CN1316293C - Assembled planar display structure - Google Patents
Assembled planar display structure Download PDFInfo
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- CN1316293C CN1316293C CNB021540799A CN02154079A CN1316293C CN 1316293 C CN1316293 C CN 1316293C CN B021540799 A CNB021540799 A CN B021540799A CN 02154079 A CN02154079 A CN 02154079A CN 1316293 C CN1316293 C CN 1316293C
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- transparency carrier
- system board
- display panels
- package assembly
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Abstract
The present invention discloses an assembled structure of a plane display, which comprises a liquid crystal display and a system main board, wherein the liquid crystal display has a backlight board and a liquid crystal display panel which is arranged on the backlight board. The system main board has a control chip which is jointed on the system main board, wherein the control chip is used for controlling the liquid crystal display. The liquid crystal display is arranged on the system main board, and is electrically connected to the system main board in a direct wire bonding mode.
Description
Technical field
The present invention relates to a kind of flat-panel screens, particularly a kind of assembled planar display structure.
Background technology
LCD, it is a kind of flat-panel screens of par, be in daily life now, can be applied to considerable electrical appliance, the for example TV or the display device of computer, display on the computing machine, display screen on wrist-watch or the mobile phone, the display device of many controllers, or even the display panel of laser disc sound equipment.The range of application of LCD is so extensive, and the assembling between the electronic component is also just quite important.Most of LCD all can be electrically connected with system board via a flexible printed circuit board, wherein most importantly because have the control device of control LCD on the system board.System board mainly is to use printed circuit board (PCB) with required circuit layout thereon, and present control device all is to use integrated circuit (IC) chip join by the semiconductor technology manufacturing on system board.
As shown in Figure 1, the periphery of a LCD 100 has at least one flexible printed circuit board 102.One end of flexible printed circuit board 102 can be electrically connected to the pin of LCD 100, and the other end can be electrically connected on the system board 104, as shown in Figure 2.LCD 100 comprises display panels 110 and backlight 120, wherein display panels 110 has transparency carrier 112, one liquid crystal layer 114 is on following transparency carrier 112, with one on transparency carrier 116 be positioned on the liquid crystal layer 114, and backlight 120 has an optical plate 122 and a light source 124 is positioned on the end surfaces of optical plate 122.The LCD 100 of this use backlight 120 is most of now transmissive type liquid crystal displays that use.One end of flexible printed circuit board 102 electrically connects with following transparency carrier 112, and the other end uses connector 108 to be connected with system board 104.Use the benefit of flexible printed circuit board 102 in Fig. 2, to display, because the connection of this mode can significantly reduce the volume of LCD assembling.
The package assembly of above-mentioned LCD can see the patent in many various countries for details, and for example United States Patent (USP) 5844733 has mainly been introduced the assembling of using in the LCD of notebook computer.United States Patent (USP) 6181404 mainly is to introduce to use (rigid) connector of rigidity to connect LCD and system board.Taiwan patent announcement numbers 476122 has mainly been introduced the assemble method of the flat-panel screens with opaque substrate, and it is bonded with each other liquid crystal panel, printed circuit board (PCB) and heat radiator.Taiwan patent announcement numbers 422933 is patents of Samsung, mainly is to use the LCD module of printed circuit board arrangement.Taiwan patent announcement numbers 448337 is patents of Seiko Epson company, mainly is to have introduced by the elastomeric joint that clips input end is connected with the driving circuit tip node.
Another connects the mode of the controller of LCD and system board, is directly chip to be formed directly on the lower glass substrate of LCD with semiconductor technology, on the just so-called glass plate chip (COG is arranged; Chip On Glass) technology.There is the chip technology can be on a kind of typical glass plate referring to United States Patent (USP) 6292248.Though this technology can realize the lightening of display,, the cost of present this first and then complicated technology is not low, and the qualification rate on producing in batches is also not satisfactory simultaneously.
Yet the electrical appliance of daily life has been to advance towards the direction of volume minimization always, and it has been to be not easy to have realized very much that the package assembly of above-mentioned flat-panel screens is wanted the volume minimization with display.Therefore, we need other mode to realize the lightening of display.
Summary of the invention
In the foregoing invention background, many shortcomings that traditional LCD package assembly is produced, the main purpose of the present invention is panel of LCD is joined on the system board, can dispense the technology that chip is arranged on flexible printed circuit board or the glass plate.
Another object of the present invention is to the flexible printed circuit board of flexible printed circuit board, backlight of abridged display panels and several connectors, can to reach display lightening and integrated.
Another purpose of the present invention is to show that the collocation of package assembly and contact panel can directly dwindle the overall dimensions of contact panel.
According to the purpose of the above, the invention provides a kind of package assembly of flat-panel screens, comprise a LCD and a system board.Above-mentioned LCD has a backlight and a display panels is positioned on the backlight.The said system mainboard has a control chip and engages on it, and control chip wherein is in order to controlling above-mentioned LCD, and above-mentioned LCD is positioned on the system board.Above-mentioned display panels is electrically connected to system board in the mode of direct joint, thereby dispenses flexible printed circuit board.
The present invention provides a kind of package assembly of flat-panel screens simultaneously, comprises a LCD and a system board, and wherein LCD has a backlight and a display panels is positioned on the backlight.Above-mentioned backlight comprises an optical plate, and be positioned on the optical plate end surfaces and by a line source that light emitting diode constituted, and above-mentioned display panels comprises one first transparency carrier that is positioned on the above-mentioned backlight, one is positioned at the liquid crystal layer on first transparency carrier, and second transparency carrier that is positioned on the liquid crystal layer.The said system mainboard has a control chip and engages on it, and control chip is in order to control foregoing liquid crystal display.The foregoing liquid crystal display is positioned on the system board, and first transparency carrier of display panels is electrically connected to system board in the mode of direct lead-in wire bonding.
Description of drawings
Fig. 1 shows the structural representation of traditional display panels and flexible printed circuit board;
Fig. 2 shows traditional display panels and the package assembly synoptic diagram between the system board;
Fig. 3 is the side structure synoptic diagram that the shown display panels of package assembly according to the present invention directly is engaged in system board;
Fig. 4 be the shown display panels of package assembly according to the present invention directly be engaged in system board on look synoptic diagram;
Fig. 5 is the side structure synoptic diagram that shown display panels of package assembly according to the present invention and contact panel directly are engaged in system board; And
Fig. 6 be shown display panels of package assembly according to the present invention and contact panel directly be engaged in system board on look synoptic diagram.
Description of reference numerals in the accompanying drawing is as follows:
10 system boards, 12 control chips
20 LCD, 22 bonding wires
23 fixed orifices, 24 bonding wires
26 bonding wires, 30 backlight
32 optical plates, 34 light sources
36 Polarizers, 40 display panels
42 first transparency carriers, 44 liquid crystal layers
46 second transparency carriers, 48 Polarizers
50 contact panels, 52 lower electrode layers
54 gaps son 55 adhesion layers
Transparency carrier on 56 upper electrode layers 58
100 LCD, 102 flexible printed circuit boards
104 system boards, 106 control chips
108 connectors, 110 display panels
112 first transparency carriers, 114 liquid crystal layers
116 second transparency carriers, 120 backlight
122 optical plates, 124 light sources
Embodiment
Some embodiments of the present invention are described in detail as follows.Yet except describing in detail, the present invention can also be widely implements at other embodiment, and scope of the present invention do not limited, and it is as the criterion with appended claim.
The present invention mainly provides a kind of package assembly of flat-panel screens, comprises a LCD and a system board.Above-mentioned LCD has a backlight and a display panels is positioned on the backlight.The said system mainboard has a control chip and engages on it, and control chip wherein is in order to controlling above-mentioned LCD, and above-mentioned LCD is positioned on the system board.Above-mentioned display panels is electrically connected to system board in the mode of direct lead-in wire bonding.
Above-mentioned backlight has the end surfaces that an optical plate and a light source are positioned at optical plate, and light source constitutes a line source by light emitting diode, and wherein above-mentioned light emitting diode is engaged on the said system mainboard.Above-mentioned display panels comprises one first transparency carrier that is positioned on the above-mentioned backlight, and one is positioned at the liquid crystal layer on first transparency carrier, and second transparency carrier that is positioned on the liquid crystal layer.Lead-in wire bonding between above-mentioned display panels and the system board is between first transparency carrier and system board.Above-mentioned first transparency carrier has at least one fixed orifice, in order to the foregoing liquid crystal display panel is fixed on this system board.Above-mentioned display panels comprises one first Polarizer between aforementioned lights guide plate and light source, and second Polarizer that is positioned on aforementioned second transparency carrier.
The package assembly of aforementioned flat-panel screens comprises that more a contact panel is positioned on the above-mentioned display panels, and wherein the bottom transparency carrier of contact panel is above-mentioned second Polarizer.In addition, above-mentioned contact panel directly is electrically connected with the said system mainboard in the mode of lead-in wire bonding.
A kind of package assembly of flat-panel screens comprises a LCD and a system board, and wherein LCD has a backlight and a display panels is positioned on the backlight.Above-mentioned backlight comprises an optical plate, and be positioned on the end surfaces of optical plate and by a line source that light emitting diode constituted, and above-mentioned display panels comprises one first transparency carrier that is positioned on the above-mentioned backlight, one is positioned at the liquid crystal layer on first transparency carrier, and second transparency carrier that is positioned on the liquid crystal layer.The said system mainboard has a control chip and engages on it, and control chip is in order to control foregoing liquid crystal display.The foregoing liquid crystal display is positioned on the system board, and first transparency carrier of display panels is electrically connected to system board in the mode of direct lead-in wire bonding.
Above-mentioned light emitting diode is engaged on the system board, and above-mentioned first transparency carrier has at least one fixed orifice, in order to display panels is fixed on the system board.Above-mentioned display panels comprises one first Polarizer between aforementioned lights guide plate and light source, and second Polarizer that is positioned on aforementioned second transparency carrier.The package assembly of above-mentioned flat-panel screens comprises that more one is positioned at the contact panel on the display panels, and wherein the bottom transparency carrier of contact panel is second Polarizer, and directly is electrically connected with system board in the mode of lead-in wire bonding.
Next, the embodiment of the package assembly of a flat-panel screens is described according to the present invention.As shown in Figure 3, a LCD 20 is arranged on the system board 10, wherein the control chip 12 of a control LCD 20 is bonded on the system board 10.LCD 20 comprise a backlight 30 with and on a display panels 40 is arranged.Backlight 30 comprises that an optical plate 32 and a line source 34 are positioned on the end surfaces of optical plate, and wherein line source 34 can be that several light emitting diodes are formed, and directly is bonded on the system board 10.Display panels 40 has mainly comprised one first transparency carrier 42 on backlight 30, and a liquid crystal layer 44 is on first transparency carrier 42, and one second transparency carrier 46 is on liquid crystal layer 44, and a Polarizer 48 is on second transparency carrier 46.First transparency carrier 42 mainly is the following transparency carrier as display panels 40, and array thin film transistor (TFT) (not shown in the diagram) is formed on down on the transparency carrier.Form protective seam (not shown in the diagram) and transparency conducting layer (not shown in the diagram) then in regular turn afterwards, even if the lower plate of display panels 40 has been finished.Second transparency carrier 46 forms color filter layer (not shown in the diagram) and transparency conducting layer (not shown in the diagram) afterwards in regular turn towards the direction of thin film transistor (TFT), promptly forms the upper plate of display panels 40.Then with the sealing of upper plate and lower plate and pour into liquid crystal again after vacuumizing and promptly form display panels 40.The technology of above-mentioned display panels is a kind of traditional manufacture, and the material of transparency carrier can be plastic cement, glass or other materials similar.The driving circuit of the thin film transistor (TFT) of display panels 40 is that direct layout is on following transparency carrier, therefore having many pins at the periphery of first transparency carrier 42 is electrically connected with the thin film transistor (TFT) of display panels 40, and these pins can directly utilize traditional bonding, for example direct Wire Bonding Technology is connected on the system board 10.Fig. 3 is the side structure synoptic diagram, therefore only shows a bonding wire 22.In fact have the periphery that many bonding wires 22 are positioned at LCD 20.Joining technique is not limited to Wire Bonding Technology, and other possible joining technique also can use.
Fig. 4 shown the foregoing description on look synoptic diagram.On system board 10, a control chip 12 is bonded on the system board 10, in order to controlling and driving LCD 20.There are many bonding wires 22 to be connected on the system board 10 above first transparency carrier 42.In addition, first transparency carrier 42 can use plastic substrate, can utilize the location, hole in moulding or back technology, and be fixed on the system board 10 with screw.Therefore, four fixed orifices 23 are arranged on first transparency carrier 42, LCD 20 and system board 10 can be fixed.
Be noted that the above-mentioned optical plate 32 and first transparency carrier 42 also can be combined as a whole, be about to the following transparency carrier of optical plate as display panels 40.At this moment, the joining technique soldered ball that also can be used in combination similar welded ball array encapsulation (BGA) engages or the bump bond of the coil type encapsulation (TCP) of similar drive IC.
Plane of the present invention shows package assembly, can be simultaneously on the collocation contact panel.As shown in Figure 5, on the Polarizer 48 of display panels 20, directly form the lower electrode layer 52 of contact panel 50,, thereby omitted the layer of transparent substrate just directly with the following transparency carrier of Polarizer 48 as contact panel.Use the technology of traditional contact panel to form gap 54 in regular turn then, adhesion layer 55, upper electrode layer 56 and last transparency carrier 55.It should be noted that and to use a Polarizer 36 between optical plate 32 and light source 34.The bonding wire 24,26 of contact panel 50 can be directly connected on the system board 10.Yet because Fig. 5 is the structural representation of side, actual bonding wire can not be such arrangement.
As shown in Figure 6, be shown display panels of package assembly according to the present invention and contact panel directly be engaged in system board on look synoptic diagram.The design of contact panel at present mostly uses silver slurry line (silver bus) to do design, usually because the design of configuration makes outward appearance asymmetric up and down.Even size is also bigger than LCD.Therefore, in the present invention can be directly the terminals of contact panel 50 directly be connected on the system board 10 via connecting line 24,26, and then dwindle the overall dimensions of contact panel.
The present invention directly joins panel of LCD on the system board to, can dispense the technology that chip is arranged on flexible printed circuit board or the glass plate, and it is lightening and integrated that the flexible printed circuit board of omission display panels, the flexible printed circuit board of backlight and several connectors can reach display.Moreover, the overall dimensions that contact panel can be directly dwindled in the such demonstration package assembly and the collocation of contact panel.
The above is the preferred embodiments of the present invention only, is not in order to limit claim of the present invention; All other do not break away from spirit disclosed in this invention and the equivalence finished changes or modify, and all should be included in the claims.
Claims (10)
1. the package assembly of a flat-panel screens comprises:
One LCD has a backlight and a display panels and is positioned on this backlight; And
One system board, have a control chip and engage on it, this control chip is in order to control this LCD, and wherein this LCD is positioned on this system board, and this display panels is electrically connected to this system board in the mode of direct joint, thereby dispenses flexible printed circuit board.
2. the package assembly of flat-panel screens as claimed in claim 1, wherein above-mentioned backlight have the end surfaces that an optical plate and a light source are positioned at this optical plate.
3. the package assembly of flat-panel screens as claimed in claim 2, wherein above-mentioned light source is constituted a line source by light emitting diode, and is engaged on this system board.
4. the package assembly of flat-panel screens as claimed in claim 2, wherein above-mentioned display panels comprises:
One first transparency carrier is positioned on this backlight;
One liquid crystal layer is positioned on this first transparency carrier; And
One second transparency carrier is positioned on this liquid crystal layer, this optical plate that wherein above-mentioned first transparency carrier is this backlight, and this first transparency carrier has at least one fixed orifice, and it is fixed in this display panels on this system board.
5. the package assembly of flat-panel screens as claimed in claim 4, wherein above-mentioned display panels is between this first transparency carrier and this system board with direct joint the between this system board.
6. the package assembly of flat-panel screens as claimed in claim 5, wherein above-mentioned direct joint are selected from the lead-in wire bonding, soldered ball engages and bump bond.
7. the package assembly of flat-panel screens as claimed in claim 4, wherein above-mentioned display panels comprises:
One first Polarizer is between this optical plate and this light source; And
One second Polarizer is positioned on this second transparency carrier.
8. the package assembly of flat-panel screens as claimed in claim 7 comprises that more a contact panel is positioned on this display panels.
9. the package assembly of flat-panel screens as claimed in claim 8, wherein the bottom transparency carrier of above-mentioned contact panel is this second Polarizer.
10. the package assembly of flat-panel screens as claimed in claim 9, wherein above-mentioned contact panel directly is electrically connected with this system board in the mode of lead-in wire bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021540799A CN1316293C (en) | 2002-12-10 | 2002-12-10 | Assembled planar display structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021540799A CN1316293C (en) | 2002-12-10 | 2002-12-10 | Assembled planar display structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1506723A CN1506723A (en) | 2004-06-23 |
| CN1316293C true CN1316293C (en) | 2007-05-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021540799A Expired - Fee Related CN1316293C (en) | 2002-12-10 | 2002-12-10 | Assembled planar display structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1316293C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102346322A (en) * | 2010-07-27 | 2012-02-08 | 群康科技(深圳)有限公司 | Touch-control type display device |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102386498A (en) * | 2006-12-25 | 2012-03-21 | 良英股份有限公司 | Three-dimensional connector for coordinate input device |
| KR101309862B1 (en) | 2009-12-10 | 2013-09-16 | 엘지디스플레이 주식회사 | Liquid Crystal Display Device Including Touch Panel |
| CN106200030B (en) * | 2015-04-30 | 2019-07-05 | 小米科技有限责任公司 | Liquid crystal display, pressure measurement method and device |
| CN109507235A (en) * | 2017-09-15 | 2019-03-22 | 佛山市顺德区美的饮水机制造有限公司 | TDS detects pen |
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|---|---|---|---|---|
| JPH10186393A (en) * | 1996-12-19 | 1998-07-14 | Shin Etsu Polymer Co Ltd | Connector for display inspection of liquid crystal display panel, and production therefor |
| US5844773A (en) * | 1995-12-01 | 1998-12-01 | Texas Instruments Incorporated | Portable computing device having light source in base |
| JPH1184376A (en) * | 1997-09-04 | 1999-03-26 | Mitsubishi Electric Corp | Display device |
| JP2001005404A (en) * | 1999-06-18 | 2001-01-12 | Casio Comput Co Ltd | Display module |
| US6181404B1 (en) * | 1998-02-27 | 2001-01-30 | 3Com Corporation | Apparatus and method for mounting a liquid crystal display (LCD) assembly onto a printed circuit board |
| JP2001166328A (en) * | 1999-09-30 | 2001-06-22 | Optrex Corp | Electrode connection structure of liquid crystal display panel |
| US6292248B1 (en) * | 1997-08-09 | 2001-09-18 | Lg. Philips Lcd Co., Ltd. | COG type liquid crystal panel and fabrication method thereof having first and second conductive bumps in different planes |
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2002
- 2002-12-10 CN CNB021540799A patent/CN1316293C/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5844773A (en) * | 1995-12-01 | 1998-12-01 | Texas Instruments Incorporated | Portable computing device having light source in base |
| JPH10186393A (en) * | 1996-12-19 | 1998-07-14 | Shin Etsu Polymer Co Ltd | Connector for display inspection of liquid crystal display panel, and production therefor |
| US6292248B1 (en) * | 1997-08-09 | 2001-09-18 | Lg. Philips Lcd Co., Ltd. | COG type liquid crystal panel and fabrication method thereof having first and second conductive bumps in different planes |
| JPH1184376A (en) * | 1997-09-04 | 1999-03-26 | Mitsubishi Electric Corp | Display device |
| US6181404B1 (en) * | 1998-02-27 | 2001-01-30 | 3Com Corporation | Apparatus and method for mounting a liquid crystal display (LCD) assembly onto a printed circuit board |
| JP2001005404A (en) * | 1999-06-18 | 2001-01-12 | Casio Comput Co Ltd | Display module |
| JP2001166328A (en) * | 1999-09-30 | 2001-06-22 | Optrex Corp | Electrode connection structure of liquid crystal display panel |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102346322A (en) * | 2010-07-27 | 2012-02-08 | 群康科技(深圳)有限公司 | Touch-control type display device |
| CN102346322B (en) * | 2010-07-27 | 2016-01-20 | 群康科技(深圳)有限公司 | Touch control display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1506723A (en) | 2004-06-23 |
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