CN105969237B - The preparation method of anisotropic conductive film - Google Patents
The preparation method of anisotropic conductive film Download PDFInfo
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- CN105969237B CN105969237B CN201610493208.0A CN201610493208A CN105969237B CN 105969237 B CN105969237 B CN 105969237B CN 201610493208 A CN201610493208 A CN 201610493208A CN 105969237 B CN105969237 B CN 105969237B
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K3/08—Metals
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/10—Encapsulated ingredients
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/18—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet characterized by perforations in the adhesive tape
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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- Chemical & Material Sciences (AREA)
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- Inorganic Chemistry (AREA)
- Non-Insulated Conductors (AREA)
Abstract
The present invention provides a kind of preparation method of anisotropic conductive film, hole that is several being arranged regularly and running through the resin glue film is first produced on resin glue film, then in the several holes for the conduction liquid comprising conducting particles being instilled the resin glue film by the way of spraying, obtain anisotropic conductive adhesive layer, wherein, the arrangement mode of hole can carry out special designing according to the concrete application scene of anisotropic conductive film on resin glue film, so as to accurately control distribution situation of the conducting particles in anisotropic conductive film, anisotropic conductive film material especially suitable for high-precision requirement.
Description
Technical field
The present invention relates to field of display technology more particularly to a kind of preparation methods of anisotropic conductive film.
Background technique
With the development of electronic technology, electronic product, liquid crystal are increasingly be unable to do without in daily life and work
Important component of the display screen as electronic product, also closely affects the usage experience of people.
Anisotropic conductive film (Anisotropic Conductive Film, ACF) be have simultaneously then, it is conductive, absolutely
The conduction that the translucent polymer continuous material of three kinds of characteristics of edge mainly includes resin glue material and is mixed in resin glue material
Particle has the characteristic in vertical direction conducting, horizontal direction insulation.The application of ACF has had more than 60 years to go through so far
History, as lighter, thinner, shorter, the smaller market demands of binding structure (bonding) and development trend, ACF are widely used in
In the design of domestic electronic appliances, especially prominent is the application in liquid crystal display (LCD), can be used to form display panel
Binding structure between circuit layer, for example, liquid crystal display connects flexible circuit board in the manufacturing process of liquid crystal display panel
When (Flexible Printed Circuit, FPC), the connecting lead wire on the connecting lead wire and FPC on liquid crystal display is led to
It crosses label to be accurately positioned, then hot pressing ACF is bonded；Using ACF bound to be mainly characterized by pressing against the time short,
The reliability of connection is high, is easy for minute protrusions (bump), and be easy for the electricity of fine mode (fine pitch patterns)
Interpolar conducting.
The preparation process of traditional anisotropic conductive film specifically includes that the mixing by resin glue material and conducting particles
The step of, by the mixture coating film forming of resin glue material and conducting particles the step of, segmentation step, winding step and encapsulation walk
This rapid 5 steps.But the anisotropic conductive film produced in this way, in conducting particles distribution situation can not
It is controlled, it is difficult between electrode in the binding structure formed using anisotropic conductive film made from the conventional preparation techniques
To maintain identical conducting resistance, there are partial electrodes not in contact with the risk for arriving conducting particles, sends out so as to cause the situation of open circuit
Raw, therefore, the electric conductivity of material is restricted.
Summary of the invention
The purpose of the present invention is to provide a kind of preparation methods of anisotropic conductive film, can accurately control conducting particles
Distribution situation, the anisotropic conductive film material especially suitable for high-precision requirement.
To achieve the above object, the present invention provides a kind of preparation methods of anisotropic conductive film, comprising the following steps:
Step 1 provides a hard plate and substrate membrane material, and the substrate membrane material is fixed on the hard plate；
Step 2 is coated with one layer of resin material in the substrate membrane material, forms resin glue film；
Step 3 produces several holes through the resin glue film on the resin glue film；
Step 4 provides conducting particles and solvent, disperses the conducting particles in the solvent, obtains conduction liquid, so
In several holes that conduction liquid is instilled the resin glue film by the way of spraying afterwards, then by the solvent in several holes
Removal, obtains anisotropic conductive adhesive layer, and the anisotropic conductive adhesive layer includes resin glue film and positioned at the hole of the resin glue film
Conducting particles in hole；
Step 5 separates substrate membrane material with hard plate, then carries out to substrate membrane material and anisotropic conductive adhesive layer
Cutting；Or first substrate membrane material and anisotropic conductive adhesive layer are cut, then substrate membrane material is separated with hard plate；
Step 6 carries out winding and encapsulation to substrate membrane material and anisotropic conductive adhesive layer, completes the system of anisotropic conductive film
It is standby, obtain include substrate membrane material and anisotropic conductive adhesive layer anisotropic conductive film.
In the step 2, the coating layer thickness for the resin material being coated in the substrate membrane material is 15-45 μm.
In the step 2, the resin material being coated in the substrate membrane material is epoxy system resin or acrylic compounds tree
Rouge.
The conducting particles provided in the step 4 is carbon fiber, carbon nanotube ball, metallic or conductive gold spacer；
Wherein, the conductive gold spacer include polymer core and successively coat from inside to outside the polymer core nickel layer and
Layer gold.
In the step 3, the several holes formed on the resin glue film being answered according to the specific of anisotropic conductive film
It is accordingly arranged with scene.
The hard plate provided in the step 1 is glass plate, and the substrate membrane material provided is polyimide film.
In the step 2, resin material is coated in the substrate membrane material using spin coating or slot coated mode.
The solvent provided in the step 4 is ethyl alcohol；It will be in several holes by way of baking in the step 4
Solvent removal.
In the step 5, the cutting width cut to substrate membrane material and anisotropic conductive adhesive layer is 1.5-3.5mm.
In the step 3, number is produced on the resin glue film using yellow light process or using nanometer embossing
A hole.
Beneficial effects of the present invention: the present invention provides a kind of preparation methods of anisotropic conductive film, first in resin glue
Hole that is several being arranged regularly and running through the resin glue film is produced on film, it then will be comprising leading by the way of spraying
The conduction liquid of charged particle instills in several holes of the resin glue film, obtains anisotropic conductive adhesive layer, wherein on resin glue film
The arrangement mode of hole can carry out special designing according to the concrete application scene of anisotropic conductive film, so as to accurately control
Distribution situation of the conducting particles processed in anisotropic conductive film, the anisotropic conductive film material especially suitable for high-precision requirement
Material.
For further understanding of the features and technical contents of the present invention, it please refers to below in connection with of the invention detailed
Illustrate and attached drawing, however, the drawings only provide reference and explanation, is not intended to limit the present invention.
Detailed description of the invention
With reference to the accompanying drawing, by the way that detailed description of specific embodiments of the present invention, technical solution of the present invention will be made
And other beneficial effects are apparent.
In attached drawing,
Fig. 1 is the flow chart of the preparation method of anisotropic conductive film of the invention；
Fig. 2-3 is the schematic diagram of the preparation method step 1 of anisotropic conductive film of the invention；
Fig. 4-5 is the schematic diagram of the preparation method step 2 of anisotropic conductive film of the invention；
Fig. 6-7 is the schematic diagram of the preparation method step 3 of anisotropic conductive film of the invention；
Fig. 8-9 is the schematic diagram of the preparation method step 4 of anisotropic conductive film of the invention；
Figure 10 is the schematic diagram of the preparation method step 5 of anisotropic conductive film of the invention.
Specific embodiment
Further to illustrate technological means and its effect adopted by the present invention, below in conjunction with preferred implementation of the invention
Example and its attached drawing are described in detail.
Referring to Fig. 1, the present invention provides a kind of preparation method of anisotropic conductive film, comprising the following steps:
Step 1, as Figure 2-3, provide a hard plate 100, with substrate membrane material 210, the substrate membrane material 210 is consolidated
It is scheduled on the hard plate 100.
Wherein, fixation of the substrate membrane material 210 on the hard plate 100 can be used in the art at present existing soft
Property film fixed form carry out because being the prior art, details are not described herein.
Specifically, the hard plate 100 provided in the step 1 is glass plate.
Specifically, the substrate membrane material 210 provided in the step 1 is polyimide film.
Step 2, as illustrated in figures 4-5, using spin coating (spin coater) or slot coated (slit) mode in the substrate
It is coated with the resin material that a layer thickness is 15-45 μm in membrane material 210, forms resin glue film 221.
Specifically, in the step 2, the resin material being coated in the substrate membrane material 210 can be thermoplastic resin
Such as acrylic resin, or thermosetting resin such as epoxy system resin etc..
Step 3, as shown in fig. 6-7, using yellow light process, using mask plate (mask) by way of exposure development,
Several holes 222 through the resin glue film 221 being arranged regularly are produced on the resin glue film 221；Alternatively, using
Nanometer embossing produces several holes through the resin glue film 221 being arranged regularly on the resin glue film 221
Hole 222.
Specifically, the size and spacing of hole 222 can be conductive according to prepared anisotropy on the resin glue film 221
The concrete application scene of glue film and carry out special designing.
Step 4, as Figure 8-9, conducting particles 223 and solvent are provided, dispersed the conducting particles 223 in described molten
In agent, conduction liquid is obtained, in several holes 222 that conduction liquid is then instilled the resin glue film 221 by the way of spraying,
Then the solvent in several holes 222 is removed, obtains anisotropic conductive adhesive layer 220, the anisotropic conductive adhesive layer 220 wraps
Include resin glue film 221 and the conducting particles 223 in the hole 222 of the resin glue film 221.
Specifically, the conducting particles 223 provided in the step 4 can for carbon fiber, carbon nanotube ball (CNT ball),
The particle of all conductive energy such as metallic, traditional conductive gold spacer, wherein the conductive gold spacer includes polymer
Core and nickel (Ni) layer and golden (Au) layer for successively coating the polymer core from inside to outside.
Specifically, the solvent provided in the step 4 is ethyl alcohol, can be by way of baking by the number in the step 4
Solvent removal in a hole 222.
Specifically, since in the present invention, conducting particles 223 is targetedly distributed in several holes of the resin glue film 221
In hole 222, so that special designing is carried out by concrete application scene by the arrangement mode to the hole 222 on resin glue film 221,
Distribution situation of the conducting particles 223 in anisotropic conductive film can be accurately controlled, therefore uses preparation method of the invention
Obtained anisotropic conductive film and in the binding structure that is formed, be easy to maintain identical conducting resistance between electrode, and
Can be avoided partial electrode causes the situation of open circuit to occur not in contact with to conducting particles.
Step 5, as shown in Figure 10, substrate membrane material 210 is separated with hard plate 100, then to substrate membrane material 210
It is cut with anisotropic conductive adhesive layer 220；Alternatively, first being cut to substrate membrane material 210 and anisotropic conductive adhesive layer 220, then will
Substrate membrane material 210 is separated with hard plate 100.
Specifically, in the step 5, cutting that the substrate membrane material 210 is cut with anisotropic conductive adhesive layer 220
Width is 1.5-3.5mm.
Step 6 carries out winding and encapsulation to substrate membrane material 210 and anisotropic conductive adhesive layer 220, completes anisotropic conductive adhesive paste
The preparation of film, obtain include substrate membrane material 210 Yu anisotropic conductive adhesive layer 220 anisotropic conductive film.
In conclusion first being made on resin glue film the present invention provides a kind of preparation method of anisotropic conductive film
Hole that is several being arranged regularly out and running through the resin glue film, then will include conducting particles by the way of spraying
Conduction liquid instills in several holes of the resin glue film, obtains anisotropic conductive adhesive layer, wherein the row of hole on resin glue film
Column mode can carry out special designing according to the concrete application scene of anisotropic conductive film, so as to accurately control conductive particle
Distribution situation of the son in anisotropic conductive film, the anisotropic conductive film material especially suitable for high-precision requirement.
The above for those of ordinary skill in the art can according to the technique and scheme of the present invention and technology
Other various corresponding changes and modifications are made in design, and all these change and modification all should belong to the claims in the present invention
Protection scope.
Claims (10)
1. a kind of preparation method of anisotropic conductive film, which comprises the following steps:
Step 1 provides a hard plate (100) and substrate membrane material (210), the substrate membrane material (210) is fixed on described hard
On matter plate (100)；
Step 2 is coated with one layer of resin material on the substrate membrane material (210), is formed resin glue film (221)；
Step 3 produces several holes (222) through the resin glue film (221) on the resin glue film (221)；
Step 4 provides conducting particles (223) and solvent, disperses the conducting particles (223) in the solvent, is led
It is electro-hydraulic, in several holes (222) that conduction liquid is then instilled the resin glue film (221) by the way of spraying, then will
Solvent removal in several holes (222), obtains anisotropic conductive adhesive layer (220), anisotropic conductive adhesive layer (220) packet
The conducting particles (223) for including resin glue film (221) and being located in the hole (222) of the resin glue film (221)；
Step 5 separates substrate membrane material (210) with hard plate (100), then to substrate membrane material (210) and anisotropy
Conductive adhesive layer (220) is cut；Alternatively, first cut to substrate membrane material (210) and anisotropic conductive adhesive layer (220), then by base
Counterdie material (210) is separated with hard plate (100)；
Step 6 carries out winding and encapsulation to substrate membrane material (210) and anisotropic conductive adhesive layer (220), completes anisotropic conductive adhesive paste
The preparation of film, obtain include substrate membrane material (210) Yu anisotropic conductive adhesive layer (220) anisotropic conductive film.
2. the preparation method of anisotropic conductive film as described in claim 1, which is characterized in that in the step 2, described
The coating layer thickness for the resin material being coated in substrate membrane material (210) is 15-45 μm.
3. the preparation method of anisotropic conductive film as described in claim 1, which is characterized in that in the step 2, described
The resin material being coated in substrate membrane material (210) is epoxy system resin or acrylic resin.
4. the preparation method of anisotropic conductive film as described in claim 1, which is characterized in that provided in the step 4
Conducting particles (223) is carbon fiber, carbon nanotube ball, metallic or conductive gold spacer；
Wherein, the conductive gold spacer includes polymer core and successively coats the nickel layer and layer gold of the polymer core from inside to outside.
5. the preparation method of anisotropic conductive film as described in claim 1, which is characterized in that in the step 3, described
The several holes (222) formed on resin glue film (221) are accordingly carried out according to the concrete application scene of anisotropic conductive film
Arrangement.
6. the preparation method of anisotropic conductive film as described in claim 1, which is characterized in that provided in the step 1
Hard plate (100) is glass plate, and the substrate membrane material (210) provided is polyimide film.
7. the preparation method of anisotropic conductive film as described in claim 1, which is characterized in that in the step 2, using rotation
It applies or slot coated mode is coated with resin material on the substrate membrane material (210).
8. the preparation method of anisotropic conductive film as described in claim 1, which is characterized in that provided in the step 4
Solvent is ethyl alcohol；The solvent in several holes (222) is removed by way of baking in the step 4.
9. the preparation method of anisotropic conductive film as described in claim 1, which is characterized in that in the step 5, to substrate
The cutting width that membrane material (210) and anisotropic conductive adhesive layer (220) are cut is 1.5-3.5mm.
10. the preparation method of anisotropic conductive film as described in claim 1, which is characterized in that in the step 3, use
Yellow light process or use nanometer embossing produce several holes (222) on the resin glue film (221).
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| CN201610493208.0A CN105969237B (en) | 2016-06-29 | 2016-06-29 | The preparation method of anisotropic conductive film |
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| CN105969237B true CN105969237B (en) | 2019-03-12 |
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Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108611002B (en) * | 2016-12-05 | 2019-09-13 | 航天特种材料及工艺技术研究所 | A kind of polyimide support glue film and preparation method thereof |
| CN107452438B (en) | 2017-07-27 | 2019-10-11 | 京东方科技集团股份有限公司 | A kind of anisotropy conductiving glue band and tape roll, binding structure and display device |
| KR102254467B1 (en) * | 2018-07-12 | 2021-05-21 | 에이치엔에스하이텍(주) | Manufacturing method for anisotropic conductive adhesive film |
| CN109628002B (en) * | 2018-11-21 | 2020-06-02 | 武汉华星光电半导体显示技术有限公司 | Anisotropic conductive adhesive tape and manufacturing method thereof |
| CN109637699B (en) * | 2018-12-12 | 2020-05-12 | 武汉华星光电半导体显示技术有限公司 | Method and apparatus for manufacturing anisotropic conductive film |
| CN112521873A (en) * | 2020-12-01 | 2021-03-19 | 湖南省凯纳方科技有限公司 | Method for manufacturing anisotropic conductive film |
| CN115368849B (en) * | 2021-05-20 | 2023-10-03 | 中国科学院福建物质结构研究所 | Anisotropic conductive adhesive film and preparation method and application thereof |
| US20230310336A1 (en) * | 2022-03-31 | 2023-10-05 | Novocure Gmbh | Electrode Assembly Having Perforated Anisotropic Layer, And Systems And Methods Of Applying Tumor-Treating Fields Using Same |
| WO2023219357A1 (en) * | 2022-05-09 | 2023-11-16 | 주식회사 마이다스에이치앤티 | Stretchable anisotropic conductive film containing liquid metal particles and manufacturing method therefor |
| CN115386318B (en) * | 2022-09-02 | 2023-10-13 | 中国科学院合肥物质科学研究院 | Anisotropic conductive adhesive, preparation and application thereof in ultra-fine pitch electrode packaging |
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| CN1658335A (en) * | 2004-02-18 | 2005-08-24 | 嘉得隆科技股份有限公司 | Manufacturing method of conducting resin film and its product |
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