CN202503812U - Semi-flexible printed circuit board used for static bending - Google Patents
Semi-flexible printed circuit board used for static bending Download PDFInfo
- Publication number
- CN202503812U CN202503812U CN2012201079248U CN201220107924U CN202503812U CN 202503812 U CN202503812 U CN 202503812U CN 2012201079248 U CN2012201079248 U CN 2012201079248U CN 201220107924 U CN201220107924 U CN 201220107924U CN 202503812 U CN202503812 U CN 202503812U
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- rigid plate
- prepreg
- circuit board
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Abstract
A semi-flexible printed circuit board used for static bending comprises a first thin rigid plate of a produced circuit, a first rigid plate of the produced circuit and a first immobile prepreg, wherein the first rigid plate is provided with a first open window, and the first immobile prepreg is provided with a first hollow area; the first open window is corresponding to the first hollow area; and the first thin rigid plate, the first immobile prepreg and the first rigid plate are stacked and jointly pressed successively. According to the semi-flexible printed circuit board, dedicated flexible plate material is replaced by the first thin rigid plate, such that final cost of a whole product is greatly reduced. At the same time, the adopted first immobile prepreg arranged between the first thin rigid plate and the first rigid plate can control glue overflow, enabling the surface of the semi-flexible printed circuit board to be flat and concave-free.
Description
Technical field
The utility model relates to field of circuit boards, particularly relates to half flexible circuit board that is used for static bending.
Background technology
Half flexible circuit board (Semi-Flex PCB); Be a kind of PCB that is used for static bending field that in the hardboard course of processing of standard, combines the dark Milling Process of control or rigid-flex board process technology (mill uncap or open window etc.) to obtain; The asymmetrical laminated construction of normal employing only is applicable to the installation process that receives static stress.Usually, in some application scenarios, need not continue dynamically to bend,, adopt conventional PI material often to make cost too high as bending such as only when installing, do over again and keeping in repair, carrying out the bending of limited number of time ground.
After circuit is made in normal rigid printed board (pure FR-4 lamination) pressing, mill thinly, the specific region control is milled to certain thickness deeply, can this be milled thin zone as flexible bending district through controlling dark lathe; When adopting this kind to mill thin technology, very high to the dark required precision of the control of equipment, equipment cost is high, mill thin district became uneven and be prone to cause stress to concentrate and fracture, and the bending district needs repeatedly cutting back and forth of milling cutter when big, and efficient is lower.Or rigid element is independently made the back and is opened window in the bending zone, and the also corresponding window of opening of flow model prepreg is with the other half flexible portion lamination that independently completes.The circuit board of this kind structure exists groove edge pressing depression and the half flexible risk of pressure break on the edge of, the defective that depression directly causes follow-up circuit to be made.
The utility model content
Based on this, be necessary to provide that a kind of the cost of material is low, nonpitting half flexible circuit board of surfacing easy to process.
A kind of half flexible circuit board that is used for static bending; First rigid plate, first of comprise the first slim rigid plate of making circuit, having made circuit is the flow model prepreg not; Offering first on said first rigid plate windows; Said first does not have first vacancy section on the flow model prepreg, and said first windows correspondingly with said first vacancy section, and the order of piling up pressing is followed successively by the said first slim rigid plate, first not flow model prepreg, first rigid plate.
Among embodiment, also comprise protective layer therein, said protective layer is fitted in the surface of the said first slim rigid plate, and said protective layer and said first is windowed corresponding.
Therein among embodiment, the said first slim rigid plate be in single sided board, double sided board, the multi-layer sheet any, said first rigid plate be in single sided board, double sided board, the multi-layer sheet any.
A kind of half flexible circuit board that is used for static bending; Second rigid plate, first of comprise the first slim rigid plate of making circuit, make first rigid plate of circuit, having made circuit is flow model prepreg, second flow model prepreg not; Offering first on said first rigid plate windows; Offering second on said second rigid plate windows; Said first does not have first vacancy section on the flow model prepreg, and said second does not have second vacancy section on the flow model prepreg, and its order of piling up pressing is followed successively by not flow model prepreg, second rigid plate of flow model prepreg, the first slim rigid plate, second of first rigid plate, first; Said first window corresponding with said first vacancy section, said second window corresponding with said second vacancy section.
The special flexible sheet that the first slim rigid plate of above-mentioned half flexible circuit board substitutes makes the ultimate cost of entire product reduce greatly, also satisfies the static state bending of limited number of time.Simultaneously first of the employing between the first slim rigid plate and first rigid plate not the flow model prepreg can control excessive glue, make the nonpitting phenomenon generation of surfacing of half flexible circuit board.
First window the first corresponding slim rigid plate surface applying protective layer, outside making flexible portion whole flow process all can not being exposed to after pressing, the risk of frangible, breakage and chemical medicinal liquid etch not.
Description of drawings
Fig. 1 is present technique scheme one embodiment half a flexible circuit board structure chart;
Fig. 2 is another embodiment half flexible circuit board structure chart of present technique scheme.
Description of reference numerals:
1, the first slim rigid plate, 2, first rigid plate, 3, the first flow model prepreg not, 4, first windows, 5, first vacancy section, 6, protective layer, 7, second rigid plate, 8, the second flow model prepreg not, 9, second windows, 10, second vacancy section.
Embodiment
Below, in conjunction with accompanying drawing the present technique scheme is done further explanation.
See also Fig. 1; A kind of half flexible circuit board that is used for static bending; First rigid plate 2, first of comprise the first slim rigid plate 1 of making circuit, having made circuit is not offered first on flow model prepreg 3, the first rigid plate 2 and is windowed and 4, the first on the flow model prepreg 3 first vacancy section 5 is not arranged; First windows 4 correspondingly with first vacancy section 5, and the order of piling up pressing is followed successively by the first slim rigid plate 3, first not flow model prepreg 3, first rigid plate 2.With first window 4, first vacancy section, 5 corresponding first slim rigid plate 1 the corresponding region be static bending district.
Among embodiment, also comprise protective layer 6 therein, protective layer 6 is fitted in the surface of the first slim rigid plate 1, and protective layer 6 and first is windowed 4 corresponding.
Therein among embodiment, the first slim rigid plate 1 be in single sided board, double sided board, the multi-layer sheet any, first rigid plate be in single sided board, double sided board, the multi-layer sheet any.
See also Fig. 2 therein among embodiment; Second rigid plate 7, first that half flexible circuit board that is used for static bending comprises the first slim rigid plate 1 of making circuit, make first rigid plate 2 of circuit, made circuit is flow model prepreg 3, second flow model prepreg 8 not; Offer first on first rigid plate 2 and window 4; Offer second on second rigid plate 7 and window 9; First does not have first vacancy section 5, the second on the flow model prepreg 8 second vacancy section 10 not to be arranged on the flow model prepreg 3, and its order of piling up pressing is followed successively by not flow model prepreg 8, second rigid plate 7 of the slim rigid plate of flow model prepreg 3, first 1, second of first rigid plate 2, first; First window 4 corresponding with first vacancy section 5, second window 9 corresponding with second vacancy section 10.
The special flexible sheet that the first slim rigid plate of above-mentioned half flexible circuit board substitutes makes the ultimate cost of entire product reduce greatly.Simultaneously first of the employing between the first slim rigid plate and first rigid plate not the flow model prepreg can control excessive glue, make the nonpitting phenomenon generation of surfacing of half flexible circuit board.
First window the first corresponding slim rigid plate surface applying protective layer, outside making flexible portion whole flow process all can not being exposed to after pressing, the risk of frangible, breakage and chemical medicinal liquid etch not.
Above embodiment has only expressed several kinds of execution modes of the utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model claim.Should be pointed out that for the person of ordinary skill of the art under the prerequisite that does not break away from the utility model design, can also make some distortion and improvement, these all belong to the protection range of the utility model.Therefore, the protection range of the utility model patent should be as the criterion with accompanying claims.
Claims (4)
1. one kind is used for static half flexible circuit board that bends; It is characterized in that; First rigid plate, first of comprise the first slim rigid plate of making circuit, having made circuit is the flow model prepreg not; Offering first on said first rigid plate windows; Said first does not have first vacancy section on the flow model prepreg, and said first windows correspondingly with said first vacancy section, and the order of piling up pressing is followed successively by the said first slim rigid plate, first not flow model prepreg, first rigid plate.
2. half flexible circuit board that is used for static bending as claimed in claim 1 it is characterized in that also comprise protective layer, said protective layer is fitted in the surface of the said first slim rigid plate, and said protective layer and said first is windowed corresponding.
3. half flexible circuit board that is used for static bending as claimed in claim 1; It is characterized in that; The said first slim rigid plate be in single sided board, double sided board, the multi-layer sheet any, said first rigid plate be in single sided board, double sided board, the multi-layer sheet any.
4. one kind is used for static half flexible circuit board that bends; It is characterized in that; Second rigid plate, first of comprise the first slim rigid plate of making circuit, make first rigid plate of circuit, having made circuit is flow model prepreg, second flow model prepreg not; Offer first on said first rigid plate and window, offer second on said second rigid plate and window, said first does not have first vacancy section on the flow model prepreg; Said second does not have second vacancy section on the flow model prepreg; Its order of piling up pressing is followed successively by not flow model prepreg, second rigid plate of flow model prepreg, the first slim rigid plate, second of said first rigid plate, first, said first window corresponding with said first vacancy section, said second window corresponding with said second vacancy section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201079248U CN202503812U (en) | 2012-03-20 | 2012-03-20 | Semi-flexible printed circuit board used for static bending |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201079248U CN202503812U (en) | 2012-03-20 | 2012-03-20 | Semi-flexible printed circuit board used for static bending |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202503812U true CN202503812U (en) | 2012-10-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012201079248U Expired - Fee Related CN202503812U (en) | 2012-03-20 | 2012-03-20 | Semi-flexible printed circuit board used for static bending |
Country Status (1)
| Country | Link |
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| CN (1) | CN202503812U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102946688A (en) * | 2012-11-22 | 2013-02-27 | 高德(苏州)电子有限公司 | Flexible circuit board |
| CN103957657A (en) * | 2014-04-25 | 2014-07-30 | 华为机器有限公司 | Flexible circuit board and optical module with flexible circuit board |
| CN104602444A (en) * | 2015-01-29 | 2015-05-06 | 高德(苏州)电子有限公司 | Automotive multilayer-structured circuit board and production method thereof |
| CN106304697A (en) * | 2016-08-24 | 2017-01-04 | 江门崇达电路技术有限公司 | A kind of manufacture method of false rigid-flex combined board |
| CN107613639A (en) * | 2017-08-01 | 2018-01-19 | 深圳明阳电路科技股份有限公司 | One kind partly scratches pcb board and preparation method thereof |
| CN110944449A (en) * | 2019-12-26 | 2020-03-31 | 上海创功通讯技术有限公司 | Bendable multi-layer hard circuit board and manufacturing method thereof |
| CN112351571A (en) * | 2019-08-06 | 2021-02-09 | 奥特斯(中国)有限公司 | Semi-flexible component carrier and method of manufacturing the same |
| CN112349676A (en) * | 2019-08-06 | 2021-02-09 | 奥特斯奥地利科技与系统技术有限公司 | Semi-flexible component carrier and method for producing the same |
-
2012
- 2012-03-20 CN CN2012201079248U patent/CN202503812U/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102946688A (en) * | 2012-11-22 | 2013-02-27 | 高德(苏州)电子有限公司 | Flexible circuit board |
| CN102946688B (en) * | 2012-11-22 | 2015-02-25 | 高德(苏州)电子有限公司 | Flexible circuit board |
| CN103957657A (en) * | 2014-04-25 | 2014-07-30 | 华为机器有限公司 | Flexible circuit board and optical module with flexible circuit board |
| CN104602444A (en) * | 2015-01-29 | 2015-05-06 | 高德(苏州)电子有限公司 | Automotive multilayer-structured circuit board and production method thereof |
| CN106304697A (en) * | 2016-08-24 | 2017-01-04 | 江门崇达电路技术有限公司 | A kind of manufacture method of false rigid-flex combined board |
| CN107613639A (en) * | 2017-08-01 | 2018-01-19 | 深圳明阳电路科技股份有限公司 | One kind partly scratches pcb board and preparation method thereof |
| US11284508B2 (en) | 2019-08-06 | 2022-03-22 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Semi-flex component carrier with dielectric material having high elongation and low young modulus |
| CN112351571A (en) * | 2019-08-06 | 2021-02-09 | 奥特斯(中国)有限公司 | Semi-flexible component carrier and method of manufacturing the same |
| CN112349676A (en) * | 2019-08-06 | 2021-02-09 | 奥特斯奥地利科技与系统技术有限公司 | Semi-flexible component carrier and method for producing the same |
| US11291119B2 (en) | 2019-08-06 | 2022-03-29 | At&S (China) Co. Ltd. | Semi-flex component carrier with dielectric material surrounding an embedded component and having locally reduced young modulus |
| CN112349676B (en) * | 2019-08-06 | 2022-04-05 | 奥特斯奥地利科技与系统技术有限公司 | Semi-flexible component carrier and method for producing the same |
| CN112351571B (en) * | 2019-08-06 | 2022-08-16 | 奥特斯(中国)有限公司 | Semi-flexible component carrier and method of manufacturing the same |
| CN110944449A (en) * | 2019-12-26 | 2020-03-31 | 上海创功通讯技术有限公司 | Bendable multi-layer hard circuit board and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121024 Termination date: 20200320 |