TWI708532B - Rigid-flex board and method for making the same - Google Patents

Abstract

The present invention discloses a rigid-flex board and a method for making the same. The rigid-flex board comprises a first circuit board structure (CBS), a second circuit board structure (CBS) and a third circuit board structure (CBS). The first CBS and the second CBS are mechanically separated from each other, and the third CBS comprises an insulating connection substrate, an insulating stacking substrate, and a circuit structure formed between the two substrates. Particularly, the insulating connection substrate is coated with a curable material such as thermosetting resin, such that the insulating connection substrate is able to have a permanent connection with the first CBS and the second CBS. Therefore, the rigid-flex board of the present invention exhibits outstanding properties of good flexibility and steady connection reliability.

Description

Flexible and hard composite board and its manufacturing method

The invention relates to a circuit board structure, in particular to a flexible and hard composite board and its manufacturing method.

Circuit boards can be divided into rigid circuit boards (referred to as rigid boards), flexible circuit boards (soft boards), and flexible and rigid composite boards according to the hardness of the dielectric material. The flexible and rigid composite boards are usually made of flexible boards and rigid boards. It is combined with the flexibility of a soft board and the strength of a hard board, so it is often used in the parts carriers of electronic products.

The prior art soft and hard composite board usually forms circuits after the soft board and the hard board are respectively formed, and then the soft and hard boards are pressed together. The hard board is pre-formed with slots, so that the flexible and hard composite boards have Flexible, and the hard board part can be equipped with surface mounted devices (surface mounted devices).

The prior art flexible and hard composite board manufacturing process is complicated and expensive, and the assembly process of its surface mount components is also complicated.

In view of this, the main purpose of the present invention is to provide a flexible and hard composite board that is easy to manufacture and its manufacturing method.

In order to achieve the above and other objectives, the present invention provides an embodiment of a flexible and rigid composite board, which includes: A first circuit board structure, including: at least one first insulating substrate, a first circuit structure formed on a first surface of the first insulating substrate, and a second circuit structure formed on the first insulating substrate A second circuit structure on the surface; a second circuit board structure comprising: at least one second insulating substrate, a third circuit structure formed on a third surface of the second insulating substrate, and a third circuit structure formed on the first A fourth circuit structure on the fourth surface of one of the two insulating substrates; and a third circuit board structure, including: a fifth surface is mechanically connected to the second surface and the second surface of the first insulating substrate An insulating connecting substrate on the fourth surface of the insulating substrate and a fifth circuit structure formed on a sixth surface of the connecting substrate; wherein the flexibility of the connecting substrate is much greater than that of the first An insulating substrate and the second insulating substrate, the fifth surface of the connecting substrate is covered with a curable adhesive material, and the curable adhesive material is cured into a cured adhesive layer so that the third circuit board structure and the A permanent connection is formed between the first circuit board structure and the second circuit board structure; wherein a plurality of hollow areas penetrate the connecting substrate and the cured adhesive layer, so that the fifth circuit structure is formed through the plurality of hollow areas It is electrically connected to the second circuit structure and the fourth circuit structure, and the third circuit board structure has a bendable section between the first circuit board structure and the second circuit board structure; wherein, A part of the fifth circuit structure is formed after the connecting substrate is mechanically connected to the first insulating substrate and the second insulating substrate.

In order to achieve the above and other objectives, the present invention provides another embodiment of the flexible and rigid composite board, including: A first circuit board structure, including: at least one first insulating substrate, a first circuit structure formed on a first surface of the first insulating substrate, and a second circuit structure formed on the first insulating substrate A second circuit structure on the surface; a second circuit board structure comprising: at least one second insulating substrate, a third circuit structure formed on a third surface of the second insulating substrate, and a third circuit structure formed on the first A fourth circuit structure on the fourth surface of one of the two insulating substrates; and a third circuit board structure, including: a fifth surface is mechanically connected to the second surface and the second surface of the first insulating substrate An insulating connecting substrate on the fourth surface of the insulating substrate and a fifth circuit structure formed on a sixth surface of the connecting substrate; wherein the flexibility of the connecting substrate is much greater than that of the first An insulating substrate and the second insulating substrate; wherein a curable adhesive material is coated on the second circuit structure of the first circuit board structure and the fourth circuit structure of the second circuit board structure, and The curable adhesive material is cured into a cured adhesive layer to form a permanent connection between the third circuit board structure and the first circuit board structure and the second circuit board structure; wherein a plurality of hollow areas penetrate the connection The base material and the cured adhesive layer enable the fifth circuit structure to be electrically connected to the second circuit structure and the fourth circuit structure through the plurality of hollow areas, and the third circuit board structure has an interposition between the first A bendable section between the circuit board structure and the second circuit board structure; wherein a part of the fifth circuit structure is mechanically connected to the first insulating substrate and the second insulating substrate at the connecting substrate The substrate is formed later.

In order to achieve the above and other objectives, the present invention also provides an embodiment of a method for manufacturing a flexible and rigid composite board, which includes the following steps: A first circuit board structure and a second circuit board structure are provided, wherein the first circuit board structure includes at least a first insulating substrate, and a first circuit structure formed on a first surface of the first insulating substrate And a second circuit structure formed on a second surface of the first insulating substrate, and the second circuit board structure includes at least one second insulating substrate formed on one of the second insulating substrates A part of a third circuit structure on the third surface and a fourth circuit structure formed on a fourth surface of the second insulating substrate; uncured is formed on a fifth surface of an insulating connecting substrate Or a semi-cured curable adhesive material, the flexibility of the connecting substrate is much greater than the first insulating substrate and the second insulating substrate; the uncured or semi-cured curable adhesive material will be formed The fifth surface of the connecting substrate is pressed against the second surface of the first insulating substrate and the fourth surface of the second insulating substrate; the curable adhesive material is completely cured into a cured adhesive layer; A plurality of hollow areas are formed on the sixth surface of the substrate and the cured adhesive layer to expose the second circuit structure of the first circuit board structure and the second circuit board structure by using the plurality of hollow areas A fourth circuit structure; and forming a fifth circuit structure on the sixth surface of the connecting substrate, wherein a part of the fifth circuit structure is filled in the hollow area, so that the fifth circuit structure and the The second circuit structure and the fourth circuit structure are electrically connected; wherein, the connecting base material and the fifth circuit structure form a third circuit board structure, and the third circuit board structure has a structure between the first circuit board And a bendable section between the second circuit board structure.

Since the fifth circuit structure is formed after the connecting substrate is mechanically connected to the first circuit board structure and the second circuit board structure, this is in contrast to the prior art that requires a circuit structure to be formed on the flexible board in advance. The manufacturing method of the structure is different, and it is expected that the present invention will therefore have a higher yield and productivity, and the degree of freedom of process design can also be increased.

<The present invention>

1: Soft and hard composite board

10: The first circuit board structure

20: The second circuit board structure

30: The third circuit board structure

11: The first insulating substrate

12: The first line structure

13: Second line structure

111: first surface

112: second surface

12a, 13a: thin copper plating

12b, 12c, 13b: electroplated copper layer

12d: Surface plating layer

12e: solder mask

12W: Welded window

21: Second insulating substrate

22: The third line structure

23: Fourth line structure

211: Third Surface

212: Fourth Surface

22a, 23a: thin copper plating

22b, 22c, 23b: electroplated copper layer

22d: surface plating

22e: solder mask

22W: Welded window

31: Connect the substrate

32: Laminated substrate

33e: solder mask

33: Fifth line structure

35: hollow area

34: Bendable section

30b: Cured adhesive layer

30a: Curable adhesive material

312: Sixth Surface

311: Fifth Surface

10B: Substrate

S1~S4: steps

10T: Through hole

101, 102: copper plating layer

103, 104: Electroplated copper layer

100: Double-sided copper substrate

Figure 1 is a side cross-sectional view of a rigid-flex composite board of the present invention.

Figure 2 is a flowchart of a method for manufacturing a flexible and rigid composite board according to the present invention.

3A to 3I are schematic diagrams of the process of step S1.

Figure 4 is a schematic diagram of the first process of step S2.

FIG. 5A and FIG. 5B are schematic diagrams of the second process in step S2.

Figures 6A and 6B are schematic diagrams of the process of step S3.

Fig. 7A to Fig. 7D are schematic diagrams of the process of step S4.

Figures 8A to 8B are schematic diagrams of the solder resist insulation manufacturing process.

In order to be able to more clearly describe the flexible and rigid composite board and its manufacturing method proposed by the present invention, the preferred embodiments of the present invention will be described in detail below in conjunction with the drawings.

Figure 1 shows a side cross-sectional view of a rigid-flex composite board of the present invention. As shown in FIG. 1, the flexible and rigid composite board 1 of the present invention mainly includes a first circuit board structure 10, a second circuit board structure 20, and a third circuit board structure 30 in terms of structural composition. Wherein, the first circuit board structure 10 and the second circuit board structure 20 are mechanically separated. In addition, the first circuit board structure 10 includes a first insulating substrate 11, a first circuit structure 12 formed on a first surface 111 of the first insulating substrate 11, and a first insulating substrate 11 a second circuit structure 13 on a second surface 112. Engineers familiar with the design and production of flexible circuit boards should know that the material of the first insulating substrate 11 can be Polyimide (PI), Polyethylene Terephthalate (PET) or Polyethylene Naphthalate (PEN).

The first circuit structure 12 includes a thin copper-plated layer 12a, at least one electroplated copper layer (12b, 12c), and a surface electroplating layer 12d fabricated in layers, and the second circuit structure 13 includes a thin copper-plated layer 12a fabricated in layers. The copper-plated layer 13a and at least one copper-plated layer 13b. Specifically, the thin copper plating layer 12a and the thin copper plating layer 13a can be a sputtered copper layer or an electroless copper plating layer, and the surface electroplating layer 12d is a nickel layer, a gold layer, a silver layer, One of the palladium layers or their laminated structure, such as electroplated nickel-gold laminated structure, electroplated nickel-silver-gold laminated structure, electroplated nickel-silver laminated structure, electroless nickel-gold laminated structure, electroless nickel-silver laminated structure, or nickel-palladium-gold laminated structure. And, as shown in Figure 1, the first circuit structure 12 is further covered with a solder mask 12e, and the solder mask 12e is provided with a plurality of solder windows 12W to expose the surface plating layer 12d, so that the surface is attached Surface mounted devices are easily soldered or electrically connected to the surface plating layer 12d.

On the other hand, the second circuit board structure 20 includes: a second insulating substrate 21, a third circuit structure 22 formed on a third surface 211 of the second insulating substrate 21, and a third circuit structure 22 formed on the second insulating substrate 21. A fourth circuit structure 23 on a fourth surface 212 of the insulating substrate 21. Similarly, the material of the second insulating substrate 21 can be PI, PET, or PEN. According to the design of the present invention, the third circuit structure 22 includes a thin copper-plated layer 22a, at least one electroplated copper layer (22b, 22c), and a surface electroplated layer 22d, and the fourth circuit structure 23 includes A thin copper plating layer 23a and at least one copper electroplating layer 23b are fabricated in layers. Specifically, the thin copper plating layer 22a and the thin copper plating layer 23a can be a sputtered copper layer or an electroless copper plating layer, and the surface electroplating layer 22d is a nickel layer, a gold layer, a silver layer, One of the palladium layers or their laminated structure. And, as shown in Figure 1, the third circuit structure 22 is further covered with a solder mask 22e, and the solder mask 22e is provided with a plurality of solder windows 22W to expose the surface plating layer 22d, so that the surface is attached The mounting element is easily soldered or electrically connected to the surface plating layer 22d.

In more detail, the third circuit board structure 30 includes: an insulated connecting substrate 31 and a fifth circuit structure 33; wherein, the connecting substrate 31 has a fifth surface 311 through a solid The adhesive layer is mechanically connected to the second surface 112 of the first insulating substrate 11 and the fourth surface 212 of the second insulating substrate 21. Moreover, as shown in FIG. 1, the fifth circuit structure 33 is formed on a sixth surface 312 of the connecting substrate 31. According to the design of the present invention, a cured adhesive layer is formed on a fifth surface 311 of the connecting substrate 31, and the cured adhesive layer is made of a curable adhesive material, such as thermosetting resin, photocurable resin, Or the resin cured by adding a curing agent. Moreover, the flexibility of the connecting substrate 31 is much greater than that of the first insulating substrate 11 and the second insulating substrate 21. The connecting substrate is made of, for example, a common flexible circuit board material (FPC) or polyimide (PI).

It must be particularly noted that the fifth circuit structure 33 of the third circuit board structure 30, a part of the first circuit structure 12 of the first circuit board structure 10 (ie, the electroplated copper layer 12c and the surface electroplated layer 12d), and a part of the third circuit structure 22 (ie, the electroplated copper layer 22c and the surface electroplating layer 22d) are mechanically connected to the first insulating base 11 and the second insulating base at the connecting base 31 The material is formed after 21. Moreover, a plurality of hollow areas 35 penetrate through the connecting substrate 31 and the cured adhesive layer, so that the fifth circuit structure 33 is electrically connected to the second circuit structure 13 and the fourth circuit structure 23 through the plurality of hollow areas 35. The third circuit board structure 30 has a bendable section 34 between the first circuit board structure 10 and the second circuit board structure 20. Therefore, the third circuit board structure 30 has the characteristics of a soft board, while the first circuit board structure 10 and the second circuit board structure 20 have the characteristics of a hard board, and the first circuit board structure 10 and the second circuit board structure 20 can Relative displacement.

Continuing, the manufacturing method of the flexible and rigid composite board of the present invention will be described in detail below with the aid of related drawings. Figure 2 shows a flow chart of a manufacturing method of a flexible and rigid composite board of the present invention. When performing the production of the flexible and hard composite board 1 as shown in Figure 1, step S1 is first performed: a first circuit board structure 10 and a second circuit board structure 20 are provided, wherein the first circuit board structure 10 includes A first insulating base Material 11, a part of a first circuit structure 12 formed on a first surface 111 of the first insulating substrate 11, and a second circuit structure formed on a second surface 112 of the first insulating substrate 11 13, and the second circuit board structure 20 includes a second insulating substrate 21, a part of a third circuit structure 22 formed on a third surface 211 of the second insulating substrate 21, and a part of a third circuit structure 22 formed on the second insulating substrate 21. A fourth circuit structure 23 on a fourth surface 212 of the insulating substrate 21.

Fig. 3A to Fig. 3I show a schematic diagram of the process of step S1. As shown in FIG. 3A, first, a substrate 10B is taken, and then a copper-plated layer 101 and a copper-plated layer 102 are formed on the two surfaces of the substrate 10B to obtain a double-sided copper substrate 100. Wherein, both the copper plating layer 101 and the copper plating layer 102 can be a sputtered copper layer or an electroless copper plating layer. Next, as shown in FIG. 3B, a drilling operation is performed to form a plurality of via holes 10T on the double-sided copper substrate 100. Continuing, as shown in FIG. 3C, an electroplated copper layer 103 is formed on the surface of the double-sided copper substrate 100 and the inner wall surface of each of the via holes 101. As shown in FIG. 3D, the hole plugging operation is then performed, and an insulating material such as a solder mask 104 is filled in each of the via holes 101.

Further, as shown in FIG. 3E, a grooving operation is performed on the double-sided copper substrate 100. At this time, the prototypes of the first circuit board structure 10 and the second circuit board structure 20 have appeared. Then, as shown in Fig. 3F, Fig. 3G, Fig. 3H, and Fig. 3I, dry film, exposure, development, and etching and stripping operations are sequentially performed, and the first circuit board A second circuit structure 13 is formed on the second surface 112 of the first insulating substrate 11 of the structure 10, and a second circuit structure 13 is formed on the fourth surface 212 of the second insulating substrate 21 of the second circuit board structure 20 Four-line structure 23. As shown in FIG. 3I, the second circuit structure 13 includes a thin copper-plated layer 13a and at least one electroplated copper layer 13b fabricated by layers, and the fourth circuit structure 23 includes a thin copper-plated layer 23a fabricated by layers. And at least one electroplated copper layer 23b. It is worth noting that at this time, only the prototype of the first circuit structure 12 appears on the first surface 111 of the first insulating substrate 11 (compare FIG. 1), and the third surface 211 of the second insulating substrate 21 Only the prototype of the third line structure 22 appears above (compare Figure 1).

After completing step S1, the manufacturing method of the rigid-flex composite board of the present invention then executes step S2: in the case of using a cured adhesive layer, an insulating connecting substrate 31 is mechanically connected with a fifth surface 311 thereof A circuit board structure 10 and the second circuit board structure 20. In particular, step S2 includes at least two manufacturing methods. Figure 4 shows a schematic diagram of the first process of step S2. As shown in Fig. 4, an uncured or semi-cured curable adhesive material 30a is formed on a fifth surface 311 of an insulated connecting substrate 31, and then the uncured or semi-cured curable adhesive material will be formed. The fifth surface 311 of the bonding substrate 31 of the adhesive material 30a is pressed against the second surface 112 of the first insulating substrate 11 and the fourth surface 21 of the second insulating substrate 21, and then the curable adhesive material 30a is completely cured into a cured adhesive layer 30b.

5A and 5B show schematic diagrams of the second process of step S2. As shown in FIG. 5A, an uncured or semi-cured curable adhesive is formed on the second circuit structure 13 of the first circuit board structure 10 and the fourth circuit structure 23 of the second circuit board structure 20 Material 30, the second surface 112 of the first circuit board structure 10 and the fourth surface 212 of the second circuit board structure 20 on which the uncured or semi-cured curable adhesive material 30a is formed are pressed onto an insulating connecting substrate 31 The flexibility of the connecting substrate 31 is much greater than that of the first insulating substrate 11 and the second substrate 21. It must be added that, taking the epoxy resin as an example, the varnish of the resin is still in a monomer and diluted state by the solvent, which is called uncured (A-Stage). Furthermore, after drying with hot air and/or infrared rays, the molecular weight of the tree finger will be increased to a complex or oligomer. The state of the resin at this time is called a semi-cured (B-Stage). As shown in FIG. 5B, continue to completely cure the curable adhesive material 30a into a cured adhesive layer 30b. Taking epoxy resin as an example, when the resin in the semi-cured state is continuously heated to polymerize it into a polymer resin, it is called a fully cured (C-Stage).

After the curable adhesive material 30a is completely cured into a cured adhesive layer 30b, the fifth surface 311 of the connecting substrate 31 mechanically connects the first circuit board structure 10 and the second circuit board structure 20.

Continue to refer to Fig. 2 and Fig. 6A and Fig. 6B show a schematic diagram of the process of step S3. After completing step S2, the method flow proceeds to step S3: forming a plurality of hollow areas 35 on a sixth surface 312 of the connecting substrate 31 and the cured adhesive layer 30b, so that the plurality of hollow areas 35 are used to expose the first The second circuit structure 13 of a circuit board structure 10 and the fourth circuit structure 23 of the second circuit board structure 20. It is easy to understand that, as shown in Figures 6A and 6B, the sixth surface 312 of the connecting substrate 31 can be connected to the sixth surface 312 of the connecting substrate 31 by pressing the film (upper photoresist), exposing, developing, and etching and stripping the film. A plurality of hollow areas 35 are formed on the cured adhesive layer 30b.

Continuing, the method flow is to perform step S4: forming a fifth circuit structure 33 on the sixth surface 312 of the connecting substrate 31, wherein a part of the fifth circuit structure 33 is filled in the hollow area 35, The fifth circuit structure 33 is electrically connected to the second circuit structure 13 and the fourth circuit structure 23 respectively. Specifically, the fifth circuit structure 33, a part of the first circuit structure 12, and a part of the third circuit structure 22 are formed in step S5. Fig. 7A to Fig. 7D show a schematic diagram of the process of step S4. As shown in FIG. 7A, the copper plating operation is performed to form an electroplated copper layer 105 on the electroplated copper layer 103 of the first circuit board structure 10 and the second circuit board structure 20, and at the same time on the sixth connecting substrate 31 An electroplated copper layer 106 is formed on the surface. Wherein, a part of the electroplated copper layer 106 is filled in the hollow area 35 of the insulating connecting substrate 31, and the electroplated copper layer 106 is used to electrically connect the second circuit structure 13 and the fourth circuit structure 23. Then, as shown in Figure 7B, Figure 7C, and Figure 7D, the electroplated copper layer 105 and the electroplated copper layer 106 are sequentially pressed and dried, exposed, developed, and etched and stripped, and the electroplated copper layer 104 And the electroplated copper layer 105 is made into a patterned circuit layer. It can be seen from FIG. 7D that the connecting substrate 31 and the fifth circuit structure 33 constitute the third circuit board structure 30, and the third circuit board structure 30 has a structure between the first circuit board structure 10 and the second circuit board structure 10 A bendable section 34 between the circuit board structures 20. On the other hand, the thin copper plating layer 12a, the electroplating copper layer 12b, and the electroplating copper layer 12c of the first circuit structure 12 have been fabricated, and the thin copper plating layer 22a of the third circuit structure 22, The copper-plated layer 22a, the copper-plated layer 22b, and the copper-plated layer 22c have also been completed.

Finally, perform solder mask insulation work. As shown in FIG. 8A and FIG. 8B, the first circuit structure 10 and the first circuit structure 20 are covered with a solder mask 107, and the third circuit structure 30 is covered with a solder mask 108. Next, a plurality of welding windows (12W, 22W) are formed in the solder resist ink 107 by pressing dry film (upper photoresist), exposure, development, and etching and stripping operations. Finally, as shown in Figure 1, perform surface electroplating treatment on the plurality of welding windows (12W, 22W) to form the surface electroplating layer 12d of the first circuit structure 12 and the second circuit as shown in Figure 1 The surface of the structure 12 is electroplated 22d. In addition, the solder resist ink 108 is connected to the sixth surface 312 of the connecting substrate 31 as an insulating laminated substrate 32, so that the fifth circuit structure 33 is formed between the laminated substrate 32 and the connecting substrate 31 .

It should be noted that the solder resist ink 107 finally becomes the solder resist layer 12e, the solder resist layer 22e, and the solder resist layer 33e. On the other hand, the first circuit board structure 10 and the second circuit board structure 20 may be two-layer boards or multi-layer boards. Simply put, the number of layers of the first insulating base material 11 and the second insulating base material 21 depends on the circuit wiring requirements; similarly, the third circuit board structure 30 can also adjust its insulating connection according to the circuit wiring requirements. The number of stacked layers of the substrate 31 and/or the insulating laminated substrate 32.

In short, the present invention provides a flexible and rigid composite board 1, which includes a first circuit board structure 10, a second circuit board structure 20 and a third circuit board structure 30. Wherein, the first circuit board structure 10 and the second circuit board structure 20 are not mechanically connected, and the third circuit board structure 30 includes an insulating connecting substrate 31, an insulating laminated substrate 32, and forming The wiring structure between the connecting substrate 31 and the insulating laminated substrate 32. In particular, the connecting substrate 31 is made of a curable adhesive material, such as a thermosetting resin or a photosetting resin. Therefore, the insulating connecting base material 31 can permanently connect the first insulating base material 11 and the second insulating base material 21, so the flexible and rigid composite board 1 of the present invention can simultaneously have good flexibility and stability. Excellent connection reliability and other excellent properties.

It must be emphasized that the above detailed description is a specific description of possible embodiments of the present invention, but this embodiment is not intended to limit the scope of the present invention. Any equivalent implementation or modification without departing from the technical spirit of the present invention, All should be included in the patent scope of this case.

1: Soft and hard composite board

10: The first circuit board structure

20: The second circuit board structure

30: The third circuit board structure

11: The first insulating substrate

12: The first line structure

13: Second line structure

111: first surface

112: second surface

12a, 13a: thin copper plating

12b, 12c, 13b: electroplated copper layer

12d: Surface plating layer

12e: solder mask

12W: Welded window

21: Second insulating substrate

22: The third line structure

23: Fourth line structure

211: Third Surface

212: Fourth Surface

22a, 23a: thin copper plating

22b, 22c, 23b: electroplated copper layer

22d: surface plating

22e: solder mask

22W: Welded window

31: Connect the substrate

32: Laminated substrate

33e: solder mask

33: Fifth line structure

35: hollow area

34: Bendable section

311: Fifth Surface

30b: Cured adhesive layer

312: Sixth Surface

Claims (10)

A flexible and hard composite board, including: A first circuit board structure, including: at least one first insulating substrate, a first circuit structure formed on a first surface of the first insulating substrate, and a second circuit structure formed on the first insulating substrate A second circuit structure on the surface; A second circuit board structure including: at least one second insulating substrate, a third circuit structure formed on a third surface of the second insulating substrate, and a fourth circuit structure formed on the second insulating substrate A fourth circuit structure on the surface; and A third circuit board structure, including: a fifth surface of the first insulating substrate is mechanically connected to the second surface of the first insulating substrate and one of the fourth surface of the second insulating substrate is insulated from a connecting substrate and forming A fifth circuit structure on a sixth surface of the connecting substrate; Wherein, the flexibility of the connecting substrate is much greater than that of the first insulating substrate and the second insulating substrate, the fifth surface of the connecting substrate is covered with a curable adhesive material, and the curable adhesive material is cured Forming a cured adhesive layer to form a permanent connection between the third circuit board structure and the first circuit board structure and the second circuit board structure; Wherein, a plurality of hollow areas penetrate the connecting substrate and the cured adhesive layer, so that the fifth circuit structure is electrically connected to the second circuit structure and the fourth circuit structure through the plurality of hollow areas, and the first The three circuit board structure has a bendable section between the first circuit board structure and the second circuit board structure; Wherein, a part of the fifth circuit structure is formed after the connecting substrate is mechanically connected to the first insulating substrate and the second insulating substrate. A flexible and hard composite board, including: A first circuit board structure, including: at least one first insulating substrate, a first circuit structure formed on a first surface of the first insulating substrate, and a second circuit structure formed on the first insulating substrate A second circuit structure on the surface; A second circuit board structure including: at least one second insulating substrate, a third circuit structure formed on a third surface of the second insulating substrate, and a fourth circuit structure formed on the second insulating substrate A fourth circuit structure on the surface; and A third circuit board structure, including: a fifth surface of the first insulating substrate is mechanically connected to the second surface of the first insulating substrate and one of the fourth surface of the second insulating substrate is insulated from a connecting substrate and forming A fifth circuit structure on a sixth surface of the connecting substrate; Wherein, the flexibility of the connecting substrate is much greater than that of the first insulating substrate and the second insulating substrate; Wherein, a curable adhesive material covers the second circuit structure of the first circuit board structure and the fourth circuit structure of the second circuit board structure, and the curable adhesive material is cured into a cured adhesive layer. So that the third circuit board structure forms a permanent connection with the first circuit board structure and the second circuit board structure; Wherein, a plurality of hollow areas penetrate the connecting substrate and the cured adhesive layer, so that the fifth circuit structure is electrically connected to the second circuit structure and the fourth circuit structure through the plurality of hollow areas, and the first The three circuit board structure has a bendable section between the first circuit board structure and the second circuit board structure; Wherein, a part of the fifth circuit structure is formed after the connecting substrate is mechanically connected to the first insulating substrate and the second insulating substrate. The flexible and rigid composite board according to claim 1 or 2, wherein the first circuit structure and the third circuit structure each include a thin copper-plated layer, at least one copper-plated layer, and a surface that are made in layers The electroplating layer, and the surface electroplating layer is one of a nickel layer, a gold layer, a silver layer, a palladium layer or a laminated structure thereof. The flexible and hard composite board according to claim 1 or 2, wherein the second circuit structure and the fourth circuit structure each include a thin copper plating layer and at least one copper electroplating layer fabricated in layers. The rigid-flex composite board according to claim 1 or 2, wherein the first circuit structure and the third circuit structure are each covered with a solder mask, and the solder mask is provided with a plurality of solder windows. A manufacturing method of rigid and flexible composite board, including the following steps: A first circuit board structure and a second circuit board structure are provided, wherein the first circuit board structure includes at least a first insulating substrate, and a first circuit structure formed on a first surface of the first insulating substrate And a second circuit structure formed on a second surface of the first insulating substrate, and the second circuit board structure includes at least one second insulating substrate formed on one of the second insulating substrates A part of a third circuit structure on the third surface, and a fourth circuit structure formed on a fourth surface of the second insulating substrate; An uncured or semi-cured curable adhesive material is formed on a fifth surface of an insulating connecting substrate, the flexibility of the connecting substrate is much greater than that of the first insulating substrate and the second insulating substrate ； The fifth surface of the connecting substrate on which the uncured or semi-cured curable adhesive material is formed is pressed against the second surface of the first insulating substrate and the fourth surface of the second insulating substrate ； Make the curable adhesive material completely solidify into a solidified adhesive layer; A plurality of hollow areas are formed on a sixth surface of the connecting substrate and the cured adhesive layer to expose the second circuit structure and the second circuit board structure of the first circuit board structure by using the plurality of hollow areas The fourth line structure of; and A fifth circuit structure is formed on the sixth surface of the connecting substrate, wherein a part of the fifth circuit structure is filled in the hollow area, so that the fifth circuit structure is separated from the second circuit structure and the The fourth circuit structure is electrically connected; Wherein, the connecting substrate and the fifth circuit structure constitute a third circuit board structure, and the third circuit board structure has a bendable between the first circuit board structure and the second circuit board structure segment. A manufacturing method of rigid and flexible composite board, including the following steps: A first circuit board structure and a second circuit board structure are provided, wherein the first circuit board structure includes at least a first insulating substrate, and a first circuit structure formed on a first surface of the first insulating substrate And a second circuit structure formed on a second surface of the first insulating substrate, and the second circuit board structure includes at least one second insulating substrate formed on one of the second insulating substrates A part of a third circuit structure on the third surface, and a fourth circuit structure formed on a fourth surface of the second insulating substrate; Forming an uncured or semi-cured curable adhesive material on the second circuit structure of the first circuit board structure and the fourth circuit structure of the second circuit board structure; The second surface of the first circuit board structure and the fourth surface of the second circuit board structure on which the uncured or semi-cured curable adhesive material is formed are press-fitted to an insulating connecting substrate, the connecting The flexibility of the substrate is much greater than that of the first insulating substrate and the second insulating substrate; Make the curable adhesive material completely solidify into a solidified adhesive layer; A plurality of hollow areas are formed on a sixth surface of the connecting substrate and the cured adhesive layer to expose the second circuit structure and the second circuit board structure of the first circuit board structure by using the plurality of hollow areas The fourth line structure of; and A fifth circuit structure is formed on the sixth surface of the connecting substrate, wherein a part of the fifth circuit structure is filled in the hollow area, so that the fifth circuit structure is separated from the second circuit structure and the The fourth circuit structure is electrically connected; Wherein, the connecting substrate and the fifth circuit structure constitute a third circuit board structure, and the third circuit board structure has a bendable between the first circuit board structure and the second circuit board structure segment. The method for manufacturing a flexible and rigid composite board according to claim 6 or 7, wherein the other part of the first circuit structure and the other part of the third circuit structure are mechanically connected to the connecting base material The first insulating base material and the second insulating base material are formed later, and the first circuit structure and the third circuit structure are each covered with a solder resist layer, and the solder resist layer is provided with a plurality of welding windows. The flexible and hard composite board according to claim 6 or 7, wherein the first circuit structure and the third circuit structure each comprise a thin copper plating layer, at least one copper electroplating layer, and a surface electroplating Layer, and the surface electroplating layer is one of a nickel layer, a gold layer, a silver layer, a palladium layer or a laminated structure thereof. The flexible and hard composite board according to claim 6 or 7, wherein the second circuit structure and the fourth circuit structure each include a thin copper plating layer and at least one copper electroplating layer fabricated in layers.

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