 A TW 98127026A TW I367710 B TWI367710 B TW I367710B
Authority
TW
Taiwan
Prior art keywords
rigid
circuit board
fabrication method
flex circuit
flex
Prior art date
Application number
TW098127026A
Other languages
Chinese (zh)
Other versions
TW201106825A (en
Inventor
Chih Ming Chang
Kuo Wei Li
Hsiao Wen Chen
Original Assignee
Unimicron Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unimicron Technology Corp filed Critical Unimicron Technology Corp
Priority to TW098127026A priority Critical patent/TWI367710B/en
Publication of TW201106825A publication Critical patent/TW201106825A/en
Application granted granted Critical
Publication of TWI367710B publication Critical patent/TWI367710B/en

Links

TW098127026A 2009-08-11 2009-08-11 Fabrication method of rigid-flex circuit board TWI367710B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW098127026A TWI367710B (en) 2009-08-11 2009-08-11 Fabrication method of rigid-flex circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW098127026A TWI367710B (en) 2009-08-11 2009-08-11 Fabrication method of rigid-flex circuit board

Publications (2)

Publication Number Publication Date
TW201106825A TW201106825A (en) 2011-02-16
TWI367710B true TWI367710B (en) 2012-07-01

Family

ID=44814459

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098127026A TWI367710B (en) 2009-08-11 2009-08-11 Fabrication method of rigid-flex circuit board

Country Status (1)

Country Link
TW (1) TWI367710B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI649016B (en) * 2018-03-26 2019-01-21 同泰電子科技股份有限公司 Soft and hard composite board and its preparation method

Also Published As

Publication number Publication date
TW201106825A (en) 2011-02-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees