CN106405892B - The crimping structure and compression bonding method of panel display apparatus - Google Patents
The crimping structure and compression bonding method of panel display apparatus Download PDFInfo
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- CN106405892B CN106405892B CN201610936615.4A CN201610936615A CN106405892B CN 106405892 B CN106405892 B CN 106405892B CN 201610936615 A CN201610936615 A CN 201610936615A CN 106405892 B CN106405892 B CN 106405892B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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Abstract
In the crimping structure and compression bonding method of panel display apparatus provided by the invention, first insulation system and the second insulation system are made using insulating materials, so that conducting particles is stuck in the accommodation space that first insulation system and the second insulation system cooperatively form in crimping, avoids conducting particles intensive and ACF is caused laterally to be connected.
Description
Technical field
The present invention relates to field of display technology, in particular to the crimping structure and compression bonding method of a kind of panel display apparatus.
Background technique
In recent years, with the fast development and application of information technology, radio mobile communication and information household appliances, people are to electronics
The dependence of product is growing day by day, more brings flourishing for various display technologies and display device.Panel display apparatus has
Fully planarize, be light, is thin, power saving the features such as, therefore be widely used.Current main panel display apparatus includes liquid
Crystal display (Liquid crystal displays, abbreviation LCD), plasma scope (Plasma display
Panel, abbreviation PDP), field-emitter display (Field emission displays, abbreviation FED), organic electroluminescent it is aobvious
Show device (Organic light-emitting diode displays, abbreviation OLED) etc..
Anisotropic conductive film (Anisotropic Conductive Film, abbreviation ACF) is that one kind contains conducting particles
Thermmohardening or thermoplasticity resin film, there is between the conducting particles certain gap.It is filled in various FPD
In the manufacturing process set, usually utilize ACF by chip (IC), flexible circuit board (flexible circuit board, abbreviation
) etc. FPC electronic devices are fixed on a display panel, and electrically conduct with display panel realization.
It is structural representation of the panel display apparatus of the prior art after mould group technique incorporated by reference to reference Fig. 1 and Fig. 2
Figure.As depicted in figs. 1 and 2, the display panel 10 of panel display apparatus has the step for crimping chip and flexible circuit board
Anisotropic conductive film 13 is first coated on the step side of display panel 10 by side in mould group technical process, is recycled certain
The electronic devices such as chip 11, flexible circuit board 12 are crimped on formation mould group on display panel 10 by pressure and temperature, due to described
The conducting particles 15 of anisotropic conductive film 13 is in close contact after extrusion, so that the electricity such as the chip 11, flexible circuit board 12
The crimp type terminal 10a of the crimp type terminal 10b of sub- device and display panel 10 is realized in vertical direction (i.e. Z-direction) electrically to be led
It is logical, meanwhile, still there is certain gap in the horizontal direction, therefore do not lead between conducting particles 15 between adjacent electrode
It is logical.
However, finding in practical manufacturing process, the conducting particles of ACF is not substantially uniformity in resin film,
The portion of ACF will appear the intensive phenomenon of conducting particles.Moreover, ACF will appear conducting particles to two after squeezing
The phenomenon that side is mobile, leads to the conducting particles more crypto set of horizontal direction.Referring to FIG. 3, it is the FPD of the prior art
There is the intensive structural schematic diagram of conducting particles after mould group technique in device.As shown in figure 3, anisotropic conductive film 13 is passing through
After extruding, conducting particles 15 is assembled in the two sides of crimp type terminal, causes ACF laterally conducting (i.e. horizontal direction conducting), makes
Obtain short circuit between adjacent crimp type terminal.
Base this, how to solve the problems, such as existing panel display apparatus be easy to appear in the fabrication process ACF laterally be connected,
At those skilled in the art's technical problem urgently to be resolved.
Summary of the invention
The purpose of the present invention is to provide a kind of crimping structure of panel display apparatus and compression bonding methods, existing to solve
Panel display apparatus is easy to appear the problem of ACF is laterally connected in the fabrication process.
In order to solve the above technical problems, the present invention provides a kind of crimping structure of panel display apparatus, the FPD
The crimping structure of device include: multiple first crimp type terminals, multiple second crimp type terminals and be set to it is the multiple first pressure
Anisotropic conductive film between connecting terminal and multiple second crimp type terminals；
Wherein, the first insulation system is each formed between the multiple first crimp type terminal, first insulation system
Side has multiple first pits, the second insulation system is each formed between the multiple second crimp type terminal, described second absolutely
The side of edge structure has multiple second dimples, and the multiple first pit is opposite one by one with the position of multiple second dimples, and
An accommodation space is collectively formed in first pit and second dimple, and the accommodation space is for accommodating at least one described different side
The conducting particles of property conductive adhesive film.
Optionally, in the crimping structure of the panel display apparatus, the accommodation space is spherical accommodation space, institute
The diameter for stating spherical accommodation space is greater than the diameter of the conducting particles.
Optionally, in the crimping structure of the panel display apparatus, the accommodation space is elliposoidal accommodation space,
The minimum diameter of the elliposoidal accommodation space is greater than the diameter of the conducting particles.
Optionally, in the crimping structure of the panel display apparatus, first insulation system and the second insulation are tied
The material that structure uses is identical, is organic material, silicon nitride or silica.
Optionally, in the crimping structure of the panel display apparatus, first pit passes through with second dimple
Transfer printing process or etching technics are made.
Optionally, in the crimping structure of the panel display apparatus, first pit and the second dimple
Shape and size are all the same.
Optionally, in the crimping structure of the panel display apparatus, the display panel be liquid crystal display panel or
Organic electroluminescent display panel.
The present invention also provides a kind of compression bonding method of panel display apparatus, the compression bonding method packet of the panel display apparatus
It includes:
A display panel is provided, the display panel has multiple first crimp type terminals；
Form the first insulation system between the multiple first crimp type terminal, first insulation system has multiple the
One pit；
Anisotropic conductive film is coated on first insulation system and multiple first crimp type terminals；
One chip or flexible circuit board are provided, the chip or flexible circuit board have multiple second crimp type terminals,
Form the second insulation system between the multiple second crimp type terminal, second insulation system has multiple the
Two pits；And
By the chip or flexible circuit board crimping on said display panel so that the multiple first pit with it is multiple
The position of second dimple is opposite one by one, and a diameter of Spherical Volume is collectively formed in first pit and second dimple.
Optionally, in the compression bonding method of the panel display apparatus, first insulation system and the second insulation are tied
The material that structure uses is identical, is organic material, silicon nitride or silica.
Optionally, in the compression bonding method of the panel display apparatus, first pit passes through with second dimple
Transfer printing process or etching technics are made.
In the crimping structure and compression bonding method of panel display apparatus provided by the invention, using insulating materials production first
Insulation system and the second insulation system, so that conducting particles is stuck in first insulation system and the second insulation system in crimping
In the accommodation space cooperatively formed, avoids conducting particles intensive and ACF is caused laterally to be connected.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the panel display apparatus of the prior art after mould group technique；
Fig. 2 is the enlarged diagram of region A in Fig. 1；
Fig. 3 is that the panel display apparatus of the prior art the intensive structural schematic diagram of conducting particles occurs after mould group technique；
Fig. 4 is the structural schematic diagram of the crimping structure of the panel display apparatus of the embodiment of the present invention one；
Fig. 5 is the structural schematic diagram of the crimping structure of the panel display apparatus of the embodiment of the present invention two；
Fig. 6 is the structural schematic diagram of the crimping structure of the panel display apparatus of the embodiment of the present invention three；
Fig. 7 is the flow chart of the compression bonding method of the panel display apparatus of other embodiments of the invention.
Specific embodiment
Crimping structure and crimping side below in conjunction with the drawings and specific embodiments to panel display apparatus proposed by the present invention
Method is described in further detail.According to following explanation and claims, advantages and features of the invention will be become apparent from.It needs to illustrate
, attached drawing is all made of very simplified form and using non-accurate ratio, only conveniently, lucidly to aid in illustrating originally
The purpose of inventive embodiments.
[embodiment one]
Referring to FIG. 4, its structural schematic diagram for the crimping structure of the panel display apparatus of the embodiment of the present invention one.Such as figure
Shown in 4, the crimping structure 200 of the panel display apparatus includes: multiple first crimp type terminals on display panel 20
20a, multiple second crimp type terminal 20b on chip and/or flexible circuit board 22 and be set to it is the multiple first pressure
Anisotropic conductive film between connecting terminal 20a and multiple second crimp type terminal 20b；The multiple first crimp type terminal 20a it
Between be each formed with the first insulation system 30a, the first insulation system 30a side have multiple first pits, it is the multiple
The side of the second insulation system 30b, the second insulation system 30b is each formed between second crimp type terminal 20b with multiple
Second dimple, the multiple first pit is opposite one by one with the position of multiple second dimples, and first pit and second recessed
An accommodation space is collectively formed in hole, and the accommodation space is used to accommodate the conducting particles of at least one anisotropic conductive film
25。
Specifically, the first insulation system 30a is opposite with the position of the second insulation system 30b, and opposed facing one
Side is provided with multiple pits, and the second of the first pit of the first insulation system 30a and the second insulation system 30b is recessed
An accommodation space is collectively formed in hole.
In the present embodiment, multiple first pits of the first insulation system 30a and the second insulation system 30b's is more
A second dimple is close to hemispheric arc pit.Therefore the first pit of the first insulation system 30a and described the
A spherical accommodation space is collectively formed in the second dimple of two insulation system 30b, and the diameter of the spherical shape accommodation space is generally higher than
The diameter of the conducting particles 25 of ACF.
In the present embodiment, the diameter of the conducting particles 25 is 3 μm, and the diameter of the spherical shape accommodation space is greater than 3 μm.Example
Such as, the diameter of the spherical accommodation space is 3.5 μm, 4 μm, 4.5 μm, 5 μm, 6 μm or 8 μm.
In the present embodiment, the first insulation system 30a and the second insulation system 30b using organic material or other be easy to
Obtain the insulating materials of pit, such as silicon nitride (SiNx) or silica (SiOx).
In the present embodiment, first pit passes through transfer printing process with second dimple or etching technics is made, and described
Second dimple and the shape and size of first pit are all the same.
Preferably, the first insulation system 30a is identical as the material that the second insulation system 30b is used.
As shown in figure 4, in the crimping structure 200 of the panel display apparatus, the first crimp type terminal 20a and second
Conducting particles 25 between crimp type terminal 20b is in close contact due to extruding, and Z-direction (in figure shown in dotted arrow) realizes electricity
Property conducting, the conducting particles 25 beside the first crimp type terminal 20a and the second crimp type terminal 20b is stuck in described first and insulate
Between structure 30a and the second insulation system 30b, due to the limitation of spherical accommodation space, the conducting particles 25 is in the horizontal direction
On do not contact with each other, therefore can thoroughly avoid ACF transverse direction conduction problem.At the same time, due to the first insulation system 30a
There is wavy curved surface with the second insulation system 30b, the lateral adhesive force of ACF is increased, and which thereby enhances the crimping knot
The reliability of structure 200.
In the present embodiment, each spherical shape accommodation space accommodates a conducting particles 25.In other embodiments, each spherical shape
Accommodation space accommodates two, even more than conducting particles 25.
In the present embodiment, the first insulation system 30a is crimped with the thickness of the second insulation system 30b according to described first
Terminal 20a is configured with the height of the second crimp type terminal 20b and the diameter of conducting particles 25, as long as can be avoided described lead
Charged particle 25 is crushed in crimping.
[embodiment two]
Referring to FIG. 5, its structural schematic diagram for the crimping structure of the panel display apparatus of the embodiment of the present invention two.Such as figure
Shown in 5, the crimping structure 200 of the panel display apparatus includes: multiple first crimp type terminals on display panel 20
20a, multiple second crimp type terminal 20b on chip and/or flexible circuit board 22 and be set to it is the multiple first pressure
Anisotropic conductive film between connecting terminal 20a and multiple second crimp type terminal 20b；The multiple first crimp type terminal 20a it
Between be each formed with the first insulation system 30a, the first insulation system 30a side have multiple first pits, it is the multiple
The side of the second insulation system 30b, the second insulation system 30b is each formed between second crimp type terminal 20b with multiple
Second dimple, the multiple first pit is opposite one by one with the position of multiple second dimples, and first pit and second recessed
An accommodation space is collectively formed in hole, and the accommodation space is used to accommodate the conducting particles of at least one anisotropic conductive film
25。
In the present embodiment, the second of the first pit of the first insulation system 30a and the second insulation system 30b is recessed
Hole is arc pit, and an elliposoidal accommodation space is collectively formed, and the minimum diameter of the elliposoidal accommodation space, which is greater than, leads
The diameter of charged particle 25.
Due to the limitation of elliposoidal accommodation space, the conducting particles 25 does not contact with each other in the horizontal direction, therefore energy
It is enough thoroughly to avoid ACF transverse direction conduction problem.At the same time, since the first insulation system 30a and the second insulation system 30b has
There is wavy curved surface, the lateral adhesive force of ACF is increased, and which thereby enhances the reliability of the crimping structure 200.
[embodiment three]
Referring to FIG. 6, its structural schematic diagram for the crimping structure of the panel display apparatus of the embodiment of the present invention three.Such as figure
Shown in 6, the crimping structure 200 of the panel display apparatus includes: multiple first crimp type terminals on display panel 20
20a, multiple second crimp type terminal 20b on chip and/or flexible circuit board 22 and be set to it is the multiple first pressure
Anisotropic conductive film between connecting terminal 20a and multiple second crimp type terminal 20b；The multiple first crimp type terminal 20a it
Between be each formed with the first insulation system 30a, the first insulation system 30a side have multiple first pits, it is the multiple
The side of the second insulation system 30b, the second insulation system 30b is each formed between second crimp type terminal 20b with multiple
Second dimple, the multiple first pit is opposite one by one with the position of multiple second dimples, and first pit and second recessed
An accommodation space is collectively formed in hole, and the accommodation space is used to accommodate the conducting particles of at least one anisotropic conductive film
25。
In the present embodiment, the second of the first pit of the first insulation system 30a and the second insulation system 30b is recessed
A polygon accommodation space is collectively formed to be trapezoidal pit in the cross section in hole.
Due to the limitation of polygon accommodation space, the conducting particles 25 does not contact with each other in the horizontal direction, therefore energy
It is enough thoroughly to avoid ACF transverse direction conduction problem.At the same time, due to the first insulation system 30a's and the second insulation system 30b
Surface has concave-convex fluctuating, and the lateral adhesive force of ACF is increased, and which thereby enhances the reliability of the crimping structure 200.
Correspondingly, the present invention also provides a kind of compression bonding methods of panel display apparatus.Referring to FIG. 7, it is the present invention
The flow chart of the compression bonding method of the panel display apparatus of embodiment.As shown in fig. 7, the compression bonding method packet of the panel display apparatus
It includes:
Step 1: providing a display panel, and the display panel has multiple first crimp type terminals；
Step 2: forming the first insulation system between multiple first crimp type terminals of the display panel, and described first
Insulation system has multiple first pits；
Step 3: anisotropic conductive film is coated on first insulation system and multiple first crimp type terminals；
Step 4: providing a chip or flexible circuit board, and the chip or flexible circuit board have multiple second pressure connection terminals
Son,
Step 5: the second insulation system, the second insulation system tool are formed between the multiple second crimp type terminal
There are multiple second dimples；
Step 6: on said display panel by the chip or flexible circuit board crimping, so that the multiple first is recessed
Hole is opposite one by one with the position of multiple second dimples, and an accommodation space is collectively formed in first pit and second dimple.
Below in conjunction with specific embodiments and the drawings 4-6, the present invention will be described in detail.
Firstly, providing a display panel 20, the display panel 20 has a step side, is placed on the step side more
A first crimp type terminal 20a.
Then, the first insulation system 30a, institute are formed between multiple first crimp type terminal 20a of the display panel 20
The first insulation system 30a is stated with multiple first pits.The multiple first pit is by transfer printing process or etching technics shape
At.
Then, anisotropic conductive film is coated on the first insulation system 30a and multiple first crimp type terminal 20a
On.
Later, a chip (or flexible circuit board) 22 is provided, the chip (or flexible circuit board) 22 has multiple second
Crimp type terminal 20b.
Hereafter, the second insulation system 30b, the second insulation knot are formed between the multiple second crimp type terminal 20b
Structure 30b has multiple second dimples.The multiple first pit is also to be formed by transfer printing process or etching technics.
Wherein, the position of the multiple first pit and the multiple second dimple corresponds, and first pit
It is all the same with the shape and size of the second dimple.
In the present embodiment, first pit and the second dimple are close to hemispheric arc pit.At other
In embodiment, the cross sectional shape of first pit and the second dimple can be triangle, quadrangle, pentagon etc., only
The accommodation space for wanting first pit and the second dimple to be collectively formed can limit the conducting particles of ACF in the horizontal direction
On position, be not in contact with each other conducting particles.
Finally, the chip (or flexible circuit board) 22 is crimped on the display panel 20 using certain pressure and temperature
On, form mould group.At this point, first pit and second dimple are collectively formed a spherical accommodation space, beside crimp type terminal
Conducting particles 25 is stuck in the spherical accommodation space.
So far, the crimping structure 200 of the panel display apparatus is formed.
In the present embodiment, the display panel 20 is liquid crystal display panel or OLED display panel.Correspondingly, the plate
Display device is liquid crystal display device or OLED display.
In other embodiments, chip provided by step 4 (or flexible circuit board) 22 not only has multiple second crimping
Terminal, and it is formed with the second insulation system between multiple second crimp type terminals, it can be omitted step 5 in the case.
To sum up, in the crimping structure and compression bonding method of panel display apparatus provided in an embodiment of the present invention, using insulation
Material makes the first insulation system and the second insulation system so that conducting particles be stuck in crimping first insulation system and
In the accommodation space that second insulation system cooperatively forms, avoids conducting particles intensive and ACF is caused laterally to be connected.
Foregoing description is only the description to present pre-ferred embodiments, not to any restriction of the scope of the invention, this hair
Any change, the modification that the those of ordinary skill in bright field does according to the disclosure above content, belong to the protection of claims
Range.
Claims (10)
1. a kind of crimping structure of panel display apparatus characterized by comprising multiple first crimp type terminals, multiple second pressures
Connecting terminal and the anisotropic conductive film being set between the multiple first crimp type terminal and multiple second crimp type terminals；
Wherein, the first insulation system, the side of first insulation system are each formed between the multiple first crimp type terminal
With multiple first pits, the second insulation system, the second insulation knot are each formed between the multiple second crimp type terminal
The side of structure has multiple second dimples, and the multiple first pit is opposite one by one and described with the position of multiple second dimples
An accommodation space is collectively formed in first pit and second dimple, and the accommodation space is led for accommodating at least one described anisotropy
The conducting particles of electric glue film, the accommodation space that first pit is collectively formed with the second dimple can limit leading for ACF
The position of charged particle in the horizontal direction, is not in contact with each other conducting particles.
2. the crimping structure of panel display apparatus as described in claim 1, which is characterized in that the accommodation space is spherical holds
Receive space, the diameter of the spherical shape accommodation space is greater than the diameter of the conducting particles.
3. the crimping structure of panel display apparatus as described in claim 1, which is characterized in that the accommodation space is elliposoidal
Accommodation space, the minimum diameter of the elliposoidal accommodation space are greater than the diameter of the conducting particles.
4. the crimping structure of panel display apparatus as described in claim 1, which is characterized in that first insulation system and
The material that two insulation systems use is identical, is organic material, silicon nitride or silica.
5. the crimping structure of panel display apparatus as described in claim 1, which is characterized in that first pit and second recessed
Hole is made up of transfer printing process or etching technics.
6. such as the crimping structure of panel display apparatus described in any one of claim 1 to 5, which is characterized in that described first is recessed
It cheats all the same with the shape and size of the second dimple.
7. the crimping structure of panel display apparatus as claimed in claim 5, which is characterized in that display panel is LCD display
Plate or organic electroluminescent display panel.
8. a kind of compression bonding method of panel display apparatus characterized by comprising
A display panel is provided, the display panel has multiple first crimp type terminals；
The first insulation system is formed between the multiple first crimp type terminal, first insulation system is recessed with multiple first
Hole；
Anisotropic conductive film is coated on first insulation system and multiple first crimp type terminals；
One chip or flexible circuit board are provided, the chip or flexible circuit board have multiple second crimp type terminals,
The second insulation system is formed between the multiple second crimp type terminal, second insulation system is recessed with multiple second
Hole；And
On said display panel by the chip or flexible circuit board crimping, so that the multiple first pit and multiple second
The position of pit is opposite one by one, and first pit and second dimple are collectively formed an accommodation space, first pit with
The accommodation space that the second dimple is collectively formed can limit the position of the conducting particles of ACF in the horizontal direction, make conduction
Particle is not in contact with each other.
9. the compression bonding method of panel display apparatus as claimed in claim 8, which is characterized in that first insulation system and
The material that two insulation systems use is identical, is organic material, silicon nitride or silica.
10. the compression bonding method of panel display apparatus as claimed in claim 8, which is characterized in that first pit and second
Pit passes through transfer printing process or etching technics is made.
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| CN201610936615.4A CN106405892B (en) | 2016-10-24 | 2016-10-24 | The crimping structure and compression bonding method of panel display apparatus |
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| CN201610936615.4A CN106405892B (en) | 2016-10-24 | 2016-10-24 | The crimping structure and compression bonding method of panel display apparatus |
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| CN111179750A (en) * | 2019-12-12 | 2020-05-19 | 武汉华星光电技术有限公司 | Structure of display panel and manufacturing method thereof |
| CN112235942B (en) * | 2020-09-21 | 2021-10-22 | 广州国显科技有限公司 | Display module and display device |
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