TW201330713A - Glue-free single-sided copper-clad laminate with adhesion function and manufacturing method thereof - Google Patents

Abstract

The present invention discloses a glue-free single-sided copper-clad laminate with adhesion function and its manufacturing method. Through forming an insulating adhesive layer on the glue-free single-sided copper-clad laminate, a convenient and efficient glue-free single-sided copper-clad laminate with adhesion function is provided, so that the glue-free single-sided copper-clad laminate and the insulating adhesive layer are integrally formed in one piece, thereby providing use convenience to customers, simplifying the adhesive binding operation for customers, saving the customer's production process and working hours, and having a good dimensional stability. Because the insulating adhesive layer is formed by coating and baking integrally on the glue-free single-sided copper-clad laminate, the problems of being prone to generating bubbles during the pure glue lamination operation or poor appearance in the prior art can be avoided, thereby improving production yield and reducing production cost. The glue-free single-sided copper-clad laminate with adhesion function of the present invention is suitable for use in the production process of multilayer board and other FPC boards that require the combination of the glue-free substrate and pure glue.

Description

Glue-free single-sided copper-clad substrate with paste function and manufacturing method thereof

The invention belongs to the field of printed circuit boards, and in particular relates to a glueless single-sided copper-clad substrate and a manufacturing method thereof.

Printed Circuit Board (PCB) and Flexible Copper Clad Laminate (FCCL) are important substrates for manufacturing electronic communication, and they are required to be thin, light and structural as the basic material for electronic interconnection. Flexible and so on. With the development of electronic products towards miniaturization and high functionality, the demand for miniaturization of circuit spacing is increasing day by day, such as folding mobile phones, digital cameras, digital video cameras, car satellite positioning devices, LCD TVs, notebook computers, IC substrates, etc. . Under the emphasis on high-performance, high-speed transmission and lightweight and thin, the required substrates are also moving toward more precision, high density and multi-functionality. In addition, as market competition heats up, there is a need to further reduce substrate costs.

The non-rubber-coated copper-clad substrate refers to a copper-clad substrate with no adhesive layer directly between the copper foil layer and the insulating substrate, and the currently used non-rubber double-sided copper-clad substrate and the non-adhesive single-sided copper-clad substrate are produced. The process is complicated and the equipment requirements are high. Therefore, the production cost is often higher than that of the conventional copper-clad laminate substrate, and the production yield is also low. However, the non-rubber-coated copper foil substrate has its unique product performance advantages and has an irreplaceable role in some aspects of practical production applications. Therefore, there is an urgent need for a product which can be mass-produced, has convenient production, and has low cost and has the characteristics of a non-rubber-coated copper foil substrate. The traditional multi-layer board or flexible circuit board production process is a non-adhesive copper-clad substrate bonded with a pure rubber film for hot pressing bonding, which is easy to produce bubbles or poor appearance during the process of bonding the pure plastic film. The yield is low and the price of pure film is relatively high.

In order to overcome the above drawbacks, the present invention provides a glueless single-sided copper-clad substrate having a pasting function and a manufacturing method thereof, and the glueless single-sided copper-clad substrate with a pasting function obtained by the method of the invention makes no glue Copper-clad laminate and insulation bonding The rubber layer is integrally formed, which not only facilitates the customer's fit and work, but also saves the customer's production process and working hours, and improves the production yield, reduces the production cost, and has good dimensional stability.

The technical solution adopted by the present invention to solve the technical problem thereof is: a glueless single-sided copper-clad substrate having a pasting function, comprising an insulating substrate and a copper foil layer, the insulating substrate being formed on a lower surface of the copper foil layer The lower surface of the insulating substrate is formed with an insulating adhesive layer, and the lower surface of the insulating adhesive layer is pasted with a release layer.

Wherein, the insulating adhesive layer is in a semi-flow semi-cured state (B-stage).

Wherein the insulating substrate is one of a polyimide film (PI) film, a polyethylene terephthalate (PET) film, a polynaphthyl ester (PEN) film, and a liquid crystal polymer (LCP) film, Preferred is a polyimide film (PI) film. The insulating substrate has a thickness of 7 to 100 um.

Wherein, the copper foil layer is one of a calendered (RA) copper foil, an electrolytic (ED) copper foil and a high-stretch (HD) copper foil, and the copper foil layer has a thickness of 5 to 100 um.

Wherein, the insulating adhesive layer is an epoxy resin adhesive layer, an acrylate adhesive layer, a polyethylene terephthalate adhesive layer, a polyurethane adhesive layer, and a polyimine rubber adhesive layer. In one type, the insulating adhesive layer has a thickness of 5 to 50 um.

Wherein, the release layer is one of a release film and a release paper, and the release layer has a thickness of 30 to 200 um.

The above-mentioned method for manufacturing a glueless single-sided copper-clad substrate having a pasting function is as follows: a liquid dispersion of an insulating adhesive layer is applied to the surface of an insulating substrate of a glueless single-sided copper-clad substrate, and then baked, so that The liquid dispersion of the insulating adhesive layer reaches a semi-flow and semi-cured state to form an insulating adhesive layer, and then the release layer is pasted on the surface of the insulating adhesive layer to obtain the glueless single side having the pasting function. Copper clad laminate.

The invention has the beneficial effects that the invention provides a convenient and quick glueless single-sided copper-clad substrate with a paste function after forming an insulating adhesive layer on the glueless single-sided copper-clad substrate, so that no glue is obtained The single-sided copper-clad substrate and the insulating adhesive layer are integrally formed, which is convenient for customers to use, simplifies the customer's fitting and operation, saves the customer's production process and working hours, and has good dimensional stability; and the insulating adhesive layer It is formed by coating and baking on the glueless single-sided copper-clad substrate, which avoids the bubbles or appearance which are easy to be produced when the traditional glue is glued, improves the production yield and reduces the production cost. The glueless single-sided copper-clad substrate with paste function of the invention is suitable for the multi-layer board production process and other FPC substrates which need to be combined by the glueless substrate and the pure glue.

The preferred embodiments of the present invention are described in detail below with reference to the accompanying drawings in order to make the advantages and features of the present invention more readily understood by those skilled in the art, so that the scope of the present invention is more clearly defined. .

A glueless single-sided copper-clad laminate substrate having a pasting function, comprising an insulating substrate 2 and a copper foil layer 1, the insulating substrate 2 being formed on a lower surface of the copper foil layer 1, and a lower surface of the insulating substrate 2 is formed There is an insulating adhesive layer 3, and the lower surface of the insulating adhesive layer 3 is pasted with the release layer 4.

Wherein, the insulating adhesive layer 3 is in a semi-flow semi-cured state (B-stage).

Wherein, the insulating substrate 2 is one of a polyimide film (PI) film, a polyethylene terephthalate (PET) film, a polynaphthyl ester (PEN) film, and a liquid crystal polymer (LCP) film. Preferred is a polyimide film (PI) film. The insulating substrate 2 has a thickness of 7 to 100 um.

The copper foil layer 1 is one of a rolled (RA) copper foil, an electrolytic (ED) copper foil, and a high-stretch (HD) copper foil, and the copper foil layer 1 has a thickness of 5 to 100 μm.

Wherein, the insulating adhesive layer 3 is an epoxy resin adhesive layer, an acrylate adhesive layer, a polyethylene terephthalate adhesive layer, a polyurethane adhesive layer and a polyimine rubber layer. For one type, the insulating adhesive layer 3 has a thickness of 5 to 50 um.

Wherein, the release layer 4 is one of a release film and a release paper, and the release layer 4 has a thickness of 30 to 200 um.

The manufacturing method of the above-mentioned glueless single-sided copper-clad substrate having a pasting function is as follows:

1. Preparation of a single-sided copper-clad laminate without glue:

An organic solvent is used to mix and dissolve the components required to form a liquid dispersion of the insulating substrate, and the liquid dispersion of the insulating substrate is applied to the copper foil layer using a coating production apparatus, and passed through an in-line drying oven to remove the inside. The organic solvent is contained and cured to avoid sticking to each other during winding, and the component is reacted and solidified by a subsequent baking process to form a rubber-free single-sided copper-clad substrate;

2. Preparing the glueless single-sided copper-clad substrate with the paste function of the invention:

The organic solvent is used to mix the required components to form a liquid dispersion of the insulating adhesive layer, and the liquid dispersion of the insulating adhesive layer is applied to the surface of the insulating substrate by using a coating production device, and passed through an on-line drying oven. Baking, removing the contained organic solvent, and bringing the liquid dispersion of the insulating adhesive layer into a semi-flow and semi-cured state to form an insulating adhesive layer, and finally coating the release layer on the insulating adhesive layer. The glueless single-sided copper-clad substrate having the pasting function is obtained.

Through the adjustment of the formulation of the insulating adhesive layer, the thermal expansion coefficient of the insulating substrate and the insulating adhesive layer is achieved, thereby forming a holistic, high-size stability soft circuit board material.

The glueless single-sided copper-clad substrate with paste function of the invention is suitable for the multi-layer board production process and other FPC substrates which need to be combined by the glueless substrate and the pure glue.

The dimensional stability test results of the glueless single-sided copper-clad substrate with paste function of the present invention are as follows:

In the above table, samples 1 and 2 are the glueless single-sided copper-clad substrates with paste function of the present invention; sample 3 is a traditional process glueless single-sided copper-clad substrate coated with pure glue; sample 4 is glue-free single-sided Copper clad laminate.

1‧‧‧copper layer

2‧‧‧Insulating substrate

3‧‧‧Insulating substrate

4‧‧‧ release layer

1 is a schematic view of a glueless single-sided copper-clad substrate having a pasting function according to the present invention.

1‧‧‧copper layer

2‧‧‧Insulating substrate

3‧‧‧Insulating substrate

4‧‧‧ release layer

Claims (8)

A glueless single-sided copper-clad substrate having a pasting function, comprising an insulating substrate (2) and a copper foil layer (1), the insulating substrate (2) being formed on a lower surface of the copper foil layer (1), The lower surface of the insulating substrate (2) is formed with an insulating adhesive layer (3), and the lower surface of the insulating adhesive layer (3) is coated with a release layer (4). The non-adhesive single-sided copper-clad laminate substrate having a pasting function according to the first aspect of the invention is characterized in that the insulating adhesive layer (3) is in a semi-flow semi-cured state. The non-adhesive single-sided copper-clad substrate having a pasting function according to claim 1, wherein the insulating substrate (2) is a polyimide film or polyethylene terephthalate. One of an ester film, a polynaphthyl ester film, and a liquid crystal polymer film, the insulating substrate (2) having a thickness of 7 to 100 μm. A non-glue single-sided copper clad laminate having a pasting function according to claim 3, wherein the insulating substrate (2) is a polyimide film. The non-glue single-sided copper-clad substrate with a pasting function according to claim 1, wherein the copper foil layer (1) is a rolled copper foil, an electrolytic copper foil and a high-stretch copper foil. For example, the copper foil layer (1) has a thickness of 5 to 100 um. The non-adhesive single-sided copper-clad substrate with a pasting function according to claim 1, wherein the insulating adhesive layer (3) is an epoxy adhesive layer or an acrylate adhesive layer. And one of a polyethylene terephthalate adhesive layer, a polyurethane adhesive layer and a polyimine rubber adhesive layer, wherein the insulating adhesive layer (3) has a thickness of 5 to 50 μm. The non-adhesive single-sided copper-clad laminate substrate having a pasting function according to claim 1, wherein the release layer (4) is one of a release film and a release paper, and the release type The thickness of the layer (4) is 30 to 200 um. A method for producing a glueless single-sided copper-clad substrate having a pasting function according to any one of claims 1 to 7, characterized in that the liquid dispersion of the insulating adhesive layer is coated on the glueless The surface of the insulating substrate of the single-sided copper-clad substrate is then baked, so that the liquid dispersion of the insulating adhesive layer is semi-flowed and semi-cured to form an insulating adhesive layer, and then the surface of the insulating adhesive layer is pasted. The adhesive-free layer is used to obtain the glueless single-sided copper-clad substrate having the pasting function.