CN211843506U - Coating method high-frequency MPI flexible copper-clad plate - Google Patents
Coating method high-frequency MPI flexible copper-clad plate Download PDFInfo
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- CN211843506U CN211843506U CN202020067447.1U CN202020067447U CN211843506U CN 211843506 U CN211843506 U CN 211843506U CN 202020067447 U CN202020067447 U CN 202020067447U CN 211843506 U CN211843506 U CN 211843506U
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Abstract
The utility model discloses a coating method high-frequency MPI flexible copper clad laminate, which comprises an MPI film, wherein copper clad mechanisms are arranged on the upper side and the lower side of the MPI film; the copper-clad mechanism comprises a first high-frequency adhesive, a second high-frequency adhesive, a first copper foil and a second copper foil; the MPI film is characterized in that a first high-frequency adhesive and a second high-frequency adhesive are respectively bonded to the upper side and the lower side of the MPI film, and a first copper foil and a second copper foil are respectively bonded to the top of the first high-frequency adhesive and the bottom of the second high-frequency adhesive. The utility model discloses a 5G communication antenna is with flexible copper-clad plate of no glue based on MPI, the low dielectric low-loss antenna material surface of development coating method production technology covers the application in the aspect of the copper technique, realizes the integrated manufacturing of 5G high frequency low-loss antenna flexible printed circuit board (FPC).
Description
Technical Field
The utility model relates to a technical field is made in the integration of 5G communication antenna high frequency low-loss antenna flexible printed circuit board (FPC), specifically is a flexible copper-clad plate of coating method high frequency MPI.
Background
The 5G, i.e., the fifth generation mobile communication technology, is a new generation wireless mobile communication technology based on the characteristics of ultrahigh density, ultrahigh speed, ultralow time delay, ultra-wide connection, ultrahigh reliability, safety and the like, under the working condition of 5G high frequency and high speed, the reasonable selection of the transmission line dielectric material and the design of parameters have decisive influence on the loss of the transmission line, and the integrity and accuracy of signal transmission require that the transmission line dielectric material has the characteristics of low dielectric constant and low loss. The localization of low dielectric low loss Flexible Printed Circuit (FPC) materials suitable for high density, high frequency and high speed integrated circuit applications is becoming the research and development focus of this industry.
The 5G antenna material has two solutions of LCP (liquid Crystal Polymer) and PI (polyimide). LCP has excellent properties, but also has disadvantages that a molding process is not easily controlled, physical properties of a product are anisotropic, mechanical properties in a direction perpendicular to shear flow during molding are poor, fibrillation is easily caused, and the like, so it is necessary to modify LCP to improve mechanical properties of a film. On the other hand, the price of LCP raw material is expensive, which results in high price of LCP, which is the most important problem affecting the development of LCP, so that the cost reduction has become the research focus of manufacturers. In addition, due to the high price of LCP substrate and the inability of current PI flexible board to meet the consumer demand, ModifyPI (MPI) is emerging. While modifyPI is not as good as LCP in terms of transmission loss, dimensional stability and flexibility, its performance can be improved by modifying the fluoride formulation and its cost is only 70% of that of LCP. It was also disclosed that the LCP softboards originally intended for the new apple iPhone would also be replaced by the modify PI.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a flexible copper-clad plate of coating method high frequency MPI has solved the problem that proposes in the background art.
In order to achieve the above object, the utility model provides a following technical scheme: a coating method high-frequency MPI flexible copper clad laminate comprises an MPI film, wherein copper clad mechanisms are arranged on the upper side and the lower side of the MPI film;
the copper-clad mechanism comprises a first high-frequency adhesive, a second high-frequency adhesive, a first copper foil and a second copper foil; the MPI film is characterized in that a first high-frequency adhesive and a second high-frequency adhesive are respectively bonded to the upper side and the lower side of the MPI film, and a first copper foil and a second copper foil are respectively bonded to the top of the first high-frequency adhesive and the bottom of the second high-frequency adhesive.
In a preferred embodiment of the present invention, the first copper foil and the second copper foil are electrolytic copper foils.
As a preferred embodiment of the present invention, the thickness of the MPI film is 50 um.
As a preferred embodiment of the present invention, the thickness of the first copper foil and the second copper foil is 12 um.
Compared with the prior art, the beneficial effects of the utility model are as follows:
the product is an MPI-based non-adhesive flexible copper-clad plate for a 5G communication antenna, and the application of the coating technology on the surface of a low-dielectric low-loss antenna material of a coating production process is developed, so that the integrated manufacturing of a 5G high-frequency low-loss antenna flexible printed circuit board (FPC) is realized.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a front view of a high-frequency MPI flexible copper-clad plate according to the coating method of the present invention;
FIG. 2 is a production technical route view of the coating method of the high-frequency MPI flexible copper clad laminate of the utility model;
FIG. 3 is a schematic diagram of a coating process for producing a high-frequency MPI flexible copper clad laminate by a coating method.
In the figure: the adhesive comprises a first MPI film 1, an MPI film 2, a first high-frequency adhesive 3, a second high-frequency adhesive 4, a first copper foil 5 and a second copper foil.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected" and "disposed" are to be construed broadly, and may for example be fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-3, the present invention provides a technical solution: a coating method high-frequency MPI flexible copper clad laminate comprises an MPI film 1, wherein copper clad mechanisms are arranged on the upper side and the lower side of the MPI film 1;
the copper-clad mechanism comprises a first high-frequency adhesive 2, a second high-frequency adhesive 3, a first copper foil 4 and a second copper foil 5; the MPI film comprises an MPI film 1 and is characterized in that a first high-frequency adhesive 2 and a second high-frequency adhesive 3 are respectively bonded to the upper side and the lower side of the MPI film 1, and a first copper foil 4 and a second copper foil 5 are respectively bonded to the top of the first high-frequency adhesive 2 and the bottom of the second high-frequency adhesive 3.
Referring to fig. 1 in this embodiment, the product is an adhesive-free flexible copper clad laminate for a MPI-based 5G communication antenna, and the application of the low-dielectric low-loss antenna material surface copper clad technology of the coating method production process is developed to realize the integrated manufacturing of a flexible printed circuit board (FPC) of the 5G high-frequency low-loss antenna.
Wherein the first copper foil 4 and the second copper foil 5 are electrolytic copper foils.
Wherein, the thickness of MPI film 1 is 50 um.
Wherein, the thickness of first copper foil 4 and second copper foil 5 is 12 um.
When the high-frequency MPI flexible copper-clad plate adopting the coating method is used, the high-frequency first high-frequency adhesive 2 and the second high-frequency adhesive 3 are coated on the MPI film 1, and are coated with the first copper foil 4 and the second copper foil 5 in a heating and pressurizing mode, so that an MPI single/double-sided copper-clad plate product can be produced.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (4)
1. A coating method high-frequency MPI flexible copper clad laminate comprises an MPI film (1) and is characterized in that: copper-clad mechanisms are arranged on the upper side and the lower side of the MPI film (1);
the copper-clad mechanism comprises a first high-frequency adhesive (2), a second high-frequency adhesive (3), a first copper foil (4) and a second copper foil (5); the MPI film is characterized in that a first high-frequency adhesive (2) and a second high-frequency adhesive (3) are respectively bonded to the upper side and the lower side of the MPI film (1), and a first copper foil (4) and a second copper foil (5) are respectively bonded to the top of the first high-frequency adhesive (2) and the bottom of the second high-frequency adhesive (3).
2. The coating method high-frequency MPI flexible copper-clad plate according to claim 1, characterized in that the first copper foil (4) and the second copper foil (5) are electrolytic copper foils.
3. The coating method high-frequency MPI flexible copper-clad plate according to claim 1, which is characterized in that: the thickness of the MPI film (1) is 50 um.
4. The coating method high-frequency MPI flexible copper-clad plate according to claim 1, which is characterized in that: the thickness of first copper foil (4) and second copper foil (5) is 12 um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020067447.1U CN211843506U (en) | 2020-01-14 | 2020-01-14 | Coating method high-frequency MPI flexible copper-clad plate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202020067447.1U CN211843506U (en) | 2020-01-14 | 2020-01-14 | Coating method high-frequency MPI flexible copper-clad plate |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112770489A (en) * | 2020-12-30 | 2021-05-07 | 江阴骏驰新材料科技有限公司 | Teflon double-sided copper-clad plate and preparation method thereof |
| CN114670530A (en) * | 2022-03-01 | 2022-06-28 | 信维通信（江苏）有限公司 | PI flexible copper-clad plate suitable for middle and high frequency bands and manufacturing process thereof |
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2020
- 2020-01-14 CN CN202020067447.1U patent/CN211843506U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112770489A (en) * | 2020-12-30 | 2021-05-07 | 江阴骏驰新材料科技有限公司 | Teflon double-sided copper-clad plate and preparation method thereof |
| CN114670530A (en) * | 2022-03-01 | 2022-06-28 | 信维通信（江苏）有限公司 | PI flexible copper-clad plate suitable for middle and high frequency bands and manufacturing process thereof |
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