CN110366310B - Soft and hard composite board and its making method - Google Patents
Soft and hard composite board and its making method Download PDFInfo
- Publication number
- CN110366310B CN110366310B CN201810286907.7A CN201810286907A CN110366310B CN 110366310 B CN110366310 B CN 110366310B CN 201810286907 A CN201810286907 A CN 201810286907A CN 110366310 B CN110366310 B CN 110366310B
- Authority
- CN
- China
- Prior art keywords
- circuit
- circuit board
- substrate
- layer
- soft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims description 11
- 239000000758 substrate Substances 0.000 claims abstract description 103
- 238000004519 manufacturing process Methods 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 12
- 238000003384 imaging method Methods 0.000 claims abstract description 9
- 238000007747 plating Methods 0.000 claims description 26
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 12
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 239000010931 gold Substances 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910052763 palladium Inorganic materials 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 30
- 229910052802 copper Inorganic materials 0.000 description 30
- 239000010949 copper Substances 0.000 description 30
- 238000009713 electroplating Methods 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 5
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 3
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 3
- 239000010956 nickel silver Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 238000006552 photochemical reaction Methods 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
Abstract
The invention provides a soft and hard composite board, which comprises a first circuit board structure, a second circuit board structure and a third circuit board structure, wherein the first circuit board structure comprises a first base material and a first circuit structure; the third connection substrate is made of a photo imaging dielectric and has flexibility greater than that of the first and second substrates, the third connection substrate is mechanically connected to the first and second circuit board structures, the third circuit board structure has a bendable section between the first and second circuit board structures, and the third circuit structure is formed after the third connection substrate is mechanically connected to the first and second circuit board structures. The invention also provides a manufacturing method of the soft and hard composite board.
Description
Technical Field
The present invention relates to a circuit board structure, and more particularly, to a soft and hard composite board and a method for manufacturing the same.
Background
The circuit board can be classified into a hard circuit board (hard board), a flexible circuit board (soft board) and a soft and hard composite board according to the hardness of the dielectric substance, wherein the soft and hard composite board is usually formed by combining the soft board and the hard board, and has the flexibility of the soft board and the strength of the hard board, so the circuit board is often applied to a component carrier of an electronic product.
In the prior art, after the soft board and the hard board form the circuit respectively, the soft board and the hard board are pressed together, wherein the hard board is provided with a slot in advance, so that the soft board and the hard board have flexibility in the slot area, and the hard board can be provided with surface mounted devices (surface mounted devices).
The soft and hard composite board in the prior art is complex and expensive in manufacturing process, and the assembling process of the surface mounting component is also complex. In addition, the conventional flexible printed circuit board is generally made of FR-4 or PI material, which generally does not resist high temperature, and thus the design freedom of the subsequent process is affected.
Disclosure of Invention
In view of the above, the main objective of the present invention is to provide a soft and hard composite board which is easy to manufacture and a manufacturing method thereof.
In order to achieve the above and other objects, the present invention provides a soft and hard composite board, which comprises a first circuit board structure, a second circuit board structure and a third circuit board structure, wherein the first circuit board structure has a first surface and an opposite second surface, the first circuit board structure comprises at least an insulating first substrate and a first circuit structure formed on the at least one first substrate, the second circuit board structure has a third surface and an opposite fourth surface, the second circuit board structure comprises an insulating second substrate and a second circuit structure formed on the at least one second substrate, the third circuit board structure has a fifth surface and an opposite sixth surface, the third circuit board structure comprises an insulating third connection substrate, at least an insulating third stacked substrate and a third circuit structure formed between the third connection substrate and the at least one third stacked substrate, the third connecting base material is positioned on the fifth surface of the third circuit board structure; wherein the third connection substrate has a flexibility greater than the first substrate and the second substrate, and is made of a photo-imageable dielectric; the third circuit structure is electrically connected with the first circuit structure and the second circuit structure respectively, and the third circuit structure is provided with a bendable section between the first circuit structure and the second circuit structure; the third circuit structure is only distributed between the fifth surface and the sixth surface, and at least one part of the third circuit structure is formed after the third connecting substrate is mechanically connected with the first circuit board structure and the second circuit board structure.
In order to achieve the above and other objects, the present invention provides a method for manufacturing a soft and hard composite board, comprising the steps of:
providing a first circuit board structure and a second circuit board structure, wherein the first circuit board structure is provided with a first surface and an opposite second surface, the first circuit board structure comprises at least one insulated first base material and a first circuit structure formed on the at least one first base material, the second circuit board structure is provided with a third surface and an opposite fourth surface, and the second circuit board structure comprises at least one insulated second base material and a second circuit structure formed on the at least one second base material;
mechanically connecting a third connection substrate to the first surface of the first circuit board structure and the third surface of the second circuit board structure, wherein the third connection substrate has greater flexibility than the first substrate and the second substrate, and is made of a photoimageable dielectric;
forming a plurality of hollow areas which can expose the first circuit structure or the second circuit structure on the third connecting substrate;
forming at least one insulated third laminated substrate and a third circuit structure on the third connecting substrate, so that the third circuit structure is arranged between the third connecting substrate and the at least one third laminated substrate, and one part of the third circuit structure is filled in the hollow area of the third connecting substrate, so that the third circuit structure is electrically connected with the first circuit structure and the second circuit structure respectively;
the third circuit board structure is provided with a bendable section between the first circuit board structure and the second circuit board structure, the third circuit board structure is provided with a fifth surface and a sixth reverse surface, and the third circuit structures are only distributed between the fifth surface and the sixth surface.
Since the third connection substrate is made of a photo-imageable dielectric, the third circuit structure can be formed after the third connection substrate is mechanically connected to the first and second circuit structures, which is different from the prior art in which a circuit structure is formed on a flexible board in advance.
Other effects and embodiments of the present invention will be described in detail with reference to the accompanying drawings.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic cross-sectional view of one embodiment of a soft and hard composite board according to the present invention;
fig. 2 to 21 are schematic cross-sectional views illustrating a manufacturing process of a soft and hard composite board according to an embodiment of the present invention.
Description of the symbols
10 first circuit board structure 11 first surface
12 second surface 13a, 13b first substrate
14 first circuit structure 14a electroless copper plating
14b, 14c copper plating layer 14d surface plating layer
20 a third surface of the second circuit-board structure 21
22 fourth surface 23a, 23b second substrate
24 second circuit structure 24a electroless copper plating
24b, 24c copper plating layer 24d surface plating layer
30 fifth surface of third circuit board structure 31
32 sixth surface 33 third connection substrate
33a hollow-out 34 third laminated substrate
35 third circuit structure 35a copper electroplating layer
36 bendable section 100 double-sided copper substrate
101 via 102 electroplated copper layer
103 solder mask ink 104, 105 electroplating copper layer
106 solder mask layer 107 photoimageable dielectric layer
Detailed Description
Referring to fig. 1, a soft and hard composite board according to an embodiment of the present invention is illustrated, and the soft and hard composite board includes a first circuit board structure 10, a second circuit board structure 20, and a third circuit board structure 30.
The first circuit board structure 10 has a first surface 11 and an opposite second surface 12, and the first circuit board structure 10 includes two insulating first substrates 13a and 13b and a first circuit structure 14 formed on the first substrates 13a and 13b, wherein the first substrate 13a is made of PP, the second substrate 13b is made of solder resist, and the first circuit structure 14 illustratively includes a chemical copper plating layer 14a, a copper electroplating layer 14b and 14c, and a surface electroplating layer 14d, wherein the surface electroplating layer 14d may be but is not limited to one of a nickel layer, a gold layer, a silver layer, and a palladium layer or a laminated structure thereof, such as a nickel-gold electroplating laminated structure, a nickel-silver laminating structure, or a nickel-palladium-gold laminated structure.
The second circuit board structure 20 has a third surface 21 and an opposite fourth surface 22, the second circuit board structure 20 has two insulating second substrates 23a, 23b and a second circuit structure 24 formed on the second substrates 23a, 23b, wherein the second substrate 23a is made of PP, for example, the second substrate 23b is made of solder resist, for example, the second circuit structure 24 illustratively comprises an electroless copper plating layer 24a, copper plating layers 24b, 24c and a surface plating layer 24d which are made in layers, wherein the surface plating layer 24d can be but is not limited to one of nickel layer, gold layer, silver layer, palladium layer or their laminated structure, such as an electroplated nickel-gold laminate structure, an electroplated nickel-silver laminate structure, an electroless nickel-gold laminate structure, an electroless nickel-silver laminate structure, or a nickel-palladium-gold laminate structure, these surface plating layers 14d, 24d may be used, for example, to attach surface mount components or connection ports. The first and second circuit board structures 10 and 20 are not mechanically connected (mechanically separated).
The third circuit board structure 30 has a fifth surface 31 and an opposite sixth surface 32, and the third circuit board 30 includes an insulating third connection substrate 33, an insulating third laminated substrate 34, and a third circuit structure 35 formed between the third connection substrate 33 and the third laminated substrate 34. The third connecting substrate 33 is made of a photosensitive imaging dielectric (e.g., ultraviolet) which is photosensitive to light with a specific wavelength range, and a photosensitizer (e.g., a photosensitive polymer) in the photosensitive imaging dielectric has photosensitive groups which are subjected to a photochemical reaction when irradiated with light with a specific wavelength range; the photoimageable dielectric may be a positive photoimageable dielectric, the photoactive region of which is soluble in a developer; the photosensitive imaging dielectric can also be a negative photosensitive imaging dielectric, and the non-photosensitive area of the photosensitive imaging dielectric can be dissolved in a developing solution; the third laminated substrate 34 can be made of photo-imaging dielectric or other dielectric or insulating material with flexibility, wherein the flexibility of the third connecting substrate 33 and the third laminated substrate 34 is preferably greater than that of the first substrate 13a, 13b and the second substrate 23a, 23b, so that the third circuit board structure 30 has a bendable section 36 between the first circuit board structure 10 and the second circuit board structure 20, and thus the third circuit board structure 30 has the characteristic of a soft board, while the first and second circuit board structures 10, 20 have the characteristic of a hard board, and the first and second circuit board structures 10, 20 can be relatively displaced.
In addition, the third connection substrate 33 is located on the fifth surface 31 of the third circuit board structure 30, and the third connection substrate 33 is mechanically connected (mechanically connected to) the first surface 11 of the first circuit board structure 10 and the third surface 21 of the second circuit board structure 20. On the other hand, the sixth surface 32 of the third circuit board structure 30 is not connected to other circuit board structures (especially hard boards).
The third circuit structure 35 is formed on the third connection substrate 33 and the third laminated substrate 34, the third circuit structure 35 illustratively includes a copper electroplating layer 35a, a portion of the third circuit structure 35 extends to the bendable section 36, and preferably, the third circuit structure 35 electrically connects at least a portion of the circuits in the first circuit structure 14 to at least a portion of the circuits in the second circuit structure 24.
Fig. 2 to 21 disclose a manufacturing process of a soft and hard composite board, which is described as follows:
as shown in fig. 2, a double-sided copper substrate 100 is first taken, then a drilling operation is performed as shown in fig. 3 to form a via hole 101 on the double-sided copper substrate 100, then a copper plating operation is performed as shown in fig. 4 to form a copper electroplating layer 102 on the surface of the double-sided copper substrate 100 and in the via hole 101, and then a via hole operation is performed as shown in fig. 5 to fill the via hole 101 with an insulating material such as solder mask ink 103.
Next, as shown in fig. 6, a grooving operation is performed to make the double-sided copper base material 100 substantially have the prototype of the first circuit board structure 10 and the second circuit board structure 20. Then, as shown in fig. 7 to 10, dry film pressing, exposure, development, and etching film stripping are sequentially performed to form a patterned circuit layer on the double-sided copper substrate 100.
To this end, the structure on the left side of the double-sided copper substrate 100 is the basic configuration of the first circuit board structure 10, and the structure on the right side of the double-sided copper substrate 100 is the basic configuration of the second circuit board structure 20, that is, the first circuit board structure 10 and the second circuit board structure 20 are provided.
Next, as shown in fig. 11, a lamination process is performed again to mechanically connect the third connection substrate 33 to the first surface 11 of the first circuit board structure 10 and the third surface 21 of the second circuit board structure 20, wherein the third connection substrate 33 is made of a photo-imageable dielectric.
Then, as shown in fig. 12 and 13, exposure and development operations are sequentially performed to form a plurality of hollow areas 33a on the third connection substrate 33, where the first circuit structure or the second circuit structure can be exposed.
As shown in fig. 14, a copper plating operation is performed to form a copper plating layer 104 on the second surface 12 and the fourth surface 22 of the first and second circuit board structures 10 and 20, and a copper plating layer 105 is also formed on the surface of the third connection substrate 33, and a portion of the copper plating layer 105 is filled in the hollow area 33a of the third connection substrate 33, so that the copper plating layer 105 is electrically connected to the first and second circuit structures.
Then, as shown in fig. 15 to 18, dry film pressing, exposure, development, and etching stripping operations are sequentially performed on the electroplated copper layers 104 and 105, so as to manufacture the electroplated copper layers 104 and 105 into a patterned circuit layer.
Then, as shown in fig. 19 to fig. 21, performing solder mask insulating operation, exposure, and development operation, respectively forming a solder mask layer 106 and a photo imaging dielectric layer 107 on the surfaces of the electroplated copper layers 104 and 105, forming a window on the solder mask layer 106, and finally performing surface electroplating treatment on the window of the solder mask layer 106 to obtain the soft and hard composite board as shown in fig. 1. In this embodiment, the third circuit structure is formed after the third connection substrate is mechanically connected to the first and second circuit board structures.
It should be noted that the first and second circuit board structures can be two-layer boards or multi-layer boards, and the number of layers of the first substrate and the second substrate depends on the circuit wiring requirement; similarly, the number of layers of the third stacked structure can be adjusted according to the circuit wiring requirements of the third circuit board structure. It should be noted that, the third circuit structure referred to herein refers to a circuit structure completely located on the fifth and sixth surfaces, and other circuit structures (e.g., the conductive layer extending between the first and third circuit board structures and the via hole) extending beyond the fifth surface are not the third circuit structure referred to herein.
The above-described embodiments and/or implementations are only for illustrating the preferred embodiments and/or implementations of the present technology, and are not intended to limit the implementations of the present technology in any way, and those skilled in the art can make many modifications or changes without departing from the scope of the technology disclosed in the present disclosure, but should be construed as technology or implementations that are substantially the same as the present technology.
Claims (12)
1. A soft and hard composite board, comprising:
a first circuit board structure having a first surface and an opposite second surface, the first circuit board structure including at least one insulating first substrate and a first circuit structure formed on the at least one first substrate;
a second circuit board structure having a third surface and an opposite fourth surface, the second circuit board structure including at least one insulating second substrate and a second circuit structure formed on the at least one second substrate; and
a third circuit board structure having a fifth surface and an opposite sixth surface, the third circuit board structure including an insulated third connection substrate, at least one insulated third stacked substrate, and a third circuit structure formed between the third connection substrate and the at least one third stacked substrate, the third connection substrate being located on the fifth surface of the third circuit board structure;
wherein the third connection substrate has a flexibility greater than the first substrate and the second substrate, and is made of a photoimageable dielectric;
the third connecting substrate is mechanically connected to the first surface of the first circuit board structure and the third surface of the second circuit board structure, the third circuit structure is electrically connected with the first circuit structure and the second circuit structure respectively, and the third circuit board structure is provided with a bendable section between the first circuit board structure and the second circuit board structure;
wherein the third circuit structure is only distributed between the fifth surface and the sixth surface, and at least a portion of the third circuit structure is formed after the third connection substrate is mechanically connected to the first and second circuit board structures.
2. The composite soft and hard board of claim 1, wherein the at least one third laminated substrate has greater flexibility than the first substrate and the second substrate.
3. The composite board of claim 1, wherein the first circuit structure has at least one surface plating layer on the second surface, and the surface plating layer is one of a nickel layer, a gold layer, a silver layer, and a palladium layer, or a laminated structure thereof.
4. The composite board of claim 1, wherein the second circuit structure has at least one surface plating layer on the fourth surface, and the surface plating layer is one of a nickel layer, a gold layer, a silver layer, and a palladium layer, or a laminated structure thereof.
5. The composite soft and rigid board of claim 1, wherein a portion of the first circuit structure is formed after the third connection substrate is mechanically connected to the first and second circuit board structures.
6. The composite soft and rigid board of claim 1, wherein a portion of the second circuit structure is formed after the third connection substrate is mechanically connected to the first and second circuit board structures.
7. The method for manufacturing the soft and hard composite board is characterized by comprising the following steps of:
providing a first circuit board structure and a second circuit board structure, wherein the first circuit board structure is provided with a first surface and an opposite second surface, the first circuit board structure comprises at least one insulated first base material and a first circuit structure formed on the at least one first base material, the second circuit board structure is provided with a third surface and an opposite fourth surface, and the second circuit board structure comprises at least one insulated second base material and a second circuit structure formed on the at least one second base material;
mechanically connecting a third connection substrate to the first surface of the first circuit board structure and the third surface of the second circuit board structure, wherein the third connection substrate has a flexibility greater than that of the first substrate and the second substrate, and is made of a photo-sensitive imaging dielectric;
forming a plurality of hollow areas on the third connection substrate, wherein the hollow areas can expose the first circuit structure or the second circuit structure;
forming at least one insulated third laminated substrate and a third circuit structure on the third connection substrate, so that the third circuit structure is arranged between the third connection substrate and the at least one third laminated substrate, and one part of the third circuit structure is filled in a hollow area of the third connection substrate, so that the third circuit structure is electrically connected with the first circuit structure and the second circuit structure respectively;
the third circuit board structure is provided with a bendable section between the first circuit board structure and the second circuit board structure, the third circuit board structure is provided with a fifth surface and a sixth reverse surface, and the third circuit structure is only distributed between the fifth surface and the sixth surface.
8. The method for manufacturing a soft and hard composite board according to claim 7, wherein the at least one third laminated substrate has a flexibility greater than that of the first substrate and the second substrate.
9. The method for manufacturing a soft and hard composite board according to claim 7, wherein the first circuit structure has at least one surface plating layer on the second surface, and the surface plating layer is one of a nickel layer, a gold layer, a silver layer, and a palladium layer or a laminated structure thereof.
10. The method for manufacturing a soft and hard composite board according to claim 7, wherein the second circuit structure has at least one surface plating layer on the fourth surface, and the surface plating layer is one of a nickel layer, a gold layer, a silver layer and a palladium layer or a laminated structure thereof.
11. The method of making a soft or hard composite board according to claim 7, wherein a portion of the first circuit structure is formed after the third connection substrate is mechanically connected to the first and second circuit board structures.
12. The method of making a soft or hard composite board according to claim 7, wherein a portion of the second circuit structure is formed after the third connection substrate is mechanically connected to the first and second circuit board structures.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107110355 | 2018-03-26 | ||
| TW107110355A TWI649016B (en) | 2018-03-26 | 2018-03-26 | Soft and hard composite board and its preparation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110366310A CN110366310A (en) | 2019-10-22 |
| CN110366310B true CN110366310B (en) | 2022-06-17 |
Family
ID=63945600
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820458650.4U Withdrawn - After Issue CN208047005U (en) | 2018-03-26 | 2018-04-03 | Soft and hard composite board |
| CN201810286907.7A Active CN110366310B (en) | 2018-03-26 | 2018-04-03 | Soft and hard composite board and its making method |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820458650.4U Withdrawn - After Issue CN208047005U (en) | 2018-03-26 | 2018-04-03 | Soft and hard composite board |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN208047005U (en) |
| TW (1) | TWI649016B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI708532B (en) * | 2019-06-05 | 2020-10-21 | 李蕙如 | Rigid-flex board and method for making the same |
| CN112087863A (en) * | 2019-06-13 | 2020-12-15 | 李蕙如 | Soft and hard composite board and its making method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005122657A1 (en) * | 2004-06-11 | 2005-12-22 | Ibiden Co., Ltd. | Rigid-flex wiring board and method for producing same |
| JP2006148127A (en) * | 2004-11-22 | 2006-06-08 | Valeo Vision | Manufacturing method of support of light emitting diode interconnected in three-dimensional environment |
| CN102159021A (en) * | 2010-02-12 | 2011-08-17 | 揖斐电株式会社 | Flex-rigid wiring board and method for manufacturing the same |
| EP2768294A2 (en) * | 2013-01-08 | 2014-08-20 | Carl Freudenberg KG | Assembly having a flexible circuit board |
| CN107613639A (en) * | 2017-08-01 | 2018-01-19 | 深圳明阳电路科技股份有限公司 | One kind partly scratches pcb board and preparation method thereof |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100584962B1 (en) * | 2004-07-26 | 2006-05-29 | 삼성전기주식회사 | Rigid-flexible PCB having a coverlay made from Liquid Crystal Polymer and manufacturing method thereof |
| TWI345432B (en) * | 2007-07-26 | 2011-07-11 | Nan Ya Printed Circuit Board Corp | Method for manufacturing a rigid-flex circuit board |
| TW200944078A (en) * | 2008-04-09 | 2009-10-16 | Compeq Mfg Co Ltd | A manufacturing method for a soft-hard board |
| TWI367710B (en) * | 2009-08-11 | 2012-07-01 | Unimicron Technology Corp | Fabrication method of rigid-flex circuit board |
| CN103124472B (en) * | 2011-11-18 | 2015-12-16 | 北大方正集团有限公司 | A kind of rigid/flexible combined printed circuit board manufacture method and rigid/flexible combined printed circuit board |
| CN103987207B (en) * | 2013-02-07 | 2017-03-01 | 欣兴电子股份有限公司 | Flexible and hard composite circuit board and manufacturing method thereof |
| TWM568019U (en) * | 2018-03-26 | 2018-10-01 | 同泰電子科技股份有限公司 | Rigid-flex circuit board |
-
2018
- 2018-03-26 TW TW107110355A patent/TWI649016B/en active
- 2018-04-03 CN CN201820458650.4U patent/CN208047005U/en not_active Withdrawn - After Issue
- 2018-04-03 CN CN201810286907.7A patent/CN110366310B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005122657A1 (en) * | 2004-06-11 | 2005-12-22 | Ibiden Co., Ltd. | Rigid-flex wiring board and method for producing same |
| JP2006148127A (en) * | 2004-11-22 | 2006-06-08 | Valeo Vision | Manufacturing method of support of light emitting diode interconnected in three-dimensional environment |
| CN102159021A (en) * | 2010-02-12 | 2011-08-17 | 揖斐电株式会社 | Flex-rigid wiring board and method for manufacturing the same |
| EP2768294A2 (en) * | 2013-01-08 | 2014-08-20 | Carl Freudenberg KG | Assembly having a flexible circuit board |
| CN107613639A (en) * | 2017-08-01 | 2018-01-19 | 深圳明阳电路科技股份有限公司 | One kind partly scratches pcb board and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201941671A (en) | 2019-10-16 |
| CN208047005U (en) | 2018-11-02 |
| TWI649016B (en) | 2019-01-21 |
| CN110366310A (en) | 2019-10-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0478313B1 (en) | A multilayer printed circuit board and manufacturing method therefor | |
| KR102517144B1 (en) | Multilayer Flexible Printed Wiring Board and Method for Producing Same | |
| JP5198105B2 (en) | Manufacturing method of multilayer flexible printed wiring board | |
| US20090250253A1 (en) | Printed circuit board and manufacturing method thereof | |
| JP2005183952A (en) | Manufacturing method of printed circuit board having conductive holes and board thereof | |
| KR20000047653A (en) | Two signal one power plane circuit board | |
| KR100499008B1 (en) | Two-sided PCB without via hole and the manufacturing method thereof | |
| JP2007184568A (en) | Circuit board manufacturing method | |
| TWI479972B (en) | Multi-layer flexible printed wiring board and manufacturing method thereof | |
| US20070272654A1 (en) | Method for Manufacturing Circuit Board | |
| CN101325845B (en) | Multilayer printed circuit board and method of fabricating the same | |
| CN110366310B (en) | Soft and hard composite board and its making method | |
| US20070132087A1 (en) | Via hole having fine hole land and method for forming the same | |
| WO2007116622A1 (en) | Multilayer circuit board having cable portion and method for manufacturing same | |
| US6586687B2 (en) | Printed wiring board with high density inner layer structure | |
| JP3770895B2 (en) | Manufacturing method of wiring board using electrolytic plating | |
| CN209861268U (en) | Multi-layer circuit board structure with through hole and blind hole simultaneously | |
| KR20060066971A (en) | Manufacturing method for double side flexible printed circuit board | |
| TWM568019U (en) | Rigid-flex circuit board | |
| KR100658972B1 (en) | Pcb and method of manufacturing thereof | |
| CN112153802B (en) | Circuit board structure and manufacturing method thereof | |
| JP2004072125A (en) | Manufacturing method of printed wiring board, and printed wiring board | |
| KR100658437B1 (en) | Pcb and it's manufacturing method used bump board | |
| JP2008141033A (en) | Multilayer printed-wiring board and method of manufacturing the same | |
| JP2009088334A (en) | Printed circuit board manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |