CN214227141U - NFC resistance welding antenna board - Google Patents
NFC resistance welding antenna board Download PDFInfo
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- CN214227141U CN214227141U CN202021235910.5U CN202021235910U CN214227141U CN 214227141 U CN214227141 U CN 214227141U CN 202021235910 U CN202021235910 U CN 202021235910U CN 214227141 U CN214227141 U CN 214227141U
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Abstract
The utility model provides a NFC resistance welding antenna board, which comprises at least one single-sided substrate; the single-sided substrate comprises from top to bottom: the solder mask layer, the copper foil layer, the adhesive layer and the flexible board layer; the scheme changes the traditional welding-proof processing technology, and the acrylic resin PET single-sided adhesive tape is adopted to replace the traditional manufacturing technology of printing with PI cover films and printing ink, so that the manufacturing technology of the traditional antenna plate is changed, the cost of the antenna is reduced, the manufacturing flow is optimized, the overall performance of the antenna plate is improved, and the reliability is ensured.
Description
Technical Field
The utility model belongs to the technical field of the antenna panel, specific saying relates to a NFC welds antenna panel.
Background
With the continuous progress of the technology, the functional requirements on electronic products are higher and higher, meanwhile, the short, small, light and thin NFC antenna board is also very important in appearance, for the NFC function is adopted by smart phones more and more, but the printing of the solder resist ink is not easy to control the product quality, the printing of the ink is not favorable for environmental protection in combination with the current environment-friendly situation, and the solder resist of the FPC and the NFC antenna board is made into the most troublesome problem at present.
SUMMERY OF THE UTILITY MODEL
For solving the problem that prior art exists, the utility model provides a NFC welds antenna board.
The technical scheme of the utility model is realized like this:
an NFC resistance welding antenna board comprises at least one single-sided substrate; the single-sided substrate comprises from top to bottom: solder mask layer, copper foil layer, adhesive layer, hose layer.
Furthermore, the solder mask layer is an acrylic resin PET single-sided adhesive tape, and the thickness of the solder mask layer is 10-100 um.
Furthermore, the copper foil layer is formed by rolling electrolytic copper foil, and the thickness of the copper foil layer is 5-70 μm.
Furthermore, the adhesive layer is epoxy resin or acrylic resin, and the thickness of the adhesive layer is 5-100 μm.
Further, the base film of the flexible board layer comprises a polyimide film and a polyester film, and the thickness of the flexible board layer is 10-100 μm.
Furthermore, the resistance welding antenna board can also be a double-sided substrate, wherein the double-sided substrate is formed by combining two single-sided substrates, and the two single-sided substrates are symmetrically arranged. Namely, from top to bottom: solder mask layer, copper foil layer, adhesive layer, hose layer, adhesive layer, copper foil layer, solder mask. And a copper plating layer is arranged between the copper foil layer and the solder mask layer in the double-sided basic.
The utility model discloses an operating principle's effect as follows:
the production process comprises the following steps:
(1) firstly, cutting single-sided and double-sided substrate materials into proper sizes (of course, single-sided panels can be produced by adopting continuous rolls), and processing dry film coating;
(2) then, manufacturing the single-sided copper foil into a required circuit pattern according to design; the double-sided copper foil is drilled, deposited and plated with copper, and then the dry film is pressed to manufacture the required circuit pattern.
(3) According to the requirements of finished products, an acrylic resin series PET single-sided adhesive tape is pressed on the line pavement to protect the line and achieve the insulation effect;
(4) and (4) performing surface treatment on the bonding pad, and then manufacturing the product into the appearance required by the drawing by using tools such as a die and the like.
According to the scheme, the acrylic resin PET single-sided tape is adopted to replace a traditional manufacturing process of printing with a PI covering film and ink, a single-sided substrate or a double-sided substrate is set according to requirements, then a circuit pattern is produced according to a processing method, and then the acrylic resin PET single-sided tape is subjected to temperature-free pressing on the surface of a circuit to be made into a solder mask. The flexible printed circuit board layer substrate film in the integrated structure of the FPC and NFC antenna resistance welding new process comprises a Polyimide (PI) film, a Polyester (PET) film, a Polynaphthalene Ester (PEN) film, a Liquid Crystal Polymer (LCP) film and the like, and the thickness of the flexible printed circuit board layer substrate film is 10-100 mu m. The adhesive layer in the integrated structure of the FPC and NFC antenna solder-resisting new process is an epoxy resin or acrylic resin system, and the thickness of the adhesive layer is between 5 and 100 mu m. The thickness of the copper foil layer in the integrated structure of the FPC and NFC antenna solder-resisting new process is 5-70 mu m, and the integrated structure comprises rolled and electrolytic copper foils. The thickness of the acrylic resin PET single-sided adhesive tape in the integrated structure of the FPC and the NFC antenna board is between 10 and 100 um. The manufacturing process of the traditional double-sided FPC and NFC antenna board is changed, the manufacturing cost of the FPC and NFC antenna board is reduced, the manufacturing process of the FPC and NFC antenna board is optimized, and the overall performance of the FPC and NFC antenna board is improved.
The scheme changes the traditional welding-proof processing technology, and the acrylic resin PET single-sided adhesive tape is adopted to replace the traditional manufacturing technology of printing with PI cover films and printing ink, so that the manufacturing technology of the traditional antenna plate is changed, the cost of the antenna is reduced, the manufacturing flow is optimized, the overall performance of the antenna plate is improved, and the reliability is ensured.
Drawings
Fig. 1 is a schematic structural diagram of embodiment 1 of an NFC resistance welding antenna board according to the present invention;
fig. 2 is a schematic structural diagram of embodiment 2 of the NFC solder mask antenna board of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiments of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit ly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
Example 1
As shown in fig. 1, an NFC solder mask antenna board is a single-sided substrate, and the single-sided substrate includes, from top to bottom: solder mask layer, copper foil layer, adhesive layer, hose layer. The solder mask layer is an acrylic resin PET single-sided adhesive tape, and the thickness of the solder mask layer is 10-100 um. The copper foil layer is formed by rolling electrolytic copper foil, and the thickness of the copper foil layer is 5-70 mu m. The adhesive layer is made of epoxy resin or acrylic resin, and the thickness of the adhesive layer is 5-100 mu m. The base film of the soft board layer comprises a polyimide film and a polyester film, and the thickness of the soft board layer is 10-100 mu m.
The specific working process is as follows:
the production process comprises the following steps:
(1) firstly, cutting single-sided and double-sided substrate materials into proper sizes (of course, single-sided panels can be produced by adopting continuous rolls), and processing dry film coating;
(2) then, manufacturing the single-sided copper foil into a required circuit pattern according to design; the double-sided copper foil is drilled, deposited and plated with copper, and then the dry film is pressed to manufacture the required circuit pattern.
(3) According to the requirements of finished products, an acrylic resin series PET single-sided adhesive tape is pressed on the line pavement to protect the line and achieve the insulation effect;
(4) and (4) performing surface treatment on the bonding pad, and then manufacturing the product into the appearance required by the drawing by using tools such as a die and the like.
According to the scheme, the acrylic resin PET single-sided tape is adopted to replace a traditional manufacturing process of printing with a PI covering film and ink, a single-sided substrate or a double-sided substrate is set according to requirements, then a circuit pattern is produced according to a processing method, and then the acrylic resin PET single-sided tape is subjected to temperature-free pressing on the surface of a circuit to be made into a solder mask. The flexible printed circuit board layer substrate film in the integrated structure of the FPC and NFC antenna resistance welding new process comprises a Polyimide (PI) film, a Polyester (PET) film, a Polynaphthalene Ester (PEN) film, a Liquid Crystal Polymer (LCP) film and the like, and the thickness of the flexible printed circuit board layer substrate film is 10-100 mu m. The adhesive layer in the integrated structure of the FPC and NFC antenna solder-resisting new process is an epoxy resin or acrylic resin system, and the thickness of the adhesive layer is between 5 and 100 mu m. The thickness of the copper foil layer in the integrated structure of the FPC and NFC antenna solder-resisting new process is 5-70 mu m, and the integrated structure comprises rolled and electrolytic copper foils. The thickness of the acrylic resin PET single-sided adhesive tape in the integrated structure of the FPC and the NFC antenna board is between 10 and 100 um. The manufacturing process of the traditional double-sided FPC and NFC antenna board is changed, the manufacturing cost of the FPC and NFC antenna board is reduced, the manufacturing process of the FPC and NFC antenna board is optimized, and the overall performance of the FPC and NFC antenna board is improved.
Example 2
As shown in fig. 2, embodiment 2 is different from embodiment 1 in that the antenna board has a double-sided substrate structure, and the double-sided substrate is formed by combining two single-sided substrates, and the two single-sided substrates are symmetrically arranged. Namely, from top to bottom: solder mask layer, copper foil layer, adhesive layer, hose layer, adhesive layer, copper foil layer, solder mask. And a copper plating layer is also arranged between the copper foil layer and the solder mask layer in the double-sided substrate.
Finally, although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the present invention can be modified or replaced by other means without departing from the spirit and scope of the present invention, which should be construed as limited only by the appended claims.
Claims (2)
1. An NFC resistance welding antenna board is characterized by comprising at least one single-sided substrate; the single-sided substrate comprises from top to bottom: the solder mask layer, the copper foil layer, the adhesive layer and the flexible board layer; the solder mask layer is an acrylic resin PET single-sided tape, and the thickness of the solder mask layer is 10-100 um; the copper foil layer is formed by rolling electrolytic copper foil, and the thickness of the copper foil layer is 5-70 mu m; the adhesive layer is made of epoxy resin or acrylic resin, and the thickness of the adhesive layer is 5-100 mu m; the base film of the soft board layer comprises a polyimide film and a polyester film, and the thickness of the soft board layer is 10-100 mu m.
2. The NFC resistance welding antenna board according to claim 1, wherein the resistance welding antenna board is a double-sided substrate, the double-sided substrate is formed by combining two single-sided substrates, and the two single-sided substrates are symmetrically arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021235910.5U CN214227141U (en) | 2020-06-29 | 2020-06-29 | NFC resistance welding antenna board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021235910.5U CN214227141U (en) | 2020-06-29 | 2020-06-29 | NFC resistance welding antenna board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214227141U true CN214227141U (en) | 2021-09-17 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021235910.5U Active CN214227141U (en) | 2020-06-29 | 2020-06-29 | NFC resistance welding antenna board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214227141U (en) |
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2020
- 2020-06-29 CN CN202021235910.5U patent/CN214227141U/en active Active
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