CN1316515C - Manufacturing method of conducting resin film and its product - Google Patents
Manufacturing method of conducting resin film and its product Download PDFInfo
- Publication number
- CN1316515C CN1316515C CNB2004100055941A CN200410005594A CN1316515C CN 1316515 C CN1316515 C CN 1316515C CN B2004100055941 A CNB2004100055941 A CN B2004100055941A CN 200410005594 A CN200410005594 A CN 200410005594A CN 1316515 C CN1316515 C CN 1316515C
- Authority
- CN
- China
- Prior art keywords
- base material
- conductive
- adhesive film
- conductive adhesive
- insulating cement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 239000011347 resin Substances 0.000 title description 2
- 229920005989 resin Polymers 0.000 title description 2
- 239000000463 material Substances 0.000 claims abstract description 70
- 238000000034 method Methods 0.000 claims abstract description 25
- 238000005187 foaming Methods 0.000 claims abstract description 10
- 239000004568 cement Substances 0.000 claims description 32
- 239000002313 adhesive film Substances 0.000 claims description 30
- 239000007788 liquid Substances 0.000 claims description 15
- 229920000297 Rayon Polymers 0.000 claims description 10
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 claims 9
- 239000002245 particle Substances 0.000 claims 1
- 238000007711 solidification Methods 0.000 claims 1
- 230000008023 solidification Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 6
- 238000005516 engineering process Methods 0.000 abstract description 6
- 238000009413 insulation Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 10
- 239000000047 product Substances 0.000 description 7
- 239000012528 membrane Substances 0.000 description 6
- 239000011859 microparticle Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- 235000009262 Dracaena angustifolia Nutrition 0.000 description 1
- 240000007833 Dracaena angustifolia Species 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- -1 aluminium hydrogen compound Chemical class 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000003317 industrial substance Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Images
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to a manufacturing method for a conductive paste film and a finished product manufactured by the method. The manufacturing method comprises the following procedures: a. mixing a foaming material with a base material of a liquid-state insulation paste film; b. solidifying the base material of a liquid-state insulation paste film; c. foaming the foaming material in the base material of a liquid-state insulation paste film to form through holes; d. forming conductive layers at double surfaces and filling with the through holes to form a conductive path. The conductive paste film manufactured by the method has the effect of conduction and has the effect that a conductive zone can be controlled, and has the advantage of simple production technology.
Description
Technical field
The present invention relates to manufacture method of a kind of conductive adhesive film and products thereof, particularly about a kind of conductive effect and the conductive adhesive film manufacture method of conductive region and the finished product of making by this method that can control conductive adhesive film.
Background technology
For preventing the electromagnetic interference of electronic equipment, must form the conduction shielding layer of ground connection around the electronic equipment, and this screen is preferably soft, to adapt to the assembling demand of different form factor.The two sides of glued membrane all must have conductive layer, electrically contacts to reach with the inner surface of electronic component and device housings respectively.
The production method of existing conductive adhesive film normally is provided with wire braid on flexible parent metal.These wire braids are difficult to and base material merges, and easily come off, phenomenons such as fracture and loose contact, thereby make the electric conductivity variation of conductive adhesive film.And this kind mode of production also exists many shortcomings such as apparatus expensive, technology are loaded down with trivial details, product resistance to pressure difference.
Japan Patent JP00/09214 has disclosed a kind of manufacture method of the conductive adhesive film based on semar technique.This patent discloses a kind of the utilization and compresses the conductive adhesive film that spreads upon the electrically conductive microparticle layer on the supporter and obtain having the electrically conductive microparticle compression layer, and above-mentioned electrically conductive microparticle layer is to form by spreading upon the dispersion liquid that contains electrically conductive microparticle and resin on the supporter and making it dry.This manufacture method can only form conductive layer on the two sides of glued membrane respectively, but does not have to solve problem how to set up conductive path in insulation support body.
The another one solution route is a material of seeking special character.As a kind of polymer-matrix electrolyte composition that U.S. Pat 99/20404 is mentioned, said composition has fabulous film forming, pliability, mechanical strength and higher conductivity.Another kind of newer technology is that the organic solvent of the complex compound that comprises a kind of amines and aluminium hydrogen compound and a kind of conduction is formed composition, be coated in the substrate, then it is heat-treated and/or light radiation, thereby form a kind of conductive adhesive film such as electrode or wiring.But these compounds often cost an arm and a leg, complicate fabrication process, and do not solve the problem of conductive path position and density.
Summary of the invention
The object of the present invention is to provide a kind of manufacture method of conductive adhesive film,, provide a kind of production technology simple and can control the conductive adhesive film manufacture method of the conductive effect and the conductive region of conductive adhesive film to overcome above-mentioned the deficiencies in the prior art.
For achieving the above object, the invention provides a kind of manufacture method of conductive adhesive film, it may further comprise the steps: a, sneak into expanded material at the insulating cement film base material of liquid state; B, curing insulating cement film base material; C, make the expanded material foaming in the insulating cement film base material form through hole; D, at two-sided formation conductive layer, and fill up through hole, form conductive path.
Another object of the present invention is to provide a kind of conductive adhesive film of making according to the manufacture method of this kind conductive adhesive film.This conductive adhesive film comprises the insulating cement film base material, is provided with some conductive paths on the insulating cement film base material, and the two-sided formation conductive layer of insulating cement film base material scribbles the conduction viscose on a conductive layer or two conductive layers.When finished product state, also be provided with strippable paper on the described conduction viscose.
Can make the conductive film that is applicable to multiple product and has the ELECTROMAGNETIC OBSCURANT function according to way of the present invention with elasticity and thinner thickness.Manufacture method of the present invention can be controlled its conductive effect by the deal of adjusting expanded material, even control its conductive region, has overcome prior art and can not solve conductive path position and density issue.Manufacture method of the present invention directly forms through hole on base material, therefore conductive path and the conductive layer that forms has integrative-structure, has better electric conductivity and reliability.The manufacture process and the expensive compound of the complexity that is adopted with prior art are compared, and the simple and used material of manufacture method manufacture process of the present invention all is cheap common industrial chemicals.
The present invention is further illustrated below in conjunction with accompanying drawing and embodiment.
Description of drawings
Fig. 1 sneaks into the schematic diagram of expanded material for the insulating cement film base material of liquid state of the present invention.
Fig. 2 is the schematic diagram after insulating cement film base material of the present invention solidifies.
Fig. 3 forms the schematic diagram of through hole for expanded material foaming of the present invention.
Fig. 4 forms the schematic diagram of conductive layer and conductive path for the present invention.
Schematic diagram after Fig. 5 scribbles the conduction viscose and establishes strippable paper for the present invention.
Embodiment
Relevant detailed description of the present invention and technology contents, existing as follows with regard to accompanying drawings:
At first consult Fig. 1, this is the schematic diagram that insulating cement film base material 1 liquid among the present invention is sneaked into expanded material 2.At first prepare a kind of insulating cement film base material 1 of liquid state, in this liquid state glued membrane base material 1, sneak into graininess expanded material 2, the rough thickness that equals final cured glue film of its granular size, the just thickness of the base material of conductive adhesive film in the future.Generally speaking, expanded beads is evenly distributed in the liquid base material to get final product, but can improve in certain embodiments, the electric conductivity of this part with the more intensive conductive path 22 (Fig. 4) of formation by the expanded material 2 of sneaking into a greater number in the part of liquid insulating cement film base material 1.Otherwise the expanded material 2 that also can sneak into lesser amt in the part of liquid insulating cement film base material 1 weakens the electric conductivity of this part.So just can control its conductive effect, even control its conductive region by the deal of adjusting expanded material 2.The liquid insulating cement film base material 1 here can be any by solidifying the material that can form the insulating cement film base material.
See also Fig. 2, this is the schematic diagram after insulating cement film base material of the present invention solidifies.Liquid insulating cement film base material 1 is solidified, when needs insulating cement film base material 11 is certain thickness, can add the thickness that is pressed into expection to the insulating cement film base material 11 that solidifies simultaneously.Light, heat, ultraviolet ray, radiation or magnetic field can make some specific liquid solidify, and these methods all can be arranged in pairs or groups in the present invention and be selected for use specific liquid insulating cement film base material 1 to use.But the most common and the most simple curing still adds curing agent, the composition of curing agent is modal amine, polyamide, acid anhydrides etc., the principle of selecting curing agent in the present invention for use is the insulating properties that does not change insulating cement film base material 11, should avoid dissolving expanded material 2 simultaneously, perhaps produce reaction with expanded material 2.
See also Fig. 3, this is the schematic diagram that foaming forms through hole 21 in the expanded material 2 of the present invention.Expanded material generally respond two kinds on type and thermal decomposition type, the former produces bubble, the latter by chemical reaction and then produces bubble by decomposes.The two can adopt in the present invention, but the former should be noted that the electric property and the physical property that can not influence base material.The most normal employing is the expanded material of thermal decomposition type, and promptly the glued membrane heating to solidifying makes the air in the expanded material 2 in the glued membrane break because of expansion, and forms roughly high density through hole 21 uniformly on glued membrane.
See also Fig. 4, this is the schematic diagram that the present invention forms conductive layer 31,32 and conductive path 22.At the two sided coatings or the conducting layer sputtering 31,32 of insulating cement film base material 11, and make electric conducting material fill through hole 21 on the insulating cement film base material 11, and between the two sides, set up conductive path 22.
See also Fig. 5, this is the schematic diagram after the present invention scribbles conduction viscose 4 and establishes strippable paper 5.On the conductive adhesive film two sides or one side coating conduction viscose 4, then can make suitable size, shape usefulness according to client's needs as conduction and electromagnetic shielding.Can also on viscose 4, establish one deck strippable paper 5 with protection conduction mucigel 4 at finished product state, in the time will being attached on the electronic equipment casing, just it be removed.
Above introduce, it only is preferred embodiment of the present invention, can not limit scope of the invention process with this, i.e. the variation that is equal to done according to the present invention of those skilled in the art in the present technique field is for example carried out combination and variation with each step among the above embodiment.And those skilled in that art improvement, the variation known, all should still belong to the scope that patent of the present invention contains.
Claims (12)
1, a kind of manufacture method of conductive adhesive film is characterized in that it may further comprise the steps: a, sneak into expanded material (2) at the insulating cement film base material (1) of liquid state; B, solidified glue film base material (11); C, make the expanded material foaming in the insulating cement film base material (11) form through hole (21); D, in two-sided formation conductive layer (31,32), and fill up through hole (21), form conductive path (22).
2, conductive adhesive film preparation method as claimed in claim 1 is characterized in that: described expanded material (2) is that diameter satisfies the particle that can run through insulating cement film base material (11) thickness at this its diameter of expanded material foaming back.
3, conductive adhesive film preparation method as claimed in claim 1 is characterized in that: described curing is to add curing agent by the insulating cement film base material (1) in liquid state to carry out.
4, conductive adhesive film preparation method as claimed in claim 1 is characterized in that: can add the thickness that is pressed into expection to insulating cement film base material (11) in the described solidification process.
5, conductive adhesive film preparation method as claimed in claim 1 is characterized in that: described foaming is by carrying out solidifying insulating cement film base material (11) heating.
6, conductive adhesive film preparation method as claimed in claim 1 is characterized in that: described conductive layer (31,32) and conductive path (22) form by coating.
7, conductive adhesive film preparation method as claimed in claim 1 is characterized in that: described conductive layer (31,32) and conductive path (22) form by sputter.
8, conductive adhesive film preparation method as claimed in claim 1 is characterized in that: described preparation method also is included in the step that conductive layer (31,32) is gone up coating conduction viscose (4).
9, conductive adhesive film preparation method as claimed in claim 8 is characterized in that: also be provided with strippable paper (5) on the described conduction viscose (4).
10, a kind of conductive adhesive film, comprise insulating cement film base material (11), on insulating cement film base material (11), be provided with some conductive paths that run through (22), and the two-sided formation conductive layer of insulating cement film base material (11) (31,32), it is characterized in that: this conductive path that runs through is to run through the insulating cement film base material by the foaming of the expanded material that adds in the insulating substrate to form, and the material of described formation conductive layer (31,32) and the material that is arranged in the conductive path (22) that runs through are identical.
11, conductive adhesive film as claimed in claim 10 is characterized in that: also be provided with conduction viscose (4) on the described conductive layer (31,32).
12, conductive adhesive film as claimed in claim 11 is characterized in that: also be provided with strippable paper (5) on the described conduction viscose (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100055941A CN1316515C (en) | 2004-02-18 | 2004-02-18 | Manufacturing method of conducting resin film and its product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100055941A CN1316515C (en) | 2004-02-18 | 2004-02-18 | Manufacturing method of conducting resin film and its product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1658335A CN1658335A (en) | 2005-08-24 |
| CN1316515C true CN1316515C (en) | 2007-05-16 |
Family
ID=35007726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100055941A Expired - Lifetime CN1316515C (en) | 2004-02-18 | 2004-02-18 | Manufacturing method of conducting resin film and its product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1316515C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105969237B (en) * | 2016-06-29 | 2019-03-12 | 深圳市华星光电技术有限公司 | The preparation method of anisotropic conductive film |
| CN109413975A (en) * | 2018-11-05 | 2019-03-01 | 深圳市睿晖新材料有限公司 | A kind of frequency electromagnetic waves shielding material |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2309196A1 (en) * | 1973-02-21 | 1974-09-05 | Matsushita Electric Ind Co Ltd | Making electrical contacts - by plating bore of substrate internally |
| GB1396481A (en) * | 1973-02-15 | 1975-06-04 | Matsushita Electric Ind Co Ltd | Manufacture of printed circuit boards |
| US3936170A (en) * | 1972-08-01 | 1976-02-03 | Minolta Camera Kabushiki Kaisha | Elastic electroconductive product |
| CN1177820A (en) * | 1996-06-12 | 1998-04-01 | 崔圭泽 | Transparent conductive plastic-film electrode and mfg. method thereof |
| JP2000248235A (en) * | 1999-02-26 | 2000-09-12 | Nitto Denko Corp | Electroconductive double-sided adhesive sheet |
| JP2003208820A (en) * | 2002-01-10 | 2003-07-25 | Nitto Denko Corp | Anisotropic conductive film and its manufacturing method |
| JP2003286457A (en) * | 2002-03-28 | 2003-10-10 | Asahi Kasei Corp | Anisotropic conductive adhesive sheet and its manufacturing method |
-
2004
- 2004-02-18 CN CNB2004100055941A patent/CN1316515C/en not_active Expired - Lifetime
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3936170A (en) * | 1972-08-01 | 1976-02-03 | Minolta Camera Kabushiki Kaisha | Elastic electroconductive product |
| GB1396481A (en) * | 1973-02-15 | 1975-06-04 | Matsushita Electric Ind Co Ltd | Manufacture of printed circuit boards |
| DE2309196A1 (en) * | 1973-02-21 | 1974-09-05 | Matsushita Electric Ind Co Ltd | Making electrical contacts - by plating bore of substrate internally |
| CN1177820A (en) * | 1996-06-12 | 1998-04-01 | 崔圭泽 | Transparent conductive plastic-film electrode and mfg. method thereof |
| JP2000248235A (en) * | 1999-02-26 | 2000-09-12 | Nitto Denko Corp | Electroconductive double-sided adhesive sheet |
| JP2003208820A (en) * | 2002-01-10 | 2003-07-25 | Nitto Denko Corp | Anisotropic conductive film and its manufacturing method |
| JP2003286457A (en) * | 2002-03-28 | 2003-10-10 | Asahi Kasei Corp | Anisotropic conductive adhesive sheet and its manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1658335A (en) | 2005-08-24 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: TIANJIN LAI'ERDE ELECTRONIC MATERIAL CO., LTD. Free format text: FORMER OWNER: KERRY TOO LONG IT CO., LTD. Effective date: 20090724 |
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Effective date of registration: 20090724 Address after: Taifeng Road, Tianjin economic and Technological Development Zone Hongtai Industrial Park C3&C4 Building No. 87 Patentee after: TIANJIN LAIRD TECHNOLOGIES Ltd. Address before: 6F, 94 West Creek Street, three heavy County, Taiwan, Taipei Patentee before: CATERON TECHNOLOGY CO.,LTD. |
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| TR01 | Transfer of patent right |
Effective date of registration: 20201127 Address after: No.398 Yuandian Road, Xinzhuang Industrial Zone, Minhang District, Shanghai, 201108, China Patentee after: LAIRD TECHNOLOGIES, Inc. Address before: Plant C3 & C4, Hongtai Industrial Park, 87 Taifeng Road, Tianjin Economic and Technological Development Zone, 300457 Patentee before: TIANJIN LAIRD TECHNOLOGIES Ltd. |
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| CX01 | Expiry of patent term |
Granted publication date: 20070516 |
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| CX01 | Expiry of patent term |