CN111463229A - Miniature L ED display panel and electronic equipment - Google Patents
Miniature L ED display panel and electronic equipment Download PDFInfo
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- CN111463229A CN111463229A CN202010274105.1A CN202010274105A CN111463229A CN 111463229 A CN111463229 A CN 111463229A CN 202010274105 A CN202010274105 A CN 202010274105A CN 111463229 A CN111463229 A CN 111463229A
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- 239000000758 substrate Substances 0.000 claims abstract description 76
- 239000002313 adhesive film Substances 0.000 claims abstract description 21
- 239000012790 adhesive layer Substances 0.000 claims description 33
- 239000002245 particle Substances 0.000 claims description 25
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000010410 layer Substances 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 3
- 238000003491 array Methods 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 claims 1
- 238000003466 welding Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000000084 colloidal system Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
The invention relates to a miniature L ED display panel and electronic equipment, wherein the miniature L ED display panel comprises a substrate, an anisotropic conductive adhesive film and a plurality of L ED chips, wherein the anisotropic conductive adhesive film is arranged on the substrate, and the plurality of L ED chips are arranged on one side of the anisotropic conductive adhesive film, which is far away from the substrate, and the anisotropic conductive adhesive film coats the side surface of the L ED chip and electrically connects the electrodes of the L ED chip and bonding pads of the substrate.
Description
Technical Field
The invention relates to the technical field of display screens, in particular to a miniature L ED display panel and electronic equipment.
Background
As shown in fig. 1, the miniature L ED display panel includes a substrate a and a plurality of L ED chips b disposed on the substrate a, wherein each L ED chip b constitutes a pixel, and each pixel can be driven to light individually.
However, in practical use, cracks are easily generated between the L ED chip b and the substrate a, for example, as shown in fig. 2, when the micro L ED display panel is bent, a crack c is generated between the L ED chip b and the substrate a, which results in the disconnection of the electrical connection therebetween, and affects the display function of the micro L ED display panel.
Disclosure of Invention
Accordingly, it is desirable to provide a micro L ED display panel and an electronic device, which solve the problem that cracks are easily generated between a L ED chip and a substrate of the conventional micro L ED display panel.
A miniature L ED display panel comprises a substrate, an anisotropic conductive adhesive film, a plurality of L ED chips and electrodes, wherein a circuit and a bonding pad electrically connected with the circuit are arranged on the substrate, the anisotropic conductive adhesive film is arranged on the substrate, the L ED chips are arranged on the substrate, each L ED chip comprises a main body and an electrode, the main body is provided with a light emitting surface and a backlight surface which are arranged in a back-to-back mode, and side faces respectively connected with the light emitting surface and the backlight surface, the electrodes are arranged on the backlight surface and are electrically connected with the bonding pad through the anisotropic conductive adhesive film, and the anisotropic conductive adhesive film coats the side faces of the main body.
In the invention, the anisotropic conductive adhesive film fills the gap between the substrate and the L ED chip, and when the substrate is bent, the anisotropic conductive adhesive film has certain flexibility, so that cracks between the L ED chip and the substrate can be effectively avoided.
The anisotropic conductive adhesive film comprises a lower adhesive layer arranged on the substrate, conductive particles arranged in the lower adhesive layer and used for electrically connecting the bonding pads with the electrodes, and an upper adhesive layer arranged on the surface of the lower adhesive layer far away from the substrate and covering the side surface of the main body, so that the material cost of the miniature L ED display panel can be reduced to a certain extent.
The backlight surface is covered by the upper adhesive layer in an extending mode, and/or the thickness of the upper adhesive layer is larger than the thickness of the electrode and smaller than or equal to the thickness of the L ED chip in the direction from the substrate to the L ED chip, and/or the thickness of the lower adhesive layer is larger than or equal to the thickness of a bonding pad in the direction from the substrate to the L ED chip.
Further, the anisotropic conductive adhesive film comprises a colloid and a plurality of conductive particles arranged in the colloid; wherein the concentration of the conductive particles between the electrode and the pad is C, 3pcs/100um2＜C＜4pcs/100um2(ii) a And/or the distance between the electrode and the bonding pad is equal to the diameter of the conductive particles, so that the material cost can be reduced to a certain extent.
Furthermore, in the direction from the substrate to the L ED chip, the relationship between the thickness T of the anisotropic conductive film and the thickness T of the L ED chip is 0.5T < 1.5T, so that during production, the thickness of the anisotropic conductive film is set according to the thickness of the L ED chip, and the production design of the anisotropic conductive film can be simpler and more convenient.
Furthermore, the electrode comprises a positive electrode and a negative electrode, the positive electrode and the negative electrode are arranged on the backlight surface at intervals, a gap between the positive electrode and the negative electrode is larger than 3D, wherein D is the diameter of conductive particles in the anisotropic conductive adhesive film, short circuit between the positive electrode and the negative electrode can be effectively avoided, and/or a plurality of L ED chip arrays are arranged on the substrate, and/or the substrate is a substrate with curvature or flexibility.
Furthermore, the anisotropic conductive adhesive film comprises a plurality of conductive adhesive units, the conductive adhesive units are arranged on the substrate at intervals, and one conductive adhesive unit is used for electrically connecting an electrode of the L ED chip with the bonding pad.
Further, be equipped with the inner concave structure that a plurality of intervals set up on the base plate, the pad sets up on the backlight face of inner concave structure, the electrode stretches into in the inner concave structure, set up like this and can reduce miniature L ED display panel thickness to a certain extent.
Furthermore, at least one part of the main body is arranged in the concave structure, or the main body is positioned outside the concave structure, the backlight surface and the substrate are arranged at intervals, and the anisotropic conductive film fills a gap between the backlight surface and the substrate.
Furthermore, the electrodes of the L ED chip comprise an anode and a cathode, wherein one of the concave structures is internally provided with one of the pads, and the anode and the cathode extend into one of the concave structures respectively, or one of the concave structures is internally provided with two of the pads, and the anode and the cathode are simultaneously arranged in one of the concave structures.
An electronic device comprising a miniature L ED display panel as claimed in any preceding claim.
Drawings
FIG. 1 is a schematic diagram of a conventional miniature L ED display panel;
FIG. 2 is a schematic diagram of a micro L ED display panel when bent;
FIG. 3 is a partial schematic view of a micro L ED display panel according to a first embodiment of the present invention;
FIG. 4 is a partial schematic view of a substrate according to a first embodiment of the present invention;
fig. 5 is a schematic partial cross-sectional view of a micro L ED display panel according to a first embodiment of the present invention;
fig. 6 is a schematic partial cross-sectional view of a micro L ED display panel according to a second embodiment of the present invention;
fig. 7 is a schematic partial cross-sectional view of a micro L ED display panel according to a third embodiment of the present invention;
fig. 8 is a schematic partial cross-sectional view of a micro L ED display panel according to a fourth embodiment of the present invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather should be construed as broadly as the present invention is capable of modification in various respects, all without departing from the spirit and scope of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
As shown in fig. 3 to 5, in the present embodiment, the micro L ED display panel 100 includes a substrate 1, a plurality of L ED chips 2, and an anisotropic conductive film 3, wherein the substrate 1 is a driving substrate and includes a base material 11, a circuit 12, and a plurality of pads 13, the base material 11 includes a carrying surface 111, the circuit 12 and the pads 13 are disposed on the carrying surface, the pads 13 are electrically connected to the circuit 12, the anisotropic conductive film 3 is disposed on the carrying surface 111, the L ED chips 2 are disposed on a side of the anisotropic conductive film 3 away from the substrate 1, and the electrodes 21 of the L ED chips 2 and the pads 13 of the substrate 1 can be electrically connected together through the anisotropic conductive film 3.
As shown in fig. 5, in the present embodiment, the electrode 21 and the pad 13 are disposed at an interval, the anisotropic conductive film 3 is filled between the electrode 21 and the pad 13, and the anisotropic conductive film 3 electrically connects the electrode 1 and the pad 13, when the substrate 1 or the L ED chip 2 is stressed (for example, when the substrate 1 is bent), the anisotropic conductive film 3 can play a role of buffering to avoid stress concentration caused by direct contact between the electrode 21 and the pad 13, meanwhile, the assembled anisotropic conductive film 3 fills the gap between the substrate 1 and the L ED chip 2, and when the substrate 1 is bent, the anisotropic conductive film 3 has a certain flexibility, which can effectively avoid cracks between the L ED chip 2 and the substrate 1, and at this time, the electrode 21 and the pad 13 are electrically connected through the disposition of the anisotropic conductive film 3.
In this embodiment, the substrate 1 may be a hard substrate or a flexible substrate, wherein when the substrate 1 is the hard substrate 1, the substrate 11 may be a glass substrate, an aluminum substrate, or the like, and when the substrate 1 is the flexible substrate, the substrate 11 may be PET, PI, PTEF, or the like.
As shown in FIG. 3, in the present embodiment, the L ED chips 2 are arranged on the substrate 1 in an array, in addition, as shown in FIG. 5, L ED chips 2 further include a main body 22, the main body 22 has a light-emitting surface 221 and a backlight surface 222 which are oppositely arranged, and side surfaces 223 respectively connected with the light-emitting surface 221 and the backlight surface 222, electrodes 21 are arranged on the backlight surface 222, and when the driving board supplies power to L ED chips 2, the main body 22 is lighted.
As shown in fig. 5, in the present embodiment, the anisotropic conductive film 3 covers the side surface 223 of the main body 22, so that the L ED chip 2 and the substrate 1 can be connected more firmly, wherein the anisotropic conductive film 3 covers the side surface 223 of the main body 22 either partially or completely.
As shown in fig. 5, in the present embodiment, the anisotropic conductive film 3 includes a colloid 31 and conductive particles 32 disposed in the colloid 31, wherein the colloid 31 may be a thermosetting resin, and the conductive particles 32 may be metal powder such as gold, silver, and nickel, or polymer plastic balls with a metal layer coated on the surface.
As shown in fig. 5, in the present embodiment, the adhesive 31 includes an upper adhesive layer 311 and a lower adhesive layer 312, wherein the lower adhesive layer 312 is connected to the substrate 1, the upper adhesive layer 311 is disposed on a surface of the lower adhesive layer 312 away from the substrate 1, the conductive particles 32 are disposed in the lower adhesive layer 312, and the upper adhesive layer 311 does not include the conductive particles 32, i.e., in the present embodiment, the anisotropic conductive adhesive film 3 includes the lower adhesive layer 312 capable of conducting electricity and the non-conductive upper adhesive layer 311, the lower adhesive layer 312 is used to electrically connect the electrodes 21 and the pads 13 together when in use, and the upper adhesive layer 311 is used to cover the side surfaces 223 of the main body 22. during assembly, the anisotropic conductive adhesive film 3 is disposed on the supporting surface 111 of the substrate 1, and then the L ED chip 2 is pressed on the anisotropic conductive adhesive film 3, during pressing, the electrodes 21 penetrate the upper adhesive layer 311 to be electrically connected to the pads 13 through the conductive particles 32 in the lower adhesive layer 312, and during pressing, a portion of the main body 22 is also extruded into the upper adhesive layer 311, so that the side surfaces 223 of the main body 22 are covered by the adhesive layer 311, and the adhesive layer L is extended to improve the bonding strength between the.
In this embodiment, the anisotropic conductive film 3 may be prepared by providing a thin anisotropic conductive film (defined as a base film), i.e., the base film itself has the lower adhesive layer 312 and the conductive particles 32, and then providing a connecting adhesive such as resin on the base film to form the upper adhesive layer 311. Namely, in the actual production, the anisotropic conductive film with a thinner thickness can be reprocessed to make the thickness of the anisotropic conductive film meet the predetermined requirement. Of course, the anisotropic conductive film 3 may also be prepared by directly providing a substrate with a larger thickness, and then disposing the conductive particles 32 into the substrate, i.e. the upper adhesive layer 311 and the lower adhesive layer 312 are integrated.
In this embodiment, the thickness of the anisotropic conductive film 3 is greater than the thickness of the bonding pad 13 to ensure that the bonding pad 13 and the electrode 21 can be electrically connected through the anisotropic conductive film 3, meanwhile, the thickness of the anisotropic conductive film 3 is less than the sum of the thickness of the L ED chip 2, the thickness of the bonding pad 13 and the diameter of the conductive particles 32, so as to prevent the anisotropic conductive film 3 from being attached to the light emitting surface 221 of the L ED chip 2. in actual production, the relationship between the thickness T of the anisotropic conductive film 3 and the thickness T of the L ED chip 2 is 0.5T < 1.5T, so that in production, the thickness of the anisotropic conductive film 3 is set according to the thickness of the L ED chip 2, so that the production design of the anisotropic conductive film 3 can be more simple and convenient.
In addition, in the present embodiment, the thickness of the upper adhesive layer 311 is greater than the thickness 21 degrees of the electrodes in the direction from the substrate 1 to the L ED chip 2 and is equal to or less than the thickness of the L ED chip 2, while the thickness of the lower adhesive layer 312 is equal to or greater than the thickness of the pads 13 in the direction from the substrate 1 to the L ED chip 2.
As shown in FIG. 5, in the present embodiment, the conductive particles 32 are arranged in a single layer, i.e. only one conductive particle 32 is located between the electrode 21 and the pad 13 in the direction from the L ED chip 2 to the substrate 1, which can reduce the material cost to some extent, in order to ensure the electrical connection effect between the electrode 21 and the pad 13, in the present embodiment, the density of the conductive particles 32 between the electrode 21 and the pad 13 is C, wherein 3pcs/100um2 < C < 4pcs/100um2In addition, in the embodiment, the gap between the conductive particles 32 is larger than the diameter D of the conductive particles 32, which can effectively avoid the contact between the conductive particles 32 when the L ED chips 2 are pressed against the anisotropic conductive adhesive film 3, in addition, to avoid the short circuit between the positive electrode 211 and the negative electrode 212, the gap between the two electrodes 21 is larger than 3D, and meanwhile, the distance between the electrodes of two adjacent L ED chips 2 is also larger than 3D.
In the above embodiments, a layer of anisotropic conductive film 3 is disposed on the supporting surface 111, and then each L ED chip 2 is disposed on the anisotropic conductive film 3, that is, a plurality of L ED chips 2 are disposed on the same anisotropic conductive film 3 at the same time, as shown in fig. 6, in the second embodiment provided by the present invention, the anisotropic conductive film 3 includes a plurality of conductive film units 33, the conductive film units 33 are disposed at intervals, wherein the conductive film units 33 correspond to the L ED chips 2 one by one, and each L ED chip 2 is electrically connected to the corresponding pad 13 through the conductive film unit 33.
As shown in fig. 7, in the third embodiment of the present invention, the supporting surface 111 is provided with a concave structure 112, the bonding pads 13 are disposed in the concave structure 112, the electrodes 21 extend into the concave structure 112 during assembly and are spaced apart from the bonding pads 13, and the anisotropic conductive film 3 is filled between the electrodes 21 and the bonding pads 13 to electrically connect the electrodes 21 and the bonding pads 13, so that the thickness of the micro L ED display panel 100 can be reduced to a certain extent.
As shown in fig. 7, in the present embodiment, the number of the concave structures 112 is multiple, the concave structures 112 are disposed at intervals, two bonding pads 13 are disposed in one concave structure 112, and each L ED chip 2 corresponds to one concave structure 112, that is, the positive electrode 211 and the negative electrode 212 of the L ED chip 2 both extend into the concave structure 112.
In addition, as shown in fig. 7, in the present embodiment, the L ED chip 2 is disposed outside the concave structure 112, i.e. the backlight surface 222 and the supporting surface 111 are spaced apart, at this time, the anisotropic conductive film 3 fills the gap of the concave structure 112 and is attached to the supporting surface 111, and by properly setting the amount of glue, the anisotropic conductive film 3 can cover the side surface 223 of the main body 22 after assembly.
Of course, in actual production, the main body 22 may also extend into the concave structure 112, wherein the main body 22 may be partially or completely inserted into the concave structure 112. At this time, the anisotropic conductive film 3 fills the gap between the main body 22 and the sidewall of the concave structure 112.
As shown in fig. 8, compared to the third embodiment, in the fourth embodiment of the present invention, a bonding pad 13 is disposed in one concave structure 112, and then one L ED chip 2 corresponds to two concave structures 112 disposed at an interval, after the positive electrode 211 and the negative electrode 212 of the L ED chip 2 respectively extend into the two concave structures 112, the partition wall 113 between the two concave structures 112 separates to prevent the conductive particles 32 from moving from one concave structure 112 to the other concave structure 112, thereby preventing the positive electrode 211 and the negative electrode 212 of the L ED chip 2 from being shorted.
The invention also provides an electronic device, which uses the miniature L ED display panel 100 according to any of the above embodiments, wherein the electronic device can be a mobile phone, a computer, a television, etc.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A miniature L ED display panel, comprising:
a substrate having a circuit thereon and a pad electrically connected to the circuit;
an anisotropic conductive film disposed on the substrate;
the LED packaging structure comprises a substrate, a plurality of L ED chips and electrodes, wherein the L ED chips are arranged on the substrate and comprise a main body and the electrodes, the main body is provided with a light-emitting surface and a backlight surface which are arranged in a reverse mode, and side faces connected with the light-emitting surface and the backlight surface respectively, the electrodes are arranged on the backlight surface and are electrically connected with bonding pads through anisotropic conductive adhesive films, and the anisotropic conductive adhesive films wrap the side faces of the main body.
2. The miniature L ED display panel of claim 1, wherein the anisotropic conductive film comprises:
the lower adhesive layer is arranged on the substrate;
the conductive particles are arranged in the lower adhesive layer and used for electrically connecting the electrode and the bonding pad together;
and the upper glue layer is arranged on the surface of the substrate far away from the lower glue layer, and covers the side surface of the main body.
3. The miniature L ED display panel of claim 2, wherein the size coat extends over the backlight surface, and/or
The thickness of the upper adhesive layer is larger than that of the electrode and is less than or equal to that of the L ED chip in the direction from the substrate to the L ED chip, and/or
The thickness of the lower adhesive layer is larger than or equal to that of the bonding pad in the direction from the substrate to the L ED chip.
4. The miniature L ED display panel of claim 1, wherein the anisotropic conductive film comprises a gel and a plurality of conductive particles disposed within the gel;
wherein the concentration of the conductive particles between the electrode and the pad is C, 3pcs/100um2＜C＜4pcs/100um2(ii) a And/or
A distance between the electrode and the pad is equal to a diameter of the conductive particle; and/or
In the direction from the substrate to the L ED chip, the relation between the thickness T of the anisotropic conductive adhesive film and the thickness T of the L ED chip is 0.5T < T < 1.5T.
5. The miniature L ED display panel of claim 1, wherein the electrodes comprise positive and negative electrodes spaced apart on the backlight surface, and the gap between the positive and negative electrodes is greater than 3D, where D is the diameter of the conductive particles in the anisotropic conductive film, and/or
A plurality of L ED chip arrays arranged on the substrate, and/or
The substrate is a substrate having curvature or flexibility.
6. The micro L ED display panel of claim 1, wherein the anisotropic conductive film comprises a plurality of conductive adhesive units, each of the conductive adhesive units is disposed at intervals on the substrate, and one of the conductive adhesive units is used to electrically connect one of the L ED chips and the substrate together.
7. The miniature L ED display panel of claim 1, wherein the substrate has a plurality of spaced apart recesses, the bonding pads are disposed on a backlight surface of the recesses, and the electrodes extend into the recesses.
8. The miniature L ED display panel of claim 7, wherein at least a portion of the main body is disposed in the recessed structure, or
The main body is located outside the concave structure, the backlight surface and the substrate are arranged at intervals, and the anisotropic conductive film fills a gap between the backlight surface and the substrate.
9. The micro L ED display panel of claim 7, wherein the electrodes of the L ED chips include positive and negative electrodes;
one of the concave structures is internally provided with one of the bonding pads, and the positive electrode and the negative electrode respectively extend into one of the concave structures; or two welding pads are arranged in one concave structure, and the positive electrode and the negative electrode are simultaneously arranged in one concave structure.
10. An electronic device, characterized in that it comprises a miniature L ED display panel as claimed in any one of claims 1-9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010274105.1A CN111463229A (en) | 2020-04-09 | 2020-04-09 | Miniature L ED display panel and electronic equipment |
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| CN202010274105.1A CN111463229A (en) | 2020-04-09 | 2020-04-09 | Miniature L ED display panel and electronic equipment |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112201671A (en) * | 2020-10-23 | 2021-01-08 | 业成科技（成都）有限公司 | Display device and method for manufacturing the same |
| WO2022262048A1 (en) * | 2021-06-16 | 2022-12-22 | 深圳市华星光电半导体显示技术有限公司 | Display panel and method for preparing same |
| WO2023103021A1 (en) * | 2021-12-10 | 2023-06-15 | Tcl华星光电技术有限公司 | Preparation method for display apparatus, and display apparatus and tiled display apparatus |
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Application publication date: 20200728 |