CN104427742B - Cover layer and circuit board - Google Patents
Cover layer and circuit board Download PDFInfo
- Publication number
- CN104427742B CN104427742B CN201310381441.6A CN201310381441A CN104427742B CN 104427742 B CN104427742 B CN 104427742B CN 201310381441 A CN201310381441 A CN 201310381441A CN 104427742 B CN104427742 B CN 104427742B
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- China
- Prior art keywords
- layer
- solvent
- percentage composition
- insulating barrier
- weight
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to a kind of cover layer, it includes insulating barrier, and the insulating barrier is coated with to be formed using colloid admixture.The colloid admixture includes epoxy resin, end carboxyl resin, focus ratio, solvent, defoamer, curing agent and catalyst.The invention further relates to a kind of circuit board using the covering film production formation protective layer.
Description
Technical field
The present invention relates to circuit board making technology, more particularly to a kind of cover layer and circuit board.
Background technology
Because electronic product is to individualized development, for the printed circuit board (PCB) applied to electronic product requirement also increasingly
Variation.In circuit board product, it usually needs cover layer is formed on the surface of circuit board, with to the conducting wire in circuit board
Protected.Cover layer usually three-decker, i.e. release layer, glue-line and insulating barrier before not fitted.The insulating barrier
Generally without viscosity, insulating barrier is bonded in the surface of release layer by the glue-line.In use, release layer is gone
Remove, insulating barrier is fitted in the surface of circuit board by glue-line.It is less and less with the thickness of circuit board, including glue-line and insulation
The cover layer of layer adds the thickness of circuit board.
The content of the invention
In view of this, it is necessary to which a kind of cover layer with relatively small thickness and the circuit board including the cover layer are provided.
A kind of cover layer, it includes insulating barrier, and the insulating barrier is coated with to be formed using colloid admixture.The colloid mixing
Thing includes epoxy resin, end carboxyl resin, focus ratio, solvent, defoamer, curing agent and catalyst.
A kind of circuit board, it includes substrate layer, conductive circuit layer and protective layer, and the conductive circuit layer is formed at substrate layer
Surface, the protective layer is formed at conducting wire layer surface and covers the conductive circuit layer, and the protective layer is using described
Insulating barrier be pressed on conducting wire layer surface by heating and formed.
The cover layer provided relative to prior art, the technical program, it has good viscosity, can pass through pressing
Mode directly be combined with each other with the conducting wire of circuit board, it is thus possible to cover layer is directly pressed on into circuit board, without setting
Put and be combined with each other between other glue-line and circuit board, so as to effectively reduce the thickness of the circuit board with protective layer.
Also, using the protective layer of the technical program as protective layer, with relatively low dielectric constant and dissipation factor, and with good
Good pliability.
Brief description of the drawings
Fig. 1 is the diagrammatic cross-section for the cover layer that the technical program embodiment is provided.
Fig. 2 is the diagrammatic cross-section for the circuit board that the technical program is provided.
Main element symbol description
Following embodiment will further illustrate the present invention with reference to above-mentioned accompanying drawing.
Embodiment
The cover layer and circuit board provided below in conjunction with drawings and Examples the technical program is made further detailed
Explanation.
Referring to Fig. 1, the technical program provides a kind of cover layer 10, it includes release layer 12 and insulating barrier 11.It is described exhausted
Edge layer 11 is coated with to be formed using colloid admixture.The colloid admixture includes epoxy resin, end carboxyl resin, poly phenol oxygen tree
Fat, solvent, defoamer, curing agent and catalyst.
The epoxide equivalent of the epoxy resin is preferably 450 to 600.The epoxy resin is in the colloid admixture
Weight/mass percentage composition is 3.9% to 4.5%.The end carboxyl resin can be nbr carboxyl terminal.The end carboxyl resin exists
Weight/mass percentage composition in the colloid admixture is 0.9% to 1.2%.The focus ratio is in the colloid admixture
Weight/mass percentage composition is 10% to 25%.The solvent can include the first solvent and the second solvent.The solvent is in the colloid
Weight/mass percentage composition in mixture is 55% to 85%.First solvent is used for dissolved epoxy.First solvent can
Think butyl cellosolve or butyl glycol ether.Weight/mass percentage composition of first solvent in the colloid admixture be
10% to 25%.Second solvent is used to dissolve focus ratio, and second solvent can be acetic acid carbitol ester or second
Glycol ether acetic acid esters.Weight/mass percentage composition of second solvent in the colloid admixture is 45% to 70%.It is described to disappear
Infusion is silane coupler, is specifically as follows A-187, and it includes γ-(2,3- the third oxygen of epoxy) propyl trimethoxy silicane.It is described
Weight/mass percentage composition of the defoamer in the colloid admixture is 0.06% to 0.08%.The curing agent can be Ancamide
2482.Weight/mass percentage composition of the curing agent in the colloid admixture is 0.95% to 1.1%.The catalyst can be
2- heptadecyl imidazoles.Weight/mass percentage composition of the catalyst in the colloid admixture is 0.2% to 0.28%.
The release layer 12 can be polyethylene terephthalate（PET）Mould release membrance, or other have from
The mould release membrance on type surface.
The cover layer 10 can be adopted to make with the following method and formed:
The first step, prepares colloid admixture.
In this step, the consumption of each component is weighed in proportion with reference to the percentage composition of above-mentioned each component.The colloid is mixed
Compound can be adopted to make with the following method and formed.
First, the epoxy resin is added in the first solvent so that epoxy resin is completely dissolved in the first solvent, is obtained
To the first solution.
Then, by first solution and end carboxyl mixed with resin, and defoamer silane coupler is added so that first is molten
Liquid reacts with end carboxyl resin, obtains the second solution.
Then, focus ratio is added into the second solvent so that focus ratio is dissolved completely in the second solvent,
Obtain the 3rd solution.
Then, the 3rd solution and the second solution are sufficiently mixed, obtain mixed solution.
Finally, curing agent and catalyst are added in the mixed solution, and make it that curing agent and catalyst are dispersed
In the mixed solution, colloid admixture is obtained.
The viscosity of the colloid admixture is 1500cps to 5500cps.
Second step, is coated on the surface of release layer 12, and by heating, obtain insulating barrier 11 by the colloid admixture.
The colloid admixture is coated on into the surface of release layer 12 to be formed by the way of printing or rotary coating.
In heating, the temperature of heating is 85 degrees Celsius to 120 degrees Celsius, and the duration is 15 minutes to 30 minutes so that colloid is mixed
Partial solvent volatilization in compound so that the colloid admixture of coating turns into membranaceous insulating barrier 11.In the present embodiment, formation
The thickness of insulating barrier 11 is 15 microns to 30 microns.
The release layer 12 is only used for supporting and including insulating barrier 11, and the cover layer 10 can only include insulating barrier 11.
Referring to Fig. 2, the technical program also provides a kind of including circuit board 100 of the insulating barrier 11 as protective layer.
Circuit board 100 includes substrate layer 110, conductive circuit layer 120 and protective layer 130.
The substrate layer 110 has first surface 111.The substrate layer 110 can be made of polyimides.The base
The thickness of material layer 110 is 12.5 microns to 25 microns.It is understood that the substrate layer 110 can also be using poly- to benzene two
Formic acid glycol ester or PEN are made.
The conductive circuit layer 120 is formed at the first surface 111.The thickness of the conductive circuit layer 120 is 12 micro-
Rice is to 18 microns.
The substrate layer 110 and conductive circuit layer 120 can be passed through using the copper-clad base plate for including substrate layer 110 and copper foil layer
Image transfer and etch process are crossed, the copper foil layer of copper-clad base plate is made to form conductive circuit layer 120 and obtain.
The protective layer 130 is formed at the side of conductive circuit layer 120, and the covering of protective layer 130 conductive circuit layer 120 is simultaneously
In filling to the space between the conducting wire of conductive circuit layer 120.
The protective layer 130 is formed for the insulating barrier 11 of the cover layer 10 by fitting and pressing baking solidify afterwards.Tool
Body, can the insulating barrier 11 of first cover layer 10 fit in the surface of conductive circuit layer 120, and release layer 12 is removed.Then,
To be fitted with insulating barrier 11 conductive circuit layer 120 and substrate layer 110 carry out heating pressing so that insulating barrier 11 be deformed and
In filling to the space of conductive circuit layer 120, and it solidify to form protective layer 130.In the present embodiment, the temperature of heating is Celsius for 95
Degree is to 110 degrees Celsius, and duration is 15 minutes to 30 minutes.
It can be drawn by test, the insulating barrier 11 that the technical program is provided has good electric property and thermodynamics
Energy.Tested using IPC-TM-650 2.5.5.3 method, when the thickness of protective layer 130 is 24 microns, electric field frequency
During for 1GHz, dielectric constant is 2.895.When electric field frequency is 5GHz, dielectric constant is 2.75.When electric field frequency is 10GHz, it is situated between
Electric constant is 2.685.When the thickness of protective layer 130 is 24 microns, when electric field frequency is 1GHz, dissipation factor
（dissipation factor）For 0.044.When electric field frequency is 5GHz, dielectric constant is 0.0034.Electric field frequency is 10GHz
When, dielectric constant is 0.0255.When the thickness of insulating barrier 11 is 24 microns, its glass transition temperature is 55.8 degrees Celsius,
Thermal resistance is 305 DEG C/W.
The cover layer that the technical program is provided, it has good viscosity, can be by way of pressing directly and circuit
The conducting wire of plate be combined with each other, it is thus possible to cover layer is directly pressed on into circuit board, without set other glue-line with
It is be combined with each other between circuit board, so as to effectively reduce the thickness of the circuit board with protective layer.Also, use this technology
The protective layer of scheme is as protective layer, with relatively low dielectric constant and dissipation factor, and with good pliability.
It is understood that for the person of ordinary skill of the art, can be done with technique according to the invention design
Go out other various corresponding changes and deformation, and all these changes and deformation should all belong to the protection model of the claims in the present invention
Enclose.
Claims (9)
1. a kind of cover layer, it includes insulating barrier, and the insulating barrier is coated with to be formed using colloid admixture, the colloid admixture
Including epoxy resin, end carboxyl resin, focus ratio, solvent, defoamer, curing agent and catalyst, in colloid mixing
In thing, the weight/mass percentage composition of the epoxy resin is 3.9% to 4.5%, and the weight/mass percentage composition of the end carboxyl resin is
0.9% to 1.2%, the weight/mass percentage composition of the focus ratio is 10% to 25%, the weight/mass percentage composition of the solvent
For 55% to 85%, the weight/mass percentage composition of the defoamer is 0.06% to 0.08%, and the quality percentage of the curing agent contains
Measure as 0.95% to 1.1%, weight/mass percentage composition of the catalyst in the colloid admixture is 0.2% to 0.28%.
2. cover layer as claimed in claim 1, it is characterised in that the epoxide equivalent of the epoxy resin is 450 to 600, institute
End carboxyl resin is stated for nbr carboxyl terminal, the solvent includes the first solvent and the second solvent, first solvent is used for
Dissolved epoxy, first solvent is butyl cellosolve or butyl glycol ether, and second solvent is used to dissolve poly- phenol
Oxygen tree fat, second solvent is acetic acid carbitol ester or ethyl cellosolve acetate, and the defoamer includes γ-(2,3-
The oxygen of epoxy third) propyl trimethoxy silicane, the catalyst is 2- heptadecyl imidazoles.
3. cover layer as claimed in claim 2, it is characterised in that quality of first solvent in the colloid admixture
Percentage composition be 10% to 25%, weight/mass percentage composition of second solvent in the colloid admixture be 45% to
70%.
4. cover layer as claimed in claim 1, it is characterised in that the thickness of the insulating barrier is 15 microns to 25 microns.
5. cover layer as claimed in claim 1, it is characterised in that the viscosity of the colloid admixture be 1500cps extremely
5500cps。
6. cover layer as claimed in claim 1, it is characterised in that also including release layer, the insulating barrier is formed at release layer
Surface.
7. a kind of circuit board, it includes substrate layer, conductive circuit layer and protective layer, and the conductive circuit layer is formed at substrate layer
Surface, the protective layer is formed at conducting wire layer surface and covers the conductive circuit layer, and the protective layer will using right
Ask the insulating barrier described in 1 to 4 any one to be pressed on conducting wire layer surface by heating to be formed.
8. circuit board as claimed in claim 7, it is characterised in that the thickness of the substrate layer is 12.5 microns to 25 microns,
The thickness of the conductive circuit layer is 12 microns to 18 microns.
9. circuit board as claimed in claim 7, it is characterised in that the material of the substrate layer is polyimides, gathered to benzene two
Formic acid glycol ester or PEN.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310381441.6A CN104427742B (en) | 2013-08-28 | 2013-08-28 | Cover layer and circuit board |
| TW102135258A TWI538576B (en) | 2013-08-28 | 2013-09-30 | Coverlay and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310381441.6A CN104427742B (en) | 2013-08-28 | 2013-08-28 | Cover layer and circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104427742A CN104427742A (en) | 2015-03-18 |
| CN104427742B true CN104427742B (en) | 2017-08-22 |
Family
ID=52975357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310381441.6A Active CN104427742B (en) | 2013-08-28 | 2013-08-28 | Cover layer and circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104427742B (en) |
| TW (1) | TWI538576B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI713420B (en) * | 2019-04-01 | 2020-12-11 | 新揚科技股份有限公司 | Circuit board structure |
| CN110003421B (en) * | 2019-04-22 | 2020-11-10 | 黑龙江省科学院石油化学研究院 | Ultralow-temperature toughening material and modified cyanate ester resin as well as preparation method and application thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200610217A (en) * | 2004-09-01 | 2006-03-16 | Nan Ya Printed Circuit Board Corp | Method for manufacturing bipolar plate and direct methanol fuel cell |
| CN101393394A (en) * | 2007-09-21 | 2009-03-25 | 太阳油墨制造株式会社 | Photo-cured and heat-cured resin composition and pcondensate thereof |
| CN102393603A (en) * | 2007-05-08 | 2012-03-28 | 太阳控股株式会社 | Photocuring resin composition, dry film, curing product and print circuit board |
| CN102812571A (en) * | 2010-03-31 | 2012-12-05 | 端点工程有限公司 | Optical device and method for manufacturing same |
| CN102844708A (en) * | 2010-04-14 | 2012-12-26 | 东丽株式会社 | Negative photosensitive resin composition, and protective film and touch panel member using the same |
-
2013
- 2013-08-28 CN CN201310381441.6A patent/CN104427742B/en active Active
- 2013-09-30 TW TW102135258A patent/TWI538576B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200610217A (en) * | 2004-09-01 | 2006-03-16 | Nan Ya Printed Circuit Board Corp | Method for manufacturing bipolar plate and direct methanol fuel cell |
| CN102393603A (en) * | 2007-05-08 | 2012-03-28 | 太阳控股株式会社 | Photocuring resin composition, dry film, curing product and print circuit board |
| CN101393394A (en) * | 2007-09-21 | 2009-03-25 | 太阳油墨制造株式会社 | Photo-cured and heat-cured resin composition and pcondensate thereof |
| CN102812571A (en) * | 2010-03-31 | 2012-12-05 | 端点工程有限公司 | Optical device and method for manufacturing same |
| CN102844708A (en) * | 2010-04-14 | 2012-12-26 | 东丽株式会社 | Negative photosensitive resin composition, and protective film and touch panel member using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI538576B (en) | 2016-06-11 |
| TW201517705A (en) | 2015-05-01 |
| CN104427742A (en) | 2015-03-18 |
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| Date | Code | Title | Description |
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| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20170309 Address after: Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Zhending Technology Co., Ltd. |
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| CB02 | Change of applicant information |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Applicant after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant after: Peng Ding Polytron Technologies Inc Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Peng Ding Polytron Technologies Inc |
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