CN107749239B - Display panel, display device and manufacturing method of display panel - Google Patents
Display panel, display device and manufacturing method of display panel Download PDFInfo
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- CN107749239B CN107749239B CN201711047298.1A CN201711047298A CN107749239B CN 107749239 B CN107749239 B CN 107749239B CN 201711047298 A CN201711047298 A CN 201711047298A CN 107749239 B CN107749239 B CN 107749239B
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- 239000002245 particle Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 5
- 239000002313 adhesive film Substances 0.000 claims 4
- 239000004973 liquid crystal related substance Substances 0.000 claims 2
- 230000000694 effects Effects 0.000 abstract description 23
- 238000010586 diagram Methods 0.000 description 12
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- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
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Abstract
The embodiment of the invention discloses a display panel, a display device and a manufacturing method of the display panel, wherein the display panel comprises a substrate base plate, the substrate base plate comprises a drive chip binding area, at least two rows of first connecting pins are arranged in the drive chip binding area, and each row of the first connecting pins comprises at least two first connecting pins; the thickness of each first connecting pin arranged in the same row is the same, and the thickness of the first connecting pins arranged in different rows is different; the drive chip binding area is rectangular, and the extending direction of the row is parallel to the long edge direction of the drive chip binding area. Compared with the existing display panel, the display panel provided by the embodiment of the invention can improve the binding effect of the display panel and the control module, further eliminate the phenomena of signal crosstalk and display nonuniformity of the display panel and improve the display effect of the display panel.
Description
Technical Field
The present invention relates to display technologies, and in particular, to a display panel, a display device, and a method for manufacturing the display panel.
Background
With the development of display technology, the display effect of the display panel is continuously improved, so that the display panel is widely applied to various display products such as mobile phones, tablet computers and information inquiry machines in halls of public places to meet different requirements of users.
A control module is generally bound to an existing display panel to implement functions such as display, touch position detection, fingerprint identification, or touch pressure detection under the control of the control module. However, in the existing display panel, due to poor binding effect, the contact between the connection pins of part of the control modules and the connection pins of the display panel is often poor, which causes the phenomena of signal crosstalk and uneven display of the display panel.
Disclosure of Invention
The invention provides a display panel, a display device and a manufacturing method of the display panel, which are used for improving the binding effect of the display panel and a control module, further eliminating the phenomena of signal crosstalk and uneven display of the display panel and improving the display effect of the display panel.
In a first aspect, an embodiment of the present invention provides a display panel, where the display panel includes a substrate base, where the substrate base includes a driver chip bonding region, where at least two rows of first connection pins are disposed, and each row of the first connection pins includes at least two first connection pins;
the thickness of each first connecting pin arranged in the same row is the same, and the thickness of the first connecting pins arranged in different rows is different;
the drive chip binding area is rectangular, and the extending direction of the row is parallel to the long edge direction of the drive chip binding area.
In a second aspect, an embodiment of the present invention further provides a display device, where the display device includes the display panel provided in any one of the embodiments of the present invention;
the control module comprises a plurality of third connecting pins, and the third connecting pins and the first connecting pins are arranged in one-to-one correspondence; the control module is bonded with the drive chip binding area through an anisotropic conductive film, and the third connecting pin is electrically connected with the first connecting pin corresponding to the third connecting pin.
In a third aspect, an embodiment of the present invention further provides a manufacturing method of a display panel, where the manufacturing method of the display panel includes;
providing a substrate base plate, wherein the substrate base plate comprises a drive chip binding area, and the drive chip binding area is rectangular;
forming at least two rows of first connecting pins in the binding area of the drive chip, wherein each row of the first connecting pins comprises at least two first connecting pins; the thickness of each first connecting pin arranged in the same row is the same, and the thickness of the first connecting pins arranged in different rows is different; the extending direction of the row is parallel to the long side direction of the binding area of the driving chip.
According to the embodiment of the invention, the problems of signal crosstalk and uneven display of the display panel caused by poor binding effect of the existing display panel and poor contact between the connection pins of part of the control module and the connection pins of the display panel are solved by setting different thicknesses of the first connection pins in different rows, so that the binding effect of the display panel and the control module is improved, the phenomena of signal crosstalk and uneven display of the display panel are eliminated, and the display effect of the display panel is improved.
Drawings
Fig. 1 is a schematic structural diagram of a conventional display panel;
fig. 2 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
FIG. 3 is a schematic sectional view taken along line B1-B2 in FIG. 2;
FIG. 4 is a schematic structural diagram of the display panel provided in FIG. 2 after the control module is bound thereto;
fig. 5 is a schematic structural diagram of another display panel according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of another display panel according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a display device according to an embodiment of the present invention;
fig. 8 is a flowchart of a method for manufacturing a display panel according to an embodiment of the invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
Fig. 1 is a schematic structural diagram of a conventional display panel. Referring to fig. 1, the display panel includes a substrate base plate 10, and a plurality of first connection pins 11 are disposed on the substrate base plate 10. When the control module 20 is bonded to the display panel 10, the control module 20 is bonded to the base substrate 10, and a force F is applied to the control module 20. Under the action of the force F, the first connection pins 11 on the substrate base plate 10 are electrically connected with the third connection pins 21 on the control module 20 in a one-to-one correspondence manner.
With continued reference to fig. 1, during the actual manufacturing process, under the action of the force F, the control module 20 may warp, that is, a portion of the control module 20 that is farther away from the action point a of the force F (e.g., a portion located inside the dashed circle in fig. 1) may bend away from the substrate base 10. Due to the occurrence of the warping phenomenon, the distance d between the warped portion and the substrate base plate 10 is greater than the sum of the thicknesses of the third connecting pin 21 and the first connecting pin 11, so that the third connecting pin 21 arranged on the warped portion and the first connecting pin 11 on the substrate base plate 10 are in poor contact, and thus signals cannot be transmitted, and the problems of signal crosstalk and uneven display of the display panel occur.
Fig. 2 is a schematic structural diagram of a display panel according to an embodiment of the present invention. FIG. 3 is a schematic sectional view taken along line B1-B2 in FIG. 2. Referring to fig. 2 and 3, the display panel includes a substrate base plate 10, the substrate base plate 10 includes a driver chip bonding area 13, at least two rows of first connection pins 11 (exemplarily, 3 rows of first connection pins 11 are included in the driver chip bonding area 13), each row of first connection pins 11 includes at least two first connection pins 11 (exemplarily, 19 first connection pins 11 are included in each row in fig. 1); the first connecting pins 11 arranged in the same row have the same thickness, and the first connecting pins 11 arranged in different rows have different thicknesses; the driver chip bonding area 13 is rectangular, and the extending direction of the row is parallel to the long side direction 200 of the driver chip bonding area 13.
Fig. 4 is a schematic structural diagram of the display panel provided in fig. 2 after the control module is bound. Referring to fig. 4, in the above technical solution, the phrase "the first connection pins 11 disposed in different rows have different thicknesses" specifically means that the thickness of each first connection pin 11 is adjusted according to the distance between each first connection pin 11 and the acting point a of the force F during binding, so that the thickness of each first connection pin 11 in a row closer to the acting point a of the force F is smaller, and the thickness of each first connection pin 11 in a row farther from the acting point a of the force F is larger. The essence of the arrangement is that the thickness of the first connection pins 11 arranged near the warping portion is increased, so that the first connection pins 11 can fully fill the gaps formed between the control module 20 and the substrate base plate 10 due to warping, that is, the distance d between the control module 20 near the warping portion and the substrate base plate 10 is equal to or less than the sum of the thicknesses of the third connection pins 21 and the first connection pins 11, so that the first connection pins 11 arranged near the warping portion can be well contacted with the third connection pins 21 on the control module 20, thereby solving the problems of signal crosstalk and display of the display panel caused by poor contact between the third connection pins 21 of part of the control module 20 and the first connection pins 11 of the display panel due to poor binding effect of the existing display panel, and realizing improvement of the binding effect of the display panel and the control module 20, thereby eliminating the phenomena of signal crosstalk and display unevenness of the display panel and improving the display effect of the display panel.
In consideration of the fact that, in actual installation, in order to make as many first connection pins 11 as possible contact well with third connection pins 21 on the control module after one pressing, the geometric center of the control module 20 is pressed by the force F, i.e. the point of application a of the force F is located at the geometric center of the control module 20.
With continued reference to fig. 3, in actual implementation, optionally, the smaller the distance from the first connection pin 11 to the edge of the long side of the driver chip bonding area 13 adjacent thereto, the larger the thickness of the first connection pin 11, along the short side direction 100 of the driver chip bonding area 13. Since the action point a of the force F is located at the geometric center of the control module 20, and the vertical projection of the geometric center of the control module 20 on the substrate coincides with the geometric center of the driver chip bonding area 13, the farther the installation position of the first connection pin 11 is from the geometric center of the driver chip bonding area 13 along the short side direction of the driver chip bonding area 13, the smaller the distance of the first connection pin 11 from the edge of the long side of the driver chip bonding area 13 adjacent to the first connection pin 11 is, and the easier the installation position of the first connection pin 11 is to warp. Through setting up "bind district 13 minor face direction 100 along the driver chip, the distance that first connection pin 11 apart from the edge of the long limit of the driver chip that rather than closes on binds district 13 is the less, first connection pin 11 thickness is big more," can make the first connection pin 11 that sets up near warping part can be good with the third connection pin 21 on the control module contact, improve display panel and control module 20's the effect of binding, and then eliminate display panel's signal crosstalk and show inhomogeneous phenomenon, improve display panel's display effect.
Fig. 5 is a schematic structural diagram of another display panel according to an embodiment of the present invention. Referring to fig. 5, the driving chip bonding area 13 of the display panel is bonded to the control module 20 through an anisotropic conductive film 30. The anisotropic conductive film 30 includes conductive particles 31. The first connection pin 11 is electrically connected to the third connection pin 21 of the control module 20, and the electrical connection is substantially realized by the conductive particles 31 embedded between the first connection pin 11 and the third connection pin 21.
Considering two first connection pins 11 having different thicknesses, the first connection pin 11 having a larger thickness is more "protruded" than the first connection pin 11 having a smaller thickness. The first connection pin 11 with the greater thickness makes it easier to "give priority" to the control module 20 and to "lift" the control module 20 compared to the first connection pin 11 with the smaller thickness. Obviously, the larger the difference between the thicknesses of the two first connection pins 11 is, the larger the distance between the control module 20 and the substrate base plate 10 is under the supporting action of the first connection pin 11 with the larger thickness, so that the distance between the control module 20 and the substrate base plate 10 at the position where the first connection pin 11 with the smaller thickness is disposed is larger than the sum of the thicknesses of the first connection pin 11 with the smaller thickness and the third connection pin 21 corresponding to the first connection pin 11 with the smaller thickness, and further the first connection pin 11 with the smaller thickness cannot be in contact with the third connection pin 21 corresponding to the third connection pin. For this purpose, 1/3 in which the difference between the thicknesses of the first connection pins 11 of adjacent rows is smaller than or equal to the diameter of the conductive particles 31 is optionally provided. The advantage of setting up like this is, avoid appearing because the great first connecting pin 11 of thickness lifts control module 20 "too high", cause the less first connecting pin 11 of thickness can not be rather than the bad phenomenon of the third connecting pin 21 contact of corresponding, and then make each conductive particle 31 can with first connecting pin 11 and with the third connecting pin 21 on the control module 20 abundant electrical contact, further eliminate display panel's signal crosstalk and the uneven phenomenon of display, improve display panel's display effect.
Fig. 6 is a schematic structural diagram of another display panel according to an embodiment of the present invention. Optionally, as shown in fig. 6, the display panel further includes a second connection pin 12; the driver chip bonding region 13 includes a first long side 131 and a second long side 132; the distance of each first connecting pin 11 from the first long side 131 is greater than the distance from the second long side 132; the distance from each second connection pin 12 to the first long side 131 is smaller than the distance from the second long side 132; the thickness of the first connection pin 11 closest to the second long side 132 of the driver chip bonding region 13 is the same as the thickness of the second connection pin 12; the first connecting pin 11 is used as a signal output end; the second connection pin 12 serves as a signal input. The advantage of setting up like this is, can make first connecting pin 11 and second connecting pin 12 all can with the third connecting pin 21 on the control module abundant electrical contact to guarantee the validity of signal input, output transmission, eliminate display panel's signal crosstalk and show uneven phenomenon, improve display panel's display effect.
With continued reference to fig. 6, in the display panel, the substrate base plate 10 may further include a display region 14 and a non-display region 15; a plurality of scanning lines 16 and a plurality of data lines 17 are arranged in the display area 14; the driver chip bonding area 13 is arranged in the non-display area 15; the first connecting lead 11 and the scanning line 16 are made of the same material and are located in the same film layer as the scanning line 16; alternatively, the first connecting lead 11 and the data line 17 are made of the same material and located in the same film layer as the data line 17.
Compared with the scheme that the first connecting lead 11 and the scanning line 16 are on different film layers, the first connecting lead 11 and the scanning line 16 are made of the same material and are located in the same film layer as the scanning line 16, so that the thickness of the display panel can be reduced. In addition, the first connecting pins 11 and the scanning lines 16 only need one etching process in the manufacturing process, and no mask plate needs to be manufactured on the first connecting pins 11 and the scanning lines 16 respectively, so that the cost is saved, the number of manufacturing processes is reduced, and the production efficiency is improved. Similarly, compared with the scheme that the first connection pin 11 and the data line 17 are in different film layers, the first connection pin 11 and the data line 17 are made of the same material and are located in the same film layer as the data line 17, so that the thickness of the display panel can be reduced. In addition, the first connecting pins 11 and the data lines 17 only need one etching process in the manufacturing process, and no mask plate needs to be manufactured on the first connecting pins 11 and the data lines 17 respectively, so that the cost is saved, the number of manufacturing processes is reduced, and the production efficiency is improved.
In the above technical solution, the shapes of the first connection pin 11 and the second connection pin 12 may be various, and optionally, the shapes of the first connection pin 11 and the second connection pin 12 are rectangles or circles, etc. Further, if the first connection pins 11 and the second connection pins 12 are rectangular, optionally, the short sides of the first connection pins 11 or the second connection pins 12 are parallel to the long side direction 200 of the driver chip bonding region 13. In addition, in order to further make each first connection pin 11 sufficiently electrically contact with the third connection pin 21 on the control module 20, optionally, each first connection pin 11 disposed in the same row is different in thickness, and the first connection pins 11 disposed in different rows are different in thickness.
The embodiment of the invention also provides a display device, and fig. 7 is a schematic structural diagram of the display device provided by the embodiment of the invention. As shown in fig. 7, the display device includes a control module 20 and any one of the display panels 10 according to the embodiments of the present invention. The control module 20 includes a plurality of third connection pins 21, and the third connection pins 21 are arranged in one-to-one correspondence with the first connection pins 11; the control module 20 and the driving chip bonding region 13 are bonded by the anisotropic conductive film 30, and the third connection pins 21 are electrically connected with the corresponding first connection pins 11.
According to the display device provided by the embodiment of the invention, the problems of signal crosstalk and uneven display of the display panel caused by poor binding effect of the existing display panel due to poor contact between part of the connection pins of the control module and the connection pins of the display panel are solved by setting different thicknesses of the first connection pins in different rows, so that the binding effect of the display panel and the control module is improved, the phenomena of signal crosstalk and uneven display of the display panel are eliminated, and the display effect of the display panel is improved.
With continued reference to fig. 7, the control module may be a driving chip or a flexible circuit board according to the requirement of the display panel. If the control module is a flexible circuit board, optionally, a driving chip is bound on the flexible circuit board.
It should be noted that, the driving chip is often provided with an arithmetic unit, and therefore, the size of the driving chip is often large, and therefore, if the control module is the driving chip, a region with a large size needs to be reserved in the non-display region of the display panel as the binding region of the driving chip. And the flexible circuit board is not provided with an arithmetic unit, if the control module is the flexible circuit board, only a smaller area is reserved in the non-display area of the display panel as a binding area of the drive chip. Namely, the control module is set to be a flexible circuit board, so that the area of the binding region of the driving chip can be reduced, and further the area of the non-display region of the display panel is reduced, which is consistent with the development trend of narrow frame. The control module is arranged to be a flexible circuit board, and is particularly suitable for a full-face screen.
The embodiment of the invention also provides a manufacturing method of the display panel. Fig. 8 is a flowchart of a method for manufacturing a display panel according to an embodiment of the invention. Referring to fig. 8, the method for manufacturing the display panel includes;
and S110, providing a substrate base plate.
The substrate base plate comprises a drive chip binding area, and the drive chip binding area is rectangular.
And S120, forming at least two rows of first connecting pins in the binding area of the drive chip.
Each row of first connecting pins comprises at least two first connecting pins; the thickness of each first connecting pin arranged in the same row is the same, and the thickness of the first connecting pins arranged in different rows is different; the extending direction of the rows is parallel to the long side direction of the binding area of the driving chip.
According to the display device provided by the embodiment of the invention, the problems of signal crosstalk and uneven display of the display panel caused by poor binding effect of the existing display panel due to poor contact between part of the connection pins of the control module and the connection pins of the display panel are solved by setting different thicknesses of the first connection pins in different rows, so that the binding effect of the display panel and the control module is improved, the phenomena of signal crosstalk and uneven display of the display panel are eliminated, and the display effect of the display panel is improved.
In order to further improve the binding effect between the display panel and the control module, optionally, the distance from the first connection pin to the edge of the long edge of the binding region of the driver chip adjacent to the first connection pin is smaller along the short edge direction of the driver chip, and the thickness of the first connection pin is larger.
Optionally, S120 includes:
forming a metal layer in a drive chip binding region of a substrate base plate;
and etching the metal layer by using the half-tone mask so that the etched metal layer forms a plurality of first connecting pins.
The half-tone mask plate comprises a light-transmitting area and a non-light-transmitting area. Wherein, the light transmittance of different light transmission areas on the half-tone mask plate is different. And etching the metal layer by using the half-tone mask, so that the etched metal layer has different thicknesses. Therefore, the first connecting pins 11 with different thicknesses can be formed in the same process step, the cost is saved, the number of processes is reduced, and the production efficiency is improved.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious modifications, rearrangements, combinations and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. A display panel is characterized by comprising a substrate base plate, wherein the substrate base plate comprises a drive chip binding area, at least two rows of first connecting pins are arranged in the drive chip binding area, and each row of the first connecting pins comprises at least two first connecting pins;
the thickness of each first connecting pin arranged in the same row is the same, and the thickness of the first connecting pins arranged in different rows is different;
the drive chip binding area is rectangular, and the extending direction of the row is parallel to the long edge direction of the drive chip binding area;
the device also comprises a second connecting pin;
the drive chip binding region comprises a first long edge and a second long edge;
the distance between each first connecting pin and the first long edge is greater than the distance between each first connecting pin and the second long edge; the distance between each second connecting pin and the first long edge is smaller than the distance between each second connecting pin and the second long edge;
the thickness of the first connecting pin closest to the second long edge of the drive chip binding region is the same as that of the second connecting pin;
the drive chip binding area is bonded with the control module through an anisotropic conductive adhesive film;
the anisotropic conductive adhesive film comprises conductive particles;
the difference between the thicknesses of the first connecting pins of the adjacent rows is less than or equal to 1/3 of the diameter of the conductive particles.
2. The display panel according to claim 1,
along the short side direction of the drive chip binding area, the smaller the distance between the first connecting pin and the edge of the long side of the drive chip binding area adjacent to the first connecting pin is, the larger the thickness of the first connecting pin is.
3. The display panel according to claim 1, wherein the first connection pin serves as a signal output terminal; the second connection pin is used as a signal input end.
4. The display panel according to claim 1, wherein the substrate base plate includes a display region and a non-display region;
a plurality of scanning lines and a plurality of data lines are arranged in the display area; the drive chip binding area is arranged in the non-display area;
the first connecting pin is made of the same material as the scanning line and is positioned in the same film layer as the scanning line; or
The first connecting pin is made of the same material as the data line and is positioned in the same film layer as the data line.
5. A display device comprising a control module and the display panel of any one of claims 1-4;
the control module comprises a plurality of third connecting pins, and the third connecting pins and the first connecting pins are arranged in one-to-one correspondence; the control module is bonded with the drive chip binding area through an anisotropic conductive film, and the third connecting pin is electrically connected with the first connecting pin corresponding to the third connecting pin.
6. The display device according to claim 5, wherein the display device is a liquid crystal display device
The control module is a driving chip.
7. The display device according to claim 5, wherein the display device is a liquid crystal display device
The control module is a flexible circuit board, and a driving chip is bound on the flexible circuit board.
8. A method for manufacturing the display panel according to any one of claims 1 to 4, comprising;
providing a substrate base plate, wherein the substrate base plate comprises a drive chip binding area, and the drive chip binding area is rectangular;
forming at least two rows of first connecting pins in the binding area of the drive chip, wherein each row of the first connecting pins comprises at least two first connecting pins; the thickness of each first connecting pin arranged in the same row is the same, and the thickness of the first connecting pins arranged in different rows is different; the extending direction of the row is parallel to the long edge direction of the binding area of the driving chip;
further comprising:
forming a second connecting pin in the binding region of the drive chip;
the drive chip binding region comprises a first long edge and a second long edge; the distance between each first connecting pin and the first long edge is greater than the distance between each first connecting pin and the second long edge; the distance between each second connecting pin and the first long edge is smaller than the distance between each second connecting pin and the second long edge; the thickness of the first connecting pin closest to the second long edge of the drive chip binding region is the same as that of the second connecting pin;
the drive chip binding area is bonded with the control module through an anisotropic conductive adhesive film;
the anisotropic conductive adhesive film comprises conductive particles;
the difference between the thicknesses of the first connecting pins of the adjacent rows is less than or equal to 1/3 of the diameter of the conductive particles.
9. The method for manufacturing a display panel according to claim 8,
along the short side direction of the driving chip, the smaller the distance between the first connecting pin and the edge of the long side of the binding area of the driving chip adjacent to the first connecting pin is, the larger the thickness of the first connecting pin is.
10. The method for manufacturing a display panel according to claim 8, wherein the forming of the plurality of first connection pins in the driver chip bonding region includes;
forming a metal layer in the driver chip bonding region of the substrate base plate;
and etching the metal layer by using a half-tone mask so as to form a plurality of first connecting pins on the etched metal layer.
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| CN109036155A (en) * | 2018-07-26 | 2018-12-18 | 武汉华星光电技术有限公司 | Display panel and display device |
| US10877330B2 (en) | 2018-10-19 | 2020-12-29 | HKC Corporation Limited | Display device |
| CN109166478B (en) * | 2018-10-19 | 2021-04-06 | 惠科股份有限公司 | Display device |
| CN109087589B (en) * | 2018-10-22 | 2021-06-18 | 惠科股份有限公司 | Array substrate, display panel and display device |
| CN112908164A (en) * | 2021-01-21 | 2021-06-04 | 厦门天马微电子有限公司 | Display module, manufacturing method of display module and display device |
| CN113473696B (en) * | 2021-06-30 | 2023-04-07 | 昆山工研院新型平板显示技术中心有限公司 | Display module and display device |
| CN113917747B (en) * | 2021-09-30 | 2022-11-01 | 武汉华星光电技术有限公司 | Display panel and display device |
| CN113823183B (en) * | 2021-09-30 | 2022-09-09 | 武汉华星光电技术有限公司 | Display panel and display device |
| CN113823241B (en) * | 2021-09-30 | 2022-09-27 | 武汉华星光电技术有限公司 | Drive chip and display panel |
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| KR102535557B1 (en) * | 2016-03-07 | 2023-05-24 | 삼성디스플레이 주식회사 | Display apparatus and electronic device |
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| CN101587874A (en) * | 2008-05-22 | 2009-11-25 | 瀚宇彩晶股份有限公司 | Chip with drive integrated circuit and corresponding liquid crystal display |
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