CN112908164A - Display module, manufacturing method of display module and display device - Google Patents
Display module, manufacturing method of display module and display device Download PDFInfo
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- CN112908164A CN112908164A CN202110081697.XA CN202110081697A CN112908164A CN 112908164 A CN112908164 A CN 112908164A CN 202110081697 A CN202110081697 A CN 202110081697A CN 112908164 A CN112908164 A CN 112908164A
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
- H10K59/1315—Interconnections, e.g. wiring lines or terminals comprising structures specially adapted for lowering the resistance
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Abstract
The invention discloses a display module, a manufacturing method of the display module and a display device, and relates to the technical field of display, wherein the display module and the display device comprise a display panel, a cover plate positioned on one side of a light-emitting surface of the display panel and a main plate positioned on one side of a backlight surface of the display panel; the cover plate comprises a first surface and a second surface which are oppositely arranged along the direction perpendicular to the plane of the display panel, and the second surface is positioned on one side of the cover plate facing the display panel. In this application, because be provided with electric connection's first pin and second pin on the second surface, through making first pin and mainboard connection, and make the second pin be connected with the first conductive part in the display panel binding area, the connection of display panel and mainboard has been realized, therefore need not to introduce the FPC connector again, the problem that the display panel that leads to on the mainboard was inserted to close to the FPC connector and the mainboard is difficult for separating has been solved, and then be convenient for dismantle or change the display module assembly in the display product.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display module, a manufacturing method of the display module and a display device.
Background
With the development of mobile electronic product technology, many display panel manufacturers attract consumers with narrow frame and high screen ratio as selling points, and the frame width of the display module is directly related to the size of the frame of the electronic product.
In order to reduce the frame width of the display module, a Flexible Printed Circuit (FPC) is bonded to the substrate in the lower frame region of the display panel in the related art, and the Flexible Printed Circuit is bent to the back of the display panel after the driver chip is integrated into the Flexible Printed Circuit, so that the space of the lower frame of the display module is saved. However, the bent flexible circuit board needs to be further connected to the main board through the FPC connector, and the FPC connector is plugged into the main board, so that great difficulty is caused in detaching and replacing the display module in the display device, particularly the wearable device.
Disclosure of Invention
In view of this, the invention provides a display module, a manufacturing method of the display module and a display device, which are easy to separate the display module from a main board, so that the display module in a display product is more convenient to disassemble.
In a first aspect, the present application provides a display module, including:
the display panel comprises a light-emitting surface and a backlight surface;
the cover plate is positioned on one side of the light emitting surface;
the main board is positioned on one side of the display panel, which is far away from the cover plate;
along a direction perpendicular to a plane of the display panel, the cover plate comprises a first surface and a second surface which are oppositely arranged, the second surface is positioned on one side of the cover plate facing the display panel, the second surface comprises a first pin and a second pin, and the first pin is electrically connected with the second pin; the display panel comprises a binding area, wherein the binding area comprises at least one first conductive part, the first pin is connected with the mainboard, and the second pin is connected with the first conductive part.
In a second aspect, the present application further provides a method for manufacturing a display module, including:
providing a cover plate, and manufacturing a first pin and a second pin on one side surface of the cover plate; the first pin is electrically connected with the second pin;
providing a display panel, wherein the display panel comprises a binding area, the binding area comprises a plurality of first conductive parts, and the second pins are connected with the first conductive parts;
providing a mainboard and connecting the first pins with the mainboard;
and assembling the cover plate, the display panel and the main board.
In a third aspect, the present application further provides a display device including the display module provided in the present application.
Compared with the prior art, the display module, the manufacturing method of the display module and the display device provided by the invention at least realize the following beneficial effects:
the display module, the manufacturing method of the display module and the display device comprise a display panel, a cover plate and a main plate, wherein the cover plate is positioned on one side of a light emitting surface of the display panel, and the main plate is positioned on one side of a backlight surface of the display panel; the cover plate comprises a first surface and a second surface which are oppositely arranged along the direction perpendicular to the plane of the display panel, and the second surface is positioned on one side of the cover plate facing the display panel. In this application, because be provided with electric connection's first pin and second pin on the second surface, through making first pin and mainboard connection, and make the second pin be connected with the first conductive part in the display panel binding area, the connection of display panel and mainboard has been realized, therefore need not to introduce the FPC connector again, the problem that the display panel that leads to on the mainboard was inserted to close to the FPC connector and the mainboard is difficult for separating has been solved, and then be convenient for dismantle or change the display module assembly in the display product.
Of course, it is not necessary for any product in which the present invention is practiced to achieve all of the above-described technical effects simultaneously.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic top view of a display module according to an embodiment of the present disclosure;
FIG. 2 is a BB' cross-sectional view of the display module of FIG. 1;
FIG. 3 is a partial schematic view of the display module shown in FIG. 2 according to an embodiment;
FIG. 4 is another partial schematic view of the display module shown in FIG. 2;
fig. 5 is a schematic diagram illustrating the distribution of the first pins and the second pins on the cover plate provided in the embodiment of fig. 2;
FIG. 6 is a partial schematic view of the display module shown in FIG. 2;
FIG. 7 is a cross-sectional view of another BB' of the display module of FIG. 1;
FIG. 8 is a partial schematic view of the display module shown in FIG. 7 according to the embodiment;
FIG. 9 is a partial schematic view of the display module shown in FIG. 7 according to the embodiment;
FIG. 10 is a cross-sectional view of another BB' of the display module of FIG. 1;
FIG. 11 is a partial schematic view of the area C1 in the embodiment of FIG. 10;
FIG. 12 is a cross-sectional view of another BB' of the display module of FIG. 1;
FIG. 13 is a partial schematic view of the area C2 in the embodiment of FIG. 12;
FIG. 14 is a schematic diagram illustrating a distribution of the groove structures on the cover plate according to the embodiment of the present application;
FIG. 15 is a cross-sectional view of another BB' of the display module of FIG. 1;
fig. 16 is a schematic flow chart illustrating a manufacturing method of a display module according to an embodiment of the present disclosure;
fig. 17 is a schematic structural diagram of a display device according to an embodiment of the present disclosure.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
Fig. 1 is a schematic top view of a display module according to an embodiment of the present disclosure, fig. 2 is a cross-sectional view of a display module BB' according to the embodiment of fig. 1, fig. 3 is a schematic partial view of the display module according to the embodiment of fig. 2, and fig. 4 is another schematic partial view of the display module according to the embodiment of fig. 2. Referring to fig. 1-4, the present application provides a display module 100, including:
a display panel 10 including a light emitting surface and a backlight surface;
the cover plate 20 is positioned on one side of the light-emitting surface;
the main board 30 is positioned on one side of the display panel 10 away from the cover plate 20;
in a direction perpendicular to the plane of the display panel 10, the cover plate 20 includes a first surface 201 and a second surface 202 disposed oppositely, the second surface 202 is located on a side of the cover plate 20 facing the display panel 10, the second surface 202 includes a first pin P1 and a second pin P2, and the first pin P1 is electrically connected to the second pin P2; the display panel 10 includes a bonding region 40, and the bonding region 40 includes at least one first conductive portion 401, wherein the first pin P1 is connected to the main board 30, and the second pin P2 is connected to the first conductive portion 401.
Specifically, the display module 100 provided in the present application includes a display panel 10, a cover plate 20 and a main board 30, where the display panel 10 includes a light-emitting surface and a backlight surface, the cover plate 20 is located on one side of the light-emitting surface of the display panel 10, and the main board 30 is located on one side of the backlight surface of the display panel 10; the light-emitting surface of the display panel 10 refers to a surface of the display panel 10 contacting the cover plate 20, and light emitted from the light-emitting surface is emitted to the cover plate 20.
In this embodiment, the display panel 10 is a liquid crystal display panel or an organic light emitting display panel. When the display panel 10 is a liquid crystal display panel, the display panel includes a first substrate 101 and a second substrate 102 that are disposed opposite to each other, a liquid crystal layer 103 is disposed between the first substrate 101 and the second substrate 102, and liquid crystal molecules (not shown in the figure) in the liquid crystal layer 103 can be deflected under the action of an electric field between the first substrate 101 and the second substrate 102 to form a liquid crystal light valve, which allows or prevents light of a backlight source from passing through. As shown in fig. 2, the second substrate 102 covers a partial area of the first substrate 101 to form a dual-layer substrate area a1 of the display panel 10, and at least one end of the first substrate 101 protrudes out of the covered area of the second substrate 102 to form a single-layer substrate area a2 of the display panel 10. The display panel 10 includes a display area AA and a non-display area NA at least partially surrounding the display area AA, and it is apparent that the display area AA is located in the dual-layer substrate area a1, the single-layer substrate area a2 is located in the non-display area NA, and the single-layer substrate area a2 has the bonding area 40 therein.
Alternatively, the display panel 10 may also be an Organic Light-Emitting display panel (OELD). At this time, the display panel 10 includes a substrate, a thin film transistor array layer, a light emitting layer and a package layer, wherein the thin film transistor array layer is located on a surface of one side of the substrate, the light emitting layer is located on a side of the thin film transistor array layer away from the substrate, and the package layer is located on a side of the light emitting layer away from the substrate. The display panel 10 further includes a display region and a non-display region at least partially surrounding the display region, wherein a bonding region is disposed in the non-display region and is formed by extending the substrate. That is, in the organic light emitting display panel, the binding region is also located at the single substrate region. Of course, the substrate may be a glass substrate or a flexible substrate made of polyimide.
Further, in the present embodiment, the bonding region 40 includes at least one first conductive portion 401, and along a direction perpendicular to the plane of the display panel 10, the cover plate 20 includes a first surface 201 and a second surface 202 that are disposed oppositely, the second surface 202 is located on a side of the cover plate 20 facing the display panel 10, and the second surface 202 is further provided with a first pin P1 and a second pin P2 that are electrically connected. It should be understood that, in the related art, the driving elements required for implementing the display function are usually integrated on the display panel, and in the present application, the driving elements are disposed on the main board 30 of the display module 100, and are connected to the conductive portion 301 on the main board 30 through the first pin P1, and the second pin P2 is connected to the first conductive portion 401, so that the display panel 10 is electrically connected to the main board 30, and therefore, an FPC connector is not required to be introduced, the problem that the display panel 10 is not easily separated from the main board 30 due to the insertion of the FPC connector on the main board 30 is solved, and further, the display module 100 in the display product is conveniently detached or replaced. In addition, this application need not to bind the flexible circuit board in display panel 10's the district 40 of binding through adopting above-mentioned design to cause the pulling to the individual layer base plate district when buckling the flexible circuit board in avoiding the correlation technique, be favorable to guaranteeing display panel 10's yield, promote product reliability.
It should be noted that the electrical connection between the first pin P1 and the second pin P2 means that there is a direct or indirect electrical contact therebetween, and as long as the electrical signal conduction between the first pin P1 and the second pin P2 can be realized, the first pin P1 is electrically connected to the second pin P2; for example, referring to fig. 3, the first pin P1 and the second pin P2 are two ends of the same pin, respectively, or as shown in fig. 4, the first pin P1 and the second pin P2 can be connected through a conductive medium. Moreover, it should be understood by those skilled in the art that the display panel 10, the cover plate 20 and the main board 30 are not substantially separated but fixedly connected in the display module 100, and the illustration of fig. 2 is only for the convenience of describing the embodiment.
In addition, as shown in fig. 1, the shape of the display panel 10 in this embodiment may be a circle or an ellipse, so as to manufacture wearable devices such as a smart watch; in some other embodiments of the present application, the display panel 10 may also be in other shapes, such as a conventional rectangular display panel or a special-shaped display panel, and further used for manufacturing products such as a mobile phone and a tablet computer, which is not limited in the present application.
Optionally, with reference to fig. 4, the first pin P1 and the second pin P2 are connected by a metal trace L.
In this embodiment, metal may be deposited and etched on the second surface 202 of the glass cover plate 20 to form a metal trace L, so that the first pin P1 is electrically connected to the second pin P2 through the metal trace L, and further, the driving signal provided by the motherboard 30 is received by the signal lines in the display panel 10 after passing through the first pin P1, the second pin P2 and the first conductive portion 401 in sequence. Obviously, the cover plate 20 is provided with the first pin P1 and the second pin P2 which are electrically connected, so that the display panel 10 is electrically connected with the main board 30, and the problem that the display panel 10 is not easily separated from the main board 30 due to the fact that the FPC connector is inserted into the main board 30 can be solved; meanwhile, the manufacturing process of the metal wiring L is relatively mature, so that the design mode is favorable for saving the manufacturing cost and simplifying the structure of the display module 100, thereby ensuring the product yield.
In addition, in some other embodiments of the present application, the first pin P1 and the second pin L2 may also be connected through another conductive medium, such as an anisotropic conductive film. Fig. 5 is a schematic diagram illustrating the distribution of the first pins and the second pins on the cover plate according to the embodiment of fig. 2. As shown in fig. 5, when the number of the first pins P1 and the number of the second pins P2 are both multiple, the first pins P1 and the second pins P2 can be connected in a one-to-one correspondence manner through a conductive medium such as a metal trace L.
Fig. 6 is another partial schematic view of the display module according to the embodiment of fig. 2. In this embodiment, as shown in fig. 6, the main board 30 includes a first driver chip 31, and the first driver chip 31 is connected to the first pin P1.
Specifically, the display module 100 further includes a first driver chip 31, the first driver chip 31 is pressed on the main board 30, and since the first driver chip 31 is electrically connected to the main board 30 and the main board 30 is electrically connected to the first pin P1 of the cover plate 20 through the conductive portion 301, the first driver chip 31 on the main board 30 can be electrically connected to the display panel 10, and the display panel 10 can receive the driving control signal output by the first driver chip 31 and perform displaying; the main Board 30 for fixing the driving chip may be a Printed Circuit Board (PCB). In this embodiment, the first driving chip 31 is disposed on the main board 30, so that the position of the first driving chip 31 in the display panel 10 can be omitted, which is beneficial to implementing a narrow frame design of the display module 100.
It should be noted that the first driver chip 31 is only for illustration and does not represent the actual connection relationship between the first pin P1 and the first driver chip 31.
Referring to fig. 3, fig. 4 and fig. 6, in the present embodiment, the second pin P2 is connected to the first conductive part 401 through the anisotropic conductive film 21.
It should be understood that the Anisotropic Conductive Film 21 (ACF) is formed by encapsulating a plurality of spherical Conductive particles in a semi-cured resin or mixing a plurality of spherical Conductive particles with a super glue, and has the characteristics of being Conductive in the vertical direction and non-Conductive in the horizontal direction. In this embodiment, the anisotropic conductive film 21 may be disposed between the elements to be bonded, that is, between the second pin P2 and the first conductive part 401, and then the anisotropic conductive film 21 is heated and pressurized to receive the temperature and pressure to connect the second pin P2 and the first conductive part 401 together, and the bonded second pin P2 and the first conductive part 401 are electrically conductive in the direction perpendicular to the plane of the display panel 10; meanwhile, the anisotropic conductive film 21 also has the function of gluing and fixing, so that the second pin P2 and the first conductive part 401 can be stably and reliably connected and fixed.
Alternatively, the first pin P1 may be connected to the conductive part 301 on the motherboard 30 through the anisotropic conductive film 21.
Fig. 7 is a schematic view showing another BB' cross section of the display module provided in the embodiment of fig. 1, and fig. 8 and 9 are partial schematic views of the display module provided in the embodiment of fig. 7. As shown in fig. 7-8, the second surface 202 further includes a third pin P3 and a fourth pin P4; the third pin P3 is electrically connected with the first pin P1, and the fourth pin P4 is electrically connected with the second pin P2; the display module 100 includes a flexible circuit board 50, wherein the flexible circuit board 50 includes a second driving chip (not shown), a second conductive portion 501 and a third conductive portion 502; the second conductive part 501 is connected with the third pin P3, the third conductive part 502 is connected with the fourth pin P4, and the second conductive part 501 is electrically connected with the third conductive part 502; the second driver chip is bound to the flexible circuit board 50 through the second conductive portion 501 and/or the third conductive portion 502.
Fig. 7 differs from fig. 2 in that: the display module 100 shown in fig. 7 further includes a flexible circuit board 50. Specifically, referring to fig. 7-8, the display module 100 further includes a flexible circuit board 50 located between the display panel 10 and the main board 30, and the second driver chip is bound to the flexible circuit board 50 through the second conductive portion 501 and/or the third conductive portion 502. Optionally, the second conductive part 501 is a signal input end of the second driver chip, and the third conductive part 502 is a signal output end of the second driver chip, or the input and output of the second driver chip share one second conductive part 501/third conductive part 502. The cover plate 20 includes a first surface 201 and a second surface 202 disposed opposite to each other along a direction perpendicular to a plane of the display panel 10, the second surface 202 is located on a side of the cover plate 20 facing the display panel 10, and the first pin P1, the second pin P2, the third pin P3 and the fourth pin P4 are disposed on the second surface 202. Since the first pin P1 is electrically connected to the main board 30 through the conductive part 301, the third pin P3 is electrically connected to the first pin P1, the second conductive part 501 is electrically connected to the third pin P3, the third conductive part 502 is electrically connected to the fourth pin P4, and the fourth pin P4 is electrically connected to the second pin P2, the path from the main board 30 to the display panel 10 is realized. Therefore, the design method does not need to introduce an FPC connector into the display module 100, so that the problem that the display panel 10 and the main board 30 are not easily separated due to the insertion of the FPC connector on the main board 30 is solved, and the display module 100 is convenient to detach and replace.
In this embodiment, the electrical connection between the first pin P1 and the third pin P3 means that there is a direct or indirect electrical contact therebetween. Optionally, as shown in fig. 8, the first pin P1 and the third pin P3 are two ends of the same pin, respectively; alternatively, as shown in fig. 9, the first pin P1 and the third pin P3 are connected through a conductive medium, such as a metal trace L, an anisotropic conductive film, and the like, and the selected conductive medium only needs to ensure that an electrical signal can be transmitted between the two, which is not limited in this application. In addition, the second pin P2 and the fourth pin P4 can be connected in the same manner as the first pin P1 and the third pin P3, and the description thereof is omitted.
It should be noted that, in some alternative embodiments, the first pin P1, the second pin P2, the third pin P3, the fourth pin P4, the conductive portion 301, the first conductive portion 401, the second conductive portion 501, and the third conductive portion 502 may all be made of the same material, and different names are given herein only for convenience of differentiation and illustration.
In the related art, after the flexible circuit board is bound to the binding area of the display panel, the flexible circuit board needs to be bent to a side of the display panel away from the cover plate, and the binding area is a single-layer substrate area, so that the single-layer substrate may be pulled and damaged when the flexible circuit board is bent. However, this design not only increases the process risk of the product, but also does not significantly improve the strength of the single-layer substrate region. In view of this, the flexible circuit board 50 bound with the second driving chip is disposed between the display panel 10 and the main board 30 in this embodiment, on one hand, the position of the second driving chip can be omitted in the display panel 10, which is beneficial to implementing the narrow frame design of the display module 100, and on the other hand, the single-layer substrate area a2 can be prevented from being pulled when the flexible circuit board 50 is bent, and the product yield is ensured without coating silicone adhesive or attaching foam.
Fig. 10 is a schematic cross-sectional view of another BB' of the display module provided in the embodiment of fig. 1, and fig. 11 is a partial schematic view of a region C1 in the embodiment of fig. 10. Referring to fig. 10 and 11, the display module 100 further includes a middle frame 60, the middle frame 60 and the cover plate 20 form an accommodating space, and the display panel 10 and the main board 30 are located in the accommodating space; the middle frame 60 comprises a first sub-surface 61, the first sub-surface 61 comprises a first thread a, the cover plate 20 comprises a third surface 203, the third surface 203 comprises a second thread b, and the cover plate 20 and the middle frame 60 are fixedly connected through the first thread a and the second thread b; the third surface 203 is perpendicular to the plane of the display panel 10, and the first sub-surface 61 is in contact with the third surface 203.
In this embodiment, the display module 100 further includes a middle frame 60, and the middle frame 60 and the cover plate 20 can form an accommodating space in which the display panel 10 and the main board 30 are located. Further, the cover plate 20 includes a third surface 203 perpendicular to the plane of the display panel 10, the surface of the middle frame 60 contacting the third surface 203 is a first sub-surface 61, wherein the first sub-surface 61 includes a first thread a, and the surface of the cover plate 20 contacting the middle frame 60, that is, the third surface 203, is correspondingly provided with a second thread b, and when the display module 100 is assembled, the first thread a and the second thread b are only required to be fixedly connected. Obviously, for products with circular or oval display panels 10, this design can facilitate the assembly and disassembly of the cover plate 20 and the middle frame 60, thereby facilitating the mass production of the display module 100.
Fig. 12 is a schematic cross-sectional view of another BB' of the display module provided in the embodiment of fig. 1, and fig. 13 is a partial schematic view of a region C2 in the embodiment of fig. 12. As shown in fig. 12-12, the display module 100 further includes a middle frame 60, the middle frame 60 and the cover plate 20 form an accommodating space, and the display panel 10 and the main board 30 are located in the accommodating space; the display module 100 further comprises a snap structure 70, wherein the snap structure 70 comprises a protrusion structure 71 and a groove structure 72; the middle frame 60 includes a second sub-surface 62, the second sub-surface 62 includes a protruding structure 71, and the second surface 202 of the cover plate 20 includes a recessed structure 72, wherein the second sub-surface 62 contacts the second surface 202, and the cover plate 20 and the middle frame 60 are engaged with each other through the protruding structure 71 and the recessed structure 72.
In this embodiment, along a direction perpendicular to the plane of the display panel 10, the front projection of the middle frame 60 is located within the front projection of the cover plate 20, and the cover plate 20 of the display module 100 can be fixedly connected to the middle frame 60 through the fastening structure 70. Specifically, as shown in fig. 11, a surface of the middle frame 60, which contacts the second surface 202 of the cover plate 20, is the second sub-surface 62, and the fastening structure 70 includes a protruding structure 71 and a recessed structure 72, where the second sub-surface 62 includes the protruding structure 71, and the second surface 202 includes the recessed structure 72, optionally, a height of the protruding structure 71 is equal to a depth of the recessed structure 72, and then when the display module 100 is assembled, the protruding structure 71 on the middle frame 60 and the recessed structure 72 on the cover plate 20 are correspondingly fastened. The design not only can simplify the assembly and disassembly of the cover plate 20 and the middle frame 60, thereby improving the mass production efficiency of the display module 100, but also can be applied to the display modules 100 with the display panels 10 of different shapes, and has good compatibility.
Of course, in some other embodiments of the present application, the protruding structures 71 may also be disposed on the second surface 202 of the cover plate 20, and the recessed structures 72 are correspondingly disposed on the second sub-surface 62 of the middle frame 60, as long as the protruding structures 71 and the recessed structures 72 can be correspondingly engaged and tightly connected, which is not limited in the present application.
In this embodiment, the number of the snap structures 70 is even, and the snap structures 70 are symmetrically distributed about the display panel 10.
Specifically, the number of the snap structures 70 in the display module 100 is even, and may be set to 4, 6 or 8, for example. Fig. 14 is a schematic diagram illustrating a distribution of the groove structures on the cover plate according to an embodiment of the present application. As shown in fig. 14, taking the circular display panel 10 as an example, the axis of symmetry of the display panel 10 is an arbitrary straight line passing through the center o, the even number of fastening structures 70 includes an even number of protruding structures 71 and an even number of recessed structures 72, and optionally, the cover plate 20 includes an even number of recessed structures 72, the recessed structures 72 are symmetrical about the axis of symmetry, and the even number of protruding structures 71 on the middle frame 60 are disposed in one-to-one correspondence with the recessed structures 72. It should be understood that, if the fastening structures 70 are disposed on one side of the symmetry axis, the cover plate 20 and the middle frame 60 on the other side of the symmetry axis cannot be fixedly connected, and there is a risk of separation between the cover plate 20 and the middle frame 60, so that the present embodiment adopts a manner of symmetrically disposing the fastening structures, which not only can facilitate the assembly and disassembly of the cover plate 20 and the middle frame 60, but also can tightly fix each part of the cover plate 20 and the middle frame 60, thereby further improving the yield of products.
Fig. 15 is a cross-sectional view of another BB' of the display module according to the embodiment of fig. 1. Alternatively, as shown in fig. 15, the second surface 202 of the cover plate 20 includes a convex portion 80 that is convex toward one side of the main plate 30; wherein the boss 80 includes a first boss 81 and a second boss 82; in a direction perpendicular to the plane of the display panel 10, the height of the first protruding portion 81 is greater than the height of the second protruding portion 82, and the orthographic projection of the second protruding portion 82 at least partially overlaps with the orthographic projection of the bonding area 40.
In the present embodiment, the cover plate 20 includes the protrusion 80, and the protrusion 80 is located on the second surface 202 and protrudes toward the main plate 30. Specifically, the protrusion 80 includes a first protrusion 81 and a second protrusion 82, wherein the first protrusion 81 is located on a side of the second protrusion 82 away from the display area, that is, when the display panel 100 is circular, the first protrusion 81 is located on the periphery of the second protrusion 82. The height of the first protrusion 81 is greater than that of the second protrusion 82 in a direction perpendicular to the plane of the display panel 10, and both form a step-like structure. It should be understood that the orthographic projection of the second projection 82 at least partially overlaps the orthographic projection of the binding region 40 means: the orthographic projection of the second raised portion 82 only covers part of the orthographic projection of the bonded region 40, or the orthographic projection of the second raised portion 82 completely coincides with the orthographic projection of the bonded region 40.
Optionally, when the orthographic projection of the second protrusion 82 coincides with the orthographic projection of the bonding region 40, and the height difference between the first protrusion 81 and the second protrusion 82 is equal to the thickness of the first substrate 102, the strength of the single-side substrate can be ensured, the thickness of the cover plate 20 can be reduced, the thickness of the display module 100 can be further reduced, and the light and thin requirements of the product can be met.
It can be seen that, in the present application, by setting that the orthographic projection of the second protruding portion 82 is at least partially overlapped with the orthographic projection of the bonding region 40, and the surface of the second protruding portion 82 close to one side of the display panel 10 is in direct contact with the bonding region 40, the strength of the single-side substrate can be improved without increasing the process, and the reliability of the product can be further ensured.
With continued reference to fig. 15, the orthographic projection of the first pin P1 is located within the orthographic projection of the first protrusion 81 along the direction perpendicular to the plane of the display panel 10.
In this embodiment, the first protrusion 81 protrudes toward the motherboard 30, and the surface of the first protrusion 81 near the motherboard 30 directly contacts the motherboard 30, and since the orthographic projection of the first pin P1 is located in the orthographic projection of the first protrusion 81, the first pin P1 can be electrically connected to the motherboard 30 in a pressing manner. Specifically, when the crimping process is adopted to realize the electric connection between different conductive parts, the conductive adhesive is arranged between the conductive parts, so that the conductive adhesive can be arranged between the preset positions of the first pin P1 and the mainboard 30, and the first pin P1 is bonded and fixed with the mainboard 30 through the pressure.
Further, along a direction perpendicular to the plane of the display panel 10, the orthographic projection of the second pin P2 is located in the orthographic projection of the second protrusion 82, so that the second pin P2 is electrically connected to the first conductive part 401 through the anisotropic conductive film, and further the first pin P1 is connected to the main board 30, and the second pin P2 is connected to the first conductive part 401, thereby achieving the electrical connection between the display panel 10 and the main board 30.
Fig. 16 is a schematic flow chart illustrating a manufacturing method of a display module according to an embodiment of the present disclosure. Referring to fig. 1-4 and 15, the present application provides a method for manufacturing a display module 100, including:
step S1, providing a cover plate 20, and forming a first lead P1 and a second lead P2 on a side surface of the cover plate 20; the first pin P1 is electrically connected to the second pin P2;
step S2, providing the display panel 10, where the display panel 10 includes a bonding region 40, the bonding region 40 includes a plurality of first conductive parts 401, and the second pins P2 are connected to the first conductive parts 401;
step S3, providing the motherboard 30, and connecting the first pin P1 with the motherboard 30;
step S4, assembling the cover plate 20, the display panel 10 and the main board 30.
Specifically, when the display module 100 provided in the present application is manufactured, first, the first pin P1 and the second pin P2 electrically connected to each other are manufactured on a surface of one side of the cover plate 20, wherein the first pin P1 and the second pin P2 can be two ends of one pin respectively, and can also be electrically connected to each other through a conductive medium, and optionally, the conductive medium is a metal trace or an anisotropic conductive film. In step S2, the display panel 10 may be, for example, a liquid crystal display panel 10, in which case the display panel 10 includes a first substrate 101 and a second substrate 102 disposed oppositely, and a liquid crystal layer 103 (not shown) is disposed between the first substrate 101 and the second substrate 102. As shown in the figure, a partial region of the first substrate 101 is located in the coverage area of the second substrate 102 to form a dual-layer substrate area a1 of the display panel 10, at least one end of the first substrate 101 extends out of the coverage area of the second substrate 102 to form a single-layer substrate area a2 of the display panel 10, a bonding area 40 is disposed in the single-layer substrate area a2, and the bonding area 40 includes a plurality of first conductive portions 401, so that the second pins P2 on the cover plate 20 are connected to the first conductive portions 401.
Of course, the display panel 10 may be an organic light emitting display panel. The display panel 10 includes a substrate, a thin film transistor array layer, a light emitting layer and a package layer, wherein the thin film transistor array layer is located on a surface of one side of the substrate, the light emitting layer is located on a side of the thin film transistor array layer away from the substrate, and the package layer is located on a side of the light emitting layer away from the substrate. The display panel 10 further includes a display region and a non-display region at least partially surrounding the display region, wherein a bonding region is disposed in the non-display region, and the bonding region may be formed by extending the substrate. That is, in the organic light emitting display panel, the binding region is also located at the single substrate region. Of course, the substrate may be a glass substrate or a flexible substrate made of polyimide.
Further, in steps S3 and S4, the first pin P1 on the cover plate 20 is connected to the main board 30, and the cover plate 20, the display panel 10, and the main board 30 are assembled. It should be understood that, the main board 30 of the display module 100 is usually laid with the circuits and driving elements required by the display panel 10 to realize the display function, and in the display module 100 manufactured by the above method, the first pin P1 is connected to the main board 30, and the second pin P2 is connected to the first conductive part 401, so that the display panel 10 is electrically connected to the main board 30, and therefore, an FPC connector is not required to be introduced, the problem that the display module 100 is not easily separated from the main board 30 due to the insertion of the FPC connector on the main board 30 is solved, and further, the display module 100 in the display product is conveniently detached or replaced.
Based on the same inventive concept, the present application further provides a display device, which includes the display module 100. Fig. 17 is a schematic structural diagram of a display device according to an embodiment of the present disclosure. As shown in fig. 17, the display device 200 provided in the present embodiment includes the display module 100 provided in the above embodiment. The display device 200 in the embodiment of fig. 17 is described by taking a smart watch as an example, but it should be understood that the display device 200 provided in the embodiment of the present invention may be other organic light emitting display devices 200 having a display function, such as a mobile phone, a computer, a television, a vehicle-mounted display device, and the present invention is not limited thereto. The organic light emitting display device 200 provided in the embodiment of the present invention has the beneficial effects of the display panel 10 provided in the embodiment of the present invention, and specific reference may be made to the specific description of the display module 100 in the above embodiments, which is not repeated herein.
According to the embodiment, the display module, the manufacturing method of the display module and the display device provided by the invention at least realize the following beneficial effects:
the display module, the manufacturing method of the display module and the display device comprise a display panel, a cover plate and a main plate, wherein the cover plate is positioned on one side of a light emitting surface of the display panel, and the main plate is positioned on one side of a backlight surface of the display panel; the cover plate comprises a first surface and a second surface which are oppositely arranged along the direction perpendicular to the plane of the display panel, and the second surface is positioned on one side of the cover plate facing the display panel. In this application, because be provided with electric connection's first pin and second pin on the second surface, through making first pin and mainboard connection, and make the second pin be connected with the first conductive part in the display panel binding area, the connection of display panel and mainboard has been realized, therefore need not to introduce the FPC connector again, the problem that the display panel that leads to on the mainboard was inserted to close to the FPC connector and the mainboard is difficult for separating has been solved, and then be convenient for dismantle or change the display module assembly in the display product.
Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (12)
1. A display module, comprising:
the display panel comprises a light-emitting surface and a backlight surface;
the cover plate is positioned on one side of the light emitting surface;
the main board is positioned on one side of the display panel, which is far away from the cover plate;
along a direction perpendicular to a plane of the display panel, the cover plate comprises a first surface and a second surface which are oppositely arranged, the second surface is positioned on one side of the cover plate facing the display panel, the second surface comprises a first pin and a second pin, and the first pin is electrically connected with the second pin; the display panel comprises a binding area, wherein the binding area comprises at least one first conductive part, the first pin is connected with the mainboard, and the second pin is connected with the first conductive part.
2. The display module assembly according to claim 1, wherein the first lead and the second lead are connected by a metal trace.
3. The display module of claim 2, wherein the main board comprises a first driver chip, and the first driver chip is connected to the first pin.
4. The display module assembly of claim 1, wherein the second lead is connected to the first conductive part through an anisotropic conductive film.
5. The display module of claim 1, wherein the second surface further comprises a third pin and a fourth pin; the third pin is electrically connected with the first pin, and the fourth pin is electrically connected with the second pin;
the display module comprises a flexible circuit board, wherein the flexible circuit board comprises a second driving chip, a second conductive part and a third conductive part; the second conductive part is connected with a third pin, the third conductive part is connected with the fourth pin, and the second conductive part is electrically connected with the third conductive part; the second driving chip is bound to the flexible circuit board through the second conductive part and/or the third conductive part.
6. The display module assembly according to claim 1, further comprising a middle frame, wherein the middle frame and the cover plate form an accommodating space, and the display panel and the main board are located in the accommodating space;
the middle frame comprises a first sub-surface, the first sub-surface comprises first threads, the cover plate comprises a third surface, the third surface comprises second threads, and the cover plate and the middle frame are fixedly connected through the first threads and the second threads; the third surface is perpendicular to a plane where the display panel is located, and the first sub-surface is in contact with the third surface.
7. The display module assembly according to claim 1, further comprising a middle frame, wherein the middle frame and the cover plate form an accommodating space, and the display panel and the main board are located in the accommodating space;
the display module further comprises a buckle structure, and the buckle structure comprises a convex structure and a groove structure; the middle frame comprises a second sub-surface, the second sub-surface comprises the convex structure, the second surface of the cover plate comprises the groove structure, the second sub-surface is in contact with the second surface, and the cover plate and the middle frame are clamped through the convex structure and the groove structure.
8. The display module of claim 7, wherein the number of the snap structures is even, and the snap structures are symmetrically distributed about the display panel.
9. The display module according to claim 1, wherein the second surface of the cover plate comprises a protrusion protruding toward one side of the main plate;
wherein the boss comprises a first boss and a second boss; along the direction perpendicular to the plane of the display panel, the height of the first protruding portion is larger than that of the second protruding portion, and the orthographic projection of the second protruding portion at least partially overlaps with the orthographic projection of the binding area.
10. The display module assembly of claim 9, wherein an orthogonal projection of the first lead is located within an orthogonal projection of the first protrusion along a direction perpendicular to a plane of the display panel.
11. A manufacturing method of a display module is characterized by comprising the following steps:
providing a cover plate, and manufacturing a first pin and a second pin on one side surface of the cover plate; the first pin is electrically connected with the second pin;
providing a display panel, wherein the display panel comprises a binding area, the binding area comprises a plurality of first conductive parts, and the second pins are connected with the first conductive parts;
providing a mainboard and connecting the first pins with the mainboard;
and assembling the cover plate, the display panel and the main board.
12. A display device comprising the display module of any one of claims 1 to 10.
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