200814891 (1) 九、發明說明 【發明所屬之技術領域】 本發明係有關使用於各種電氣機器、電子機器、液晶 機器之電路連接等的可撓性配線板及熱密封連接器。 - 【先前技術】 先前之可撓性配線板，係具備在未圖示之薄膜基材表 Φ 面隔著間隔來配列形成的複數銀線，和層積於此複數銀線 中最少非連接部分上的絕緣性樹脂，或是有黏著性的絕緣 性薄膜，而構成。 然而先前之可撓性配線板，在高溼度或結露時對銀線 施加電壓的情況下，有暴露於遷移（migration )之危險的 缺點。爲了防止此遷移造成的短路事故，先前係提案有在 銀線之端子上覆蓋塗佈碳系黏膠，或是覆蓋塗佈撥液性氟 系樹脂的方法（參考專利文件1 ) φ 專利文件1:曰本特開平8-222839號公報 【發明內容】 ^ 發明所欲解決之課題 ^ 然而，在銀線上覆蓋塗佈碳系黏膠或氟系樹脂的先前 方法，在經由異向導電黏著劑與顯示裝置之電極導通連接 的情況下，有導致連接電阻上升的問題。又，在銀線上網 版印刷有碳黏膠而個別塗佈的情況下，因爲無法銳利地印 刷，固有無法對應未滿0 · 4 m m之細節距化之虞。此細節距 200814891 (2) 化之對應，隨著近年來電視機、液晶顯示器、行動電話、 數位相機等迅速的小型化、高精緻化、彩色化，而增加其 重要性。 本發明係有鑒於上述而完成者，其目的爲提供一種熱 - 密封連接器及可撓性配線板，可抑制遷移而使電氣連接與 - 電阻安定，且做爲可達成導電線與屏障層之銳利形成，亦 可輕易對應未滿0.4mm之細節距化。 用以解決課題之手段 本發明中爲了解決上述課題，係於絕緣性基材隔著間 隔配列複數導電線；其特徵係包含最少覆蓋各導電線端部 之絕緣性屏障層，和調配在各導電線與屏障層中至少一 方，並從屏障層露出一部分的導電粒子；使屏障層比各導 電線要大，然後藉由在溶解於有機溶劑之絕緣性樹脂所構 成之黏膠樹脂中分散有無機塡充物的絕緣黏膠，來形成此 φ 屏障層，並使導電粒子之平均粒徑比屏障層厚度更大。 另外，以未滿〇.4mm之細節距來配列複數導電線爲 佳。 ^ 又，可以藉由對基材塗佈銀樹脂系之墨水並乾燥，來 形成複數導電線；然後藉由在各導電線之最少端部塗佈絕 緣黏膠並乾燥，來形成屏障層。 又，可以對無機塡充物賦予撥液性，將該一次粒子之 平均粒徑做爲0.01〜10# Π1。 又，可以將導電粒子之平均粒徑，做爲屏障層厚度之 -5- 200814891 ⑶ 1.2〜5倍的範圍。 又’本發明中爲了解決上述課題，係於絕緣性基材隔 著間隔配列複數導電線；其特徵係包含最少覆蓋各導電線 端部之絕緣性屏障層，和覆蓋此屏障層之黏著層，和調配 k 在各導電線與屏障層中至少一方，並從屏障層露出一部分 - 的導電粒子；使屏障層比各導電線要大，然後藉由在溶解 於有機溶劑之絕緣性樹脂所構成之黏膠樹脂中分散有無機 塡充物的絕緣黏膠，來形成此屏障層，並使導電粒子之平 均粒徑比屏障層厚度更大。 另外’以未滿〇 · 4mm之細節距來配列複數導電線爲 佳。 又’可以藉由對基材塗佈銀樹脂系之墨水並乾燥，來 形成複數導電線；然後藉由在各導電線之最少端部塗佈絕 緣黏膠並乾燥’來形成屏障層；然後藉由於基才經由屏障 層塗佈黏著劑並乾燥，來形成黏著層。 φ 又’可以對無機塡充物賦予撥液性，將該一次粒子之 平均松徑做爲0.01〜10// m。 又’可以將導電粒子之平均粒徑，做爲屏障層厚度之 Λ 1.2〜5倍的範圍。 * 更且又是一種製造方法，對絕緣性基材塗佈銀樹脂系 墨水而乾燥’來隔開間隔而構圖形成複數導電線，然後在 各導電線之至少端部上，塗佈在溶解於有機溶劑之絕緣性 樹脂所構成之黏膠樹脂中最少分散有無機塡充物的絕緣黏 膠’使其乾燥而層積形成屏障層，然後基材與屏障層中最 -6- 200814891 (4) 少在屏障層上塗佈黏著劑，使其乾燥而形成黏著層；其特 徵係使導電粒子調配在銀樹脂系墨水與絕緣黏膠中任一 方，使其一部份自屏障層露出，將導電粒子做爲可壓碎之 粒子，使其平均粒徑做爲屏障層厚度之1.2〜5倍的範圍即 , 可 〇 - 在此，申請專利範圍中之基材，並不特別拘束爲透 明、不透明、半透明，可因應必要來改變材質、厚度、大 0 小、形狀。做爲導電線或屏障層之形成方法，可舉出網版 印刷法、噴墨法、凹版印刷法等。屏障層可以覆蓋各導電 線之端部，也可以覆蓋各導電線之整體。 更且，本發明之可撓性配線板或熱密封連接器，最少 可使用於電視機、液晶顯示器、行動電話、數位相機、電 子字典等彩色液晶裝置、顯示裝置、透明導電性玻璃、陶 瓷基板等的導通連接或安裝。 Φ 發明效果 若依本發明，則各導電線中至少端部就不是由導電 性，而是由絕緣性屏障層來覆蓋，故可抑制遷移而有使電 ^ 氣連接或電阻安定的效果。又，可以銳利形成導電線或屏 ' 障層，而可輕易對應未滿0.4mm的細節距化。 又，若將複數導電線以未滿0.4mm之細節距來配列， 則可供於近年來電視機、液晶顯示器、行動電話、數位相 機等迅速的小型化、高精緻化、彩色化等。 更且’若對無機塡充物賦予撥液性使其難溶於水，則 -7- 200814891 (5) 可提高可撓性配線板或熱密封連接器對濕氣或水# @屏障 性。 【實施方式】 以下，若參考圖示說明本發明之可撓性配線板的理想 實施方式，則本實施方式中之可撓性配線板係如第1圖或 第2圖所示，具備於絕緣性薄膜基材1配列形成的複數銀 線2，和完全覆蓋各銀線2且爲絕緣性的複數屏障層3， 和對薄膜基材1經由複數銀線2等來層積的阻劑層4，和 分別調配在各銀線2而從屏障層3之端不露出一部份的複 數導電粒子6;其導通連接顯示裝置與電子機器，或是安 裝電路零件。 薄膜基材1，係使用特定合成樹脂，例如耐熱性、耐 藥品性、電氣特性等較優良的聚酯或聚醯亞胺樹脂，成型 爲具有可撓性之可彎曲的俯視長方形薄膜，並例如做爲 10〜8 0/z m，理想爲20〜5 0// m的厚度。此薄膜基材1，其 表面兩端部分別形成銀線2之端部用連接範圍，表面中央 部則形成爲阻劑層4用的層積範圍。 複數銀線2，係將銀樹脂系墨水做網版印刷，藉由乾 燥硬化，在薄膜基板1之表面寬度方向（第1圖之上下方 向）以未滿〇 · 4 mm之細節距來構圖形成。銀樹脂系墨水， 係例如對聚酯系合成樹脂1 0重量部份混合鱗片狀之銀粉 7 0重量部份，攪拌調配爲黏膠，並因應必要而添加硬化促 進劑、平滑劑、分散安定劑、除泡劑等添加物。 -8- 200814891 (6) 各銀線2，係形成爲厚度5〜35 // m，寬度100〜5 00 // m 之帶狀，在薄膜基材1之表面長邊方向（第1圖之左右方 向）指向爲直線，除了中央部以外之兩端部，係位於薄膜 基材1之表面端部，換言之是位於薄膜基材1之連接範 ^ 圍，而做爲顯示裝置或點子機器之電極用連接部。 . 各屏障層3係以例如溶解於有機溶劑之絕緣性樹脂， 具體來說係於聚酯等熱可塑性樹脂、熱硬化性樹脂、UV 0 硬化性樹脂所構成之黏著劑樹脂，最少攪拌分散有無機塡 充物的絕緣黏膠來形成；以比銀線2更大上一些之寬度的 方式，在銀線2之表面上網版印刷爲俯視帶狀，來穩固固 定導電粒子6。 做爲形成屏障層3之絕緣黏膠的有機溶劑，可使用例 如醋酸丁酯等酯系溶劑，而使用熱硬化性樹脂做爲絕緣性 樹脂時，則使用容易得手的聚酯樹脂或環氧樹脂。又，無 機塡充物係例如由廉價之二氧化矽或鋁氧等構成，爲了確 φ 保對水分之屏障性，係被賦予撥液性使其一次粒子之平均 粒徑做爲0.01〜10// m的範圍，而工作爲控制絕緣性樹脂 的流動性。 • 無機塡充物其一次粒子之平均粒徑爲〇 · 〇 1〜1 〇 # m的 範圍，是因爲未滿〇. 〇 1 # m時，絕緣黏膠會變得過度局黏 性而對作業性造成障礙。反之若超過1 〇 // m時，就會降低 銀線2與屏障層3之密合性，反而有損對水分的屏障性。 阻劑層4係例如使用聚甲基丙烯酸甲酯等，在薄膜基 材1之表面中央部，換言之就是在薄膜基材1之層積範圍 -9- 200814891 ⑺ 印刷爲俯視矩形，或是黏貼具有黏著性之絕緣性薄膜來層 積而形成；覆蓋複數銀線2或屏障層3之中央部，使各屏 障層3之兩端部分別露出。 導電粒子6，係例如金、銀、銅等金屬，碳粒子，對 * 碳粒子覆蓋金屬之粒子，表面鍍有金、銀、鎳而可壓碎的 . 塑膠粒子所構成；其平均粒徑形成爲屏障層3之厚度的 1.2〜5倍，理想爲1.2〜3倍的範圍；調配在銀線2之墨水 ^ 中，在其網版印刷時塗佈於薄膜基材1表面，同時貫通屏 障層3使上部自其表面露出，來電氣導通連接於顯示裝置 或電子機器的電極部。 導電粒子6之平均粒徑爲屏障層3之厚度的1.2〜5倍 範圍，是因爲在未滿1.2倍之情況下，導電粒子6會埋沒 於屏障層3內部而使其表面被覆蓋，無法得到安定的導通 連接。反之超過5倍之情況下，在網版印刷時會對網眼造 成堵塞。 φ 上述之中，使用可撓性配線板來製造熱密封連接器的 情況下，首先係在所準備之薄膜基材1表面網版印刷有銀 樹脂系墨水並乾燥硬化，使含有導電粒子6之複數銀線2 * 並列構圖形成。此時預先將銀樹脂系墨水振動動攪拌，或 * 是使用3支輥等來預先攪拌爲佳。 構圖形成複數銀線2之後，在各銀線2上網版印刷絕 緣黏膠並使其乾燥，層積形成覆蓋銀線2表面的屏障層 3，將此狀態之薄膜基材1設置於烤箱中施加熱處理，使 銀線2之導電粒子6與屏障層3有某種程度的固定。 -10- 200814891 (8) 然後在薄膜基材1之層積範圍層積形成阻劑層4，同 時在薄膜基材1之各連接範圍經由複數屏障層3來網版印 刷黏著劑並使其乾燥，而層積形成黏接於顯示裝置或電子 機器的黏著層，就可製造出熱密封連接器。 * 若依上述構造，則因爲作爲與先前大不相同的構造， . 故可抑制遷移而使電氣連接或電阻安定。又，各銀線2之 端部不是由導電性之碳屏障層，而是由絕緣性之屏障層3 _ 來覆蓋，故可對應顯示裝置最近日益要求的細節距化。具 體來說，可非常簡單地對應〇·1〜0.3 mm的細節距化，藉此 可對應近年來電視機、液晶顯示器、行動電話、數位相機 等迅速的小型化、高精緻化、彩色化。 更且，並非單純以熱可塑性樹脂、熱硬化性樹脂、 UV硬化性樹脂來形成屏障層3，而是由混合分散有無機 塡充物之絕緣黏膠來形成，故在由熱所作用之熱密封時， 完全不會使樹脂流動而導致降低表面平滑性或屏障性，可 φ 以完全供於未滿〇.4mm的細節距化。從而，先前無法達成 之小型輕量行動電話的彩色化或動畫化等，也可極輕易的 對應。 * 其次，第3圖或第4圖係表示本發明之熱密封連接器 * 的實施方式者，本實施方式中之熱密封連接器，係具備於 絕緣性薄膜基材1配列形成的複數銀線2，和完全覆蓋各 銀線2且爲絕緣性的複數屏障層3，和對薄膜基材1經由 複數銀線2等來層積的阻劑層4，和覆蓋各屏障層3之端 部的黏著層5，和分別調配在各銀線2而從屏障層3之端 -11 - 200814891 Ο) 部露出一部份的複數導電粒子6;其藉由被熱密封，而工 作爲導通連接未圖示的顯示裝置與電子機器。 各黏著層5，係由藉由加熱與加壓來展現黏著性的黏 著劑所構成，在薄膜基材1之連接範圍經由複數屏障層3 . 做網版印刷，來覆蓋屏障層3之表面或導電粒子6。形成 . 此黏著劑層5的黏著劑，只要是熱可塑性或熱硬化性的型 式就不做限制，亦即以環氧系、聚醯胺系、聚酯系等合成 | 樹脂或各種合成橡膠或其混合物爲基礎，因應必要來添加 硬化劑、加硫劑、劣化防止劑、黏著賦予劑等添加劑。 黏著劑，可以是含有多數導電粒子之異向導電黏著 劑，做爲此時之導電粒子，可舉出金、銀、銅等金屬，碳 粒子，對碳粒子覆蓋金屬之粒子。其他部份與上述可撓性 配線板之實施方式相同，故省略說明。 上述之中，要製造熱密封連接器時，首先係在所準備 之薄膜基材1表面網版印刷有銀樹脂系墨水並乾燥硬化， φ 使含有導電粒子6之複數銀線2並列構圖形成。此時預先 將銀樹脂系墨水振動動攪拌，或是使用3支輥等來預先攪 拌爲佳。 構圖形成複數銀線2之後，在各銀線2上網版印刷絕 * 緣黏膠並使其乾燥，層積形成覆蓋銀線2表面的屏障層 3，將此狀態之薄膜基材1設置於烤箱中施加熱處理，使 銀線2之導電粒子6與屏障層3有某種程度的固定。 然後在薄膜基材1之層積範圍層積形成阻劑層4，同 時在薄膜基材1之各連接範圍經由複數屏障層3來網版印 200814891 (10) 刷黏著劑並使其乾燥，而層積形成黏接於顯示裝置或電子 機器的黏著層5，就可製造出熱密封連接器。 本實施方式中，也可期待與上述實施方式相同的效 果，而且若藉由黏著層5來覆蓋各屏障層3之端部，則明 顯可沿用可撓性配線板來簡單得到熱密封連接器。 其次，第5圖係表示本發明之熱密封連接器之第2實 施方式者，此時，並非於銀樹脂系墨水含有導電粒子6， 而是於形成屏障層3之絕緣性黏膠中含有導電粒子6 ;其 他部份與上述熱密封連接器之實施方式相同，故省略說 明。 本實施方式中，也可期待與上述實施方式相同的效 果，而且明顯可大力期待製造方法或構造的多樣化。 另外，上述實施方式中，雖然於薄膜基材1之各連接 範圍，將黏著劑經由複數屏障層3來網版印刷而層積形成 黏著層5，但是也可對屏障層3網版印刷黏著劑來形成黏 著層5。又，也可在形成黏著層5之後，於薄膜基材1之 層積範圍形成阻劑層4。又，也可以於各銀線2之兩端部 分別以屏障層3覆蓋，對薄膜基材1經由複數銀線2來層 積阻劑層4。更且，也可以於銀線2與屏障層3中分別調 配導電粒子6。 實施例 以下將本發明之可撓性配線板及熱密封連接器的實施 例，與比較例一起說明。 -13- 200814891 (11) 實施例l 首先，對聚酯樹脂1 0重量部份，將鱗片狀銀粉末70 重量部份，異氰酸系硬化劑1重量部份，平滑劑、分散安 定劑、除泡劑、搖變（Thixotropic )劑各1重量部份，溶 解於甲苯：甲基乙基酮=7: 3的混合溶媒中來配製出銀墨 水。 其次將聚酯樹脂100重量部份與異氰酸系硬化劑5重 量部份溶解於甲基乙基酮中，對此添加以二甲基二氯矽烷 做過表面處理之平均粒徑〇.〇2#m的二氧化矽粉末（日本 AEROSIL公司製造：品名R972 ) 3 0重量部份、鍍金後之 導電粒子亦即丙烯酸樹脂粒子1 0重量部份，由3支輥來 混合而配製出屏障層用的絕緣黏膠。此時將二氧化矽粉末 之平均粒徑做爲0.02 // m，導電粒子亦即丙烯酸樹脂粒子 之平均粒徑做爲2 5 // m。 其次，將環氧當量900〜1 200之二酚 A型環氧樹脂 200重量部份、NBR50重量部份、重量平均分子量爲750 之t-丁基酚100重量部份、2-甲基咪唑10重量部份溶解 於環己烷，對此添加平均粒徑1 6 // m之鍍金後的碳粒子 20重量部份，而配製出黏著層用的異向導電黏著劑。 如此分別配製出銀墨水、屏障層用絕緣黏膠、以及異 向導電黏著劑之後，在厚度25/zm之聚酯薄膜上網版印刷 銀墨水，使其乾燥後之厚度成爲1 0 /z m而構圖形成複數銀 線，然後在各銀線上網版印刷絕緣黏膠，以去除溶劑而乾 -14- 200814891 (12) 燥後之厚度爲1 5 # m的方式使其乾燥，來層積形成覆蓋銀 線的屏障層。複數銀線係形成爲條數40條、節距〇·3 mm、線寬〇.l2mm，各屏障層係線寬〇.2mm。 然彳菱在聚酯薄膜上經由複數屏障層來網版印刷異向導 電黏著劑並使其乾燥，以去除溶劑而乾燥後之厚度爲2 0 //m的方式來形成黏著層，製造出第6圖所示之使用可撓 性配線版的熱密封連接器。 如此製造熱密封連接器之後，在面積電阻率3 0 Ω之 ITO基板與鍍金銅箔玻璃環氧基板之間，將所製造之熱密 封連接器以170°C、40kg/cm2、12秒的條件做熱壓接，然 後施加瞬間電位差20V之電壓，在60。(：、95%RH之環境 下投入240小時、500小時、1 〇〇〇小時之後，觀察連接端 子間之電阻値變化與銀線外觀有無異常，整理於第1表、 第2表。 實施例2 基本上與實施例1相同，但是省略掉調配於絕緣黏膠 之鍍金的丙烯酸樹脂粒子，同時將鍍金之平均粒徑35//m 的丙烯酸樹脂粒子5重量部分調配於銀墨水，製造出第7 圖所示之使用可撓性配線版的熱密封連接器。 製造出熱密封連接器之後，與實施例1 一樣，確認連 接端子間之電阻値變化與銀線外觀有無異常，整理於第1 表、第2表。 -15- 200814891 (13) 比較例1 基本上與實施例1相同，但是省略掉屏障層與鍍金的 丙稀酸樹脂粒子，製造出第8圖所示之熱密封連接器，此 外與實施例1 一樣’觀察電阻値變化與銀線外觀有無異 常，整理於第1表、第2表。 比較例2 基本上與實施例1相同，但是省略掉添加於屏障層之 撥液性二氧化矽粉末，製造出第9圖所示之熱密封連接 器’此外與實施例1 一樣，確認電阻値變化與銀線外觀有 無異常，整理於第1表、第2表。 比較例3 基本上與實施例1相同，但是將鍍金之丙烯酸樹脂粒 子的平均粒徑改變爲14//m，製造出第1〇圖所示之熱密 封連接器，此外與實施例1 一樣，確認電阻値變化與銀線 外觀有無異常，整理於第1表、第2表。 [第1表] 實施例1 實施例2 比較例1 比較例2 比較例3 連接初期 10.9Ω 10.1Q 10.8Ω 10.4Ω 23.6 Ω 240小時之後 12.1 Ω 11.4Q 16.8Ω 10.9Ω 33.1Ω 500小時之後 12.6Ω 11.6Ω 19.1 Ω 11.7Q 38.4Ω 1000小時之後 13.8Ω 12.7 Ω 22.5 Ω 12.2 Ω 64.2 Ω 200814891 (14) [第2表] 實施例1 實施例2 比較例1 比較例2 比較例3 240小時之後 無異常 無異常 有變色 有變色 無異常 500小時之後 無異常 無異常 • 無異常 1000小時之後 無異常 無異常 _ - 無異常 從第1表、第2表可明顯看出，實施例1、2之熱密 封連接器，比起比較例1、2、3，確實可得到較良好的結 果。[Brief Description of the Invention] [Technical Field] The present invention relates to a flexible wiring board and a heat-sealed connector used for connection of circuits of various electric equipment, electronic equipment, and liquid crystal equipment. - [Prior Art] The conventional flexible wiring board has a plurality of silver wires arranged at intervals on the surface of the film substrate Φ (not shown), and a minimum of non-joined portions laminated among the plurality of silver wires It is composed of an insulating resin or an adhesive insulating film. However, in the case of the prior flexible wiring board, when a voltage is applied to the silver wire at a high humidity or condensation, there is a disadvantage of being exposed to the danger of migration. In order to prevent the short-circuit accident caused by this migration, a method of coating a carbon-based adhesive on a terminal of a silver wire or covering a liquid-repellent fluorine-based resin has been proposed (refer to Patent Document 1) φ Patent Document 1 Japanese Patent Application Laid-Open No. Hei 8-222839. SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION However, the prior method of coating a carbon wire with a carbon-based adhesive or a fluorine-based resin is carried out via an anisotropic conductive adhesive. When the electrodes of the display device are electrically connected, there is a problem that the connection resistance rises. Further, in the case where the silver wire is printed with the carbon paste and applied separately, since it cannot be sharply printed, it is not possible to cope with the detail of less than 0·4 m m. This detail corresponds to the 200814891 (2), and with the recent miniaturization, high-definition, and colorization of televisions, liquid crystal displays, mobile phones, and digital cameras, the importance has increased. The present invention has been made in view of the above, and an object thereof is to provide a heat-sealed connector and a flexible wiring board which can suppress migration and make electrical connection and resistance stable, and can achieve a conductive line and a barrier layer. Sharply formed, it can easily correspond to the detailing of less than 0.4mm. Means for Solving the Problems In order to solve the above problems, in the present invention, a plurality of conductive wires are arranged on an insulating substrate at intervals, and the feature includes an insulating barrier layer covering at least the ends of the conductive wires, and is disposed at each of the conductive layers. At least one of the wire and the barrier layer, and a part of the conductive particles are exposed from the barrier layer; the barrier layer is made larger than each of the conductive wires, and then the inorganic resin is dispersed in the adhesive resin composed of the insulating resin dissolved in the organic solvent The insulating adhesive of the filling material forms the φ barrier layer and makes the average particle diameter of the conductive particles larger than the thickness of the barrier layer. In addition, it is preferable to arrange a plurality of conductive wires with a fine pitch of less than .4 mm. Further, a plurality of conductive wires may be formed by coating a substrate with a silver resin-based ink and drying; and then forming a barrier layer by coating an insulating adhesive at a minimum end portion of each conductive wire and drying. Further, it is possible to impart liquid repellency to the inorganic cerium, and the average particle diameter of the primary particles is 0.01 to 10 # Π1. Further, the average particle diameter of the conductive particles can be made into a range of the barrier layer thickness of -5 - 200814891 (3) 1.2 to 5 times. Further, in order to solve the above problems, in the present invention, a plurality of conductive wires are arranged at intervals between insulating substrates; the feature is an insulating barrier layer covering at least the ends of the conductive wires, and an adhesive layer covering the barrier layer. And formulating at least one of each of the conductive lines and the barrier layer, and exposing a portion of the conductive particles from the barrier layer; making the barrier layer larger than each of the conductive lines, and then consisting of an insulating resin dissolved in an organic solvent An insulating adhesive in which an inorganic filler is dispersed in the viscose resin to form the barrier layer, and the average particle diameter of the conductive particles is larger than the thickness of the barrier layer. In addition, it is preferable to arrange a plurality of conductive wires with a fine pitch of 4 mm. Further, a plurality of conductive wires can be formed by coating a substrate with a silver resin-based ink and drying; then forming a barrier layer by applying an insulating adhesive at a minimum end of each conductive wire and drying '; The adhesive layer is formed because the adhesive is applied to the adhesive layer via the barrier layer and dried. φ ’ can impart liquid repellency to the inorganic entangled material, and the average bulk diameter of the primary particles is 0.01 to 10 // m. Further, the average particle diameter of the conductive particles can be made into a range of 1.2 to 5 times the thickness of the barrier layer. * Further, in a manufacturing method, a silver resin-based ink is applied to an insulating substrate and dried to form a plurality of conductive lines at intervals, and then coated on at least an end portion of each conductive line to be dissolved in An insulating resin composed of an insulating resin composed of an organic solvent and having at least an inorganic filler filled with an inorganic filler is dried to form a barrier layer, and then the substrate and the barrier layer are most -6-200814891 (4) Applying an adhesive on the barrier layer and drying it to form an adhesive layer; characterized in that the conductive particles are blended in either one of the silver resin ink and the insulating adhesive, so that a part thereof is exposed from the barrier layer, and the conductive layer is conductive. The particle is used as a crushable particle, and the average particle diameter is made into a range of 1.2 to 5 times the thickness of the barrier layer, that is, the substrate in the patent application range is not particularly constrained to be transparent or opaque. , translucent, can change the material, thickness, large size, and shape as necessary. As a method of forming the conductive wire or the barrier layer, a screen printing method, an inkjet method, a gravure printing method, or the like can be given. The barrier layer may cover the ends of the respective conductive lines or may cover the entire conductive lines. Moreover, the flexible wiring board or the heat-sealed connector of the present invention can be used for at least a color liquid crystal device such as a television set, a liquid crystal display, a mobile phone, a digital camera, an electronic dictionary, a display device, a transparent conductive glass, and a ceramic substrate. Wait for a connection or installation. Φ Effect of the Invention According to the present invention, at least the end portions of the respective conductive wires are not covered by the conductive property but covered by the insulating barrier layer, so that the migration can be suppressed and the electrical connection or the electrical resistance can be stabilized. Moreover, the conductive line or the screen barrier layer can be sharply formed, and the detailing of less than 0.4 mm can be easily performed. Further, when the plurality of conductive wires are arranged at a pitch of less than 0.4 mm, it is possible to rapidly reduce the size, height, and color of televisions, liquid crystal displays, mobile phones, and digital cameras in recent years. Further, if the liquid repellency is imparted to the inorganic ruthenium to make it poorly soluble in water, -7-200814891 (5) can improve the moisture or water barrier property of the flexible wiring board or the heat-sealed connector. [Embodiment] Hereinafter, a preferred embodiment of the flexible wiring board of the present invention will be described with reference to the drawings, and the flexible wiring board of the present embodiment is provided with insulation as shown in Fig. 1 or Fig. 2 The plurality of silver wires 2 formed by the film substrate 1 and the plurality of barrier layers 3 which completely cover the silver wires 2 and which are insulating, and the resist layer 4 which is laminated on the film substrate 1 via the plurality of silver wires 2 or the like. And a plurality of conductive particles 6 respectively disposed on each of the silver wires 2 and not exposed from the end of the barrier layer 3; the conductive devices 6 are connected to the display device and the electronic device, or the circuit components are mounted. The film substrate 1 is formed into a flexible and flexible rectangular film of a plan view by using a specific synthetic resin, for example, a polyester or a polyimide resin having excellent heat resistance, chemical resistance, electrical properties, and the like. As 10~8 0/zm, ideally 20~5 0//m thickness. In the film substrate 1, the end portions of the surface are formed at the end portions for the silver wires 2, and the central portion of the surface is formed as a layer for the resist layer 4. The plurality of silver wires 2 are screen-printed with silver resin-based ink, and are patterned by dry-hardening in the surface width direction of the film substrate 1 (downward direction in FIG. 1) with a fine pitch of less than 4 mm. . The silver resin-based ink is, for example, a 70-part portion of a scaly silver powder mixed with 10 parts by weight of a polyester-based synthetic resin, and is stirred and blended into a viscose, and a hardening accelerator, a smoothing agent, a dispersion stabilizer is added as necessary. Additives such as defoamers. -8- 200814891 (6) Each silver wire 2 is formed into a strip having a thickness of 5 to 35 // m and a width of 100 to 5 00 // m in the longitudinal direction of the surface of the film substrate 1 (Fig. 1) The left and right directions are directed to a straight line, and the both ends except the center portion are located at the surface end portion of the film substrate 1, in other words, at the connection of the film substrate 1, and are used as electrodes of a display device or a point machine. Use the connection. Each barrier layer 3 is, for example, an insulating resin dissolved in an organic solvent, specifically, an adhesive resin composed of a thermoplastic resin such as polyester, a thermosetting resin, or a UV 0 curable resin, and is stirred at least with stirring. The insulating paste of the inorganic filler is formed; the surface of the silver wire 2 is screen-printed in a plan view in a manner of a larger width than the silver wire 2 to securely fix the conductive particles 6. As the organic solvent for forming the insulating adhesive of the barrier layer 3, for example, an ester solvent such as butyl acetate can be used, and when a thermosetting resin is used as the insulating resin, a polyester resin or epoxy resin which is easy to use can be used. . Further, the inorganic ruthenium is composed of, for example, inexpensive ruthenium dioxide or aluminum oxide. In order to ensure the barrier property against moisture, the liquid repellency is imparted to the average particle diameter of the primary particles as 0.01 to 10/ The range of /m, while working to control the fluidity of the insulating resin. • The average particle size of the primary particles of the inorganic inclusions is 〇· 〇1~1 〇# m, because it is not full. 〇1 # m, the insulating adhesive will become excessively sticky and work Sexuality creates obstacles. On the other hand, if it exceeds 1 〇 // m, the adhesion between the silver wire 2 and the barrier layer 3 is lowered, and the barrier to moisture is impaired. The resist layer 4 is printed, for example, in the center of the surface of the film substrate 1, in other words, using polymethyl methacrylate or the like, in the layered portion of the film substrate 1 in the range of -9-200814891 (7). An adhesive insulating film is laminated to cover the central portion of the plurality of silver wires 2 or the barrier layer 3, and both end portions of the barrier layers 3 are exposed. The conductive particles 6 are made of a metal such as gold, silver or copper, a carbon particle, a metal particle coated with a carbon particle, a surface of which is plated with gold, silver or nickel and can be crushed. The plastic particle is formed; the average particle diameter is formed. The thickness of the barrier layer 3 is 1.2 to 5 times, preferably 1.2 to 3 times; it is blended in the ink of the silver wire 2, and is applied to the surface of the film substrate 1 during screen printing while penetrating the barrier layer. 3 The upper portion is exposed from the surface to electrically connect the electrode portion of the display device or the electronic device. The average particle diameter of the conductive particles 6 is in the range of 1.2 to 5 times the thickness of the barrier layer 3 because the conductive particles 6 are buried in the barrier layer 3 and the surface thereof is covered under the condition of less than 1.2 times, and the surface is not covered. Stable conduction connection. On the other hand, if it is more than 5 times, it will cause clogging of the mesh during screen printing. φ In the above, when a heat-sealed connector is manufactured using a flexible wiring board, first, a silver resin-based ink is screen-printed on the surface of the prepared film substrate 1 and dried and cured to contain conductive particles 6. Multiple silver lines 2 * are formed in parallel. At this time, the silver resin-based ink is vibrated and stirred in advance, or * is preferably stirred in advance using three rolls or the like. After patterning the plurality of silver wires 2, the insulating adhesive is screen-printed on each of the silver wires 2 and dried to form a barrier layer 3 covering the surface of the silver wire 2, and the film substrate 1 in this state is placed in an oven. The heat treatment causes the conductive particles 6 of the silver wire 2 to be fixed to the barrier layer 3 to some extent. -10- 200814891 (8) Then, a resist layer 4 is laminated in a layered region of the film substrate 1, and the adhesive is screen-printed and dried through the plurality of barrier layers 3 in the respective connection ranges of the film substrate 1. The heat-sealed connector can be manufactured by laminating to form an adhesive layer adhered to a display device or an electronic device. * According to the above configuration, since it is a structure that is greatly different from the previous one, it is possible to suppress the migration and stabilize the electrical connection or the electric resistance. Further, since the end portions of the respective silver wires 2 are not covered by the conductive carbon barrier layer but by the insulating barrier layer 3 _, they can correspond to the more recently required detail of the display device. In particular, it is possible to easily correspond to the fine pitch of 〇·1 to 0.3 mm, and it is possible to rapidly reduce the size, height, and color of televisions, liquid crystal displays, mobile phones, and digital cameras in recent years. Further, the barrier layer 3 is not simply formed of a thermoplastic resin, a thermosetting resin, or a UV curable resin, but is formed by an insulating adhesive in which an inorganic filler is mixed and dispersed, so that heat is applied by heat. When sealing, the resin is not allowed to flow at all, resulting in a reduction in surface smoothness or barrier properties, and can be completely supplied to the pitch of less than 4 mm. As a result, colorization or animation of small and lightweight mobile phones that were previously impossible to achieve can be easily matched. * Fig. 3 or Fig. 4 shows an embodiment of the heat-sealed connector * of the present invention, and the heat-sealed connector of the present embodiment is provided with a plurality of silver wires arranged in an insulating film substrate 1 2, and a plurality of barrier layers 3 which completely cover the respective silver wires 2 and are insulative, and a resist layer 4 which is laminated on the film substrate 1 via a plurality of silver wires 2 and the like, and an end portion covering each barrier layer 3 Adhesive layer 5, and a plurality of conductive particles 6 respectively disposed at each end of the silver layer 2 and from the end of the barrier layer 3 -11 - 200814891 ;); which is thermally sealed and operated as a conductive connection Display device and electronic device. Each of the adhesive layers 5 is composed of an adhesive which exhibits adhesiveness by heating and pressurization, and is connected to the surface of the barrier layer 3 via a plurality of barrier layers 3 via a plurality of barrier layers 3 in the connection range of the film substrate 1 or Conductive particles 6. The adhesive of the adhesive layer 5 is not limited as long as it is a thermoplastic or thermosetting type, that is, an epoxy resin, a polyamide or a polyester resin, or various synthetic rubbers or Based on the mixture, additives such as a hardener, a vulcanizing agent, a deterioration preventing agent, and an adhesion-imparting agent are added as necessary. The adhesive may be an anisotropic conductive adhesive containing a plurality of conductive particles. Examples of the conductive particles at this time include metals such as gold, silver, and copper, and carbon particles, which cover the metal particles with carbon particles. The other portions are the same as those of the above-described flexible wiring board, and thus the description thereof will be omitted. In the above, in order to manufacture a heat-sealed connector, first, a silver resin-based ink is screen-printed on the surface of the prepared film substrate 1, and dried and hardened, and φ is formed by juxtaposing a plurality of silver wires 2 containing the conductive particles 6. At this time, it is preferable to stir the silver resin ink in advance or to stir it in advance using three rolls or the like. After patterning the plurality of silver wires 2, the silver paste is printed on each silver wire 2 and dried, and laminated to form a barrier layer 3 covering the surface of the silver wire 2, and the film substrate 1 in this state is placed in the oven. Heat treatment is applied to fix the conductive particles 6 of the silver wire 2 and the barrier layer 3 to some extent. Then, a resist layer 4 is laminated on the film substrate 1 in a lamination range, and at the same time, in the connection range of the film substrate 1, a plurality of barrier layers 3 are used to screen-print the 200814891 (10) brush adhesive and dry it. The heat-sealed connector can be manufactured by laminating to form an adhesive layer 5 adhered to a display device or an electronic device. Also in the present embodiment, the same effects as those of the above-described embodiment can be expected, and if the end portions of the respective barrier layers 3 are covered by the adhesive layer 5, it is apparent that the heat-sealed connector can be easily obtained by using the flexible wiring board. Next, Fig. 5 shows a second embodiment of the heat-sealed connector of the present invention. In this case, the silver-based ink does not contain the conductive particles 6, but contains conductive material in the insulating adhesive forming the barrier layer 3. The particles 6; the other portions are the same as those of the above-described heat-sealed connector, and the description thereof will be omitted. Also in the present embodiment, the same effects as those of the above-described embodiment can be expected, and it is apparent that the manufacturing method or structure can be diversified. Further, in the above-described embodiment, the adhesive layer 5 is formed by laminating the adhesive layer via the plurality of barrier layers 3 in the respective connection ranges of the film substrate 1, but the barrier layer 3 may be screen-printed with the adhesive. To form the adhesive layer 5. Further, after the adhesive layer 5 is formed, the resist layer 4 may be formed in the layered region of the film substrate 1. Further, the barrier layer 3 may be covered at both end portions of each of the silver wires 2, and the resist layer 4 may be laminated on the film substrate 1 via a plurality of silver wires 2. Further, the conductive particles 6 may be disposed in the silver wire 2 and the barrier layer 3, respectively. EXAMPLES Hereinafter, examples of the flexible wiring board and the heat-sealed connector of the present invention will be described together with a comparative example. -13- 200814891 (11) Example 1 First, for 10 parts by weight of the polyester resin, 70 parts by weight of scaly silver powder, 1 part by weight of isocyanic curing agent, smoothing agent, dispersion stabilizer, One part by weight of each of the defoaming agent and the Thixotropic agent was dissolved in a mixed solvent of toluene:methyl ethyl ketone = 7:3 to prepare a silver ink. Next, 100 parts by weight of the polyester resin and 5 parts by weight of the isocyanic curing agent are dissolved in methyl ethyl ketone, and the average particle diameter of the surface treated with dimethyl dichloromethane is added thereto. 2#m cerium oxide powder (manufactured by AEROSIL, Japan: product name R972) 30 parts by weight, gold-plated conductive particles, that is, 10 parts by weight of acrylic resin particles, mixed by 3 rolls to form a barrier layer Insulating adhesive used. At this time, the average particle diameter of the cerium oxide powder was 0.02 // m, and the average particle diameter of the conductive particles, i.e., the acrylic resin particles, was 2 5 // m. Next, an epoxy equivalent of 900 to 1 200 bisphenol A type epoxy resin 200 parts by weight, an NBR 50 weight part, a weight average molecular weight of 750 t-butyl phenol 100 parts by weight, 2-methylimidazole 10 The weight portion was dissolved in cyclohexane, and 20 parts by weight of the gold-coated carbon particles having an average particle diameter of 16 @ m was added thereto to prepare an anisotropic conductive adhesive for the adhesive layer. After the silver ink, the insulating adhesive for the barrier layer, and the anisotropic conductive adhesive are separately prepared, the silver ink is printed on the polyester film of a thickness of 25/zm, and the thickness is dried to be 10 /zm and patterned. Forming a plurality of silver wires, and then printing the insulating adhesive on each silver wire to remove the solvent and drying it to a thickness of 1 5 # m, and drying it to form a covered silver layer. The barrier layer of the line. The plurality of silver lines are formed into a number of strips of 40, a pitch of 〇·3 mm, a line width of 〇.l2 mm, and a line width of each barrier layer of 22 mm. However, on the polyester film, the enamel screen printed the anisotropic conductive adhesive through a plurality of barrier layers and dried it to remove the solvent and dried to a thickness of 20 //m to form an adhesive layer. Figure 6 shows a heat-sealed connector using a flexible wiring board. After the heat-sealed connector is thus fabricated, the heat-sealed connector is manufactured at 170 ° C, 40 kg/cm 2 , and 12 seconds between the ITO substrate having an area resistivity of 30 Ω and the gold-plated copper foil glass epoxy substrate. Do a thermocompression and then apply a voltage of 20V at a momentary potential difference at 60. (: In the environment of 95% RH, after 240 hours, 500 hours, and 1 hour, the change in resistance 连接 between the connection terminals and the appearance of the silver wire were observed, and the results were summarized in Tables 1 and 2. 2 is basically the same as in the first embodiment, but the gold-plated acrylic resin particles blended in the insulating adhesive are omitted, and the weight-bearing portion of the acrylic resin particles having an average particle diameter of 35/m is applied to the silver ink to produce the first Figure 7 shows the heat-sealed connector using the flexible wiring board. After manufacturing the heat-sealed connector, as in the first embodiment, check the resistance 値 change between the connection terminals and the appearance of the silver wire. Table, Table 2. -15- 200814891 (13) Comparative Example 1 Basically the same as Example 1, except that the barrier layer and the gold-plated acrylic resin particles were omitted, and the heat-sealed connector shown in Fig. 8 was produced. Further, in the same manner as in Example 1, "the change in resistance 値 and the appearance of the silver wire were observed, and the results were summarized in Tables 1 and 2. Table 2 is basically the same as Example 1, but the liquid added to the barrier layer is omitted. Sex 2 In the same manner as in Example 1, the heat-sealing connector shown in Fig. 9 was produced, and the change in resistance 値 and the appearance of the silver wire were confirmed to be abnormal, and the results were summarized in Tables 1 and 2. Comparative Example 3 In the same manner as in the first embodiment, the average particle diameter of the gold-plated acrylic resin particles was changed to 14/m, and the heat-sealed connector shown in Fig. 1 was produced. Further, as in the case of Example 1, the change in resistance 値 was confirmed. The appearance of the silver wire was abnormal, and it was arranged in the first table and the second table. [Table 1] Example 1 Example 2 Comparative Example 1 Comparative Example 2 Comparative Example 3 Initial connection 10.9 Ω 10.1Q 10.8 Ω 10.4 Ω 23.6 Ω 240 hours After 12.1 Ω 11.4Q 16.8Ω 10.9Ω 33.1Ω After 500 hours, 12.6Ω 11.6Ω 19.1 Ω 11.7Q 38.4Ω After 1000 hours 13.8Ω 12.7 Ω 22.5 Ω 12.2 Ω 64.2 Ω 200814891 (14) [Table 2] Example 1 Implementation Example 2 Comparative Example 1 Comparative Example 2 Comparative Example 3 No abnormality after 240 hours No abnormality Discoloration, discoloration, no abnormality, no abnormality after 500 hours, no abnormality, no abnormality after 1000 hours, no abnormality, no abnormality _ - no abnormality from the first table, Table 2 can Significant seen that heat sealing of the connector according to the embodiment 2, compared with Comparative Examples 1, 2, indeed relatively good results can be obtained.
【圖式簡單說明】 [第1圖]表示本發明之可撓性配線板之實施方式的俯 視說明圖 [第2圖]表示本發明之可撓性配線板之實施方式的部 分剖面說明圖 [第3圖]表示本發明之熱密封連接器之實施方式的部 份剖開俯視圖 [第4圖]表示本發明之熱密封連接器之實施方式的部 份剖面說明圖 [第5圖]表示本發明之熱密封連接器之第2實施方式 的部份剖面說明圖 [第6圖]表示本發明之熱密封連接器之實施例1的部 份剖面說明圖 [第7圖]表示本發明之熱密封連接器之實施例2的部 份剖面說明圖 -17- 200814891 (15) [第8圖]表示本發明之熱密封連接器之比較例1的部 份剖面說明圖 [第9圖]表示本發明之熱密封連接器之比較例2的部 份剖面說明圖 [第10圖]表示本發明之熱密封連接器之比較例3的部 份剖面說明圖 【主要元件符號說明】 1 =薄膜基材（基材） 2 :銀線（導電線） 3 =屏障層 4 :阻劑層 5 :黏著層 6 :導電粒子[Brief Description of the Drawings] [Fig. 1] is a plan view showing an embodiment of a flexible wiring board according to the present invention. [Fig. 2] is a partial cross-sectional explanatory view showing an embodiment of a flexible wiring board according to the present invention. Fig. 3 is a partially cutaway plan view showing an embodiment of the heat seal connector of the present invention. Fig. 4 is a partial cross-sectional explanatory view showing an embodiment of the heat seal connector of the present invention. [Fig. 5] BRIEF DESCRIPTION OF THE DRAWINGS FIG. 6 is a partial cross-sectional explanatory view showing a first embodiment of a heat-sealed connector of the present invention. FIG. 7 is a view showing heat of the present invention. Partial cross-sectional view of the second embodiment of the sealed connector FIG. 17 - 200814891 (15) [Fig. 8] is a partial cross-sectional explanatory view showing a comparative example 1 of the heat-sealed connector of the present invention [Fig. 9] BRIEF DESCRIPTION OF THE DRAWINGS FIG. 10 is a partial cross-sectional explanatory view showing a comparative example 3 of the heat-sealed connector of the present invention. [Main component symbol description] 1 = film substrate (Substrate) 2: Silver wire (conductive wire) 3 = Barrier layer 4: Resistor Layer 5: Adhesive layer 6: Conductive particles
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