CN104427742A - Cover film and circuit board - Google Patents
Cover film and circuit board Download PDFInfo
- Publication number
- CN104427742A CN104427742A CN201310381441.6A CN201310381441A CN104427742A CN 104427742 A CN104427742 A CN 104427742A CN 201310381441 A CN201310381441 A CN 201310381441A CN 104427742 A CN104427742 A CN 104427742A
- Authority
- CN
- China
- Prior art keywords
- solvent
- coverlay
- mass percentage
- layer
- insulating barrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Laminated Bodies (AREA)
Abstract
The invention relates to a cover film. The cover film comprises an insulation layer which is formed by coating by use of a colloid mixture. The colloid mixture comprises an epoxy resin, a carboxyl-terminated resin, a phenoxyl resin, a solvent, an antifoaming agent, a hardener and a catalyst. The invention also relates to a circuit board with a protective layer formed by use of the cover film.
Description
Technical field
The present invention relates to circuit board making technology, particularly relate to a kind of coverlay and circuit board.
Background technology
Because electronic product is to individualized development, the requirement for the printed circuit board (PCB) being applied to electronic product is also more and more diversified.In circuit board product, usually need to form coverlay on the surface of circuit board, to protect the conducting wire in circuit board.Before fitting, coverlay is generally three-decker, i.e. release layer, glue-line and insulating barrier.Described insulating barrier does not have viscosity usually, and insulating barrier is bonded in the surface of release layer by described glue-line.In use, release layer is removed, by glue-line, insulating barrier is fitted in the surface of circuit board.Along with the thickness of circuit board is more and more less, the coverlay comprising glue-line and insulating barrier adds the thickness of circuit board.
Summary of the invention
In view of this, be necessary that providing a kind of has the coverlay of less thickness and comprise the circuit board of this coverlay.
A kind of coverlay, it comprises insulating barrier, and described insulating barrier adopts colloid admixture coating to be formed.Described colloid admixture comprises epoxy resin, end carboxyl resin, focus ratio, solvent, defoamer, curing agent and catalyst.
A kind of circuit board; it comprises substrate layer, conductive circuit layer and protective layer; described conductive circuit layer is formed at the surface of substrate layer; described protective layer is formed at conductive circuit layer surface and covers described conductive circuit layer, and the insulating barrier described in described protective layer adopts is pressed on conductive circuit layer surface through heating and is formed.
Relative to prior art; the coverlay that the technical program provides; it has good viscosity; can be combined with each other conducting wire that is direct by the mode of pressing and circuit board; thus; coverlay directly can be pressed on circuit board, and be combined with each other without the need to arranging between other glue-line and circuit board, thus the thickness of the circuit board with protective layer can be effectively reduced.Further, adopt the protective layer of the technical program as protective layer, there is lower dielectric constant and dissipation factor, and there is good pliability.
Accompanying drawing explanation
Fig. 1 is the generalized section of the coverlay that the technical program embodiment provides.
Fig. 2 is the generalized section of the circuit board that the technical program provides.
Main element symbol description
Following embodiment will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
The coverlay provided the technical program below in conjunction with drawings and Examples and circuit board are described in further detail.
Refer to Fig. 1, the technical program provides a kind of coverlay 10, and it comprises release layer 12 and insulating barrier 11.Described insulating barrier 11 adopts colloid admixture to be coated with and is formed.Described colloid admixture comprises epoxy resin, end carboxyl resin, focus ratio, solvent, defoamer, curing agent and catalyst.
The epoxide equivalent of described epoxy resin is preferably 450 to 600.The mass percentage of described epoxy resin in described colloid admixture is 3.9% to 4.5%.Described end carboxyl resin can be nbr carboxyl terminal.The mass percentage of described end carboxyl resin in described colloid admixture is 0.9% to 1.2%.The mass percentage of described focus ratio in described colloid admixture is 10% to 25%.Described solvent can comprise the first solvent and the second solvent.The mass percentage of described solvent in described colloid admixture is 55% to 85%.Described first solvent is used for dissolved epoxy.Described first solvent can be butyl cellosolve or butyl glycol ether.The mass percentage of described first solvent in described colloid admixture is 10% to 25%.Described second solvent is for dissolving focus ratio, and described second solvent can be acetic acid carbitol ester or ethyl cellosolve acetate.The mass percentage of described second solvent in described colloid admixture is 45% to 70%.Described defoamer is silane coupler, is specifically as follows A-187, and it comprises γ-(2,3-epoxy third oxygen) propyl trimethoxy silicane.The mass percentage of described defoamer in described colloid admixture is 0.06% to 0.08%.Described curing agent can be Ancamide 2482.The mass percentage of described curing agent in described colloid admixture is 0.95% to 1.1%.Described catalyst can be 2-heptadecyl imidazole.The mass percentage of described catalyst in described colloid admixture is 0.2% to 0.28%.
Described release layer 12 can be PETG (PET) release film, also can have the release film of release surface for other.
Described coverlay 10 can be adopted and make formation with the following method:
The first step, preparation colloid admixture.
In this step, the consumption of each component takes in proportion with reference to the percentage composition of above-mentioned each component.Described colloid admixture can be adopted and make formation with the following method.
First, described epoxy resin is added in the first solvent, epoxy resin is dissolved in the first solvent completely, obtains the first solution.
Then, by described first solution and end carboxyl mixed with resin, and add defoamer silane coupler, the first solution and end carboxyl resin are reacted, obtains the second solution.
Then, focus ratio is added in the second solvent, focus ratio is dissolved in the second solvent completely, obtain the 3rd solution.
Then, the 3rd solution and the second solution are fully mixed, obtains mixed solution.
Finally, in described mixed solution, add curing agent and catalyst, and curing agent and catalyst are dispersed in described mixed solution, obtain colloid admixture.
The viscosity of described colloid admixture is 1500cps to 5500cps.
Second step, coats release layer 12 surface, and through heating, obtains insulating barrier 11 by described colloid admixture.
Described colloid admixture being coated release layer 12 surface can adopt the mode of printing or rotary coating to be formed.When heating, the temperature of heating is 85 degrees Celsius to 120 degrees Celsius, and the duration is 15 minutes to 30 minutes, and the partial solvent in colloid admixture is volatilized, and makes the colloid admixture be coated with become membranaceous insulating barrier 11.In the present embodiment, the thickness of the insulating barrier 11 of formation is 15 microns to 30 microns.
Described release layer 12 is only for supporting and comprising insulating barrier 11, and described coverlay 10 can only comprise insulating barrier 11.
Refer to Fig. 2, the technical program also provides a kind of and comprises the circuit board 100 of described insulating barrier 11 as protective layer.Circuit board 100 comprises substrate layer 110, conductive circuit layer 120 and protective layer 130.
Described substrate layer 110 has first surface 111.Described substrate layer 110 can adopt polyimides to make.The thickness of described substrate layer 110 is 12.5 microns to 25 microns.Be understandable that, described substrate layer 110 also can adopt PETG or PEN to make.
Described conductive circuit layer 120 is formed at described first surface 111.The thickness of described conductive circuit layer 120 is 12 microns to 18 microns.
Described substrate layer 110 and conductive circuit layer 120 can adopt the copper-clad base plate comprising substrate layer 110 and copper foil layer through image transfer and etch process, the copper foil layer of copper-clad base plate are made formation conductive circuit layer 120 and obtain.
Described protective layer 130 is formed at conductive circuit layer 120 side, and described protective layer 130 covers conductive circuit layer 120 and is filled in the space between the conducting wire of conductive circuit layer 120.
Described protective layer 130 is that the insulating barrier 11 of described coverlay 10 is through fitting and the formation of pressing baking Post RDBMS.Concrete, the insulating barrier 11 of first coverlay 10 can fit in the surface of conductive circuit layer 120, and release layer 12 is removed.Then, hot pressing is added to the conductive circuit layer 120 and substrate layer 110 being fitted with insulating barrier 11, make insulating barrier 11 produce distortion and be filled in the space of conductive circuit layer 120, and solidify to form protective layer 130.In the present embodiment, the temperature of heating is 95 degrees Celsius to 110 degrees Celsius, and the time continued is 15 minutes to 30 minutes.
Can be drawn by test, the insulating barrier 11 that the technical program provides has good electric property and thermodynamic property.Adopt the method for IPC-TM-650 2.5.5.3 to test, when the thickness of protective layer 130 is 24 microns, when electric field frequency is 1GHz, dielectric constant is 2.895.When electric field frequency is 5GHz, dielectric constant is 2.75.When electric field frequency is 10GHz, dielectric constant is 2.685.When the thickness of protective layer 130 is 24 microns, when electric field frequency is 1GHz, dissipation factor (dissipation factor) is 0.044.When electric field frequency is 5GHz, dielectric constant is 0.0034.When electric field frequency is 10GHz, dielectric constant is 0.0255.When the thickness of insulating barrier 11 is 24 microns, its glass transition temperature is 55.8 degrees Celsius, and thermal resistance is 305 DEG C/W.
The coverlay that the technical program provides; it has good viscosity; can be combined with each other conducting wire that is direct by the mode of pressing and circuit board; thus; coverlay directly can be pressed on circuit board; and be combined with each other without the need to arranging between other glue-line and circuit board, thus the thickness of the circuit board with protective layer can be effectively reduced.Further, adopt the protective layer of the technical program as protective layer, there is lower dielectric constant and dissipation factor, and there is good pliability.
Be understandable that, for the person of ordinary skill of the art, other various corresponding change and distortion can be made by technical conceive according to the present invention, and all these change the protection range that all should belong to the claims in the present invention with distortion.
Claims (10)
1. a coverlay, it comprises insulating barrier, and described insulating barrier adopts colloid admixture coating to be formed, and described colloid admixture comprises epoxy resin, end carboxyl resin, focus ratio, solvent, defoamer, curing agent and catalyst.
2. coverlay as claimed in claim 1, it is characterized in that, in described colloid admixture, the mass percentage of described epoxy resin is 3.9% to 4.5%, the mass percentage of described end carboxyl resin is 0.9% to 1.2%, the mass percentage of described focus ratio is 10% to 25%, the mass percentage of described solvent is 55% to 85%, the mass percentage of described defoamer is 0.06% to 0.08%, the mass percentage of described curing agent is 0.95% to 1.1%, the mass percentage of described catalyst in described colloid admixture is 0.2% to 0.28%.
3. coverlay as claimed in claim 2, it is characterized in that, the epoxide equivalent of described epoxy resin is preferably 450 to 600, described end carboxyl resin can be nbr carboxyl terminal, described solvent comprises the first solvent and the second solvent, described first solvent is used for dissolved epoxy, described first solvent is butyl cellosolve or butyl glycol ether, described second solvent is for dissolving focus ratio, described second solvent is acetic acid carbitol ester or ethyl cellosolve acetate, described defoamer comprises γ-(2, 3-epoxy third oxygen) propyl trimethoxy silicane, described catalyst is 2-heptadecyl imidazole.
4. coverlay as claimed in claim 3, it is characterized in that, the mass percentage of described first solvent in described colloid admixture is 10% to 25%, and the mass percentage of described second solvent in described colloid admixture is 45% to 70%.
5. coverlay as claimed in claim 1, it is characterized in that, the thickness of described insulating barrier is 15 microns to 25 microns.
6. coverlay as claimed in claim 1, it is characterized in that, the viscosity of described colloid admixture is 1500cps to 5500cps.
7. coverlay as claimed in claim 1, it is characterized in that, also comprise release layer, described insulating barrier is formed at release layer surface.
8. a circuit board; it comprises substrate layer, conductive circuit layer and protective layer; described conductive circuit layer is formed at the surface of substrate layer; described protective layer is formed at conductive circuit layer surface and covers described conductive circuit layer, and described protective layer adopts the insulating barrier described in any one of claim 1 to 5 to be pressed on conductive circuit layer surface through heating and formed.
9. circuit board as claimed in claim 8, it is characterized in that, the thickness of described substrate layer is 12.5 microns to 25 microns, and the thickness of described conductive circuit layer is 12 microns to 18 microns.
10. circuit board as claimed in claim 8, it is characterized in that, the material of described substrate layer is polyimides, PETG or PEN.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310381441.6A CN104427742B (en) | 2013-08-28 | 2013-08-28 | Cover layer and circuit board |
| TW102135258A TWI538576B (en) | 2013-08-28 | 2013-09-30 | Coverlay and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310381441.6A CN104427742B (en) | 2013-08-28 | 2013-08-28 | Cover layer and circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104427742A true CN104427742A (en) | 2015-03-18 |
| CN104427742B CN104427742B (en) | 2017-08-22 |
Family
ID=52975357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310381441.6A Active CN104427742B (en) | 2013-08-28 | 2013-08-28 | Cover layer and circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104427742B (en) |
| TW (1) | TWI538576B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110003421A (en) * | 2019-04-22 | 2019-07-12 | 黑龙江省科学院石油化学研究院 | A kind of ultralow temperature toughening material and modified cyanic acid ester resin and its preparation method and application |
| CN111800935A (en) * | 2019-04-01 | 2020-10-20 | 新扬科技股份有限公司 | Circuit board structure |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200610217A (en) * | 2004-09-01 | 2006-03-16 | Nan Ya Printed Circuit Board Corp | Method for manufacturing bipolar plate and direct methanol fuel cell |
| CN101393394A (en) * | 2007-09-21 | 2009-03-25 | 太阳油墨制造株式会社 | Photo-cured and heat-cured resin composition and pcondensate thereof |
| CN102393603A (en) * | 2007-05-08 | 2012-03-28 | 太阳控股株式会社 | Photocuring resin composition, dry film, curing product and print circuit board |
| CN102812571A (en) * | 2010-03-31 | 2012-12-05 | 端点工程有限公司 | Optical device and method for manufacturing same |
| CN102844708A (en) * | 2010-04-14 | 2012-12-26 | 东丽株式会社 | Negative photosensitive resin composition, and protective film and touch panel member using the same |
-
2013
- 2013-08-28 CN CN201310381441.6A patent/CN104427742B/en active Active
- 2013-09-30 TW TW102135258A patent/TWI538576B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200610217A (en) * | 2004-09-01 | 2006-03-16 | Nan Ya Printed Circuit Board Corp | Method for manufacturing bipolar plate and direct methanol fuel cell |
| CN102393603A (en) * | 2007-05-08 | 2012-03-28 | 太阳控股株式会社 | Photocuring resin composition, dry film, curing product and print circuit board |
| CN101393394A (en) * | 2007-09-21 | 2009-03-25 | 太阳油墨制造株式会社 | Photo-cured and heat-cured resin composition and pcondensate thereof |
| CN102812571A (en) * | 2010-03-31 | 2012-12-05 | 端点工程有限公司 | Optical device and method for manufacturing same |
| CN102844708A (en) * | 2010-04-14 | 2012-12-26 | 东丽株式会社 | Negative photosensitive resin composition, and protective film and touch panel member using the same |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111800935A (en) * | 2019-04-01 | 2020-10-20 | 新扬科技股份有限公司 | Circuit board structure |
| CN110003421A (en) * | 2019-04-22 | 2019-07-12 | 黑龙江省科学院石油化学研究院 | A kind of ultralow temperature toughening material and modified cyanic acid ester resin and its preparation method and application |
| CN110003421B (en) * | 2019-04-22 | 2020-11-10 | 黑龙江省科学院石油化学研究院 | Ultralow-temperature toughening material and modified cyanate ester resin as well as preparation method and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI538576B (en) | 2016-06-11 |
| TW201517705A (en) | 2015-05-01 |
| CN104427742B (en) | 2017-08-22 |
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| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20170309 Address after: Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Zhending Technology Co., Ltd. |
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| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Applicant after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant after: Peng Ding Polytron Technologies Inc Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Peng Ding Polytron Technologies Inc |
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