CN104640356A - Method for making insulating substrate for electronic device - Google Patents
Method for making insulating substrate for electronic device Download PDFInfo
- Publication number
- CN104640356A CN104640356A CN201410641028.3A CN201410641028A CN104640356A CN 104640356 A CN104640356 A CN 104640356A CN 201410641028 A CN201410641028 A CN 201410641028A CN 104640356 A CN104640356 A CN 104640356A
- Authority
- CN
- China
- Prior art keywords
- insulating material
- electronic devices
- substrate
- manufacture method
- insulated substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims abstract description 29
- 239000011810 insulating material Substances 0.000 claims abstract description 45
- 238000005520 cutting process Methods 0.000 claims abstract description 11
- 238000001035 drying Methods 0.000 claims abstract description 7
- 238000004519 manufacturing process Methods 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 11
- 239000004642 Polyimide Substances 0.000 claims description 8
- 229920001721 polyimide Polymers 0.000 claims description 8
- 238000010422 painting Methods 0.000 claims description 6
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- 150000002825 nitriles Chemical class 0.000 claims description 4
- 229920000570 polyether Polymers 0.000 claims description 4
- 239000004695 Polyether sulfone Substances 0.000 claims description 3
- 229920006393 polyether sulfone Polymers 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 abstract description 9
- 238000000576 coating method Methods 0.000 abstract description 9
- 238000007789 sealing Methods 0.000 abstract description 5
- 238000005507 spraying Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 19
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- -1 organic siliconresin Polymers 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 229920000728 polyester Polymers 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 239000004744 fabric Substances 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920002521 macromolecule Polymers 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920002994 synthetic fiber Polymers 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 230000005260 alpha ray Effects 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 125000006615 aromatic heterocyclic group Chemical group 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000009940 knitting Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/481—Insulating layers on insulating parts, with or without metallisation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention relates to a method for making an insulating substrate for an electronic device and belongs to the field of electronic devices. The method includes the following steps: preparing a wiring substrate, and cutting the wiring substrate to be in proper size; sealing and coating a first-layer insulating material on the wiring substrate after grooving is completed; after sealing and coating of the first-layer insulating layer is completed, drying; sealing and coating a second-layer insulating material after drying is completed; after sealing and coating of the second-layer insulating material is completed, detecting the wiring substrate to obtain the insulating substrate. In the method, a two-layer spraying mode is adopted, so that insulating performance of the insulating substrate is improved greatly. The method is simple and suitable for processing of most insulating substrates.
Description
Technical field
The present invention relates to a kind of manufacture method of insulated substrate of electronic devices and components, belong to the field of electronic component.
Background technology
Electrical insulating material is mainly used in motor, electrical equipment, as done the insulation of armature keys, stator winding, rotor windings in generator, motor.Insulating varnish, resin liquid and adhesive class.What such as insulating impregnating varnish, lamination coating, wire enamel, sealing resin liquid and multiple adhesives etc. were conventional has epoxy resin, polyester, polyurethane, organic siliconresin, polyimides alkyd resins (see phthalic resin coating) etc.Impregnation of fibers goods class.As with the goods such as empire cloth, band of all kinds of cotton of resin-dipping, silk, synthetic fibers and glass fibre or fabric gained.Laminated product class.Laminate article after various organic or inorganic ground impregnating resin, as multiple laminated sheet.Plastic products class.Obtain by adding various organic or inorganic filler in resin, as television cabin, instrument, meter case, appliance switch connector housings etc.Film, synthetic paper and composite article class thereof.Such as various macromolecule membrane capacitor dielectric material, conventional has the films such as polystyrene, polypropylene, polyester, Merlon, polytetrafluoroethylene, polyimides; Various synthetic-fibre insulating paper, as aromatic polyamide fibre paper, polyester fiber paper; Various insulating tape, insulating tape etc.Rubber class.Such as various wire cable insulating layer and sheath, heat-shrinkable tube, silicon rubber insulation terminal etc.
Printed circuit board, namely covers Copper Foil version.Ground is resin laminate person, is called that rigidity covers Copper Foil version, often adopts the resin plate such as epoxy, phenolic aldehyde; Ground is macromolecule membrane or individual layer heat resistant glass varnished cloth person, then claim flexible copper-clad paper tinsel version, often adopt polyester, polyimides, fluoro-containing copolymer film.
Electronic isolation encapsulating material, for preventing extraneous moisture and impurity on the impact of semiconductor component parameter.At present, the semiconductor components and devices of about more than 90% adopts Plastic Package.Mainly using epoxy resin and organic siliconresin, is secondly phenolic resins, polyester, polybutadiene etc.Semiconductor device dielectric film is surface protection film (comprise contact film, passivating film, moistureproof shockproof film, prevent the alpha ray shielding film etc. of soft error) and the interlayer dielectric of advising greatly the semiconductor components and devices such as film integrated circuit.As the aromatic heterocyclic polymer based on polyimides.
The making of insulated substrate directly has influence on the insulation property of plate, in existing preparation technology, adopt complicated manufacture craft to cause preparation cost higher, but overall basic quality is higher.Most manufacturing enterprise all adopts the method for better simply single coating, and the cheap but poor durability of such circuit board, quality is not highly stable.
Summary of the invention
The present invention is directed to the manufacture method that above-mentioned deficiency provides a kind of insulated substrate of electronic devices and components.
The present invention adopts following technical scheme:
The manufacture method of the insulated substrate of electronic devices and components of the present invention, making step is as follows:
1), prepare circuit board, cutting is carried out to substrate and reaches suitable dimension;
2), complete the envelope of the circuit board after cutting and be coated with ground floor insulating material;
3), ground floor insulating material envelope is after painting terminates, and carries out drying and processing;
4) after, completing baking step, envelope is coated with second layer insulating material;
5), after second layer insulating material completes, namely complete after substrate is detected.
The manufacture method of the insulated substrate of electronic devices and components of the present invention, the thickness of described ground floor insulating material is 10-30um.
The manufacture method of the insulated substrate of electronic devices and components of the present invention, the 15-20um of described second layer insulating material.
The manufacture method of the insulated substrate of electronic devices and components of the present invention, described ground floor insulating material is made up of polyimides or acrylic acid or polyether sulfone materials.
The manufacture method of the insulated substrate of electronic devices and components of the present invention, described second layer insulating material is made up of polyethers nitrile or PET or pvc material.
Beneficial effect
The manufacture method of the insulated substrate of electronic devices and components provided by the invention, adopts two layers of spraying method to considerably increase the insulation property of its substrate.This technique is simple, goes for the processing that major part insulation is basic.
Embodiment
The present invention is described in more detail below:
A manufacture method for the insulated substrate of electronic devices and components, making step is as follows:
1), prepare circuit board, cutting is carried out to substrate and reaches suitable dimension;
2), complete the envelope of the circuit board after cutting and be coated with ground floor insulating material;
3), ground floor insulating material envelope is after painting terminates, and carries out drying and processing;
4) after, completing baking step, envelope is coated with second layer insulating material;
5), after second layer insulating material completes, namely complete after substrate is detected.
As the manufacture method of the insulated substrate of electronic devices and components of the present invention, the thickness of preferred ground floor insulating material is 10-30um.
As the manufacture method of the insulated substrate of electronic devices and components of the present invention, the 15-20um of preferred second layer insulating material.
As the manufacture method of the insulated substrate of electronic devices and components of the present invention, preferred ground floor insulating material is made up of polyimides or acrylic acid or polyether sulfone materials.
As the manufacture method of the insulated substrate of electronic devices and components of the present invention, preferred second layer insulating material is made up of polyethers nitrile or PET or pvc material.
Embodiment one
A manufacture method for the insulated substrate of electronic devices and components, making step is as follows:
1), prepare circuit board, cutting is carried out to substrate and reaches suitable dimension;
2), complete the envelope of the circuit board after cutting and be coated with ground floor insulating material; The thickness of ground floor insulating material is 15um.Ground floor insulating material is made up of polyimides.
3), ground floor insulating material envelope is after painting terminates, and carries out drying and processing;
4) after, completing baking step, envelope is coated with second layer insulating material; The 18um of second layer insulating material.Second layer insulating material is made up of polyethers nitrile.
5), after second layer insulating material completes, namely complete after substrate is detected.
Embodiment two
A manufacture method for the insulated substrate of electronic devices and components, making step is as follows:
1), prepare circuit board, cutting is carried out to substrate and reaches suitable dimension;
2), complete the envelope of the circuit board after cutting and be coated with ground floor insulating material; The thickness of ground floor insulating material is 17um.Ground floor insulating material is made up of acrylic acid.
3), ground floor insulating material envelope is after painting terminates, and carries out drying and processing;
4) after, completing baking step, envelope is coated with second layer insulating material; The 19um of second layer insulating material.Second layer insulating material is made up of polyvinyl chloride.
5), after second layer insulating material completes, namely complete after substrate is detected.
Llowing group of materials in addition selected by insulating material:
Epoxy resin: epoxy resin in thermoplasticity, under various curing agent effect, can become thermosetting originally.The electric insulating quality of epoxy resin is good, heat-resisting, and weather changes, and stability is high, and poisture-penetrability is little, and towering knot is good, closely can bond with the multiple material such as metal, pottery.Be mainly used in the electronics industry in woollen yarn knitting, cast, encapsulating, coating and laminated sheet.Silica resin: also known as organic resin, has a class of organic substance and inorganic matter advantage
novelmacromolecular compound.Have good mechanical performance and thermal endurance, dielectric property are good, waterproof, moistureproof, cold-resistant, resistance to chemical attack, the corona of resistance to arc high pressure.Be widely used in manufacture organosilicon coating, silicone molding compound, for flooding, applying and the encapsulation of electronic devices and components.Transparent silicone glass resin, electric property and high frequency performance good, use under being suitable for high temperature, super-humid conditions, commonly using and doing various material surface painting plastics plastics is take synthetic resin as primary raw material, add the formulated powdery such as filler and various additives, granular or fibrous, the macromolecular material of system can be moulded under certain temperature, pressure condition.Plastics light weight, excellent electrical properties, has enough hardness and mechanical strength, is easy to shaping by Mould Machining, so be widely used in the electrical apparatus.
For making the object of the embodiment of the present invention and technical scheme clearly, the technical scheme of the embodiment of the present invention is clearly and completely described.Obviously, described embodiment is a part of embodiment of the present invention, instead of whole embodiments.Based on described embodiments of the invention, the every other embodiment that those of ordinary skill in the art obtain under without the need to the prerequisite of creative work, all belongs to the scope of protection of the invention.
Those skilled in the art of the present technique are appreciated that unless otherwise defined, and all terms used herein (comprising technical term and scientific terminology) have the meaning identical with the general understanding of the those of ordinary skill in field belonging to the present invention.Should also be understood that those terms defined in such as general dictionary should be understood to have the meaning consistent with the meaning in the context of prior art, unless and define as here, can not explain by idealized or too formal implication.
The implication of the "and/or" described in the present invention refers to respective individualism or both simultaneous situations include interior.
The implication of " inside and outside " described in the present invention refers to relative to equipment itself, in the direction of sensing equipment inside is, otherwise is outward, but not the specific restriction to equipment mechanism of the present invention.
The left side of reader is a left side, and the right of reader is the right side, but not the specific restriction to equipment mechanism of the present invention.
The indirect connection that can be the direct connection between parts also can be by other parts between parts of the implication of " connection " described in the present invention.
These are only embodiments of the present invention, it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.
Claims (5)
1. a manufacture method for the insulated substrate of electronic devices and components, is characterized in that: making step is as follows:
1), prepare circuit board, cutting is carried out to substrate and reaches suitable dimension;
2), complete the envelope of the circuit board after cutting and be coated with ground floor insulating material;
3), ground floor insulating material envelope is after painting terminates, and carries out drying and processing;
4) after, completing baking step, envelope is coated with second layer insulating material;
5), after second layer insulating material completes, namely complete after substrate is detected.
2. the manufacture method of the insulated substrate of electronic devices and components according to claim 1, is characterized in that: the thickness of described ground floor insulating material is 10-30um.
3. the manufacture method of the insulated substrate of electronic devices and components according to claim 1, is characterized in that: the 15-20um of described second layer insulating material.
4. the manufacture method of the insulated substrate of electronic devices and components according to claim 1, is characterized in that: described ground floor insulating material is made up of polyimides or acrylic acid or polyether sulfone materials.
5. the manufacture method of the insulated substrate of electronic devices and components according to claim 1, is characterized in that: described second layer insulating material is made up of polyethers nitrile or PET or pvc material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410641028.3A CN104640356A (en) | 2014-11-14 | 2014-11-14 | Method for making insulating substrate for electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410641028.3A CN104640356A (en) | 2014-11-14 | 2014-11-14 | Method for making insulating substrate for electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104640356A true CN104640356A (en) | 2015-05-20 |
Family
ID=53218524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410641028.3A Pending CN104640356A (en) | 2014-11-14 | 2014-11-14 | Method for making insulating substrate for electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104640356A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020187352A1 (en) * | 2001-06-12 | 2002-12-12 | Samsung Electro-Mechanics Co., Ltd. | Insulating film having improved adhesive strength and board having the insulating film |
| JP2004312042A (en) * | 2004-07-20 | 2004-11-04 | Sony Chem Corp | Manufacturing method for flexible printed circuit board |
| CN103200771A (en) * | 2012-01-05 | 2013-07-10 | 松扬电子材料(昆山)有限公司 | Non-glue single face copper clad laminate with bonding function and manufacturing method thereof |
-
2014
- 2014-11-14 CN CN201410641028.3A patent/CN104640356A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020187352A1 (en) * | 2001-06-12 | 2002-12-12 | Samsung Electro-Mechanics Co., Ltd. | Insulating film having improved adhesive strength and board having the insulating film |
| JP2004312042A (en) * | 2004-07-20 | 2004-11-04 | Sony Chem Corp | Manufacturing method for flexible printed circuit board |
| CN103200771A (en) * | 2012-01-05 | 2013-07-10 | 松扬电子材料(昆山)有限公司 | Non-glue single face copper clad laminate with bonding function and manufacturing method thereof |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150520 |