201106825 0905002 31592twf.doc/n 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種軟硬複合板的製作方法，且特別 是有關於一種節省硬板廢料的軟硬複合板的製作方法。 【先前技術】 車人硬複合板疋由軟板層以及硬板層交替堆疊而成的線 • 路板，其兼具有軟板的可撓性以及硬板的強度。在製作方 法上，軟硬複合板在内層製作時，即開始進行軟板層與硬 板層的壓合步驟。如圖i所示，在壓合之前，硬板層⑽ 的硬板廢料112配合相壓合的軟板層12()的線路佈局，铿 撥空而形成多個空心區域，同樣的，軟板層12〇的軟板$ 料122也要配合相壓合的硬板層11〇的線路佈局，經撈空 而形成多個空心區域。以八層的軟硬複合板為例，每—内 ^被撈空成為廢料的部分非常的多，而這些被裁切掉的部 φ 分不僅不能回收，造成資源的浪費，更要負擔大量的廢料 的運送、銷毀等成本，完全背離綠色環保及永續經營的主 流意識。 ,另外，值得、/主意的是，當軟板層或硬板層在完成線路 製作後，若有部分的線路產生斷線等不良情形時，則必須 報廢、丟棄此部分之軟板層與硬板層，而在習知的製作方 法中，由於軟板層先與硬板層相互壓合，因此，此種報廢、 丢棄，動作則必須在已壓合之硬板層與軟板層分割成多個 罕人硬複合板之後才執行。換言之，欲報廢、丢棄不良之硬 201106825 0905002 31592twf.doc/n 板層時’則必須連帶地將與相麗合之軟板層加以丢棄，而 浪費了良好部分之軟板層的材料’因而無法降低整個軟硬 複合板的生產成本，反之亦然。 【發明内容】 本發明提供一種軟硬複合板的製作方法，以節省硬板 廢料及降低生產成本。 本發明提出一種軟硬複合板的製作方法。首先，裁切 硬板’以使该硬板分離成多個子板，且該些子板具有一 第一定位部。接著，配置第一半固化膠片於良好的該些子 板與一軟板之間，該軟板具有一第二定位部。接著，配置 第一半固化膠片於一金屬箔片與良好的該些子板之間。之 後’在該第一定位部與該第二定位部相對位下，進行一預 接合步驟，以定位良好的該些子板與該軟板的相對位置。 再者，進行一熱壓接合步驟，以固著該第一半固化膠片於 3亥些子板與該軟板之間，及固著該第二半固化膠片於該些 子板與該金屬箔片之間，以形成一軟硬複合板。後續更可 裁切該軟硬複合板，以分離成多個子軟硬複合板。 本發明另提出一種軟硬複合板的製作方法。首先，裁 切硬板’以使該硬板分離成多個子板。接著，配置—半 口化膠片於良好的該些子板與一軟板之間。之後，進行一 預接合步驟，以定位良好的該些子板與該軟板之相對位 置。再者，進行一熱壓接合步驟，以固著該半固化膠片於 "亥些子板與該軟板之間，而形成一軟硬複合板。後續更可 201106825 0905002 3l592twf.doc/n 裁切該軟硬複合板’ 分軸乡個子軟硬複合板。 、在本發明之—實施例中，上述裁切硬板之後，更包括 進行也性測試，以判斷該些子板是否為良品。 在本發明之-實施例巾，上述形成第—定位部的方法 匕括雷射穿孔或機械鑽孔。 勺明之—實施财，上卿成1二处部的方法 包括雷射穿孔或機械鑽孔。 4牙過㈣-疋位部及該第二定位部。 更自ίΐΓ月之—ΐ施例中，上述進行預接合步驟之前， >形成一第一開口於該第一半固化膠 =成-第二開口於該第二半固 進Hi ，時，該軟板對應於該第—開σ㈣第頁接合 露於該些子板之間。 /、/弟―開口的部分顯 在本發明之一實施例中，上述 後’更包括電性逵桩〃 …、&接合步驟之 在本發魏板之-線格ΐ ^ κ男、苑例中，上述進行熱屨垃人， 括電性連接良好的該些子板至該金屬之 後，ΐί發明之一實施例中，上述進行熱壓接：二. 更ο括圖案化該金屬落片，以形成至少^驟之 路電性連接I好㈣些子板。 ㈣’該線 基於上述，本發明先將硬板裁切成多個 好的子板與軟板進行預接合，再以熱_4]二並師選 。口考半固化 201106825 0905002 31592twf.doc/n 膠片於良好的子板與軟板之間，以形成一軟硬複合板。由 於硬板已經過可靠度測試確認為良好的電路板，故可避免 不良的硬板因已與軟板相接合而必須連帶地將軟板加以丟 棄’而浪費了良好部分之軟板的材料。因此，本發明可有 效降低失敗率及整個軟硬複合板的生產成本。。 為讓本發明之上述特徵和優點能更明顯易懂，下文特 舉實施例，並配合所附圖式作詳細說明如下。 【實施方式】 圖2A〜圖2F繪示本發明一實施例之軟硬複合板的製 作方法的流程示意圖。圖3繪示本實施例之硬板、軟板及 對位治具的組裝示意圖。 請先參考圖2A，本實施例先進行硬板200的内層製 作’例如以增層法依序完成各個硬板層2〇1的線路佈局， 以九"成具有多層内層線路的硬板200，或是以疊合法將已 完成線路佈局的硬板層201相互堆疊，以形成具有多層内 層線路的硬板200。常用以形成增層線路板的技術方法， 例如1967年發表的增層法之一的r piated_up Technology」、1979年發表的「pactel法」、1988年德國 西門子開發了「Microwiring Substrate」的增層印刷電路 板、1990年IBM開發了「表面增層線路」（Surface Lami· Circuit ’ SLC)的增層印刷電路板、1995年松下電器開發 了「ALIVH」（Any Layer Interstitial via Hole)，以及 1996 年東芝開發了「B2it」的增層印刷電路板等。本實施例不 201106825 0905002 31592twf.doc/n 限定以何種方式完成硬板200的各個硬板層2〇1，也不限 定硬板層201上具有線路佈局或只是做為空白的介電層。 因此，當硬板200經裁切之後，將硬板2〇〇分離為多個子 - 板210f，這些子板210可以是具有相.同線路佈局的電路 板，或是具有不同線路佈局的電路板，不影響後續的製程。 裁切硬板200的方法可以為衝壓、機械切割或雷射切^割。 同時，硬板200在最佳排版利用率之下，可使特定尺寸的 硬板200裁切出數量最多的子板210，以使硬板200被切 除的廢料部分佔用整個硬板2〇〇可用部分的比例最小。一 般來5兒，通常業界可接受的最低排版利用率為6〇_⑽ %，然而，利用本發明的製作方式之後，硬板排版利用 率可以提昇至70-90%。 上述的子板210可經由目視檢驗方式排除外觀性的缺 點子板，或者經由可靠度測試（例如是電性測試、非破壞 性測試或老化測試）得知是否為良好的電路板。若經過二 試而合格的子板210即可歸類為良好的電路板，否則，將 鲁破歸類為不良的電路板而丢棄。也就是說，在未進行軟硬 ^接合步驟之前，即預先淘汰不良的電路板，保留良好的 電路板。或者在電性測試之前，經由目視檢驗的缺點子板 可根據缺點現象或缺點狀況區分為可修補缺點與不可修補 缺點。若為可修補缺點者，經修補後即為良品子板，若為 不可修補缺點者，即可立即丟棄報廢，如此，既可節省電 性測試成本費用’又可避免不良品子板造成後續製造成本 的浪費。 201106825 0905002 3 ] 592twf.doc/a ' 二匕外丄如圖3所示，經裁切的硬板200被分為多個子 之前或之後，可額外形成輔輯位用的第-定位部 士’例如疋插銷定位孔、光學定位點或指示性圖案等。同 日寸’軟板220上也同樣形成有輔助對位用的第二定位部 2?4二列如疋插銷定位孔、光學定位點或指示性圖案等。若 疋以定位孔為例，第一定位部2〇2與第二定位部2〇4例如 以雷射穿孔或機械鑽孔所形成。 π參f圖3，在第一定位孔2〇2與第二定位孔2〇4相 對$的狀悲下，這些子板21〇與相對應的軟板22〇可經由 一疋位治具300固定其相對位置，定位治具3〇〇例如是具 有多個對位插銷302的板體，而對位插銷3〇2可穿過第二 定位部202與第二定位部204。在圖2B〜圖2C中，本實施 例配置第一半固化膠片231於良好的第一子板2l〇a與第二 子板210b的一侧，且位於這些子板21〇a、21〇b與軟板22〇 之間^進行預接合步驟時’第一子板210a與第二子板 210b可經由具有黏性的第一半固化膠片231(或以定位治 具300辅助）預接合至軟板22〇的一表面。此外，本實施例 還可配置第二半固化膠片232與一金屬箔片240於良好的 第一子板21〇a與第二子板21〇b的另一侧，且第二半固化 膠片232位於這些子板210a、210b與金屬箔片240之間， 當進行預接合步驟時，第一子板210a與第二子板210b可 經由具有黏性的第二半固化膠片232(或以定位治具辅助） 預接合至金屬箔片240的一表面。 增加第二半固化膠片232與金屬箔片240的目的是為 了增加線路的層數，當然，本發明不一定要配置第二半固 201106825 0905002 3l592twf.doc/n 化膠片232與金屬箔片240，視情況而定。201106825 0905002 31592twf.doc/n VI. Description of the Invention: [Technical Field] The present invention relates to a method for fabricating a soft and hard composite panel, and more particularly to the manufacture of a soft and hard composite panel for saving hardboard scrap method. [Prior Art] A hard-wound composite panel of a vehicle is a line formed by alternately stacking a soft layer and a hard layer. The road board has both the flexibility of the flexible board and the strength of the hard board. In the production method, when the soft and hard composite sheets are produced in the inner layer, the pressing step of the soft layer and the hard layer is started. As shown in Fig. i, before the press-fitting, the hard board waste 112 of the hard layer (10) is matched with the line layout of the phase-bonded soft board layer 12 (), and a plurality of hollow areas are formed by vacating, and the same, soft board The layer 12 of the soft board material 122 is also matched with the line layout of the phased hard board layer 11〇, and a plurality of hollow areas are formed by being taken out. Taking an eight-layer soft and hard composite board as an example, there is a very large part of the waste that becomes empty, and these cut parts are not only not recoverable, which causes waste of resources and burdens a large amount. The cost of transportation and destruction of wastes is completely contrary to the mainstream awareness of green environmental protection and sustainable operation. In addition, it is worthwhile, / the idea is that when the soft board layer or the hard board layer is completed after the line is completed, if some of the lines have broken lines and other bad conditions, then it is necessary to scrap and discard this part of the soft board layer and hard. The slab layer, and in the conventional manufacturing method, since the soft slab layer is first pressed against the hard slab layer, the scrapping, discarding, and action must be separated in the pressed hard layer and the soft slab layer. It is executed after being formed into a plurality of rare hard composite boards. In other words, if you want to scrap and discard the bad 201106825 0905002 31592twf.doc/n layer, you must discard the soft layer with the phase and waste a good part of the soft layer material. Therefore, the production cost of the entire soft and hard composite board cannot be reduced, and vice versa. SUMMARY OF THE INVENTION The present invention provides a method for fabricating a soft and hard composite panel to save hardboard scrap and reduce production costs. The invention provides a method for manufacturing a soft and hard composite board. First, the hard board is cut so that the hard board is separated into a plurality of sub-boards, and the sub-boards have a first positioning portion. Next, the first prepreg is disposed between the good daughter boards and a soft board, and the soft board has a second positioning portion. Next, the first half of the cured film is placed between a metal foil and a good one of the daughter boards. Thereafter, a pre-bonding step is performed in the opposite position of the first positioning portion and the second positioning portion to position the relative positions of the sub-boards and the flexible board. Furthermore, a thermocompression bonding step is performed to fix the first prepreg film between the three sub-boards and the soft board, and fix the second pre-cured film on the sub-boards and the metal foil Between the sheets to form a soft and hard composite board. The soft and hard composite board can be cut later to separate into a plurality of sub-soft and hard composite boards. The invention further provides a method for manufacturing a soft and hard composite board. First, the hard board is cut to separate the hard board into a plurality of sub-boards. Next, the configuration - half-finishing film is between the good daughter boards and a soft board. Thereafter, a pre-bonding step is performed to position the relative positions of the sub-boards with the soft board. Furthermore, a thermocompression bonding step is performed to fix the prepreg between the sub-board and the soft board to form a soft and hard composite board. Subsequent 201106825 0905002 3l592twf.doc/n Cut the soft and hard composite board' sub-axis town soft and hard composite board. In the embodiment of the present invention, after the cutting of the hard board, the method further includes performing a test to determine whether the sub-boards are good. In the embodiment of the present invention, the above-described method of forming the first positioning portion includes laser perforation or mechanical drilling. Spooning the way - the implementation of the financial, Shang Qingcheng 12 Department of the method includes laser perforation or mechanical drilling. 4 teeth over (four) - the squatting portion and the second positioning portion. Further, in the embodiment, before the pre-bonding step, > forming a first opening in the first semi-curing gel = into - the second opening is in the second semi-solid Hi, The soft board corresponds to the first-on σ (four) page bonding exposed between the sub-boards. The part of the opening of the present invention is shown in the embodiment of the present invention. In the example, after the heat sinking, including the electrical connection of the daughter boards to the metal, in one embodiment of the invention, the above is performed by thermocompression: 2. Further patterning the metal drop In order to form at least a step of the electrical connection I (4) some of the daughter boards. (4) 'The line Based on the above, the present invention first cuts the hard board into a plurality of good sub-boards and soft boards for pre-joining, and then selects the heat _4]. Mouth test semi-curing 201106825 0905002 31592twf.doc/n Film between a good daughter board and a soft board to form a soft and hard composite board. Since the hard board has been confirmed to be a good circuit board by the reliability test, it is possible to avoid that the bad hard board has to be discarded by the soft board because it has to be joined with the soft board, and a good part of the soft board material is wasted. Therefore, the present invention can effectively reduce the failure rate and the production cost of the entire soft and hard composite board. . The above described features and advantages of the present invention will become more apparent from the description of the appended claims. [Embodiment] FIG. 2A to FIG. 2F are schematic flow charts showing a method of manufacturing a soft and hard composite board according to an embodiment of the present invention. FIG. 3 is a schematic view showing the assembly of the hard board, the soft board and the alignment fixture of the embodiment. Referring to FIG. 2A first, in this embodiment, the inner layer fabrication of the hard board 200 is first performed. For example, the line layout of each of the hard board layers 2〇1 is sequentially completed by the build-up method, and the hard board 200 having the multi-layer inner layer line is formed. Or, the hard board layers 201 of the completed line layout are stacked on each other in a stacking manner to form a hard board 200 having a plurality of inner layer lines. Commonly used to form a layered circuit board, such as r piated_up Technology, one of the layering methods published in 1967, the pactel method published in 1979, and the layered printing of "Microwiring Substrate" developed by Siemens in Germany in 1988. Circuit board, in 1990 IBM developed the "Layer Lami· Circuit ' SLC" build-up printed circuit board, in 1995 Matsushita Electric developed "ALIVH" (Any Layer Interstitial via Hole), and Toshiba in 1996 Developed a "B2it" build-up printed circuit board. This embodiment does not define the manner in which the hard board layers 2〇1 of the hard board 200 are completed, nor the dielectric layer having the line layout or just blank as the hard board layer 201. Therefore, after the hard board 200 is cut, the hard board 2 is separated into a plurality of sub-boards 210f, which may be boards having the same line layout or boards having different line layouts. Does not affect the subsequent process. The method of cutting the hard plate 200 may be stamping, mechanical cutting or laser cutting. At the same time, under the optimal layout utilization rate, the hard board 200 of a certain size can cut out the most-numbered sub-board 210, so that the scraped portion of the hard board 200 occupies the entire hard board. The proportion of the part is the smallest. In general, the minimum typographic utilization rate acceptable in the industry is 6〇_(10)%. However, after using the manufacturing method of the present invention, the hard board layout utilization rate can be increased to 70-90%. The sub-board 210 described above can be visually checked to eliminate the appearance of the missing sub-board, or via a reliability test (for example, an electrical test, a non-destructive test, or an aging test) to determine whether it is a good circuit board. A sub-board 210 that has passed the second test can be classified as a good circuit board. Otherwise, it is classified as a bad circuit board and discarded. That is to say, before the hard and soft bonding step is performed, the defective circuit board is pre-empted, and a good circuit board is retained. Or, before the electrical test, the defective sub-boards that have been visually inspected can be classified into repairable defects and non-repairable defects according to the defect phenomenon or the defect condition. If it is a repairable defect, it will be a good product after repairing. If it is not repairable, it can be discarded immediately. This will save the cost of electrical testing and avoid the subsequent manufacture of defective products. Waste of costs. 201106825 0905002 3 ] 592twf.doc/a ' As shown in Figure 3, the cut hard disk 200 is divided into a plurality of sub-positions before or after the additional positioning of the first positioning part for the auxiliary position. For example, 疋 pin positioning holes, optical positioning points or indicative patterns. Similarly, the second positioning portion 2?4, which is used for the auxiliary alignment, is also formed on the same size of the flexible plate 220, such as a pin positioning hole, an optical positioning point or an indicative pattern. If the positioning hole is taken as an example, the first positioning portion 2〇2 and the second positioning portion 2〇4 are formed, for example, by laser perforation or mechanical drilling. π f f FIG. 3, in the first positioning hole 2 〇 2 and the second locating hole 2 〇 4 relative to the shape of $, these daughter boards 21 〇 and the corresponding soft board 22 〇 can be fixed via a clamp fixture 300 The relative position of the positioning fixture 3 is, for example, a plate body having a plurality of alignment pins 302, and the alignment pins 3〇2 can pass through the second positioning portion 202 and the second positioning portion 204. In FIG. 2B to FIG. 2C, the first prepreg film 231 is disposed on one side of the first first sub-board 21a and the second sub-board 210b, and is located at the sub-boards 21a, 21b. When the pre-bonding step is performed with the flexible board 22', the first sub-board 210a and the second sub-board 210b may be pre-bonded to the soft via the viscous first pre-cured film 231 (or assisted by the positioning jig 300). A surface of the plate 22〇. In addition, this embodiment can also configure the second prepreg film 232 and a metal foil 240 on the other side of the good first and second sub-boards 21a and 21b, and the second pre-cured film 232. Located between the sub-boards 210a, 210b and the metal foil 240, when performing the pre-bonding step, the first sub-board 210a and the second sub-board 210b may pass through the second semi-cured film 232 having adhesiveness (or positioning treatment) Auxiliary) pre-bonded to a surface of the metal foil 240. The purpose of adding the second prepreg film 232 and the metal foil 240 is to increase the number of layers of the circuit. Of course, the present invention does not have to be configured with the second semi-solid 201106825 0905002 3l592twf.doc/n film 232 and the metal foil 240, Subject to availability.
接著，請參考圖2C，待完成預接合步驟之後，進行熱 壓接合步驟，使第一/第二半固化膠片231、232經高溫烘 烤而固化，進而固著第一半固化膠片231於這些子板 210a、210b與軟板220之間，且固著第二半固化膠片232 於這些子板210a、210b與金屬箔片240之間。在本實施例 中，如圖2B所示，第一半固化膠片231可於預接合步驟 之前’經撈空而形成第一開口 OP1於第一子板210a與第 二子板210b之間，同樣的’第二半固化膠片232可於預接 合步驟之前，經撈空而形成第二開口 01>2於第一子板21〇a 與第二子板210b之間’以使進行預接合的軟板22〇對應於 第一/第二開口 OP1、OP2的部分顯露於第一子板21〇&與 弟·子板21 Ob之間。 本貫施例的軟板220可以是單面線路板或雙面線路 板’若為單面線路板，軟板220的線路區222可於預接合 步驟之前先形成，若為雙面線路板，軟板24〇的一表面& 線路區222於預接合步驟之前先形成，而位於軟板24〇的 另一表面的線路區221則可選擇於預接合步驟之前先形成 或熱壓接合步驟完成後再形成。 接著，請參考圖2D〜圖2E’電性連接這些子板21〇&、 2肠至軟板22〇 I線㈣⑵，以及電性連接這些子板 2施、鳩至金屬落片240,其方法例如先以雷射貫穿軟 板220及第-半固化躁片231，以形成多個盲孔，之後再 填入導電材料2S3於盲孔中，以電性連接這些子板池、 2勘至軟板220的線路區22卜同樣的，先;^雷射貫穿金 201106825 0905002 31592twf.doc/n 屬箔片240及第二半固化膠片232，以形成多個盲孔，之 後再填入導電材料234於盲孔中，以電性連接這些子板 210a、210b至金屬箔片240。而金屬箔片240可於後續以 蝕刻方式形成一個或多個線路241、242，且對應於第一及 第二開口 OP1、〇p2的部分金屬箔片24〇也被蝕刻而成為 一開口區域OP3，以顯露出第一開口 ορι、第二開口 〇p2 以及相對應之部分軟板220。 接著，請參考圖2F，若圖2E中所形成的軟硬複合板 250為多組子軟硬複合板所集合而成的整體，則可進行裁 切的步驟’以分離為各別的子軟硬複合板25〇a或25〇b。 因此，上述的製作方法能有效提高生產的效率。在本實施 例中，子軟硬複合板250a包括第一子板210a、第二子板 21〇b以及相對應接合於第一子板210a與第二子板210b之 間的部分軟板220a，如圖2F的上圖所示。但在另一實施 例中，子軟硬複合板250b可包括單個子板21〇以及相對應 接合子板210的部分軟板220a，如圖2F的下圖所示。 綜上所述，本發明先將硬板裁切成多個子板，並篩選 良好的子板與軟板進行預接合，再以熱壓接合固著半固化 膠片於良好的子板與軟板之間，以形成一軟硬複合板。由 於硬板已經過目視檢驗或可靠度測試確認為良好的電路 板1故可避免不良的硬板因已與軟板相接合而必須連帶地 將軟板加以丟棄，而浪費了良好部分之軟板的材料。因此， 本發明可有效降低失敗率及整個軟硬複合板的生產成本。 雖然本發明已以實施例揭露如上，然其並非用以限定 本發明，任何所屬技術領域中具有通常知識者，在不脫離 201106825 0905002 3l592twf.doc/n 本發明之精神和範圍内’當可作些許之更動與潤_，故本 發明之保護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】. 圖1是習知一種軟硬複合板的製作方法的示意圖。 圖2A〜圖2F是本發明一實施例之軟硬複合板的製作 方法的流程示意圖。 圖3是本實施例之硬板、軟板及對位治具的組裝示意 圖。 【主要元件符號說明】 110 :硬板層 210b :第二子板 112 .硬板廢料 220、220a :軟板 120 :軟板層 221 :線路區 122 :軟板廢料 222 .線路區 200 :硬板 231 :第一半固化膠片 201 硬板層 232 :第二半固化膠片 202 :第一定位部 233、234 :導電材料 204 :第二定位部 240 :金屬箔片 210 :子板 241、242 :線路 210a :第一子板 250 :軟硬複合板 250a、250b :子軟硬複合板 OP1 :第一開口 300 :定位治具 OP2 :第二開α 302 :對位插銷 ΟΡ3 .開口區域 11Next, referring to FIG. 2C, after the pre-bonding step is completed, a thermocompression bonding step is performed to cure the first/second prepreg film 231, 232 by high-temperature baking, thereby fixing the first prepreg film 231. Between the sub-boards 210a, 210b and the soft board 220, a second prepreg 232 is fixed between the sub-boards 210a, 210b and the metal foil 240. In this embodiment, as shown in FIG. 2B, the first prepreg film 231 can be cut out to form a first opening OP1 between the first sub-board 210a and the second sub-board 210b before the pre-bonding step. The 'secondary prepreg film 232 can be removed to form a second opening 01>2 between the first sub-board 21〇a and the second sub-board 210b before the pre-bonding step to make the pre-bonded soft Portions of the board 22A corresponding to the first/second openings OP1, OP2 are exposed between the first sub-board 21A & and the sub-board 21 Ob. The flexible board 220 of the present embodiment may be a single-sided circuit board or a double-sided circuit board. If the single-sided circuit board is used, the circuit area 222 of the flexible board 220 may be formed before the pre-bonding step. If it is a double-sided circuit board, A surface & line region 222 of the flexible board 24 is formed prior to the pre-bonding step, and the line region 221 at the other surface of the flexible board 24 is optionally formed prior to the pre-bonding step or the thermocompression bonding step is completed. Then formed again. Next, please refer to FIG. 2D to FIG. 2E' to electrically connect the daughter boards 21〇&, 2 intestines to the soft board 22〇I line (4)(2), and electrically connect the daughter boards 2 to the metal falling sheets 240. For example, the laser penetrates the soft plate 220 and the first semi-cured slab 231 to form a plurality of blind holes, and then fills the conductive material 2S3 in the blind hole to electrically connect the sub-plate pools, The circuit area 22 of the flexible board 220 is the same, first; ^ laser through the gold 201106825 0905002 31592twf.doc / n is a foil 240 and a second semi-cured film 232 to form a plurality of blind holes, and then filled with conductive material 234 is in the blind via to electrically connect the daughter boards 210a, 210b to the metal foil 240. The metal foil 240 may be subsequently etched to form one or more lines 241, 242, and a portion of the metal foil 24 对应 corresponding to the first and second openings OP1, 〇p2 is also etched to form an open area OP3. To reveal the first opening ορι, the second opening 〇p2, and the corresponding portion of the flexible board 220. Next, please refer to FIG. 2F. If the soft and hard composite plate 250 formed in FIG. 2E is a whole of a plurality of sets of sub-soft and hard composite plates, the step of cutting can be performed to separate into separate sub-softs. Hard composite board 25〇a or 25〇b. Therefore, the above manufacturing method can effectively improve the production efficiency. In this embodiment, the sub-soft and hard composite board 250a includes a first sub-board 210a, a second sub-board 21〇b, and a partial soft board 220a correspondingly coupled between the first sub-board 210a and the second sub-board 210b. As shown in the upper figure of Figure 2F. However, in another embodiment, the sub-soft and hard composite panel 250b may include a single sub-board 21A and a portion of the flexible board 220a corresponding to the sub-board 210, as shown in the lower diagram of Figure 2F. In summary, the present invention first cuts the hard board into a plurality of sub-boards, and pre-joins the well-selected sub-boards and the soft boards, and then fixes the semi-cured film to the good sub-boards and soft boards by thermocompression bonding. Between to form a soft and hard composite board. Since the hard board has been visually inspected or the reliability test is confirmed to be a good board 1, it is possible to avoid that the bad board has to be discarded by the soft board because it has been joined with the board, and a good part of the board is wasted. s material. Therefore, the present invention can effectively reduce the failure rate and the production cost of the entire soft and hard composite board. Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can be made without departing from the spirit and scope of the invention. The scope of protection of the present invention is subject to the definition of the scope of the appended patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a conventional method of manufacturing a soft and hard composite board. 2A to 2F are schematic flow charts showing a method of fabricating a soft and hard composite board according to an embodiment of the present invention. Fig. 3 is a schematic view showing the assembly of the hard plate, the soft board and the alignment jig of the embodiment. [Main component symbol description] 110: Hard plate layer 210b: Second sub-board 112. Hard board waste 220, 220a: Soft board 120: Soft board layer 221: Line area 122: Soft board waste 222. Line area 200: Hard board 231: first pre-cured film 201 hard plate layer 232: second pre-cured film 202: first positioning portion 233, 234: conductive material 204: second positioning portion 240: metal foil 210: daughter board 241, 242: line 210a: first sub-board 250: soft and hard composite board 250a, 250b: sub-soft and hard composite board OP1: first opening 300: positioning jig OP2: second opening α 302: alignment pin ΟΡ 3. open area 11