CN110062524B

CN110062524B - Binding structure, display module and display device

Info

Publication number: CN110062524B
Application number: CN201910463301.0A
Authority: CN
Inventors: 李焕
Original assignee: Kunshan Visionox Technology Co Ltd
Current assignee: Suzhou Qingyue Optoelectronics Technology Co Ltd
Priority date: 2019-05-30
Filing date: 2019-05-30
Publication date: 2020-05-19
Anticipated expiration: 2039-05-30
Also published as: CN110062524A

Abstract

The application relates to a binding structure, a display module and a display device. The screen body comprises a binding area, and the binding area comprises the signal lead area and the first enhanced binding area which are arranged at intervals. The first enhanced binding region is provided with a first enhanced binding structure. The first reinforcing binding structure can reinforce the tensile strength between the screen body part and the flexible circuit board when the screen body part and the flexible circuit board are electrically connected and matched, so that the screen body part and the flexible circuit board can be prevented from being torn.

Description

Binding structure, display module and display device

Technical Field

The application relates to the field of display, in particular to a binding structure, a display module and a display device.

Background

The binding quality of the screen body and the flexible circuit board is a key link for maintaining normal display of the screen body. In the prior art, the flexible circuit board and the screen body are easy to tear away after being used for a long time, which affects the display effect of the screen body.

Disclosure of Invention

Based on this, it is necessary to provide a binding structure, a display module and a display device for solving the problem that the flexible circuit board and the screen body are easy to tear away after being used for a long time.

The utility model provides a binding structure, includes the screen somatic part, the screen somatic part is including binding the district, it includes that signal lead wire district and first reinforcing bind the district to bind the district, signal lead wire district and first reinforcing bind the interval and set up, first reinforcing is bound the district and is provided with first reinforcing and binds the structure, first reinforcing is bound the structure and is used for the reinforcing tensile strength between screen somatic part and the flexible circuit board.

In one embodiment, the flexible printed circuit board further comprises a second enhanced binding region, the second enhanced binding region is provided with a second enhanced binding structure, and when the flexible printed circuit board is electrically connected with the screen body, the first enhanced binding structure and the second enhanced binding structure are correspondingly matched.

In one embodiment, the first enhanced bonding structure includes a plurality of dummy signal leads, and the second enhanced bonding structure includes a plurality of dummy terminals corresponding to the plurality of dummy signal leads in a one-to-one manner.

In one embodiment, the first positioning region or the second positioning region is provided with a positioning enhancement structure.

In one embodiment, the first positioning area is provided with a plurality of positioning platforms, positioning grooves are formed among the positioning platforms, the second positioning area is provided with positioning protrusions, the positioning protrusions are matched with the positioning grooves to position the screen body and the flexible circuit board, the positioning reinforcing structure comprises a plurality of reinforcing platforms arranged in the second positioning area and located around the positioning protrusions, and the reinforcing platforms and the positioning platforms are arranged in a one-to-one correspondence mode.

In one embodiment, the bonding regions include two first enhanced bonding regions disposed at two sides of the signal lead region, and the flexible circuit board includes two second enhanced bonding regions disposed in one-to-one correspondence with the two first enhanced bonding regions, respectively.

A display module comprises the binding structure.

The display device comprises the display module and a shell, wherein the display module is arranged on the shell.

The binding structure, the display module assembly and the display device provided by the embodiment of the application. The screen body comprises a binding area, and the binding area comprises the signal lead area and the first enhanced binding area which are arranged at intervals. The first enhanced binding region is provided with a first enhanced binding structure. The first reinforcing binding structure can reinforce the tensile strength between the screen body part and the flexible circuit board when the screen body part and the flexible circuit board are electrically connected and matched, so that the screen body part and the flexible circuit board can be prevented from being torn.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention. Moreover, the drawings and the description are not intended to limit the scope of the inventive concept in any way, but rather to illustrate it by those skilled in the art with reference to specific embodiments.

Fig. 1 is a schematic diagram of a binding structure provided in an embodiment of the present application;

FIG. 2 is a diagram of a binding structure according to another embodiment of the present application;

FIG. 3 is a diagram of a binding structure according to another embodiment of the present application;

FIG. 4 provides a cross-sectional view of a binding structure according to an embodiment of the present application;

fig. 5 is a schematic view of a display module according to an embodiment of the present disclosure;

fig. 6 is a schematic view of a display device according to an embodiment of the present application.

Reference numerals:

binding structure 10

Screen body part 100

Binding region 200

Signal lead area 210

Connecting signal leads 212

Connection terminal 211

First positioning area 220

Positioning table 221

Positioning groove 222

First enhanced binding region 230

First binding enhancement structure 232

Dummy signal lead 231

Flexible circuit board 20

Second enhanced binding 310

Dummy terminal 311

Second binding enhancement structure 312

Second positioning region 320

Positioning projection 321

Reinforcing stage 322

Positioning enhancement structure 330

Conductive adhesive 340

Conductive particle 341

Indium tin oxide layer 350

Molybdenum aluminum molybdenum coating 351

Display module 30

Display device 40

Control module 400

Case 410

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more clearly apparent, the binding structure and the display panel of the present application are further described in detail by the following embodiments and with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings). In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present application and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be considered as limiting the present application.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Referring to fig. 1, an embodiment of the present application provides a binding structure 10. The binding structure 10 includes a screen body portion 100. The screen body portion 100 includes a binding region 200. The bonding region 200 includes a signal lead region 210 and a first enhanced bonding region 230 that are spaced apart. The first enhanced binding region 230 is provided with a first enhanced binding structure 232. The first reinforcing binding structure 232 is used to reinforce the tensile strength between the panel body 200 and the flexible circuit board 20. the panel body 100 may be a portion of a display screen with a glass substrate, or a portion of a flexible display screen with a flexible substrate. The bonding region 200 may be used to connect the screen body portion 100 with the flexible circuit board 20. The signal lead region 210 may be provided with a plurality of parallel connection signal leads 212. The connection signal lead 212 may be correspondingly attached to the connection terminal 211 of the flexible circuit board 20 to achieve the purpose of signal transmission. The first reinforcing binding structure 232 may serve to reinforce a tensile strength between the screen body 100 and the flexible circuit board 20 when the screen body 100 and the flexible circuit board 20 are electrically coupled and mated, and thus, the screen body 100 and the flexible circuit board 20 may be prevented from being torn.

In the embodiment of the present application, the screen body 100 includes a bonding region 200, and the bonding region 200 includes the signal lead region 210 and the first enhanced bonding region 230 at intervals. The first reinforcing binding structure 232 can reinforce the tensile strength between the screen body 100 and the flexible circuit board 20 when the screen body 100 and the flexible circuit board 20 are electrically coupled, so that the screen body 100 and the flexible circuit board 20 can be prevented from being torn.

In one embodiment, the binding structure 10 further includes the flexible circuit board 20. The flexible circuit board 20 includes a second enhanced bonding region 310. The second enhanced binding region 310 is provided with a second enhanced binding structure 312. When the flexible circuit board 20 is electrically connected to the screen body 100, the first enhanced binding structure 232 and the second enhanced binding structure 312 are correspondingly matched.

In this embodiment, the first enhanced binding structures 232 and the second enhanced binding structures 312 are correspondingly matched to increase the tensile strength between the first enhanced binding structures 232 and the second enhanced binding structures 312, so as to enhance the tensile strength between the screen body 100 and the flexible circuit board 20. The first and second reinforcing

bindings

232, 312 may be provided with the same layer of material that will fit more closely together when the first and second reinforcing

bindings

230, 310 are fitted together, thereby enhancing adhesion between the first and second reinforcing

bindings

230, 310.

Referring to fig. 2, in one embodiment, the first enhanced bonding structure 232 includes a plurality of dummy signal leads 231. The second enhanced bonding region 310 includes a plurality of dummy terminals 311 in one-to-one correspondence with the plurality of dummy signal leads 231. It is understood that the dummy signal leads 231 may conform to the shape of the connection signal leads 212 disposed at the signal lead section 210. That is, the dummy signal leads 231 can be formed in the same process as the connection signal leads 212, and thus, the manufacturing efficiency can be improved.

The dummy signal lead 231 may not be used to transfer a signal. The dummy terminal 311 may have the same shape as the connection terminal 211. The dummy terminal 311 and the connection terminal 211 may be formed in the same process. Therefore, the adhesive force between the first and second reinforcing binding

regions

230 and 310 can be improved, and the production efficiency can be improved without increasing the number of manufacturing processes.

The dummy terminal 311 may not transmit a signal. The dummy terminals 311 and the dummy signal leads 231 may correspond one to one. That is, one dummy terminal 311 may be attached to one dummy signal lead 231. When the surfaces of the dummy terminal 311 and the dummy signal lead 231 are attached to each other, the static friction between the dummy terminal 311 and the dummy signal lead 231 can be increased. Thereby improving adhesion between the first enhanced binding 230 and the second enhanced binding 310.

In one embodiment, the surface of the dummy signal lead 231 or the surface of the dummy terminal 311 is a frosted surface. The dummy signal lead 231 may have a certain width. In one embodiment, the width of the dummy signal leads 231 may be 0.08 mm to 0.15 mm wide. The width of the dummy signal lead 231 is generally greater than 0.06 mm, and when the width of the dummy signal lead 231 is less than 0.06 mm, the bonding is not firm enough due to the small area. It is understood that the width of the dummy terminal 311 may be consistent with the width of the dummy signal lead 231. The frosted surface can enhance the static friction between the dummy terminal 311 and the dummy signal lead 231, and thus can improve the adhesion between the first enhanced bonding region 230 and the second enhanced bonding region 310.

In one embodiment, the binding region 200 further includes a first positioning region 220. The first positioning region 220 and the first enhanced bonding region 230 are disposed on two sides or the same side of the signal lead region 210. The flexible circuit board 20 is provided with a second positioning region 320. The second positioning region 320 is disposed corresponding to the first positioning region 220. The first positioning region 220 and the second positioning region 320 can be used to position the screen body 100 and the flexible circuit board 20. The second positioning region 320 can cooperate with the first positioning region 220 for positioning purposes.

It will be appreciated that the first and

second positioning regions

220, 320 may be engaged by mechanical structures, or may be engaged by indicia. After the screen body 100 and the flexible circuit board 20 are positioned, the first positioning region 220 or the second positioning region 320 may be provided with a structure capable of enhancing the static friction between the screen body 100 and the flexible circuit board 20.

Referring to fig. 3, in one embodiment, the first positioning region 220 or the second positioning region 320 is provided with a positioning enhancement structure 330. The positioning enhancement structure 330 may be used to enhance adhesion between the second positioning region 320 and the first positioning region 220. The tensile strength height of the screen body portion 100 and the flexible circuit board 20 can be further increased.

In one embodiment, the first positioning zone 220 is provided with a plurality of positioning stages 221. The plurality of positioning stages 221 form a positioning groove 222 therebetween. The second positioning region 320 is provided with a positioning protrusion 321. The positioning protrusion 321 cooperates with the positioning groove 222 to position the screen body 100 and the flexible circuit board 20. The positioning reinforcing structure 330 includes a plurality of reinforcing members 322 disposed in the second positioning region 320 and around the positioning protrusion 321. The reinforcing stages 322 are disposed in one-to-one correspondence with the positioning stages 221. The positioning stages 221 may be disposed at intervals, and gaps may be formed between the positioning stages 221, and the structure of the gaps may be changed according to the placement form of the positioning stages 221. The clearance constitutes the positioning groove 222. The position of the positioning protrusion 321 may be determined according to the position of the gap.

In this embodiment, the positioning groove 222 may be filled with a conductive adhesive. The positioning protrusion 321 can press the conductive adhesive 340 and is positioned with the positioning groove 222. The reinforcing stage 322 may be spaced apart from the positioning protrusion 321. When the screen body part 100 and the flexible circuit board 20 are partially overlapped, the reinforcing table 322 is attached to the positioning table 221. The contact surfaces of the reinforcing plate 322 and the positioning plate 221 increase the static friction force between the panel body 100 and the flexible circuit board 20.

In one embodiment, the surface of the positioning stage 221 or the reinforcing stage 322 is a frosted surface. The frosted surface can increase the static friction force when the positioning stage 221 or the reinforcing stage 322 is in contact.

In one embodiment, the positioning recess 222 and the positioning protrusion 321 are cross-shaped structures. The number of the positioning stages 221 may be 4 and arranged in a matrix. Thus, the 4 positioning stages 221 form a cross-shaped positioning recess 222 therebetween. The positioning protrusion 321 is a corresponding cross structure. The plane in which the cross structure is located is defined as a coordinate system, and four of the reinforcing stages 322 may be disposed in four quadrants, respectively. The four reinforcing stages 322 correspond to the four positioning stages 221 one by one. The cross-shaped positioning groove 222 and the positioning protrusion 321 define the position 20 of the screen body 100 and the flexible circuit board in four directions, namely, front, back, left and right directions, and the structure is simple and convenient to manufacture.

In one embodiment, the positioning groove 222 and the positioning protrusion 321 may also be T-shaped, L-shaped, or the like. The structures are simple in manufacturing process and can improve production efficiency.

Referring to fig. 4, in an embodiment, in a portion of the screen body 100 where the bonding region 200 is attached to the flexible circuit board 20, a conductive adhesive 340 may be filled between the bonding region 200 and the flexible circuit board 20, and the conductive adhesive 340 has conductive particles 341. The conductive particles 341 may be a conductive material such as a metal. The connection signal lead 212 and the dummy signal lead 231 may be formed of an ito layer 350. The surface of the ito layer 350 may have a mo-al-mo plating 351. The dummy terminals 311 and the connection terminals 211 may be formed of copper layers having a thickness of about 12 to 25 micrometers, and then gold is plated on the surface of the copper layers to form a layer having a thickness of 0.05 to 0.1 micrometers.

In one embodiment, the bonding region 200 includes two of the first enhanced bonding regions 230. The two first enhanced bonding areas 230 are disposed at both sides of the signal lead area 210. The flexible circuit board 20 includes two of the second enhanced bonding regions 310. The two second enhanced binding regions 310 are respectively disposed in one-to-one correspondence with the two first enhanced binding regions 230. The two first reinforcing bonding regions 230 and the two second reinforcing bonding regions 310 cooperate to increase the contact area between the screen body 100 and the flexible circuit board 20, so that the tensile strength between the screen body 100 and the flexible circuit board 20 can be enhanced to prevent the screen body 100 and the flexible circuit board 20 from being torn.

In one embodiment, the binding region 200 further includes two first positioning regions 220. The two first positioning portions 220 may be disposed on opposite sides of the signal lead portion 210. In one embodiment, the first enhanced binding region 230, the first positioning region 220, the signal lead region 210, the first positioning region 220, and the first enhanced binding region 230 are sequentially disposed between two opposite sides of the screen body 100. The flexible circuit board 20 further includes two second positioning regions 320 and two second enhanced binding regions 310. The two second positioning regions 320 and the two second enhanced binding regions 310 are both disposed in one-to-one correspondence with the two first positioning regions 220 and the two first enhanced binding regions 230. When the flexible circuit board 20 is electrically connected to the screen body 100, the two first enhanced bonding regions 230 and the two second enhanced bonding regions 310 are respectively attached to each other. And two of the first positioning regions 220 and two of the second positioning regions 320 are cooperatively positioned.

In one embodiment, the surface of the first and second

reinforcement bonding regions

230 and 310 may have a frosted structure and a flexible material, respectively. The flexible material may be embedded in the frosted structure to enhance static friction and improve adhesion between the first and second reinforcing

lands

230, 310.

In one embodiment, the two second enhanced bonding areas 230 may be disposed at two opposite edges of the flexible circuit board 20, so that the width of the flexible circuit board 20 can be increased, the distance between the connection terminal 211 and the connection signal lead 212 in the middle of the flexible circuit board 20 and the edge of the bonding area 230 can be increased, and the probability of tearing the connection terminal 211 and the connection signal lead 212 can be reduced.

Referring to fig. 3 again, in one embodiment, the length of the dummy signal lead 231 is gradually increased from the signal lead region 210 to the first positioning region 220, and the length of the dummy terminal 311 is correspondingly consistent with the length of the dummy signal lead 231. That is, in the bonding region 200, the length of the virtual signal lead 231 becomes gradually longer from the center of the bonding region 200 to the edge of the bonding region 200. The length of the dummy terminal 311 is gradually increased in a direction from the connection terminal 211 to the second enhanced binding area 310. It can be understood that, when the screen body portion 100 and the flexible circuit board 20 are mated, the closer to the edge portions of the screen body portion 100 and the flexible circuit board 20, the easier the connecting portion of the screen body portion 100 and the flexible circuit board 20 is to be torn, so that the lengths of the dummy terminal 311 and the dummy signal lead 231 are the longest at the edge portions of the screen body portion 100 and the flexible circuit board 20, and thus the tensile strength of the dummy terminal 311 and the dummy signal lead 231 at this position is the greatest, which can effectively prevent the edge portions of the screen body portion 100 and the flexible circuit board 20 from being torn. In addition, the dummy terminal 311 and the dummy signal lead 231 having a short inner length can save materials.

Referring to fig. 5, the embodiment of the present application further provides a display module 30. The display module comprises the binding structure 10. The display device 30 may further include a control module 400, and the control module 400 may be disposed on the screen body 100. The control module 400 may be connected with the flexible circuit board 20 through the binding structure 10.

Referring to fig. 6, an embodiment of the present application further provides a display device 40. The display device 40 includes the display module 30. The display device 30 further includes a housing 410, and the display module 30 is disposed on the housing 410. The display device 30 may also include an energy storage device or the like.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present patent. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A binding structure, characterized by comprising a screen body part (100), wherein the screen body part (100) comprises a binding region (200), the binding region (200) comprises a signal lead region (210) and a first enhanced binding region (230), the signal lead region (210) and the first enhanced binding region (230) are arranged at intervals, the first enhanced binding region (230) is provided with a first enhanced binding structure (232), and the first enhanced binding structure (232) is used for enhancing the tensile strength between the screen body part (100) and a flexible circuit board (20);

the binding region (200) further comprises a first positioning region (220), and the flexible circuit board (20) comprises a second positioning region (320);

the first positioning area (220) is provided with a plurality of positioning tables (221), a positioning groove (222) is formed between the plurality of positioning tables (221), the second positioning area (320) is provided with a positioning protrusion (321), and the positioning protrusion (321) is matched with the positioning groove (222) to position the screen body part (100) and the flexible circuit board (20).

2. The bonding structure of claim 1, wherein the flexible circuit board (20) comprises a second enhanced bonding region (310), the second enhanced bonding region (310) is provided with a second enhanced bonding structure (312), and the first enhanced bonding structure (232) and the second enhanced bonding structure (312) are correspondingly matched when the flexible circuit board (20) is electrically connected to the screen body (100).

3. The bonding structure of claim 2, wherein the first enhanced bonding structure (232) includes a plurality of dummy signal leads (231), and wherein the second enhanced bonding structure (312) includes a plurality of dummy terminals (311) in one-to-one correspondence with the plurality of dummy signal leads (231).

4. The bonding structure according to claim 3, wherein a surface of the dummy signal lead (231) or a surface of the dummy terminal (311) is a frosted surface.

5. The bonding structure of claim 3, wherein the first positioning region (220) and the first enhanced bonding region (230) are disposed on two sides or the same side of the signal lead region (210), and the second positioning region (320) is disposed corresponding to the first positioning region (220).

6. The binding structure according to claim 5, characterized in that the first positioning region (220) or the second positioning region (320) is provided with a positioning enhancement structure (330).

7. The binding structure according to claim 6, characterized in that the positioning reinforcing structure (330) comprises a plurality of reinforcing tables (322) arranged in the second positioning zone (320) and around the positioning protrusion (321), the reinforcing tables (322) being arranged in a one-to-one correspondence with the positioning tables (221).

8. The bonding structure according to any one of claims 1 to 7, wherein the bonding region (200) includes two of the first enhanced bonding regions (230), the two first enhanced bonding regions (230) are disposed on both sides of the signal lead region (210), the flexible circuit board (20) includes two of the second enhanced bonding regions (310), and the two second enhanced bonding regions (310) are disposed in one-to-one correspondence with the two first enhanced bonding regions (230), respectively.

9. A display module comprising a binding structure (10) according to any one of claims 1 to 8.

10. A display device, comprising the display module (30) as claimed in claim 9, and further comprising a housing (410), wherein the display module (30) is disposed on the housing (410).