CN110493956A - A kind of PCB plate production method of bending - Google Patents
A kind of PCB plate production method of bending Download PDFInfo
- Publication number
- CN110493956A CN110493956A CN201810454429.6A CN201810454429A CN110493956A CN 110493956 A CN110493956 A CN 110493956A CN 201810454429 A CN201810454429 A CN 201810454429A CN 110493956 A CN110493956 A CN 110493956A
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- CN
- China
- Prior art keywords
- bending
- production method
- region
- plate production
- pcb plate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Abstract
A kind of PCB plate production method of bending, it is characterised in that: the following steps are included: (1) sawing sheet；(2) internal layer is made；(3) outer layer is made；(4) anti-welding；(5) blind gong；(6) it forms, pack, pcb board divides hardboard region and bending region, and bending region uses semi-flexible material, soft board printing ink to manufacture, can be realized the effect of bending.The PCB plate production method that the present invention is bent is simple, it is at low cost, take a short time, be applicable to the product of bending PCB, it is very widely used.
Description
Technical field
The present invention relates to pcb board fields, specifically more particularly to a kind of PCB plate production method of bending.
Background technique
Currently, mainly having three kinds of pcb board, FPC plate and Rigid Flex design application scenarios on the market, Rigid Flex is just
It is that flexible circuit board and rigid wiring board are combined, formation has by processes such as pressings by related process requirement
The wiring board of FPC characteristic and PCB characteristic, therefore, it can be used for some products for having particular/special requirement, and existing certain scratches
Property region, also have certain rigid region, to interiors of products space is saved, reduce finished-product volume, enhancing product performance, there have to be very big
Help, Rigid Flex is using more in the electronic products such as mobile phone on the market, but existing Rigid Flex produces work
Sequence is various, and production difficulty is big, and yields is lower, and thrown material and manpower are more, therefore its price is somewhat expensive, and the production cycle compares
It is long.
Summary of the invention
Can not be bent to solve pcb board in the prior art, using the Rigid Flex that can be bent but exist it is at high cost,
The problems such as production process is complicated, the production cycle is long, yields is low.
A kind of PCB plate production method of bending, comprising the following steps:
(1) sawing sheet: carrying out sawing sheet to rigid substrates, divides hardboard region and bending region, and the bending region uses semi-flexible
Material；(2) internal layer is made；(3) outer layer is made；(4) anti-welding, it is anti-welding the following steps are included: S1: the first printing, pcb board whole plate
Common hardboard ink is printed, pcb board is toasted after printing；S2: hardboard ink is exposed by the film, and bending region is opened
Then window develops, the hardboard ink removal on region is bent after development；S3: the second printing is covered using catch point halftone
Pcb board, only to bending region off-set oil ink, ink uses soft board ink special；S4: it is dried after printing soft board ink special
It is roasting, it is exposed, develops after baking；(5) blind gong；(6) it forms, pack.
It preferably, further include interior inspection, pressing, drilling, plating between step (2) and step (3).
Preferably, the baking temperature of S1 is 70 ~ 80 DEG C in step (4), and baking time is 10 ~ 20 minutes.
Preferably, the developing powder of S2 is 4.5-5m/min in step (4).
Preferably, each side of S3 flexible ink each hem width more corresponding than bending region goes out at least 5mm in step (4).
Preferably, the baking temperature of S4 is 70 ~ 80 DEG C in step (4), and baking time is 35 ~ 45 minutes.
Preferably, the developing powder of S4 is 4.5-5.5m/min in step (4).
Preferably, one side horizontal direction in the catch point halftone towards hardboard region is more than hardboard region and bending region
Between boundary line 10mm.
Preferably, blind gong uses optics control depth gong machine in step (5).
Preferably, the optics control depth gong machine will bend region and carry out controlled depth milling, and the milling of bending region is at a thickness of 0.15-
0.25mm。
Sawing sheet of the present invention uses semi-flexible substrate, and bending region uses soft board ink in manufacturing process, by controlling deep gong machine
To bending region carry out controlled depth milling after it is thinning, the pcb board being fabricated to its bend region may be implemented to bend, repeatedly bending all will not
Fracture occurs, falls oily phenomenon, good product quality；This pcb board has both the rigidity of traditional PCB and the flexibility of FPC, is suitable for requiring electricity
Road plate does not need dynamic and bends, but needs to bend the product of installation, and application range is very extensive；Cost of manufacture of the present invention is only soft
The 1/3 of plywood cost of hardening, it is at low cost, and production process 10 processes at least fewer than Rigid Flex, production is simple, is spent
Time is short, can enhance enterprise competitiveness.
Detailed description of the invention
Fig. 1 is flow diagram of the invention.
Specific embodiment
Below in conjunction with drawings and examples, the present invention will be further elaborated.
A kind of PCB plate production method of bending, it is characterised in that: the following steps are included:
1) sawing sheet: to rigid substrates progress sawing sheet, hardboard region and bending region are divided, bending region is curved to need in pcb board
The region of folding, bending region use semi-flexible material；(2) internal layer is made；(3) inspection in；(4) it presses；(5) it drills, be electroplated；(6)
Make outer layer；(7) anti-welding；(8) text；(9) blind gong；(10) it forms and tests；(11) FQC, surface treatment and packaging.
It is anti-welding the following steps are included:
S1: the first printing, pcb board whole plate are printed common hardboard ink, are toasted after printing to pcb board, baking temperature
It is 70 ~ 80 DEG C, baking time is 10 ~ 20 minutes, so that the ink humidity and viscosity on pcb board are suitble to, guarantees pcb board
Quality；
S2: hardboard ink is exposed by the film, then the windowing of bending region is developed, and is bent after development hard on region
The removal of leaf fat ink, developing powder 4.5-5m/min；
S3: the second printing covers pcb board using catch point halftone, and only to bending region off-set oil ink, ink is dedicated using soft board
Ink, each side of the upper flexible ink of PCB each hem width more corresponding than bending region go out at least 5mm, it is ensured that bending region is complete
Flexible ink in covering, it is ensured that bending region will not fall the effect of ink phenomenon because of bending；
S4: being toasted after printing soft board ink special, be exposed after baking, developed, and baking temperature is 70 ~ 80 DEG C, baking
Time is 35 ~ 45 minutes, so that the ink humidity and viscosity on pcb board are suitble to, guarantees the quality of pcb board, developing powder
For 4.5-5.5m/min.
One side horizontal direction in catch point halftone towards hardboard region is more than the boundary line 10mm between bending region.Blind gong uses
Optics control depth gong machine, optics control depth gong machine will bend region and carry out controlled depth milling, the milling of bending region at a thickness of 0.15-0.25mm,
It is only the equipment that controlled depth milling is preferably implemented in the present invention using optics control depth gong machine.
The bent area PCB can be bent repeatedly, such as all be not in for bending 3 times fracture and the phenomenon for falling oil.The bent area PCB
It is equipped with copper face, within the copper face at the bent area the PCB back side is with a thickness of 2oz；PCB hardboard area is equipped with drilling, hole spacing PCB bending
Area recently any distance be greater than 1.5mm；PCB hardboard area is equipped with pad, route and copper sheet, the pad, route and copper
Skin respectively apart from bent area recently any distance be more than or equal to 1mm.
Sawing sheet of the present invention uses semi-flexible substrate, and bending region uses soft board ink in manufacturing process, by controlling deep gong machine
To bending region carry out controlled depth milling after it is thinning, the pcb board being fabricated to its bend region may be implemented to bend, repeatedly bending all will not
Fracture occurs, falls oily phenomenon, good product quality；This pcb board has both the rigidity of traditional PCB and the flexibility of FPC, is suitable for requiring electricity
Road plate does not need dynamic and bends, but needs to bend the product of installation, and application range is very extensive, especially invents in electronic field
Application；Cost of manufacture of the present invention is only the 1/3 of Rigid Flex cost, at low cost, and production process is at least than soft or hard combination
Plate lacks 10 processes, and production is simple, is taken a short time, and can enhance enterprise competitiveness.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, although referring to aforementioned reality
Applying example, invention is explained in detail, to those skilled in the art, still can be to foregoing embodiments
Documented technical solution is modified or equivalent replacement of some of the technical features.All spirit in this implementation
Within principle, any modification, equivalent replacement, improvement and so on are included within the scope of protection of the present invention.
Claims (10)
1. a kind of PCB plate production method of bending, it is characterised in that: the following steps are included:
(1) sawing sheet: carrying out sawing sheet to rigid substrates, divides hardboard region and bending region, and the bending region uses semi-flexible
Material；
(2) internal layer is made；
(3) outer layer is made；
(4) anti-welding, it is anti-welding the following steps are included:
S1: the first printing, pcb board whole plate are printed common hardboard ink, are toasted after printing to pcb board；
S2: hardboard ink is exposed by the film, then the windowing of bending region is developed；
S3: the second printing covers pcb board using catch point halftone, and only to bending region off-set oil ink, ink is dedicated using soft board
Ink；
S4: it is toasted after printing soft board ink special, is exposed after baking, developed；
Blind gong；
Molding, packaging.
2. a kind of PCB plate production method of bending according to claim 1, it is characterised in that: step (2) and step (3)
Between further include it is interior inspection, pressing, drilling, plating.
3. a kind of PCB plate production method of bending according to claim 1, it is characterised in that: the baking of S1 in step (4)
Temperature is 70 ~ 80 DEG C, and baking time is 10 ~ 20 minutes.
4. a kind of PCB plate production method of bending according to claim 1, it is characterised in that: the development of S2 in step (4)
Speed is 4.5-5m/min.
5. a kind of PCB plate production method of bending according to claim 1, it is characterised in that: S3 flexible oil in step (4)
Each side of ink each hem width more corresponding than bending region goes out at least 5mm.
6. a kind of PCB plate production method of bending according to claim 1, it is characterised in that: the baking of S4 in step (4)
Temperature is 70 ~ 80 DEG C, and baking time is 35 ~ 45 minutes.
7. a kind of PCB plate production method of bending according to claim 1, it is characterised in that: the development of S4 in step (4)
Speed is 4.5-5.5m/min.
8. a kind of PCB plate production method of bending according to claim 1, it is characterised in that: the catch point halftone court
To the boundary line 10mm that one side horizontal direction in hardboard region is more than between hardboard region and bending region.
9. a kind of PCB plate production method of bending according to claim 1, it is characterised in that: blind gong uses in step (5)
Optics control depth gong machine.
10. a kind of PCB plate production method of bending according to claim 1, it is characterised in that: the optics control depth gong
Machine will bend region and carry out controlled depth milling, and the milling of bending region is at a thickness of 0.15-0.25mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810454429.6A CN110493956A (en) | 2018-05-14 | 2018-05-14 | A kind of PCB plate production method of bending |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810454429.6A CN110493956A (en) | 2018-05-14 | 2018-05-14 | A kind of PCB plate production method of bending |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110493956A true CN110493956A (en) | 2019-11-22 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810454429.6A Pending CN110493956A (en) | 2018-05-14 | 2018-05-14 | A kind of PCB plate production method of bending |
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| Country | Link |
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| CN (1) | CN110493956A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114501858A (en) * | 2022-01-04 | 2022-05-13 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of semi-flexible circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102802361A (en) * | 2012-08-27 | 2012-11-28 | 皆利士多层线路版(中山)有限公司 | Making method of semi-flexible printed circuit board |
| CN106304697A (en) * | 2016-08-24 | 2017-01-04 | 江门崇达电路技术有限公司 | A kind of manufacture method of false rigid-flex combined board |
| US20170142828A1 (en) * | 2015-11-12 | 2017-05-18 | Multek Technologies Limited | Dummy core plus plating resist restrict resin process and structure |
| CN107613639A (en) * | 2017-08-01 | 2018-01-19 | 深圳明阳电路科技股份有限公司 | One kind partly scratches pcb board and preparation method thereof |
-
2018
- 2018-05-14 CN CN201810454429.6A patent/CN110493956A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102802361A (en) * | 2012-08-27 | 2012-11-28 | 皆利士多层线路版(中山)有限公司 | Making method of semi-flexible printed circuit board |
| US20170142828A1 (en) * | 2015-11-12 | 2017-05-18 | Multek Technologies Limited | Dummy core plus plating resist restrict resin process and structure |
| CN106304697A (en) * | 2016-08-24 | 2017-01-04 | 江门崇达电路技术有限公司 | A kind of manufacture method of false rigid-flex combined board |
| CN107613639A (en) * | 2017-08-01 | 2018-01-19 | 深圳明阳电路科技股份有限公司 | One kind partly scratches pcb board and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114501858A (en) * | 2022-01-04 | 2022-05-13 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of semi-flexible circuit board |
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Application publication date: 20191122 |