TW202046831A - Rigid-flex board and method for making the same - Google Patents
Rigid-flex board and method for making the same Download PDFInfo
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本發明是關於一種線路板結構,特別是關於一種軟硬複合板及其製法。The invention relates to a circuit board structure, in particular to a flexible and hard composite board and its manufacturing method.
線路板可依介電質的軟硬度不同而區分為硬性線路板(簡稱硬板)、軟性線路板(軟板)及軟硬複合板,其中軟硬複合板通常是由軟板及硬板組合而成,並兼具軟板的可撓性及硬板的強度,因而經常被應用於電子產品的零件載具。Circuit boards can be divided into rigid circuit boards (referred to as rigid boards), flexible circuit boards (soft boards), and flexible and hard composite boards according to the different hardness of the dielectric materials. The flexible and hard composite boards are usually composed of soft and hard boards. It is combined with the flexibility of a soft board and the strength of a hard board, so it is often used in the parts carriers of electronic products.
現有技術的軟硬複合板通常是在軟板及硬板分別形成電路後,而後再將軟、硬板壓合在一起,其中硬板預先形成開槽,使軟硬複合板在開槽區域具有可撓性,而硬板部位則可裝配表面貼裝元件(surface mounted devices)。The prior art soft and hard composite board usually forms circuits after the soft board and the hard board are respectively formed, and then the soft and hard boards are pressed together. The hard board is pre-formed with slots, so that the flexible and hard composite boards have Flexible, and the hard board part can be equipped with surface mounted devices (surface mounted devices).
現有技術的軟硬複合板製程既複雜且昂貴,且其表面貼裝元件的裝配過程同樣也顯得較為複雜。The prior art flexible and hard composite board manufacturing process is complicated and expensive, and the assembly process of its surface mount components is also complicated.
有鑑於此,本發明之主要目的在於提供一種便於製作的軟硬複合板及其製法。In view of this, the main purpose of the present invention is to provide a flexible and hard composite board that is easy to manufacture and its manufacturing method.
為了達成上述及其他目的,本發明提供一種軟硬複合板之一實施例,其包括: 一第一線路板結構,包括:至少一第一絕緣基材、形成於該第一絕緣基材之一第一表面的一第一線路結構、以及形成於該第一絕緣基材之一第二表面的一第二線路結構; 一第二線路板結構,包括:至少一第二絕緣基材、形成於該第二絕緣基材之一第三表面的一第三線路結構、以及形成於該第二絕緣基材之一第四表面的一第四線路結構;以及 一第三線路板結構,包括:以其一第五表面機械連接於該第一絕緣基材的該第二表面與該第二絕緣基材的該第四表面之一絕緣的連結基材以及形成於該連結基材之一第六表面之上的一第五線路結構; 其中,該連結基材的可撓性遠大於該第一絕緣基材及該第二絕緣基材,該連結基材的該第五表面覆有一可固化黏著材料,且令該可固化黏著材料固化成一固化黏著層而使得該第三線路板結構與該第一線路板結構及該第二線路板結構之間形成永久性連接; 其中,複數個鏤空區係貫穿該連結基材與該固化黏著層,使得該第五線路結構透過該複數個鏤空區而與該第二線路結構及該第四線路結構電性連接,且該第三線路板結構具有介於該第一線路板結構及該第二線路板結構之間的一可彎折段; 其中,該第五線路結構之一部份是在該連結基材機械連接於該第一絕緣基材與該第二絕緣基材之後才形成。In order to achieve the above and other objectives, the present invention provides an embodiment of a flexible and rigid composite board, which includes: A first circuit board structure, including: at least one first insulating substrate, a first circuit structure formed on a first surface of the first insulating substrate, and a second circuit structure formed on the first insulating substrate A second circuit structure on the surface; A second circuit board structure including: at least one second insulating substrate, a third circuit structure formed on a third surface of the second insulating substrate, and a fourth circuit structure formed on the second insulating substrate A fourth circuit structure on the surface; and A third circuit board structure, including: a fifth surface of the first insulating substrate is mechanically connected to the second surface of the first insulating substrate and one of the fourth surface of the second insulating substrate is insulated from a connecting substrate and forming A fifth circuit structure on a sixth surface of the connecting substrate; Wherein, the flexibility of the connecting substrate is much greater than that of the first insulating substrate and the second insulating substrate, the fifth surface of the connecting substrate is covered with a curable adhesive material, and the curable adhesive material is cured Forming a cured adhesive layer to form a permanent connection between the third circuit board structure and the first circuit board structure and the second circuit board structure; Wherein, a plurality of hollow areas penetrate the connecting substrate and the cured adhesive layer, so that the fifth circuit structure is electrically connected to the second circuit structure and the fourth circuit structure through the plurality of hollow areas, and the first The three circuit board structure has a bendable section between the first circuit board structure and the second circuit board structure; Wherein, a part of the fifth circuit structure is formed after the connecting substrate is mechanically connected to the first insulating substrate and the second insulating substrate.
為了達成上述及其他目的,本發明提供所述軟硬複合板之另一實施例,包括: 一第一線路板結構,包括:至少一第一絕緣基材、形成於該第一絕緣基材之一第一表面的一第一線路結構、以及形成於該第一絕緣基材之一第二表面的一第二線路結構; 一第二線路板結構,包括:至少一第二絕緣基材、形成於該第二絕緣基材之一第三表面的一第三線路結構、以及形成於該第二絕緣基材之一第四表面的一第四線路結構;以及 一第三線路板結構,包括:以其一第五表面機械連接於該第一絕緣基材的該第二表面與該第二絕緣基材的該第四表面之一絕緣的連結基材以及形成於該連結基材之一第六表面之上的一第五線路結構; 其中,該連結基材的可撓性遠大於該第一絕緣基材及該第二絕緣基材; 其中,一可固化黏著材料覆於該第一線路板結構的該第二線路結構與該第二線路板結構的該第四線路結構之上,且令該可固化黏著材料固化成一固化黏著層而使得該第三線路板結構與該第一線路板結構及該第二線路板結構之間形成永久性連接; 其中,複數個鏤空區係貫穿該連結基材與該固化黏著層,使得該第五線路結構透過該複數個鏤空區而與該第二線路結構及該第四線路結構電性連接,且該第三線路板結構具有介於該第一線路板結構及該第二線路板結構之間的一可彎折段; 其中,該第五線路結構之一部份是在該連結基材機械連接於該第一絕緣基材與該第二絕緣基材之後才形成。In order to achieve the above and other objectives, the present invention provides another embodiment of the flexible and rigid composite board, including: A first circuit board structure, including: at least one first insulating substrate, a first circuit structure formed on a first surface of the first insulating substrate, and a second circuit structure formed on the first insulating substrate A second circuit structure on the surface; A second circuit board structure including: at least one second insulating substrate, a third circuit structure formed on a third surface of the second insulating substrate, and a fourth circuit structure formed on the second insulating substrate A fourth circuit structure on the surface; and A third circuit board structure, including: a fifth surface of the first insulating substrate is mechanically connected to the second surface of the first insulating substrate and one of the fourth surface of the second insulating substrate is insulated from a connecting substrate and forming A fifth circuit structure on a sixth surface of the connecting substrate; Wherein, the flexibility of the connecting substrate is much greater than that of the first insulating substrate and the second insulating substrate; Wherein, a curable adhesive material covers the second circuit structure of the first circuit board structure and the fourth circuit structure of the second circuit board structure, and the curable adhesive material is cured into a cured adhesive layer. So that the third circuit board structure forms a permanent connection with the first circuit board structure and the second circuit board structure; Wherein, a plurality of hollow areas penetrate the connecting substrate and the cured adhesive layer, so that the fifth circuit structure is electrically connected to the second circuit structure and the fourth circuit structure through the plurality of hollow areas, and the first The three circuit board structure has a bendable section between the first circuit board structure and the second circuit board structure; Wherein, a part of the fifth circuit structure is formed after the connecting substrate is mechanically connected to the first insulating substrate and the second insulating substrate.
為了達成上述及其他目的,本發明同時提供一種軟硬複合板之製造方法的一實施例,其包括以下步驟: 提供一第一線路板結構及一第二線路板結構,其中該第一線路板結構包括至少一第一絕緣基材、形成於該第一絕緣基材之一第一表面的一第一線路結構的一部分、以及形成於該第一絕緣基材之一第二表面的一第二線路結構,且該第二線路板結構包括至少一第二絕緣基材、形成於該第二絕緣基材之一第三表面的一第三線路結構的一部分、以及形成於該第二絕緣基材之一第四表面的一第四線路結構; 於一絕緣的連結基材之一第五表面之上形成未固化或半固化的一可固化黏著材料,該連結基材的可撓性遠大於該第一絕緣基材及該第二絕緣基材; 將形成有所述未固化或半固化可固化黏著材料的該連結基材的該第五表面壓合於該第一絕緣基材的該第二表面及該第二絕緣基材的該第四表面; 令該可固化黏著材料完全固化成一固化黏著層; 在該連結基材之一第六表面與該固化黏著層之上製作複數個鏤空區,以利用該複數個鏤空區露出該第一線路板結構的該第二線路結構以及該第二線路板結構的該第四線路結構;以及 在該連結基材的該第六表面上形成一第五線路結構,其中該第五線路結構的一部份填設於該鏤空區,使該第五線路結構分別與該第二線路結構及該第四線路結構電性連接; 其中,該連結基材及該第五線路結構組成一第三線路板結構,且該第三線路板結構具有介於該第一線路板結構及該第二線路板結構之間的一可彎折段。In order to achieve the above and other objectives, the present invention also provides an embodiment of a method for manufacturing a flexible and rigid composite board, which includes the following steps: A first circuit board structure and a second circuit board structure are provided, wherein the first circuit board structure includes at least a first insulating substrate, and a first circuit structure formed on a first surface of the first insulating substrate And a second circuit structure formed on a second surface of the first insulating substrate, and the second circuit board structure includes at least one second insulating substrate formed on one of the second insulating substrates A part of a third circuit structure on the third surface, and a fourth circuit structure formed on a fourth surface of the second insulating substrate; An uncured or semi-cured curable adhesive material is formed on a fifth surface of an insulating connecting substrate, the flexibility of the connecting substrate is much greater than that of the first insulating substrate and the second insulating substrate ; The fifth surface of the connecting substrate on which the uncured or semi-cured curable adhesive material is formed is pressed against the second surface of the first insulating substrate and the fourth surface of the second insulating substrate ; Make the curable adhesive material completely solidify into a solidified adhesive layer; A plurality of hollow areas are formed on a sixth surface of the connecting substrate and the cured adhesive layer to expose the second circuit structure and the second circuit board structure of the first circuit board structure by using the plurality of hollow areas The fourth line structure of; and A fifth circuit structure is formed on the sixth surface of the connecting substrate, wherein a part of the fifth circuit structure is filled in the hollow area, so that the fifth circuit structure is separated from the second circuit structure and the The fourth circuit structure is electrically connected; Wherein, the connecting substrate and the fifth circuit structure constitute a third circuit board structure, and the third circuit board structure has a bendable between the first circuit board structure and the second circuit board structure segment.
由於該第五線路結構是在該連結基材機械連接於該第一線路板結構與該第二線路板結構之後才形成,這與現有技術需預先在軟板上形成電路結構的製作方式有所不同,預期本發明將因此具有較高的產率、產能,製程設計自由度也可以增加。Since the fifth circuit structure is formed after the connecting substrate is mechanically connected to the first circuit board structure and the second circuit board structure, this is different from the manufacturing method in which a circuit structure needs to be formed on a flexible board in advance in the prior art. Different, it is expected that the present invention will therefore have a higher yield and productivity, and the degree of freedom of process design can also be increased.
第1圖為本發明之一種軟硬複合板的一側面剖視圖。Figure 1 is a side cross-sectional view of a rigid-flex composite board of the present invention.
第2圖為本發明之一種軟硬複合板的製作方法的流程圖。Figure 2 is a flowchart of a method for manufacturing a flexible and rigid composite board according to the present invention.
第3A圖至第3I圖為步驟S1的製程示意圖。3A to 3I are schematic diagrams of the process of step S1.
第4圖為步驟S2的第一製程示意圖。Figure 4 is a schematic diagram of the first process of step S2.
第5A圖與第5B圖為步驟S2的第二製程示意圖。FIG. 5A and FIG. 5B are schematic diagrams of the second process in step S2.
第6A圖和第6B圖為步驟S3的製程示意圖。Figures 6A and 6B are schematic diagrams of the process of step S3.
第7A圖至第7F圖為步驟S4的製程示意圖。7A to 7F are schematic diagrams of the process of step S4.
第8A圖至第8B圖為防焊絕緣的製程示意圖。Figures 8A to 8B are schematic diagrams of the solder resist insulation manufacturing process.
為了能夠更清楚地描述本發明所提出之一種軟硬複合板及其製造方法,以下將配合圖式,詳盡說明本發明之較佳實施例。In order to be able to more clearly describe the flexible and rigid composite board and its manufacturing method proposed by the present invention, the preferred embodiments of the present invention will be described in detail below in conjunction with the drawings.
第1圖顯示本發明之一種軟硬複合板的一側面剖視圖。如第1圖所示,本發明之軟硬複合板1於結構組成方面係主要包括:一第一線路板結構10、一第二線路板結構20及一第三線路板結構30。其中,該第一線路板結構10與該第二線路板結構20在機構上並不相連(mechanically separated)。並且,該第一線路板結構10包括一第一絕緣基材11、形成於該第一絕緣基材11之一第一表面111的一第一線路結構12、以及形成於該第一絕緣基材11之一第二表面112的一第二線路結構13。熟悉軟性線路板之設計與製作的工程師應該知道,該第一絕緣基材11的材質可以是聚醯亞胺(Polyimide, PI)、聚對苯二甲酸乙二醇酯(Polyethylene Terephthalate, PET)或聚萘二甲酸乙二醇酯(Polyethylene Naphthalate, PEN)。Figure 1 shows a side cross-sectional view of a rigid-flex composite board of the present invention. As shown in FIG. 1, the flexible and
該第一線路結構12包括分層製作的一薄鍍銅層12a、至少一電鍍銅層(12b、12c)、以及一表面電鍍層12d,且該第二線路結構13包括分層製作的一薄鍍銅層13a及至少一電鍍銅層13b。 特別說明的是,該薄鍍銅層12a及該薄鍍銅層13a皆可為一濺鍍銅層或一化學鍍銅層,且所述表面電鍍層12d為鎳層、金層、銀層、鈀層其中一者或其層疊結構,例如電鍍鎳金層疊結構、電鍍鎳銀金層疊結構、電鍍鎳銀層疊結構、化學鎳金層疊結構、化學鎳銀層疊結構、或鎳鈀金層疊結構。並且,如第1圖所示,該第一線路結構12之上更覆有一防焊層12e,且該防焊層12e開設有複數個焊接窗12W用以露出該表面電鍍層12d,使得表面貼裝元件(Surface mounted devices)易於被焊接或電連接至該表面電鍍層12d。The
另一方面,該第二線路板結構20包括:一第二絕緣基材21、形成於該第二絕緣基材21之一第三表面211的一第三線路結構22、以及形成於該第二絕緣基材21之一第四表面212的一第四線路結構23。同樣地,該第二絕緣基材21的材質可以是PI、PET、或PEN。依據本發明之設計,該第三線路結構22包括分層製作的一薄鍍銅層22a、至少一電鍍銅層(22b、22c)、以及一表面電鍍層22d,且該第四線路結構23包括分層製作的一薄鍍銅層23a及至少一電鍍銅層23b。特別說明的是,該薄鍍銅層22a及該薄鍍銅層23a皆可為一濺鍍銅層或一化學鍍銅層,且所述表面電鍍層22d為鎳層、金層、銀層、鈀層其中一者或其層疊結構。並且,如第1圖所示,該第三線路結構22之上更覆有一防焊層22e,且該防焊層22e開設有複數個焊接窗22W用以露出該表面電鍍層22d,使得表面貼裝元件易於被焊接或電連接至該表面電鍍層22d。On the other hand, the second
更詳細地說明,該第三線路板結構30包括:一絕緣的連結基材31以及一第五線路結構33;其中,該連結基材31是以其一第五表面311係透過一固化黏著層而機械連接於(mechanically connected to)該第一絕緣基材11的該第二表面112與該第二絕緣基材21的該第四表面212。並且,如第1圖所示,所述第五線路結構33係形成於該連結基材31的一第六表面312之上。依據本發明之設計,該連結基材31的一第五表面311之上形成有一固化黏著層,且所述固化黏著層由一可固化黏著材料製成,例如:熱固性樹脂、光固性樹脂、或透過添加固化劑而固化之樹脂。並且,該連結基材31的可撓性皆遠大於該第一絕緣基材11與該第二絕緣基材21。所述連結基材例如是常見的軟性電路板材質(FPC)或聚醯亞胺(PI)製成。In more detail, the third
必須特別說明的是,該第三線路板結構30的該第五線路結構33、該第一線路板結構10的該第一線路結構12之一部份(即,電鍍銅層12c及表面電鍍層12d)、以及該第三線路結構22之一部份(即,電鍍銅層22c及表面電鍍層22d)是在該連結基材31機械連接於該第一絕緣基材11與該第二絕緣基材21之後才形成。並且,複數個鏤空區35係貫穿該連結基材31與該固化黏著層,使得該第五線路結構33透過該複數個鏤空區35而與該第二線路結構13及該第四線路結構23電性連接,且該第三線路板結構30具有介於該第一線路板結構10及該第二線路板結構20之間的一可彎折段34。從而,第三線路板結構30具有軟板的特性,而第一線路板結構10和第二線路板結構20則具有硬板的特性,且第一線路板結構10和第二線路板結構20可以相對位移。It must be particularly noted that the
繼續地,下文將在相關附圖的輔助下詳細地說明本發明之軟硬複合板的製作方法。第2圖顯示本發明之一種軟硬複合板的製作方法的流程圖。執行如第1圖所繪示之軟硬複合板1之製作時,係首先執行步驟S1:提供一第一線路板結構10及一第二線路板結構20,其中該第一線路板結構10包括一第一絕緣基材11、形成於該第一絕緣基材11之一第一表面111的一第一線路結構12的一部分、以及形成於該第一絕緣基材11之一第二表面112的一第二線路結構13,且該第二線路板結構20包括一第二絕緣基材21、形成於該第二絕緣基材21之一第三表面211的一第三線路結構22的一部分、以及形成於該第二絕緣基材21之一第四表面212的一第四線路結構23。Continuing, the manufacturing method of the flexible and rigid composite board of the present invention will be described in detail below with the aid of related drawings. Figure 2 shows a flow chart of a manufacturing method of a flexible and rigid composite board of the present invention. When performing the production of the flexible and
第3A圖至第3I圖顯示步驟S1的製程示意圖。如第3A圖所示,首先取一基材10B,而後於該基材10B的二表面之上形成一鍍銅層101與一鍍銅層102,獲得一雙面銅基材100。其中,該鍍銅層101與該鍍銅層102皆可為一濺鍍銅層或一化學鍍銅層。接著,如第3B圖所示,進行鑽孔作業以在該雙面銅基材100之上形成複數導通孔10T。繼續地,如第3C圖所示,在該雙面銅基材100的表面以及各所述導通孔101的內壁面形成電鍍銅層103。如第3D圖所示,接著進行塞孔作業,於各所述導通孔101內填塞例如防焊油墨104之絕緣材質。Fig. 3A to Fig. 3I show a schematic diagram of the process of step S1. As shown in FIG. 3A, first, a
進一步地,如第3E圖所示,對該雙面銅基材100進行一進行開槽作業,此時第一線路板結構10及第二線路板結構20的雛形已經出現。而後,如第3F圖、第3G圖、第3H圖、及第3I圖所示,依序進行壓乾膜(dry film)、曝光、顯影、和蝕刻剝膜作業,而於該第一線路板結構10之第一絕緣基材11的第二表面112之上形成一第二線路結構13,且於該第二線路板結構20之第二絕緣基材21的第四表面212之上形成一第四線路結構23。如第3I圖所示,該第二線路結構13包括分層製作的一薄鍍銅層13a及至少一電鍍銅層13b,且該第四線路結構23包括分層製作的一薄鍍銅層23a及至少一電鍍銅層23b。值得注意的是,此時該第一絕緣基材11的第一表面111之上僅出現第一線路結構12的雛形(比較第1圖),且該第二絕緣基材21的第三表面211之上僅出現第三線路結構22的雛形(比較第1圖)。Further, as shown in FIG. 3E, a grooving operation is performed on the double-
在完成步驟S1之後 ,本發明之軟硬複合板之製造方法接著執行步驟S2:在使用一固化黏著層的情況下,使得一絕緣的連結基材31以其一第五表面311機械連接該第一線路板結構10與該第二線路板結構20。特別說明的是,步驟S2至少包括兩種製程方式。第4圖顯示步驟S2的第一製程示意圖。如第4圖所示,於一絕緣的連結基材31之一第五表面311之上形成未固化或半固化的一可固化黏著材料30a,接著將形成有所述未固化或半固化可固化黏著材料30a的連結基材31第五表面311壓合於該第一絕緣基材11的該第二表面112及該第二絕緣基材21的該第四表面21,而後令該可固化黏著材料30a完全固化成一固化黏著層30b。After completing step S1, the manufacturing method of the rigid-flex composite board of the present invention then executes step S2: in the case of using a cured adhesive layer, an insulating connecting
第5A圖與第5B圖顯示步驟S2的第二製程示意圖。如第5A圖所示,於該第一線路板結構10的該第二線路結構13及該第二線路板結構20的該第四線路結構23之上形成未固化或半固化的一可固化黏著材料30,將形成有所述未固化或半固化可固化黏著材料30a的第一線路板結構10第二表面112及第二線路板結構20第四表面212壓合於一絕緣的連結基材31,其中該連結基材31的可撓性遠大於該第一絕緣基材11及該第二基材21。必須補充說明的是,以環氧樹脂為例,該樹脂之膠水(Varnish)尚處於單體且被溶劑稀釋的狀態,稱為未固化(A-Stage)。進一步地,經熱風及/或紅外線乾燥之後,將使樹指分子量增大為複體或寡聚物(Oligomer),此時的樹脂狀態稱為半固化(B-Stage)。如第5B圖所示,繼續地, 令令該可固化黏著材料30a完全固化成一固化黏著層30b。以環氧樹脂為例,繼續加熱半固化狀態的樹脂而使其聚合成為高分子樹脂時,則稱為完全固化(C-Stage)。5A and 5B show schematic diagrams of the second process of step S2. As shown in FIG. 5A, an uncured or semi-cured curable adhesive is formed on the
在所述可固化黏著材料30a完全固化成固化黏著層30b之後,該連結基材31之第五表面311即機械連接該第一線路板結構10與該第二線路板結構20。After the curable
繼續地參閱第2圖,且第6A圖和第6B圖顯示步驟S3的製程示意圖。完成步驟S2之後,方法流程接著執行步驟S3:在該連結基材31之一第六表面312與該固化黏著層30b之上製作複數個鏤空區35,以利用該複數個鏤空區35露出該第一線路板結構10的該第二線路結構13以及該第二線路板結構20的該第四線路結構23。易於理解的,如第6A圖與第6B圖所示,必須利用壓乾膜(上光阻)、曝光、顯影、和蝕刻剝膜等作業,才能夠於該連結基材31之第六表面312與該固化黏著層30b之上製作出複數個所述鏤空區35。Continue to refer to Fig. 2 and Fig. 6A and Fig. 6B show a schematic diagram of the process of step S3. After completing step S2, the method flow proceeds to step S3: forming a plurality of
繼續地,方法流程係執行步驟S4:在該連結基材31的該第六表面312上形成一第五線路結構33,其中該第五線路結構33的一部份填設於該鏤空區35,使該第五線路結構33分別與該第二線路結構13及該第四線路結構23電性連接。特別說明的是,該第五線路結構33、該第一線路結構12之一部份、以及該第三線路結構22之一部份是在步驟S5形成。第7A圖至第7F圖顯示步驟S4的製程示意圖。如第7A圖所示,進行鍍銅作業,在第一線路板結構10和第二線路板結構20的電鍍銅層103上形成一電鍍銅層105,且同時於該連結基材31的第六表面上形成一電鍍銅層106。其中,電鍍銅層106的一部份填設於絕緣的連結基材31的鏤空區35,利用該電鍍銅層106與該第二線路結構13及該第四線路結構23電性連接。接著,如第7B圖、第7C圖、以及第7D圖所示,對電鍍銅層105和電鍍銅層106依序進行壓乾膜、曝光、顯影、及蝕刻剝膜作業,將電鍍銅層104和電鍍銅層105製作成圖樣化電路層。由第7D圖可知,該連結基材31與該第五線路結構33組成所述第三線路板結構30,且該第三線路板結構30具有介於該第一線路板結構10及該第二線路板結構20之間的一可彎折段34。另一方面,第一線路結構12的薄鍍銅層12a、電鍍銅層12b、及電鍍銅層12c已經製作完成,且第三線路結構22的薄鍍銅層22a、電鍍銅層22b、及電鍍銅層22c也已經製作完成。Continuing, the method flow is to perform step S4: forming a
最後,進行防焊絕緣作業。如第8A圖與第8B圖所示,於該第一電路結構10與該第一電路結構20覆上一防焊油墨107,且於該第三電路結構30覆上一防焊油墨108。接著,利用壓乾膜(上光阻)、曝光、顯影、及蝕刻剝膜作業在防焊油墨107形成複數個焊接窗(12W、22W)。最後,如第1圖所示,在該複數個焊接窗(12W、22W)處進行表面電鍍處理,形成如第1圖所示之該第一線路結構12的表面電鍍層12d以及該第二線路結構12的表面電鍍層22d。並且,所述防焊油墨108即作為絕緣的層疊基材32連接至該連結基材31的第六表面312,使得第五線路結構33形成於該層疊基材32與該連結基材31之間。Finally, perform solder mask insulation work. As shown in FIG. 8A and FIG. 8B, the
需說明的是,所述防焊油墨107最後成為防焊層12e、防焊層22e、及防焊層33e。另一方面,第一線路板結構10與第二線路板結構20可以是二層板或多層板。簡單地說,該第一絕緣基材11與該第二絕緣基材21的層數視電路佈線需求而定;同樣的,第三線路板結構30亦可依電路佈線需求而調整其絕緣的連結基材31及/或絕緣的層疊基材32之堆疊層數。It should be noted that the solder resist
簡言之,本發明提出一種軟硬複合板1,其包括一第一線路板結構10、一第二線路板結構20及一第三線路板結構30。其中,該第一線路板結構10與該第二線路板結構20在機構上並不相連,且該第三線路板結構30包括一絕緣的連結基材31、一絕緣的層疊基材32以及形成於該連結基材31和該絕緣的層疊基材32之間的線路結構。特別地,該連結基材31由一可固化黏著材料製成,例如: 熱固性樹脂或光固性樹脂。因此,所述絕緣的連結基材31能夠永久性的連接該第一絕緣基材11與該第二絕緣基材21,是以本發明之軟硬複合板1能夠同時具備可撓性佳及穩定的連接可靠度等優秀性質。In short, the present invention provides a flexible and rigid
必須加以強調的是,上述之詳細說明係針對本發明可行實施例之具體說明,惟該實施例並非用以限制本發明之專利範圍,凡未脫離本發明技藝精神所為之等效實施或變更,均應包含於本案之專利範圍中。It must be emphasized that the above detailed description is a specific description of possible embodiments of the present invention, but this embodiment is not intended to limit the scope of the present invention. Any equivalent implementation or modification without departing from the technical spirit of the present invention, All should be included in the patent scope of this case.
<本發明>
1:軟硬複合板
10:第一線路板結構
20:第二線路板結構
30:第三線路板結構
11:第一絕緣基材
12:第一線路結構
13:第二線路結構
111:第一表面
112:第二表面
12a、13a:薄鍍銅層
12b、12c、13b:電鍍銅層
12d:表面電鍍層
12e:防焊層
12W:焊接窗
21:第二絕緣基材
22:第三線路結構
23:第四線路結構
211:第三表面
212:第四表面
22a、23a:薄鍍銅層
22b、22c、23b:電鍍銅層
22d:表面電鍍層
22e:防焊層
22W:焊接窗
31:連結基材
32:層疊基材
33e:防焊層
33:第五線路結構
35:鏤空區
34:可彎折段
30b:固化黏著層
30a:可固化黏著材料
312:第六表面
311:第五表面
10B:基材
S1~S4:步驟
10T:導通孔
101、102:鍍銅層
103、104:電鍍銅層
100:雙面銅基材
<The present invention>
1: Soft and hard composite board
10: The first circuit board structure
20: The second circuit board structure
30: The third circuit board structure
11: The first insulating substrate
12: The first line structure
13: Second line structure
111: first surface
112:
1:軟硬複合板 1: Soft and hard composite board
10:第一線路板結構 10: The first circuit board structure
20:第二線路板結構 20: The second circuit board structure
30:第三線路板結構 30: The third circuit board structure
11:第一絕緣基材 11: The first insulating substrate
12:第一線路結構 12: The first line structure
13:第二線路結構 13: Second line structure
111:第一表面 111: first surface
112:第二表面 112: second surface
12a、13a:薄鍍銅層 12a, 13a: thin copper plating
12b、12c、13b:電鍍銅層 12b, 12c, 13b: electroplated copper layer
12d:表面電鍍層 12d: Surface plating layer
12e:防焊層 12e: solder mask
12W:焊接窗 12W: Welded window
21:第二絕緣基材 21: Second insulating substrate
22:第三線路結構 22: The third line structure
23:第四線路結構 23: Fourth line structure
211:第三表面 211: Third Surface
212:第四表面 212: Fourth Surface
22a、23a:薄鍍銅層 22a, 23a: thin copper plating
22b、22c、23b:電鍍銅層 22b, 22c, 23b: electroplated copper layer
22d:表面電鍍層 22d: surface plating
22e:防焊層 22e: solder mask
22W:焊接窗 22W: Welded window
31:連結基材 31: Connect the substrate
32:層疊基材 32: Laminated substrate
33e:防焊層 33e: solder mask
33:第五線路結構 33: Fifth line structure
35:鏤空區 35: hollow area
34:可彎折段 34: Bendable section
311:第五表面 311: Fifth Surface
30b:固化黏著層 30b: Cured adhesive layer
312:第六表面 312: Sixth Surface
Claims (10)
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TW202046831A true TW202046831A (en) | 2020-12-16 |
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