CN207939829U - Rigid-flexible daughter board and rigid-flex combined board - Google Patents
Rigid-flexible daughter board and rigid-flex combined board Download PDFInfo
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- CN207939829U CN207939829U CN201820240750.XU CN201820240750U CN207939829U CN 207939829 U CN207939829 U CN 207939829U CN 201820240750 U CN201820240750 U CN 201820240750U CN 207939829 U CN207939829 U CN 207939829U
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Abstract
The utility model discloses a kind of rigid-flexible daughter boards, the first rigid core plate including flexible core plate and with the pressing of flexible core plate, the flexibility core plate includes flexible substrate and is respectively arranged on the electric resistance alloy layer of flexible substrate two relative side and the first copper foil layer, and face where first copper foil layer is the stitching surface of the flexible core plate and the described first rigid core plate pressing；The flexibility core plate includes the rigid region positioned at intermediate flexure region and positioned at flexure region both ends；At least the electric resistance alloy layer side of flexure region is equipped with the second copper foil layer.The utility model avoids in process of production, and the rigid media that flexible core plate lacks support causes the phenomenon that yield rate is low to make electric resistance alloy layer lose；Meanwhile second copper foil layer the electric resistance alloy layer of flexure region is protected, making the flexure region of flexible core plate, electric resistance alloy layer is not lost in the process of bending, keeps the circuit turn-on of electric resistance alloy layer in rigid region and flexure region.
Description
Technical field
The utility model is related to printed circuit board fields, more particularly, to a kind of rigid-flexible daughter board and rigid-flex combined board.
Background technology
As electronic product develops to highly integrated, multifunction direction, traditional rigid-flex combined board surface area without
Method meets the needs of component mounter.Electronic component needs to be transferred to inside from the surface of wiring board, and uses film resistor or electricity
Hold and replace traditional discrete formula resistance or capacitance, is saved greatly the surface mount demand of rigid-flex combined board.These film resistors
Material is generally the prodigious alloy of brittleness.When film resistor, that is, electric resistance alloy layer is located at flexibility circuit layer, in process of production,
It is susceptible to the defect for losing film resistor, causes yield rate low, and in use, is susceptible to and loses film resistor
Defect, the phenomenon that causing circuit to be not turned on.
Utility model content
Based on this, the utility model lies in that the prior art is overcome to be located at flexibility circuit layer when film resistor i.e. electric resistance alloy layer
When, in process of production, it is susceptible to the defect for losing film resistor, causes yield rate low, and in use, be easy out
The defect for now losing film resistor, the phenomenon that causing circuit to be not turned on, provide a kind of rigid-flexible daughter board and rigid-flex combined board.
Its technical solution is as follows：
A kind of rigid-flexible daughter board, including flexible core plate and the first rigid core plate with the pressing of flexible core plate, the flexible core
Plate includes flexible substrate and is respectively arranged on the electric resistance alloy layer of flexible substrate two relative side and the first copper foil layer, and described first
Face where copper foil layer is the stitching surface of the flexible core plate and the described first rigid core plate pressing；The flexibility core plate includes being located at
Intermediate flexure region and the rigid region positioned at flexure region both ends；The electric resistance alloy layer side of at least flexure region is equipped with
Second copper foil layer.
After the technical program presses flexible core plate and the first rigid core plate, then to the electric resistance alloy layer on flexible core plate
And/or second copper foil layer be etched, at this point, flexible core plate obtains the support of the first rigid core plate, avoid in process of production,
The rigid media that flexible core plate lacks support causes the phenomenon that yield rate is low to make electric resistance alloy layer lose；Meanwhile
Since the electric resistance alloy layer side of at least flexure region is equipped with the second copper foil layer, electric resistance alloy of second copper foil layer to flexure region
Layer is protected, and making the flexure region of flexible core plate, electric resistance alloy layer is not lost in the process of bending, keeps rigid region
With the circuit turn-on of electric resistance alloy layer in flexure region.
Further, the flexure region on the flexible core plate is equipped with the cover film of the first copper foil layer of covering and/or described
Flexure region on flexible core plate is equipped with the cover film of covering electric resistance alloy layer and the second copper foil layer.
Further, first copper foil layer is rolled copper foil.
Further, layer of prepreg, and the prepreg are equipped between the flexible core plate and the first rigid core plate
Floor is equipped with windowing area in flexure region corresponding position.
Further, the sheet resistance of the electric resistance alloy layer ranging from 10 Ω -250 Ω.
Further, the thickness range of the electric resistance alloy layer is 0.05 μm -1 μm.
The technical program also provides a kind of rigid-flex combined board, and the rigid-flex combined board includes described in any embodiment as above
Rigid-flexible daughter board and the second rigid core plate set on the rigid-flexible daughter board side；Described second rigid core plate and first rigidity
Core plate is respectively arranged on the two relative side of the flexible core plate.
Further, layer of prepreg, and the prepreg are equipped between the flexible core plate and the second rigid core plate
Floor is equipped with windowing area in flexure region corresponding position.
Further, the described first rigid core plate and the second rigid core plate including rigid substrate and are set to rigid substrate
The conductive layer of side, face where the rigid substrate are pressed with the flexible core plate.
Further, it is equipped with windowing area on the described first rigid core plate and the second rigid core plate, and the windowing area exists
Projection on the flexibility core plate is overlapped with the flexure region.
Description of the drawings
Fig. 1 is the structural schematic diagram of the rigid-flexible daughter board of the utility model；
Fig. 2 is the fabrication processing figure of the rigid-flexible daughter board of the utility model；
Fig. 3 is the structural schematic diagram of the rigid-flex combined board of the utility model；
Fig. 4 is the fabrication processing figure of the rigid-flex combined board of the utility model.
Reference sign：
10, flexible core plate；11, flexible substrate；12, electric resistance alloy layer；13, the first copper foil layer；14, the second copper foil layer；20、
First rigid core plate；21, rigid substrate；22, conductive layer；23, open a window area；30, rigid-flexible daughter board；50, the second rigid core plate；60、
Flexure region；70, rigid region；80, layer of prepreg；90, cover film.
Specific implementation mode
It is below in conjunction with attached drawing and specifically real to make the purpose of this utility model, technical solution and advantage be more clearly understood
Mode is applied, the utility model is described in further detail.It should be understood that the specific embodiments described herein
Only to explain the utility model, the scope of protection of the utility model is not limited.
A kind of rigid-flexible daughter board 30 as depicted in figs. 1 and 2, including flexible core plate 10 and pressed with flexible core plate 10 the
One rigid core plate 20, the flexibility core plate 10 is including flexible substrate 11 and is respectively arranged on the i.e. L2 of 11 two relative side of flexible substrate
Layer and L3 layer of electric resistance alloy layer 12 and the first copper foil layer 13, first copper foil layer, 13 place face be the flexible core plate 10 and
The stitching surface that described first rigid core plate 20 presses；The flexibility core plate 10 includes positioned at intermediate flexure region 60 and being located at
The rigid region 70 at 60 both ends of flexure region；At least 12 side of electric resistance alloy layer of flexure region 60 is equipped with the second copper foil layer 14.
After present embodiment presses flexible core plate 10 and the first rigid core plate 20, then the resistance on flexible core plate 10 is closed
Layer gold 12 and/or the second copper foil layer 14 are etched, at this point, flexible core plate 10 obtains the support of the first rigid core plate 20, are avoided
In etching production process, the rigid media that flexible core plate 10 lacks support causes to make electric resistance alloy layer 12 lose
The low phenomenon of yield rate；Simultaneously as at least 12 side of electric resistance alloy layer of flexure region 60 be equipped with the second copper foil layer 14, second
Copper foil layer 14 protects the electric resistance alloy layer 12 of flexure region 10, makes the flexure region 60 of flexible core plate 10 in bending process
In, electric resistance alloy layer 12 is not lost, and the circuit turn-on of electric resistance alloy layer 12 in rigid region 70 and flexure region 60 is kept.
As shown in Fig. 2, the first copper foil layer 13 of the flexibility core plate 10 passes through layer of prepreg 80 and first rigidity
Core plate 20 presses, and the layer of prepreg 80 opens a window in 60 corresponding position of flexure region.Layer of prepreg 80 makes the first rigidity
Core plate 20 presses close with flexible core plate 10, and position facilitates the rigid core plate 20 of later stage pair first in the windowing of flexure region 60,
The layer of prepreg 80 opens a window in 60 corresponding position of flexure region.
Since the flexure region 60 of flexible core plate 10 is exposed region, thus in order to protect flexure region on flexible core plate 10
Line pattern in 60 ranges, after the first copper foil layer 13 of flexible core plate 10 is etched line pattern, on flexible core plate 10
The flexure region 60 of first copper foil layer 13 presses cover film 90, and pressing cover film is after 90s, then flexible core plate 10 and first is rigid
Core plate 20 is pressed, and rigid-flexible daughter board 30 is formed.
Similarly, the electric resistance alloy layer 12 of the rigid-flex combined board after completing and the second copper foil layer 14 are in flexure region 60
Also it is in naked state, therefore by 12 side of at least part electric resistance alloy layer of 70 corresponding position of rigid region on rigid-flexible daughter board 30
The etching of the second copper foil layer 14 after, press cover film 90 in the electric resistance alloy layer 12 of flexure region 60 and the second copper foil layer 14,
Then rigid-flexible daughter board 30 and the second rigid core plate 50 are pressed again, the pressing for completing rigid-flex combined board makes.
First copper foil layer 13 is rolled copper foil, and the bending performance of rolled copper foil is more excellent, can adapt to rigid-flexible combination
The use environment of plate.
Ranging from 10 Ω -250 Ω of the sheet resistance of electric resistance alloy layer 12 described in present embodiment, and the electric resistance alloy layer 12
Thickness range is 0.05 μm -1 μm, meets the electric property of most of rigid-flex combined boards.
As shown in Figure 3 and Figure 4, present embodiment provides a kind of rigid-flex combined board by taking four layers of rigid-flex combined board as an example, described
Rigid-flex combined board includes the rigid-flexible daughter board 30 described in any embodiment as above and second set on 30 side of rigid-flexible daughter board
Rigid core plate 50；Described second rigid core plate 50 is respectively arranged on the two-phase of the flexible core plate 10 with the described first rigid core plate 20
To side；I.e. the flexible core plate 10 is located between 20 and second rigid core plate 50 of the described first rigid core plate, is formed rigid-flexible
Board.
As shown in figure 4, the rigid-flexible daughter board 30 is pressed by layer of prepreg 80 and the described second rigid core plate 50, and institute
Layer of prepreg 80 is stated to open a window in 60 corresponding position of flexure region.Layer of prepreg 80 makes the second rigid core plate 50 and rigid-flexible daughter board
30 flexible core plate 10 presses closely, and position facilitates the rigid core plate 50 of later stage pair second in the windowing of flexure region 60, described
Layer of prepreg 80 opens a window in 60 corresponding position of flexure region.
20 and second rigid core plate 50 of described first rigid core plate including rigid substrate 21 and is set to rigid substrate 21
The conductive layer 22 of side, 21 place face of the rigid substrate are pressed with the flexible core plate 10, the conductive layer 22 be L1 layer with
L4 layers are then used to make circuit.
It is equipped with windowing area 23 on 20 and second rigid core plate 50 of described first rigid core plate, and the windowing area 23 is in institute
The projection stated on flexible core plate 10 is overlapped with the flexure region 60.It is right after the pressing of the i.e. described rigid-flex combined board completes
60 position of flexure region of first rigid core plate, 20 and second rigid core plate 50 opens a window respectively, makes the flexure region of flexible core plate 10
60 is exposed, and drill, heavy copper, plating, welding resistance, complete surface lines and make and be surface-treated etc. follow-up work, formed just
Flex combined board finished product.
The electric resistance alloy layer 121 of the rigid-flex combined board of present embodiment is not easy to lose, and greatlys save the table of rigid-flex combined board
While face paste fills demand, resistance effect ensure that.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (10)
1. a kind of rigid-flexible daughter board, which is characterized in that the first rigid core plate including flexible core plate and with the pressing of flexible core plate；Institute
Flexible core plate is stated to include flexible substrate and be respectively arranged on the electric resistance alloy layer of flexible substrate two relative side and the first copper foil layer,
Face where first copper foil layer is the stitching surface of the flexible core plate and the described first rigid core plate pressing；The flexibility core plate
It include the rigid region positioned at intermediate flexure region and positioned at flexure region both ends；At least electric resistance alloy layer of flexure region
Side is equipped with the second copper foil layer.
2. rigid-flexible daughter board according to claim 1, which is characterized in that the flexure region on the flexibility core plate is equipped with covering
Flexure region on the cover film of first copper foil layer and/or the flexible core plate is equipped with covering electric resistance alloy layer and the second bronze medal
The cover film of layers of foil.
3. rigid-flexible daughter board according to claim 1, which is characterized in that first copper foil layer is rolled copper foil.
4. rigid-flexible daughter board according to claim 1, which is characterized in that set between the flexibility core plate and the first rigid core plate
There is layer of prepreg, and the layer of prepreg is equipped with windowing area in flexure region corresponding position.
5. rigid-flexible daughter board according to claim 1, which is characterized in that the sheet resistance of the electric resistance alloy layer ranging from 10 Ω-
250Ω。
6. according to the rigid-flexible daughter board of claim 1-5 any one of them, which is characterized in that the thickness range of the electric resistance alloy layer
It is 0.05 μm -1 μm.
7. a kind of rigid-flex combined board, which is characterized in that the rigid-flex combined board includes as described in any one in claim 1-5 rigid
Scratch daughter board and the second rigid core plate set on the rigid-flexible daughter board side；Described second rigid core plate and first rigid core
Plate is respectively arranged on the two relative side of the flexible core plate.
8. rigid-flex combined board according to claim 7, which is characterized in that between the flexibility core plate and the second rigid core plate
Equipped with layer of prepreg, and the layer of prepreg is equipped with windowing area in flexure region corresponding position.
9. rigid-flex combined board according to claim 7, which is characterized in that the described first rigid core plate and the second rigid core plate
Include rigid substrate and the conductive layer set on rigid substrate side, face where the rigid substrate and the flexible core plate pressure
It closes.
10. rigid-flex combined board according to claim 7, which is characterized in that the described first rigid core plate and the second rigid core
Windowing area is equipped on plate, and projection of the windowing area on the flexible core plate is overlapped with the flexure region.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820240750.XU CN207939829U (en) | 2018-02-07 | 2018-02-07 | Rigid-flexible daughter board and rigid-flex combined board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820240750.XU CN207939829U (en) | 2018-02-07 | 2018-02-07 | Rigid-flexible daughter board and rigid-flex combined board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207939829U true CN207939829U (en) | 2018-10-02 |
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ID=63652191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820240750.XU Active CN207939829U (en) | 2018-02-07 | 2018-02-07 | Rigid-flexible daughter board and rigid-flex combined board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207939829U (en) |
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2018
- 2018-02-07 CN CN201820240750.XU patent/CN207939829U/en active Active
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