CN108401383A - The production method and its rigid-flex combined board of rigid-flex combined board - Google Patents
The production method and its rigid-flex combined board of rigid-flex combined board Download PDFInfo
- Publication number
- CN108401383A CN108401383A CN201810123865.5A CN201810123865A CN108401383A CN 108401383 A CN108401383 A CN 108401383A CN 201810123865 A CN201810123865 A CN 201810123865A CN 108401383 A CN108401383 A CN 108401383A
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- Prior art keywords
- rigid
- layer
- flexible
- core plate
- conductive layer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0391—Using different types of conductors
Abstract
The invention discloses a kind of production method of rigid-flex combined board and its rigid-flex combined board, the production method of the rigid-flex combined board includes：The first conductive layer is pressed respectively in the two relative side of flexible substrate and the second conductive layer forms flexible core plate, and first conductive layer includes electric resistance alloy layer and the copper foil layer set on electric resistance alloy layer side；Second Conductive Layer Etch of flexible core plate is gone out into line pattern；Second conductive layer of flexible core plate and the first rigid core plate are pressed, line pattern is etched on the first conductive layer, then the copper foil layer of electric resistance alloy layer side in rigid region and/or flexure region is etched, and is pressed with the second rigid core plate, rigid-flex combined board is formed.The invention avoids in process of production, the rigid media that flexible core plate lacks support causes the phenomenon that yield rate is low, ensure that yield rate to make electric resistance alloy layer lose in the production process.
Description
Technical field
The present invention relates to printed circuit board fields, production method more particularly, to a kind of rigid-flex combined board and its just
Flex combined board.
Background technology
As electronic product develops to highly integrated, multifunction direction, traditional rigid-flex combined board surface area without
Method meets the needs of component mounter.Electronic component needs to be transferred to inside from the surface of wiring board, and uses film resistor or electricity
Hold and replace traditional discrete formula resistance or capacitance, is saved greatly the surface mount demand of rigid-flex combined board.These film resistors
Material is generally the prodigious alloy of brittleness.When film resistor, that is, electric resistance alloy layer is located at flexibility circuit layer, in process of production,
It is susceptible to the defect for losing film resistor, causes yield rate low.
Invention content
Based on this, the invention reside in overcome the prior art when film resistor i.e. electric resistance alloy layer is located at flexibility circuit layer,
In process of production, it is susceptible to the defect for losing film resistor, causes the defect that yield rate is low, a kind of rigid-flex combined board is provided
Production method and its rigid-flex combined board.
Its technical solution is as follows：
A kind of production method of rigid-flex combined board, including：
The first conductive layer is pressed respectively in the two relative side of flexible substrate and the second conductive layer forms flexible core plate, it is described
First conductive layer includes the electric resistance alloy layer being bonded with flexible substrate and the copper foil layer set on electric resistance alloy layer side；
Second Conductive Layer Etch of flexible core plate is gone out into line pattern；
Second conductive layer of flexible core plate and the first rigid core plate are pressed, the first rigid-flexible daughter board is formed；
Line pattern is etched on the first conductive layer in the described first rigid-flexible daughter board, it then will be on the first rigid-flexible daughter board
The copper foil layer etching of electric resistance alloy layer side, forms the second rigid-flexible daughter board in rigid region and/or flexure region；
Second rigid-flexible daughter board and the second rigid core plate are pressed, to the flexible region of the first rigid core plate and the second rigid core plate
Domain opens a window respectively, and completes surface lines making, forms rigid-flex combined board.
First conductive layer and the second conductive layer are first pressed together in flexible substrate and form flexible core plate by the technical program respectively,
And the circuit of i.e. the second conductive layer of non-electrical resistance layer on flexible core plate is made；It then will be where the second conductive layer of flexible core plate
Face pressed with the first rigid core plate, form the first rigid-flexible daughter board.At this point, flexible core plate obtains the support of the first rigid core plate,
It avoids in process of production, the rigid media that flexible core plate lacks support causes finished product to make electric resistance alloy layer lose
The low phenomenon of rate；In the case where obtaining the first rigid core plate support, the first Conductive Layer Etch in flexible core plate is gone out into circuit
Figure ensures yield rate, and the copper foil layer of at least part electric resistance alloy layer side on the first rigid-flexible daughter board is etched, to real
The resistance function of existing electric resistance alloy layer, forms the second rigid-flexible daughter board；Finally the second rigid-flexible daughter board and the second rigid core plate are pressed,
Form rigid-flex combined board.
Further, the copper foil layer of the electric resistance alloy layer side of rigid region in the first rigid-flexible daughter board is etched, and retained
The copper foil layer of flexure region electric resistance alloy layer side.
Further, the second conductive layer of the flexible core plate passes through layer of prepreg and the described first rigid core plate pressure
It closes, and the layer of prepreg opens a window in flexure region corresponding position.
Further, the described second rigid-flexible daughter board is pressed by layer of prepreg and the described second rigid core plate, and described
Layer of prepreg opens a window in flexure region corresponding position.
Further, etched on the first conductive layer in the described first rigid-flexible daughter board line pattern the specific steps are：
One layer of wet film is printed on the first conductive layer of the first rigid-flexible daughter board and is struck off, after the wet film preliminary drying of printing, above wet film
It is bonded one layer of dry film, forms the first resist layer；First resist layer is exposed, is developed, and etches line pattern.
Further, etch the copper foil layer of electric resistance alloy layer side the specific steps are：In the first rigid-flexible daughter board
One layer of wet film is printed on first conductive layer and is struck off, and after the wet film preliminary drying of printing, one layer of dry film is bonded above wet film, is formed
Second resist layer；Second resist layer is exposed, is developed, and etches away the copper foil layer of electric resistance alloy layer side.
Further, second conductive layer is rolled copper foil.
Further, after the second Conductive Layer Etch of flexible core plate being gone out line pattern, second is conductive on flexible core plate
The flexure region of layer presses cover film.
Further, by the copper foil of electric resistance alloy layer side in rigid region on the first rigid-flexible daughter board and/or flexure region
After layer etching, cover film is pressed in the flexure region of the first conductive layer.
The technical program also provides a kind of rigid-flex combined board, and the rigid-flex combined board is by rigid described in any of the above-described embodiment
The production method of flex combined board is made.The electric resistance alloy layer of the rigid-flex combined board of the technical program is not easy to lose, and saves significantly
About the surface mount demand of rigid-flex combined board while, ensure that resistance effect.
Description of the drawings
Fig. 1 is the structural schematic diagram of the rigid-flex combined board of the present invention；
Fig. 2 is the manufacturing process of the flexible core plate in structure shown in Fig. 1；
Fig. 3 is the manufacturing process of the first rigid-flexible daughter board of the present invention；
Fig. 4 is the structural schematic diagram of the second rigid-flexible daughter board of the present invention；
Fig. 5 is the pressing manufacturing process of the rigid-flex combined board of the present invention.
Reference sign：
10, flexible core plate；11, flexible substrate；12, the first conductive layer；121, electric resistance alloy layer；122, copper foil layer；13,
Two conductive layers；20, the first rigid core plate；21, rigid substrate；22, third conductive layer；30, the first rigid-flexible daughter board；40, second just
Scratch daughter board；50, the second rigid core plate；60, flexure region；70, rigid region；80, layer of prepreg；90, cover film.
Specific implementation mode
To make the objectives, technical solutions, and advantages of the present invention more comprehensible, below in conjunction with attached drawing and specific embodiment party
Formula, the present invention is further described in detail.It should be understood that the specific embodiments described herein are only solving
The present invention is released, protection scope of the present invention is not limited.
Present embodiment is by taking four layers of rigid-flex combined board as an example, a kind of making side of rigid-flex combined board as shown in Figures 1 to 5
Method, including：
As shown in Fig. 2, two relative side, that is, L2 layers and L3 layers in flexible substrate 11 presses 12 He of the first conductive layer respectively
Second conductive layer 13 forms flexible core plate 10, and first conductive layer 12 includes the electric resistance alloy layer being bonded with flexible substrate 11
121 and the copper foil layer 122 set on 121 side of electric resistance alloy layer.
Second conductive layer 13 of flexible core plate 10 is etched into line pattern.
As shown in figure 3, the second conductive layer 13 of flexible core plate 10 and the first rigid core plate 20 are pressed, it is rigid-flexible to form first
Daughter board 30；Described first rigid core plate 20 includes rigid substrate 21 and the third conductive layer 22 set on 21 side of rigid substrate,
21 place face of the rigid substrate is stitching surface, and the third conductive layer 22 of the described first rigid core plate 20 is L4 layers.
As shown in figure 4, etching line pattern on the first conductive layer 12 in the described first rigid-flexible daughter board 30, then will
The copper foil layer 122 of 121 side of electric resistance alloy layer etches in rigid region 70 and/or flexure region 60 on first rigid-flexible daughter board 30,
Form the second rigid-flexible daughter board 40.
As shown in figure 5, the second rigid-flexible daughter board 40 and the second rigid core plate 50 are pressed, the knot of the described second rigid core plate 40
Structure is identical as the structure of the first rigid core plate 20, and stitching surface is also 21 place face of rigid substrate, the described second rigid core plate 40
Third conductive layer 22 be L1 layers；It opens a window respectively to the flexure region 60 of 20 and second rigid core plate 50 of the first rigid core plate,
And surface lines making is completed, form rigid-flex combined board.
First conductive layer 12 and the second conductive layer 13 first are pressed together on to be formed in flexible substrate 11 and scratch by present embodiment respectively
Property core plate 10, and the circuit of i.e. the second conductive layer 13 of non-electrical resistance layer on flexible core plate 10 has been made；Then by flexible core plate 10
The second conductive layer 13 where face pressed with the first rigid core plate 20, form the first rigid-flexible daughter board 30.At this point, flexible core plate 10
The support of the first rigid core plate 20 is obtained, is avoided in process of production, flexible core plate 10 lacks the rigid media of support, to make
The larger electric resistance alloy layer 121 of brittleness is lost in the production process, and the problem for causing yield rate low occurs；Obtaining first
The first conductive layer 12 in flexible core plate 10 is etched line pattern by the case where rigid core plate 20 supports, and ensures yield rate, and
The copper foil layer 122 of 121 side of at least part electric resistance alloy layer on first rigid-flexible daughter board 30 is etched, to realize electric resistance alloy
The resistance function of layer 121 forms the second rigid-flexible daughter board 40；Finally the second rigid-flexible daughter board 40 and the second rigid core plate 50 are pressed,
Form rigid-flex combined board.The sheet resistance of electric resistance alloy layer 121 in present embodiment ranging from 10 Ω -250 Ω, thickness range are
0.05μm-1μm。
Present embodiment is by the copper foil layer 122 of 121 side of electric resistance alloy layer of rigid region 70 in the first rigid-flexible daughter board 30
Etching only etches the copper foil layer 122 of the first conductive layer 12 in rigid region 70, it is made to play resistive performance, and retains flexible
The copper foil layer 122 of 121 side of electric resistance alloy layer in region 60.Wherein, 121 side of electric resistance alloy layer in etchable rigid region 70
Part copper foil layer 122, also 70 in etchable rigid region in 121 side of electric resistance alloy layer whole copper foil layers, with specific reference to
It needs to be etched.Due to positioned at 20 and second rigid core plate 50 of the flexible core plate 60 of rigid region 70 and the first rigid core plate
Pressing, and it is bent area to be exposed to external and flexure region 60 in use positioned at the flexible core plate 60 of flexure region 60
Domain is lost phenomenon to which the electric resistance alloy layer 121 being exposed on external flexible core plate 60 is extremely easy to happen, therefore, will be scratched
Property region 60 121 side of electric resistance alloy layer copper foil layer 122 retain, the electric resistance alloy layer 121 of flexure region 60 is protected
Shield, making the flexure region 60 of flexible core plate 10, electric resistance alloy layer 121 is not lost in the process of bending, keeps rigid region
70 and flexure region 60 in electric resistance alloy layer 121 circuit turn-on.
Second conductive layer 13 of the flexibility core plate 10 is pressed by layer of prepreg 80 and the described first rigid core plate 20,
And the layer of prepreg 80 opens a window in 60 corresponding position of flexure region.Layer of prepreg 80 makes the first rigid core plate 20 and flexibility
Core plate 10 presses closely, and in order to facilitate the rigid core plate 20 of later stage pair first in the windowing of flexure region 60, the prepreg
Layer 80 opens a window in 60 corresponding position of flexure region.
Similarly, the described second rigid-flexible daughter board 40 is pressed by layer of prepreg 80 and the described second rigid core plate 50, and institute
Layer of prepreg 80 is stated to open a window in 60 corresponding position of flexure region.
In addition, after being pressed with flexible core plate 10 due to the first rigid core plate 20, the surface of flexible core plate 10 can be uneven,
And since the layer of prepreg 80 for pressing is in the windowing of 60 corresponding position of flexure region, to the flexible core plate 10 after pressing
Surface is recessed in 60 corresponding position of flexure region, and if being bonded dry film directly on the first conductive layer 12 as against corrosion
Layer, then it is uneven due to flexible core plate 10, cause dry film laminating not close, causes not being exposed, develop and lose
Needle drawing shape etc. subsequently makes.To etch circuit on the first conductive layer 12 in the first rigid-flexible daughter board 30 described in present embodiment
Figure the specific steps are：One layer of wet film is printed on the first conductive layer 12 of the first rigid-flexible daughter board 30, fills the first rigid-flexible son
The recess of flexure region 60 in plate 30, and wet film is struck off, after the wet film preliminary drying of printing, one layer of fitting is dry above wet film
Film, 30 surfacing of the first rigid-flexible daughter board after being filled at this time by wet film, dry film laminating degree also higher form the first resist layer；
First resist layer is exposed, is developed, and etches line pattern.The film thickness range of wet film described in present embodiment is 10
μm-25μm；After printing wet film, the film thickness range of the dry film of fitting is 25um-40um.
Since the first conductive layer 12 of etching and etching copper foil layer 122 need to be etched at twice, and it is both needed to before etching every time
Be bonded resist layer, to present embodiment etch 121 side of electric resistance alloy layer copper foil layer 122 specific steps similarly on
The specific steps for etching line pattern on the first conductive layer 12 in the first rigid-flexible daughter board 30 are stated, are as follows：
One layer of wet film is printed on first conductive layer 12 of one rigid-flexible daughter board 30 and is struck off, after the wet film preliminary drying of printing, above wet film
It is bonded one layer of dry film, forms the second resist layer；Second resist layer is exposed, is developed, and etches away electric resistance alloy layer 121 1
The copper foil layer 122 of side.
Second conductive layer 13 is rolled copper foil, and the bending performance of rolled copper foil is more excellent, can adapt to rigid-flexible combination
The use environment of plate.
Since the flexure region 60 of flexible core plate 10 is exposed region, thus in order to protect flexure region on flexible core plate 10
Line pattern in 60 ranges, after the second conductive layer 13 of flexible core plate 10 is etched line pattern, on flexible core plate 10
The flexure region 60 of second conductive layer 13 presses cover film 90, and pressing cover film is after 90s, then flexible core plate 10 and first is rigid
Core plate 20 is pressed.
Similarly, the first conductive layer 12 of the rigid-flex combined board after completing also is in naked state in flexure region 60, because
This loses the copper foil layer 122 of 121 side of electric resistance alloy layer in rigid region 70 on the first rigid-flexible daughter board 30 and/or flexure region 60
After quarter, cover film 90 is pressed in the flexure region 60 of the first conductive layer 12, is then pressed, is completed with the second rigid core plate again
The pressing of rigid-flex combined board makes.
After the pressing of the rigid-flex combined board completes, to the flexibility of 20 and second rigid core plate 50 of the first rigid core plate
Region 60 opens a window respectively, keeps the flexure region 60 of flexible core plate 10 exposed, and drill, heavy copper, plating, welding resistance, complete surface line
Road makes and be surface-treated etc. follow-up work, forms rigid-flex combined board finished product.
Present embodiment also provides a kind of rigid-flex combined board, and the rigid-flex combined board is by rigid described in any of the above-described embodiment
The production method of flex combined board is made.The electric resistance alloy layer 121 of the rigid-flex combined board of present embodiment is not easy to lose, significantly
While saving the surface mount demand of rigid-flex combined board, resistance effect ensure that.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of production method of rigid-flex combined board, which is characterized in that including：
The first conductive layer is pressed respectively in the two relative side of flexible substrate and the second conductive layer forms flexible core plate, described first
Conductive layer includes the electric resistance alloy layer being bonded with flexible substrate and the copper foil layer set on electric resistance alloy layer side；
Second Conductive Layer Etch of flexible core plate is gone out into line pattern；
Second conductive layer of flexible core plate and the first rigid core plate are pressed, the first rigid-flexible daughter board is formed；
Line pattern is etched on the first conductive layer in the described first rigid-flexible daughter board, then by rigidity on the first rigid-flexible daughter board
The copper foil layer etching of electric resistance alloy layer side, forms the second rigid-flexible daughter board in region and/or flexure region；
Second rigid-flexible daughter board and the second rigid core plate are pressed, to the flexure region point of the first rigid core plate and the second rigid core plate
It does not open a window, and completes surface lines making, form rigid-flex combined board.
2. the production method of rigid-flex combined board according to claim 1, which is characterized in that by rigidity in the first rigid-flexible daughter board
The copper foil layer of the electric resistance alloy layer side in region etches, and retains the copper foil layer of flexure region electric resistance alloy layer side.
3. the production method of rigid-flex combined board according to claim 1, which is characterized in that the second of the flexibility core plate is led
Electric layer is pressed by layer of prepreg and the described first rigid core plate, and the layer of prepreg is opened in flexure region corresponding position
Window.
4. the production method of rigid-flex combined board according to claim 1, which is characterized in that the second rigid-flexible daughter board passes through
Layer of prepreg is pressed with the described second rigid core plate, and the layer of prepreg opens a window in flexure region corresponding position.
5. the production method of rigid-flex combined board according to claim 1, which is characterized in that in the first rigid-flexible daughter board
Etched on first conductive layer line pattern the specific steps are：One layer of printing is wet on the first conductive layer of the first rigid-flexible daughter board
Film simultaneously strikes off, and after the wet film preliminary drying of printing, one layer of dry film is bonded above wet film, forms the first resist layer；It is against corrosion to first
Layer is exposed, develops, and etches line pattern.
6. the production method of rigid-flex combined board according to claim 1, which is characterized in that etch the electric resistance alloy layer one
The copper foil layer of side the specific steps are：One layer of wet film is printed on the first conductive layer of the first rigid-flexible daughter board and is struck off, and will be printed
Wet film preliminary drying after, above wet film be bonded one layer of dry film, formed the second resist layer；Second resist layer is exposed, is developed,
And etch away the copper foil layer of electric resistance alloy layer side.
7. according to the production method of claim 1-6 any one of them rigid-flex combined boards, which is characterized in that described second is conductive
Layer is rolled copper foil.
8. according to the production method of claim 1-6 any one of them rigid-flex combined boards, which is characterized in that by flexible core plate
After second Conductive Layer Etch goes out line pattern, the flexure region of the second conductive layer presses cover film on flexible core plate.
9. according to the production method of claim 1-6 any one of them rigid-flex combined boards, which is characterized in that by the first rigid-flexible son
On plate in rigid region and/or flexure region after the copper foil layer etching of electric resistance alloy layer side, in the flexible region of the first conductive layer
Domain presses cover film.
10. a kind of rigid-flex combined board, which is characterized in that the rigid-flex combined board is rigid-flexible by claim 1-9 any one of them
The production method of board is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810123865.5A CN108401383A (en) | 2018-02-07 | 2018-02-07 | The production method and its rigid-flex combined board of rigid-flex combined board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810123865.5A CN108401383A (en) | 2018-02-07 | 2018-02-07 | The production method and its rigid-flex combined board of rigid-flex combined board |
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| CN108401383A true CN108401383A (en) | 2018-08-14 |
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| CN201810123865.5A Pending CN108401383A (en) | 2018-02-07 | 2018-02-07 | The production method and its rigid-flex combined board of rigid-flex combined board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111918490A (en) * | 2020-08-30 | 2020-11-10 | 深圳市实锐泰科技有限公司 | Manufacturing method of rigid-flex board and rigid-flex board |
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| GB2104297B (en) * | 1980-12-08 | 1985-07-24 | Sony Corp | Multilayer wiring substrate |
| CN106211639A (en) * | 2016-07-28 | 2016-12-07 | 广州杰赛科技股份有限公司 | Device embedded type rigid-flex combined board and preparation method thereof |
| CN107318235A (en) * | 2017-08-28 | 2017-11-03 | 吉安市满坤科技有限公司 | A kind of rigid/flexible combined printed circuit board preparation method |
| CN108770185A (en) * | 2018-05-31 | 2018-11-06 | 高德（无锡）电子有限公司 | Prevent the processing technology of Rigid Flex soft board bending fracture |
| CN208317114U (en) * | 2018-05-31 | 2019-01-01 | 高德（无锡）电子有限公司 | Prevent the Rigid Flex of soft board bending fracture |
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2018
- 2018-02-07 CN CN201810123865.5A patent/CN108401383A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2104297B (en) * | 1980-12-08 | 1985-07-24 | Sony Corp | Multilayer wiring substrate |
| CN106211639A (en) * | 2016-07-28 | 2016-12-07 | 广州杰赛科技股份有限公司 | Device embedded type rigid-flex combined board and preparation method thereof |
| CN107318235A (en) * | 2017-08-28 | 2017-11-03 | 吉安市满坤科技有限公司 | A kind of rigid/flexible combined printed circuit board preparation method |
| CN108770185A (en) * | 2018-05-31 | 2018-11-06 | 高德（无锡）电子有限公司 | Prevent the processing technology of Rigid Flex soft board bending fracture |
| CN208317114U (en) * | 2018-05-31 | 2019-01-01 | 高德（无锡）电子有限公司 | Prevent the Rigid Flex of soft board bending fracture |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111918490A (en) * | 2020-08-30 | 2020-11-10 | 深圳市实锐泰科技有限公司 | Manufacturing method of rigid-flex board and rigid-flex board |
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Application publication date: 20180814 |