CN101378628B - Sticking method for local additional sticking material of various printed circuit boards - Google Patents
Sticking method for local additional sticking material of various printed circuit boards Download PDFInfo
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- CN101378628B CN101378628B CN2007101477380A CN200710147738A CN101378628B CN 101378628 B CN101378628 B CN 101378628B CN 2007101477380 A CN2007101477380 A CN 2007101477380A CN 200710147738 A CN200710147738 A CN 200710147738A CN 101378628 B CN101378628 B CN 101378628B
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Abstract
The invention provides a coating method of a local additive coating material, which is applicable to various printing circuit boards, in particular to a method used for coating the additive local coating material on circuit blocks after circuit preparation or insulation layer coating are completed on a plurality of circuit blocks of the printing circuit board which is combined softly or hard or both softly and hard; the method comprises the steps as follows: a shaping material which covers a plurality of circuit blocks simultaneously is provided with a coating material; a depth control tool is used to cut the corresponding region to be coated on the circuit blocks and align the position corresponding to the circuit block; subsequently, false coating and pressing are carried out and the shaping material is torn out of the coating material; therefore, the additive coating material can be correctly coated on the prearranged position of the circuit blocks without need of bonding one by one on the circuit blocks; furthermore, the coating is exacter and the working time is saved.
Description
Technical field
The present invention is a kind of method for sticking and covering that is applicable to the local additional sticking material of various printed circuit board (PCB)s; it is after the circuit blocks on the printed circuit board (PCB) is finished circuit making back or is coated with layer of cloth; paste anti-electromagnetic interference (Electromagnetic Interference; abbreviation EMI) sheet metal or protection glued membrane take place to save the situation that can avoid misalignment man-hour again.
Background technology
Rigid printed circuit board is called hardboard again, is that material is carried on the basis of electronic industrial products such as all information, electronics, communication, consumer electronics, space flight and national defence, present design and make towards the small-bore, the direction on high density, multilayer number, fine rule road develops.
Moreover flexible printed wiring board is called soft board (FPC, flexible printed circuit) again, has characteristics such as light weight, thin little, bent, low-voltage, low consumpting power.Because product can change shape according to spatial design, and foldable and prevent electrostatic interference, make the application product volume-diminished, weight significantly alleviates, thus begin to replace traditional hardboard, and be used in commercial uses such as satellite and health care industry.Closely during the last ten years, because of information and consumption electronic products develop rapidly, emphasizing to make the consumption of soft board and quality grow up rapidly under high function, small size, the lightweight demand.Domestic manufacturers are many to produce single face and double sided board at present, mainly supply at mobile computer, mobile phone, LCD, CD-ROM drive, digital camera etc.
Again, the requirement (as mobile phone, LCD) for the density of the area that adapts to the compact product of various differences and circuit often gives soft, rigid printed circuit board in conjunction with using.
No matter the making of printed circuit board (PCB) is rigid; soft or soft; the kenel of rigid combination; often look the size or the arts demand of the circuit blocks of printed circuit board (PCB); and the plurality of circuits block is arranged on the printed circuit board (PCB); and behind the circuit of the intact circuit layer of photolithographic fabrication; avoid the influence of ambient temperature and humidity for preventing copper wire oxidation and protection circuit; and its durability of increase; must be in the top last layer protection glued membrane that adds; maybe must cover the sheet metal of going up anti-electromagnetic interference (EMI); but because of these protect glued membranes very soft, or volume is very little, very is not easy entirely to cover on the circuit blocks; therefore; generally carry out contraposition; overlay program all must be finished individually by block of block of experienced operators, and can't use automation instead; a large amount of production reduces cost.
The inventor further develops out a kind of method for sticking and covering that is applicable to the local additional sticking material of various printed circuit board (PCB)s of the present invention again because the disappearance of above-mentioned method for making when implementing studies intensively.
Summary of the invention
A purpose of the present invention, be to provide a kind of method for sticking and covering that is applicable to the local additional sticking material of various printed circuit board (PCB)s, it mainly is to be provided with the plurality of circuits block in a printed circuit board (PCB), by the coverlay that can contain several circuit blocks areas simultaneously, the zone that desire on several circuit blocks is covered once pastes simultaneously.
Another purpose of the present invention, be on certain section bar, to be provided with a sticking material, after will not cut by degree of depth control tool with the zone that pastes the corresponding position, with its aligned number circuit blocks opposite position, the material of will finalizing the design again tears off in sticking material, so, sticking material is correctly pasted on these circuit blocks precalculated positions, and once aim at circuit blocks more than several, and do not need to paste one by one the situation of not only having saved time but also can exempt misalignment.
The object of the present invention is achieved like this, a kind of method for sticking and covering that is applicable to the local additional sticking material of various printed circuit board (PCB)s, it is to be applied to one be provided with a plurality of circuits of having finished and make or be coated with on the printed circuit board (PCB) of circuit blocks of layer of cloth, and the specific region on these circuit blocks adds sticking material, and this method includes:
The typing material that can contain at least two circuit blocks on this printed circuit board (PCB) in an area, this typing material is provided with a sticking material, again by instrument with on the sticking material not with these block circuit on the corresponding position, specific region cut, and this typing material is provided with more than one corresponding points on ora terminalis;
On the printed circuit board (PCB) certain position, then be provided with the datum mark relative with corresponding points, when pasting, can be with the corresponding datum mark of corresponding points, the sticking material that can contain several circuit blocks again is covered on the specific region, and carrying out vacation subsides and pressing action, the material of will finalizing the design again tears off in sticking material;
From the above mentioned, the present invention can make sticking material correctly paste on these circuit blocks precalculated positions, and once aims at the circuit blocks more than several, and does not need to paste one by one, the situation of not only having saved time but also can exempt misalignment.
Description of drawings
Fig. 1 a～1d makes the schematic flow sheet of anti-electromagnetic interference (EMI) sheet metal during for the invention process.
Fig. 2 a～2d makes the manufacturing schematic diagram of protection glued membrane during for the invention process.
Fig. 3 and Fig. 4 are respectively the present invention and prevent that electromagnetic interference (EMI) sheet metal or protection glued membrane paste the action schematic diagram on circuit board.
Fig. 5 is the schematic diagram of the circuit board that the present invention pasted.
Fig. 6 has pasted the circuit board finished product schematic diagram of finishing for the present invention.
Drawing reference numeral:
Electromagnetic interference (EMI) shielding film 10
Corresponding points 14,34
Printed circuit board (PCB) 20
Protection glued membrane group 30
Protection glued membrane 32
Epoxy resin (EPOXY) glue 321
Embodiment
Please refer to shown in Figure 3, the present invention is a kind of method for sticking and covering that is applicable to the local additional sticking material of various printed circuit board (PCB)s, it mainly is to be provided with a plurality of circuit blocks 21 that layer of cloth was made or be coated with to circuit of having finished in a printed circuit board (PCB) 20, specific region on these circuit blocks 21 need add sticking material, and this sticking material can be anti-electromagnetic interference (EMI) sheet metal or protection glued membrane etc.; Wherein, the shielding film 10 of anti-electromagnetic interference (EMI) is formed (as shown in Figure 1a) by sheet metal 12 and certain section bar 13 of a release liners 11, anti-electromagnetic interference (EMI); And protection glued membrane group 30 is made up of a release liners 31, a protection glued membrane 32 and certain section bar 33, and is coated with epoxy resin (EPOXY) glue 321 (shown in Fig. 2 a) on this protection glued membrane 32; Please refer to Fig. 1 a～Fig. 1 d and be used to make the method that pastes the EMI suppression sheet metal for the present invention, its manufacture method is as follows:
It mainly is that the release liners 11 that can contain simultaneously earlier on the anti-electromagnetic interference (EMI) shielding film 10 of circuit blocks 21 areas on several printed circuit board (PCB)s 20 is torn (as shown in Figure 1a), anti-electromagnetic interference (EMI) sheet metal 12 is revealed, and with release liners 11 be fitted in the typing material 13 on (shown in Fig. 1 b), in present embodiment, the typing material is that wheat is drawn (mylar), again by degree of depth control tool will prevent on the electromagnetic interference (EMI) sheet metal 12 not with circuit blocks 21 on paste the corresponding position the sheet metal zone cut (shown in Fig. 1 c), and will not need anti-electromagnetic interference (EMI) sheet metal 12 to make section bar 13 by oneself to take off (shown in Fig. 1 d), so promptly on typing material 13, finish the sticking material that several desire to paste the shielding film 10 of anti-electromagnetic interference (EMI) usefulness.
Moreover, please refer to shown in Fig. 2 a～Fig. 2 d, for the present invention pastes the manufacture method of protecting glued membrane on circuit blocks, its method is as follows:
It mainly is that the release liners 31 that can contain earlier the protection glued membrane group 30 of circuit blocks 21 areas on several printed circuit board (PCB)s 20 simultaneously tears off (as Fig. 2 a; shown in Fig. 2 b); epoxy resin (EPOXY) glue 321 that makes this protection glued membrane 32 and be coated on the protection glued membrane 32 reveals; in present embodiment protection glued membrane 32 is by Polyimide (polymide; abbreviation PI) forms; again by degree of depth control tool will be not with circuit blocks 21 on desire to paste the corresponding position protection glued membrane 32 zones cut (shown in Fig. 2 c); and unwanted protection glued membrane 32 made by oneself on the section bar 33 (is carrier tape carrier tape in present embodiment) tear off (shown in Fig. 2 d), so promptly on typing material 33, finish several and desire to be covered on sticking material on the circuit blocks 21.
Please refer to Fig. 3, Fig. 4, for the present invention being used to be covered on the method for preventing electromagnetic interference (EMI) sheet metal 12 or protection glued membrane 32 on the circuit blocks 21, its method is as follows:
Can contain several circuit blocks 21 areas at the same time and remove does not need typing material 13, the 33 end limits of sheet metal 12 or protection glued membrane 32 to be provided with corresponding points 14,34; Simultaneously; also be provided with an above datum mark 22 on the printed circuit board (PCB) 20 of desiring to be capped; these datum marks 22 and with the typing material 13 of anti-electromagnetic interference (EMI) shielding film 10 or protection glued membrane group 30; corresponding points 14 on the 33 end limits; 34 is corresponding; when pasting; can be with corresponding points 14; 34 aim at the datum mark 22 of printed circuit board (PCB) 20; make sheet metal 12 or protection glued membrane 32 on this typing material 13 or 33 can aim at the precalculated position respectively; and after carrying out the vacation subsides and flattening action; the material 13 of will finalizing the design again; 33 tear off on sheet metal 12 or protection glued membrane 32; so; sheet metal 12 or protection glued membrane 32 are reclined respectively on the assigned address of each circuit blocks 21 (as Fig. 5; shown in Figure 6); and do not need to aim at one by one; not only can precisely paste is needing anti-electromagnetic interference (EMI) or is strengthening on the position of protection on the circuit blocks 21, and can save a large amount of costs of labor.
In sum, the present invention is a kind of by prefabricated operation, to avoid the corresponding one by one method that pastes, has very big value on industry, can improve the shortcoming of known technology, can promote benefit and efficient in the use.
Claims (6)
1. method for sticking and covering that is applicable to the local additional sticking material of various printed circuit board (PCB)s, it is to be applied to one be provided with a plurality of circuits of having finished and make or be coated with on the printed circuit board (PCB) of circuit blocks of layer of cloth, and the specific region on these circuit blocks adds sticking material, and this method includes:
The typing material that provides an area to contain at least two circuit blocks on this printed circuit board (PCB), this typing material is provided with a sticking material, again by instrument with on the sticking material not with these circuit blocks on the corresponding position, specific region cut, and this typing material is provided with more than one corresponding points on ora terminalis;
On the printed circuit board (PCB) certain position, then be provided with the datum mark relative with corresponding points, when pasting, with the corresponding datum mark of corresponding points, the sticking material that will contain again on the typing material of several circuit blocks is covered on the specific region, and carrying out vacation subsides and pressing action, the material of will finalizing the design again tears off in sticking material;
So, sticking material is correctly pasted on these circuit blocks precalculated positions, and once aim at the circuit blocks more than several, and not need to paste one by one, the situation of not only having saved time but also can exempt misalignment.
2. the method for sticking and covering that is applicable to the local additional sticking material of various printed circuit board (PCB)s as claimed in claim 1 is characterized in that: sticking material is the sheet metal of anti-electromagnetic interference.
3. the method for sticking and covering that is applicable to the local additional sticking material of various printed circuit board (PCB)s as claimed in claim 1 is characterized in that: sticking material is the protection glued membrane.
4. the method for sticking and covering that is applicable to the local additional sticking material of various printed circuit board (PCB)s as claimed in claim 3 is characterized in that: the protection glued membrane is made up of Polyimide and epoxide-resin glue.
5. the method for sticking and covering that is applicable to the local additional sticking material of various printed circuit board (PCB)s as claimed in claim 1 is characterized in that: the typing material is that wheat is drawn.
6. the method for sticking and covering that is applicable to the local additional sticking material of various printed circuit board (PCB)s as claimed in claim 1 is characterized in that: the typing material is a carrier tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101477380A CN101378628B (en) | 2007-08-27 | 2007-08-27 | Sticking method for local additional sticking material of various printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101477380A CN101378628B (en) | 2007-08-27 | 2007-08-27 | Sticking method for local additional sticking material of various printed circuit boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101378628A CN101378628A (en) | 2009-03-04 |
| CN101378628B true CN101378628B (en) | 2010-06-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101477380A Active CN101378628B (en) | 2007-08-27 | 2007-08-27 | Sticking method for local additional sticking material of various printed circuit boards |
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| Country | Link |
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| CN (1) | CN101378628B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102123564B (en) * | 2010-11-26 | 2013-05-01 | 中国北方车辆研究所 | Conformal coating shielding method of circuit board |
| CN106793590A (en) * | 2017-03-23 | 2017-05-31 | 深圳市华严慧海电子有限公司 | The manufacture craft of multi-layer PCB board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1647596A (en) * | 2002-04-12 | 2005-07-27 | 新藤电子工业株式会社 | Circuit board and method for manufacturing the same |
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2007
- 2007-08-27 CN CN2007101477380A patent/CN101378628B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1647596A (en) * | 2002-04-12 | 2005-07-27 | 新藤电子工业株式会社 | Circuit board and method for manufacturing the same |
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| Publication number | Publication date |
|---|---|
| CN101378628A (en) | 2009-03-04 |
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