CN107318235A - A kind of rigid/flexible combined printed circuit board preparation method - Google Patents
A kind of rigid/flexible combined printed circuit board preparation method Download PDFInfo
- Publication number
- CN107318235A CN107318235A CN201710747938.3A CN201710747938A CN107318235A CN 107318235 A CN107318235 A CN 107318235A CN 201710747938 A CN201710747938 A CN 201710747938A CN 107318235 A CN107318235 A CN 107318235A
- Authority
- CN
- China
- Prior art keywords
- rigid
- core plate
- soft
- copper foil
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
Abstract
The invention discloses a kind of manufacture method of soft and hard combined printed wiring board, using one side flexible substrate（SSFCCL）To substitute copper foil plus prepreg or one side rigid substrates or two-sided rigid substrates laminates internal layer is directly carried out with lazy flow prepreg in the one or both sides of soft board core plate (FPC), the increase of soft board core plate is provided with stiffening plate, cover layer is had additional in soft board core plate, then laminates outer layer is carried out with rigid substrate, copper foil and prepreg.The inventive method uses one side flexible substrate（SSFCCL）Lamination, supporting soft board in Rigid Flex using the toughness of SSFCCL base materials needs the copper foil above exposed parts, can obviously reduce the phenomenon of copper foil rupture when making internal layer, it is convenient after process operations handle, product yield can be significantly improved；It is also easy to control the thickness of insulating barrier, is conducive to making multistageization, the soft or hard combination multilayer board of slimming and high density interconnection printed board.
Description
Technical field
The present invention relates to a kind of printed circuit board, specifically a kind of rigid/flexible combined printed circuit board preparation method.
Background technology
With electronics and IT products to high performance, multifunction, portability development, its critical electronic part printing electricity
Road plate (PCB) also constantly develops to lightening, multistageization.But common rigid printed circuit boards also have one in terms of interconnection is installed
Fixed limitation.Therefore, start to use soft-hard combination printed board (Rigid-Flex) in increasing electronic product, it can
To be supported using rigid element, flexible interconnection is realized with flex section.So, three dimensions can be not only saved, is realized
Solid interconnection, the also flexibility with height and reliability.
Current industry has two kinds of conventional Rigid Flex production methods：
A kind of mode is direct in the one or both sides of soft core plate with rigid substrate, rigid one side or rigid double-face substrate successively
Carry out laminates inner plating.The subject matter of this method is that Rigid substrate materials used and the harmomegathus of flexible core material are poor
It is not larger, cause interlayer alignment precision poor.In addition, being laminated to using rigid substrates on thickness also has certain limitation.
Another way is to be laminated successively with rigid substrate, copper foil in the one or both sides of soft core plate.The method
The problem of be, make internal layer when soft board need exposed parts bonding nonflowing character or lazy flow prepreg base material will
Windowing in advance, but only have copper foil above it and there are difference in height, lamination and rear process without substrate support, the region and neighbouring area
Easily there is the situation that copper foil is crushed.Process chemical medicinal liquid causes many reports once from the intrusion of copper tear, can corrode soft board afterwards
It is useless, badly influence the yield of product.
The content of the invention
It is an object of the invention to provide a kind of rigid/flexible combined printed circuit board preparation method, to solve above-mentioned background technology
The problem of middle proposition.
To achieve the above object, the present invention provides following technical scheme：
The present invention uses one side flexible substrate（SSFCCL）And resin coated copper foil（RCC）It is laminated, it is possible to use SSFCCL bases
The toughness of material, which supports soft board in Rigid Flex, needs ground copper foil above exposed parts.
A kind of rigid/flexible combined printed circuit board preparation method, comprises the following steps：
A) soft board core plate, using core plate of the flexible printed-circuit board (FPC) as soft and hard combined printed wiring board, it includes soft board
Base material and the copper foil on base material two sides；The copper foil contains preformed circuitous pattern；The plate has certain exposed parts (A1, A2)；
The soft board core plate increase is provided with stiffening plate；Cover layer is had additional in the soft board core plate；
B) with laser milling shape or die formation mode to the lazy flow corresponding to flexible printed-circuit board exposed parts (A1, A2)
Prepreg base material is opened a window；The exposed parts (A1, A2) of windowing part (B1, B2) size and flexible printed-circuit board have
Identical size；
C) lazy flow prepreg base material, one side after above-mentioned windowing is overlapped successively on the one or both sides of soft board core plate to scratch
Property substrate（SSFCCL）, then it is laminated again, makes one side flexible substrate（SSFCCL）Insulating materials and lazy flow half it is solid
Change plate substrate, soft board core plate to be firmly combined together；
D) inner figure transfer is carried out on the surface of copper foil by drilling, plating, pattern transfer again, is formed containing two layers of electricity up and down
The inner plating of road figure；
E) after the completion of inner figure transfer, it is laminated successively with rigid substrate, copper foil, prepreg again on the inner plating,
Then the circuitous pattern required for outer layer is made by drilling, plating, pattern transfer formation.
The high density that can make single order or second order by the above method interconnects printed board Rigid Flex.
It is used as further scheme of the invention：Stiffening plate includes PI stiffening plates and FR4 stiffening plates.
It is used as further scheme of the invention：Cover layer uses PI cover layers.
It is used as further scheme of the invention：Such as to make the soft or hard knot of second order above high density interconnection printed board (HDI)
Plywood, then carry out following steps,
F) printed circuit board for making step e) makes outermost layer circuitous pattern as inner plating, then by step e) process.
G) finally, base material unnecessary above exposed parts (A1, A2), copper foil is needed to be milled, then made with laser soft board core plate
Redundance is taken off with aid, to completely reveal soft board core plate exposed parts.
It is used as further scheme of the invention：Above-mentioned drilling uses laser or machine drilling mode.
It is used as further scheme of the invention：Outer layer is located above soft board core plate by step g) with laser needs exposed parts
(A1, A2) mills out twice groove, need to punch the one side flexible substrate above the windowing of lazy flow prepreg base material（SSFCCL）
Or cured resin coated copper foil（RCC）, but SSFCCL base material can not be penetrated.
It is used as further scheme of the invention：One side flexible substrate（SSFCCL）And resin coated copper foil（RCC）Thickness be
5-50um, interlayer thickness of insulating layer is controlled with this.
Compared with prior art, the beneficial effects of the invention are as follows：The present invention uses one side flexible substrate（SSFCCL）Carry out layer
Pressure, it is possible to use the toughness of SSFCCL base materials, which supports soft board in Rigid Flex, needs the copper foil above exposed parts.Can be effective
Soft board core plate needs the phenomenon of copper foil rupture above exposed parts during avoiding being laminated and making inner figure, is easy to rear process to grasp
Make, product qualification rate can be significantly improved；The SSFCCL materials and the difference of thermal expansion coefficients of soft board core material of use are smaller, because
This, is easily controlled harmomegathus, and interlayer alignment precision is higher；By selecting relatively thin SSFCCL, interlayer thickness of insulating layer can be controlled,
More conducively make slimming, the soft and hard combined printed wiring board of multistageization；Increase stiffening plate and cover layer to improve impedance.
Brief description of the drawings
Fig. 1~5 are the work flow structural section figure in each stage in the embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
Referring to Fig. 1, a kind of rigid/flexible combined printed circuit board preparation method of the invention, including soft board core plate 1, soft board core plate 1
Using core plate of the flexible printed-circuit board as soft and hard combined printed wiring board, it includes the copper on flexible board substrate 11 and base material two sides
Paper tinsel 12,13；The copper foil 12,13 contains preformed circuitous pattern；The plate need to have certain exposed parts, corresponding to A1, A2；Institute
State the increase of soft board core plate 1 and be provided with stiffening plate, including PI stiffening plates and FR4 stiffening plates；Covering is had additional in the soft board core plate 1
Film, the cover layer uses PI cover layers；
Referring to Fig. 2, with laser milling shape or die stamp mode to corresponding to flexible printed-circuit board (FPC) exposed parts A1, A2
Lazy flow prepreg base material opened a window (B1, B2)；
Overlap the lazy flow prepreg base material 2,2 ' after above-mentioned windowing successively on the one or both sides of soft board core plate 1, it is single
Face flexible substrate（SSFCCL）3rd, 3 ', then it is laminated, makes one side flexible substrate（SSFCCL）Insulating materials and low flowing
Property prepreg base material 2,2 ', soft board core plate 1 is firmly combined together；Wherein, base material 31,31 ', copper foil 32,32 '.
Again by drilling, plating, pattern transfer, inner figure transfer is carried out on the surface of copper foil, is formed containing two layers up and down
The inner plating of circuitous pattern；
Referring to Fig. 3, after the completion of inner figure transfer, it is laminated again with rigid substrate 4,4 ', copper foil 5,5 ' on the inner plating,
Then the circuitous pattern required for outer layer is made by drilling, plating, pattern transfer formation.
If making second order above Rigid Flex, using the printed circuit board of above-mentioned making as inner plating, then it is interior at this
It is laminated again with rigid substrate, copper foil, prepreg on laminate, then makes outermost layer by drilling, plating, pattern transfer
Figure.
Thereafter, outer layer is located at into the top of soft board core plate 1 with laser needs exposed parts to mill out twice groove, and this gash depth can
Control, need to punch the one side flexible substrate above the windowing of lazy flow prepreg base material 2,2 '（SSFCCL）3rd, 3 ', but can not
Penetrate one side flexible substrate（SSFCCL）Base material (refer to Fig. 4, the laser part to be milled (A1, A2 region dotted line)).Finally,
Redundance A1, A2 are removed using an aid, soft board needs exposed parts to be fully exposed, that is, obtain final soft
Harden plywood product (referring to Fig. 5).
In the present invention, because the top of soft board core plate 1 uses one side flexible substrate（SSFCCL）3rd, 3 ' directly it is laminated (ginseng
See 3,3 ' in Fig. 2), SSFCCL base material has toughness, can play a supporting role, and can substantially reduce lazy flow semi-solid preparation chip base
Copper foil fracture phenomena above the windowing of material 2,2 ' part B1, B2 area, rear process chemical medicinal liquid would not enter soft board core plate 1 need to be outer
Reveal part, substantially increase the yield of product.Further, it is also possible to by the SSFCCL (5-50um) from slimming come key-course
Between thickness of insulating layer, be more beneficial for the manufacture of the soft or hard combination multilayer board of ultrathin.
The standardized element that the present invention is used can commercially, and shaped piece is according to specification and accompanying drawing note
Load can carry out customized, specific connected mode use bolt, rivet, welding of maturation etc. in the prior art of each part
Conventional meanses, machinery, part and equipment are using in the prior art, and conventional model adds circuit connection and uses prior art
Middle conventional connected mode, will not be described in detail herein.
It is obvious to a person skilled in the art that the invention is not restricted to the details of above-mentioned one exemplary embodiment, Er Qie
In the case of without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, embodiment all should be regarded as exemplary, and be nonrestrictive, the scope of the present invention is by appended power
Profit is required rather than described above is limited, it is intended that all in the implication and scope of the equivalency of claim by falling
Change is included in the present invention.Any reference in claim should not be considered as to the claim involved by limitation.
Moreover, it will be appreciated that although the present specification is described in terms of embodiments, not each embodiment is only wrapped
Containing an independent technical scheme, this narrating mode of specification is only that for clarity, those skilled in the art should
Using specification as an entirety, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
It may be appreciated other embodiment.
Claims (7)
1. a kind of manufacture method of soft and hard combined printed wiring board, comprises the following steps：
A) soft board core plate, using core plate of the flexible printed-circuit board as soft and hard combined printed wiring board, it includes flexible board substrate
And the copper foil on base material two sides；The copper foil contains preformed circuitous pattern；The plate has certain exposed parts (A1, A2)；It is described
The increase of soft board core plate is provided with stiffening plate；Cover layer is had additional in the soft board core plate；
B) with laser milling shape or die formation mode to the lazy flow corresponding to flexible printed-circuit board exposed parts (A1, A2)
Prepreg base material is opened a window, and the exposed parts (A1, A2) of windowing part (B1, B2) size and flexible printed-circuit board have
Identical size；
C) lazy flow prepreg base material, one side after above-mentioned windowing is overlapped successively on the one or both sides of soft board core plate to scratch
Property substrate（SSFCCL）, then it is laminated, makes one side flexible substrate（SSFCCL）Insulating materials and lazy flow semi-solid preparation
Plate substrate, soft board core plate are firmly combined together；
D) inner figure transfer is carried out on the surface of copper foil by drilling, plating, pattern transfer again, is formed containing two layers of electricity up and down
The inner plating of road figure；
E) after the completion of inner figure transfer, carried out successively with rigid substrate, copper foil and prepreg base material again on the inner plating
Lamination, then makes the circuitous pattern required for outer layer by drilling, plating, pattern transfer formation.
2. a kind of rigid/flexible combined printed circuit board preparation method according to claim 1, it is characterised in that stiffening plate includes
PI stiffening plates and FR4 stiffening plates.
3. a kind of rigid/flexible combined printed circuit board preparation method according to claim 1, it is characterised in that cover layer is used
PI cover layers.
4. a kind of rigid/flexible combined printed circuit board preparation method according to claim 1, it is characterised in that
F) printed circuit board for making step e) makes outermost layer circuitous pattern as inner plating, then by step e) process；
G) finally, need base material unnecessary above exposed parts (A1, A2), copper foil to be milled with laser soft board core plate, reuse auxiliary
Assistant engineer's tool takes redundance off, to completely reveal the exposed parts of soft board core plate.
5. a kind of rigid/flexible combined printed circuit board preparation method according to claim 1, it is characterised in that drilling is using sharp
Light or machine drilling mode.
6. a kind of rigid/flexible combined printed circuit board preparation method according to claim 1, it is characterised in that step g), which is used, to be swashed
Outer layer is located above soft board core plate by light needs exposed parts (A1, A2) to mill out twice groove, need to punch lazy flow prepreg
One side flexible substrate above base material windowing（SSFCCL）, but one side flexible substrate can not be penetrated（SSFCCL）Base material.
7. a kind of rigid/flexible combined printed circuit board preparation method according to claim 1 or 6, it is characterised in that described
One side flexible substrate（SSFCCL）And resin coated copper foil（RCC）Thickness be 5-50um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710747938.3A CN107318235A (en) | 2017-08-28 | 2017-08-28 | A kind of rigid/flexible combined printed circuit board preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710747938.3A CN107318235A (en) | 2017-08-28 | 2017-08-28 | A kind of rigid/flexible combined printed circuit board preparation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107318235A true CN107318235A (en) | 2017-11-03 |
Family
ID=60176990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710747938.3A Pending CN107318235A (en) | 2017-08-28 | 2017-08-28 | A kind of rigid/flexible combined printed circuit board preparation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107318235A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108401383A (en) * | 2018-02-07 | 2018-08-14 | 广州兴森快捷电路科技有限公司 | The production method and its rigid-flex combined board of rigid-flex combined board |
| CN110662342A (en) * | 2018-06-28 | 2020-01-07 | 鹏鼎控股(深圳)股份有限公司 | Rigid-flex board and manufacturing method thereof |
| CN112105158A (en) * | 2020-09-08 | 2020-12-18 | 惠州市金百泽电路科技有限公司 | Manufacturing method of rigid-flex Printed Circuit Board (PCB) utilizing cover film to resist glue |
| CN112672490A (en) * | 2020-12-01 | 2021-04-16 | 吉安满坤科技股份有限公司 | Preparation method of multilayer circuit board for 5G terminal network card and 5G network card thereof |
| CN112996287A (en) * | 2021-03-31 | 2021-06-18 | 深圳市众一贸泰电路板有限公司 | Processing method of soft-hard combined printed circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006216785A (en) * | 2005-02-03 | 2006-08-17 | Fujikura Ltd | Rigid flex build-up wiring board and its manufacturing method |
| CN101272660A (en) * | 2008-05-05 | 2008-09-24 | 上海美维电子有限公司 | Soft and hard combined printed wiring board production method |
| CN102510660A (en) * | 2011-11-27 | 2012-06-20 | 常州市协和电路板有限公司 | Single-layer impedance printed circuit board and manufacturing method thereof |
-
2017
- 2017-08-28 CN CN201710747938.3A patent/CN107318235A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006216785A (en) * | 2005-02-03 | 2006-08-17 | Fujikura Ltd | Rigid flex build-up wiring board and its manufacturing method |
| CN101272660A (en) * | 2008-05-05 | 2008-09-24 | 上海美维电子有限公司 | Soft and hard combined printed wiring board production method |
| CN102510660A (en) * | 2011-11-27 | 2012-06-20 | 常州市协和电路板有限公司 | Single-layer impedance printed circuit board and manufacturing method thereof |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108401383A (en) * | 2018-02-07 | 2018-08-14 | 广州兴森快捷电路科技有限公司 | The production method and its rigid-flex combined board of rigid-flex combined board |
| CN110662342A (en) * | 2018-06-28 | 2020-01-07 | 鹏鼎控股(深圳)股份有限公司 | Rigid-flex board and manufacturing method thereof |
| CN110662342B (en) * | 2018-06-28 | 2021-02-02 | 鹏鼎控股(深圳)股份有限公司 | Rigid-flex board and manufacturing method thereof |
| CN112105158A (en) * | 2020-09-08 | 2020-12-18 | 惠州市金百泽电路科技有限公司 | Manufacturing method of rigid-flex Printed Circuit Board (PCB) utilizing cover film to resist glue |
| CN112105158B (en) * | 2020-09-08 | 2024-04-12 | 惠州市金百泽电路科技有限公司 | Manufacturing method of rigid-flex printed circuit board by using covering film resist |
| CN112672490A (en) * | 2020-12-01 | 2021-04-16 | 吉安满坤科技股份有限公司 | Preparation method of multilayer circuit board for 5G terminal network card and 5G network card thereof |
| CN112996287A (en) * | 2021-03-31 | 2021-06-18 | 深圳市众一贸泰电路板有限公司 | Processing method of soft-hard combined printed circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107318235A (en) | A kind of rigid/flexible combined printed circuit board preparation method | |
| CN101662888B (en) | Preparation method for PCB plate with step trough | |
| CN101272660A (en) | Soft and hard combined printed wiring board production method | |
| CN102281725B (en) | Manufacturing method for circuit board | |
| CN106211638B (en) | A kind of processing method of ultra-thin multilayer printed circuit board | |
| CN101472404A (en) | Multi-layer circuit board and manufacturing method thereof | |
| CN104168711B (en) | The compression method of cavity circuit plate and its preparation method of pressing structure | |
| CN106358386A (en) | Manufacturing method of blind hole of backboard plugin | |
| US10064292B2 (en) | Recessed cavity in printed circuit board protected by LPI | |
| CN108495486A (en) | A kind of production method and High speed rear panel of High speed rear panel | |
| CN103260350A (en) | Blind buried orifice plate laminating method and blind buried orifice plate manufactured with blind buried orifice plate laminating method | |
| CN103327738A (en) | Softness-hardness combined circuit board and manufacturing method thereof | |
| CN105722317B (en) | Rigid-flexible combination printed circuit board and preparation method thereof | |
| CN103578804B (en) | A kind of preparation method of rigid/flexible combined printed circuit board | |
| CN104768318B (en) | Rigid-flexible circuit board and preparation method thereof | |
| JP2004228165A (en) | Multilayer wiring board and its manufacturing method | |
| CN109152223B (en) | Manufacturing method of rigid-flex board | |
| JP2006228887A (en) | Manufacturing method of rigid and flexible multilayer printed circuit board | |
| JP2006294666A (en) | Flex rigid wiring board and manufacturing method thereof | |
| JP2006253328A (en) | Manufacturing method of multilayer wiring board | |
| CN106793585A (en) | A kind of high density interconnection semi-flexible printed circuit board and preparation method thereof | |
| CN105657970A (en) | Rigid-flexible combined plate and method for plugging blind buried hole thereof | |
| KR100722600B1 (en) | Method for forming through holes of multilayer printed circuit board | |
| CN220325890U (en) | Local thick copper pcb | |
| TW200826774A (en) | Method for manufacturing multilayer flexible printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171103 |
|
| RJ01 | Rejection of invention patent application after publication |