CN110579917B - Display module and display device - Google Patents
Display module and display device Download PDFInfo
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- CN110579917B CN110579917B CN201910979121.8A CN201910979121A CN110579917B CN 110579917 B CN110579917 B CN 110579917B CN 201910979121 A CN201910979121 A CN 201910979121A CN 110579917 B CN110579917 B CN 110579917B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
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Abstract
The application discloses display module assembly and display device, display module assembly includes display panel, driver chip and flexible circuit board, and display panel includes the display area and centers on the non-display area of display area, the non-display area includes first frame district and second frame district, the second frame district is including binding district and fan-out area, through dividing driver chip into first district and second district along its central axis, when driver chip binds the district that binds on the base plate, first district is located one side that the second district is close to the display area, and a plurality of first output terminal and a plurality of first input terminal all set up in driver chip's second district, and the one end that is located the fan-out lead wire in the fan-out district extends to the second district and carries out electric connection with first output terminal. Can realize the lower frame narrowing of display module assembly under the condition of the size that does not change driver chip size, and be favorable to realizing higher screen to account for than.
Description
Technical Field
The application relates to the technical field of display, in particular to a display module and a display device.
Background
With the continuous development of the display market, the visual effect of the display screen is more and more strictly required by consumers, so that the requirements on the appearance design of the display screen are diversified, and the requirements on the screen occupation ratio are higher and higher. The trend of the comprehensive screen technology is to pursue a screen proportion of more than or equal to 90% through the design of an ultra-narrow frame or even no frame, and under the condition that the total area of the machine body is not changed, the display area is maximized, and the visual effect is more brilliant.
The binding of an integrated circuit Chip (IC) to Glass (COG, Chip On Glass) is a technology that is currently used in display panels and display modules, but the direct binding of an IC Chip (IC) to Glass of a display panel occupies a non-display area of a screen of the display panel, which is not favorable for realizing a narrow-frame full-screen design of the display panel.
Disclosure of Invention
The embodiment of the invention provides a display module and a display device, which are used for solving the problem that the display module in the prior art is difficult to further realize a narrow frame.
In a first aspect, to solve the above technical problem, an embodiment of the present invention provides a display module, including: the display device comprises a display panel, a driving chip and a flexible circuit board;
the display panel comprises a substrate, wherein the substrate is divided into a display area and a non-display area, the non-display area is arranged around the display area, and the display area comprises a plurality of data lines which extend along a first direction and are arranged along a second direction; the non-display area comprises a first frame area and a second frame area, the first frame area, the display area and the second frame area are sequentially arranged along the first direction, the second frame area comprises a binding area, and the driving chip is bound to the binding area; the driving chip is rectangular and comprises a first input terminal group and a first output terminal group, the first input terminal group comprises a plurality of first input terminals, the first output terminal group comprises a plurality of first output terminals, the driving chip is divided into a first area and a second area along the central axis of the driving chip along the first direction, the second area is located in the first area and is far away from the display area, and the first input terminal group and the first output terminal group are both arranged in the second area, wherein the first direction is perpendicular to the second direction; the second frame region further comprises a fan-out region, a fan-out lead is positioned in the fan-out region and extends to the second region, one end of the fan-out lead is electrically connected with the first output terminal, and the other end of the fan-out lead is electrically connected with the data line; the first input terminal is electrically connected with the flexible circuit board.
Optionally, the fan-out area is composed of a first sub fan-out area, a second sub fan-out area and a third sub fan-out area which are sequentially arranged along the second direction, the first sub fan-out area and the third sub fan-out area include a plurality of first fan-out leads, the second sub fan-out area includes a plurality of second fan-out leads, the first fan-out leads are located in the first sub fan-out area and the third sub fan-out area, the first fan-out leads are sequentially arranged along the second direction, each first fan-out lead includes at least one inflection point, each first fan-out lead includes a straight line portion extending along the first direction and a bent portion extending away from the second sub fan-out area, an intersection point of the straight line portion and the bent portion is the inflection point, and the straight line portion is located on one side of the bent portion close to the first output terminal group along the first direction; the first fan-out lead is positioned in any two of the first sub-fan-out area and the third sub-fan-out area, and the length of a straight line part of the first fan-out lead close to the second sub-fan-out area is larger than that of a straight line part of the first fan-out lead far away from the second sub-fan-out area.
Optionally, in the first sub-fan-out region and the third sub-fan-out region, a connection line of the inflection points of each first fan-out lead and the second direction form an acute included angle a, where a is greater than or equal to 2 ° and less than or equal to 80 °.
Optionally, in a direction perpendicular to a plane of the substrate, the driving chip overlaps with orthographic projections of bending portions located in the first sub-fan-out region and the third sub-fan-out region.
Optionally, along the first direction, a distance between the inflection point near the first output terminal group and the first output terminal group is d3, where 0um < d3 is not less than 50 um.
Optionally, the driving chip further includes a plurality of dummy terminals, the dummy terminals are disposed in the first region and located at an edge of the driving chip near the display region, and the dummy terminals are disposed side by side along the second direction; the substrate is provided with a plurality of virtual pads, and the virtual terminals are correspondingly bound and connected with the virtual pads.
Optionally, in a direction perpendicular to the plane where the substrate is located, projections of the plurality of dummy pads are located at a gap between projections of two adjacent fan-out leads.
Optionally, along the first direction, the first output terminal group includes at least one row of first output terminals, and the first input terminal group includes at least one row of first input terminals.
Optionally, a projection of each row of the first output terminals in the first direction does not overlap with a projection of each row of the first input terminals in the first direction. Along first direction, the interval between a row of first input terminal and the first output terminal of a row adjacent to it is less than 200 um.
Optionally, along the first direction, a projection of at least one row of the first output terminals and at least one row of the first input terminals in the first direction overlaps.
Optionally, in at least one row along the second direction, the plurality of first input terminals and the plurality of first output terminals are alternately arranged at intervals.
Optionally, along the first direction, a distance between one row of the first output terminals and one row of the first output terminals adjacent to the one row of the first output terminals is less than 200 um.
In a second aspect, an embodiment of the present invention provides a display device, which includes the display module according to the first aspect.
The invention has the following beneficial effects:
in the embodiment provided by the invention, the display module comprises a display panel, a driving chip and a flexible circuit board, wherein the display panel comprises a display area and a non-display area surrounding the display area, the non-display area comprises a first frame area and a second frame area, the first frame area, the display area and the second frame area are sequentially arranged along a first direction, the second frame area comprises a binding area and a fan-out area, the driving chip is divided into the first area and the second area along the central axis of the driving chip, when the driving chip is bound on the binding area on a substrate, the first area is positioned at one side of the second area close to the display area, a plurality of first output terminals and a plurality of first input terminals are all arranged in the second area of the driving chip, one end of a fan-out lead positioned in the fan-out area extends to the second area to be electrically connected with the first output terminals, and the other end of the fan-out lead is electrically connected with a data line in the display area, and simultaneously, the first input terminal on the driving chip is electrically connected with the flexible circuit board. Can be under the condition of the size that does not change driver chip size for along first direction, the fan-out zone can form the overlap with 1/2 driver chip's width at least, is favorable to realizing that display module's lower frame narrows, and is favorable to realizing that higher screen accounts for than.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
fig. 1 is a schematic plan view of a display module provided in the prior art;
fig. 2 is a schematic plan view illustrating a driving chip in a display module according to the prior art;
FIG. 3 is a schematic diagram illustrating a planar structure of a fan-out area and a driver chip in a display module according to the prior art;
fig. 4 is a schematic plan view illustrating a driving chip in a display module according to an embodiment of the present invention;
fig. 5 is a schematic diagram illustrating a planar structural relationship between a fan-out area and a driver chip in a display module according to an embodiment of the present invention;
fig. 6 is a schematic diagram illustrating connection relationships between a first fan-out area, a second fan-out area, and a third fan-out area of a display module according to an embodiment of the invention and a driver chip;
fig. 7 is a schematic plan view illustrating a display module according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of a planar structure of another driving chip according to an embodiment of the present invention;
FIG. 9 is a schematic diagram of a planar structure of another driving chip according to an embodiment of the present invention;
FIG. 10 is a schematic plan view illustrating a display module according to an embodiment of the invention;
fig. 11 is a schematic diagram of a partial enlarged structure of the display module testing circuit in fig. 10.
Detailed Description
The technical solutions in the embodiments of the present invention are described below in detail with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
Fig. 1 is a schematic plan view of a display module according to the prior art, fig. 2 is a schematic plan view of a driving chip in a display module according to the prior art, and fig. 3 is a schematic plan view of a connection between a fan-out area and the driving chip in a display module according to the prior art.
As shown in fig. 1 to 3, a display module in the prior art includes a display panel 100 ', a driving chip 400 ' and a flexible circuit board 500 ', the display panel includes a substrate 101 ', the substrate 101 ' includes a display area (also referred to as AA area) 20 ' and a non-display area (not shown) disposed around the display area 20 ', the display area 20 ' includes a plurality of data lines 21 ' extending along a first direction and arranged along a second direction; the non-display area comprises a first frame area 10 ' and a second frame area 30 ' along a first direction, in the embodiment of the present invention, the first frame area 10 ' may also be referred to as an upper frame area, the second frame area 30 ' may also be referred to as a lower frame area, the first frame area 10 ', the display area 20 ', and the second frame area 30 ' are sequentially arranged along the first direction, wherein the second frame area 30 ' is provided with a fan-out area 303 ' and a binding area 40 ', and the driving chip 400 ' is bound to the binding area 40 ' on the substrate 101 ' in a COG form; in the embodiment of the present invention, the substrate 101' may be a glass substrate or a plastic material or other similar thin film materials that can be used as a substrate. Wherein the first direction is shown as D1 in the figure, the second direction is shown as D2 in the figure, and the first direction and the second direction are intersected perpendicularly.
Referring to fig. 1-3, in a direction perpendicular to a plane of the substrate, the driving chip 400 ' is rectangular, the length of the driving chip 400 ' is L1, the width of the driving chip 400 ' is W1, the driving chip 400 ' includes a first input terminal group 410 ' and a first output terminal group 420 ', in a first direction, the first input terminal group 410 ' and the first output terminal group 420 ' are respectively disposed at two sides of the driving chip 400 ', when the driving chip 400 ' is bonded to the bonding region 40 ' on the substrate 101 ', the first input terminal group 410 ' is disposed away from the display region, the first output terminal group 420 ' is disposed close to the display region, the first input terminal group 410 ' includes a plurality of first input terminals 411 ', the first output terminal group 420 ' includes a plurality of first output terminals 421 ', each row of the first input terminals 411 ' is disposed side by side along a second direction, each row of the first output terminals 421' is arranged side by side along the second direction; the plurality of first input terminals 411 ' and the plurality of first output terminals 421 ' are respectively bound and connected to correspondingly disposed pads on the substrate 101 '. Optionally, the plurality of first input terminals 411 ' are arranged in a row along the first direction, the plurality of first output terminals 421 ' are arranged in two rows along the first direction, the fan-out region 303 ' includes a plurality of fan-out traces 30311 ', and the plurality of first output terminals 421 ' are electrically connected to the plurality of fan-out leads 30311 ' located in the fan-out region 303 ' in a one-to-one correspondence manner.
The length L1 of the conventional driver chip 400 'is generally about 20mm, the width W1 of the driver chip 400' is generally about 1mm, the width W1 of the driver chip 400 'is much greater than the sum of the lengths of the first input terminal group 410' and the first output terminal group 420 'along the first direction, because in the first direction, the first input terminal group 410' and the first output terminal group 420 'are respectively located at two sides of the driver chip 400', a gap with a distance d1 exists between the first input terminal group 410 'and the first output terminal group 420', d1 is greater than 300um, in consideration of reasonable utilization of space, a display panel test circuit 4010 'is arranged in a forward projection area of the gap area 402' formed here on the substrate, so as to test internal circuit signals of the display panel 100 'before the driver chip 400' is bonded. The size Y1 of the conventional lower frame is greater than or equal to the width F1+ the width W1 of the driver chip in the first direction and the width W1 of the bonding region of the flexible circuit board in the first direction, but due to the limitation of the manufacturing process and the manufacturing process of the driver chip 400', the width W1 cannot be further compressed. Furthermore, the width F1 of the fan-out area in the first direction is limited by the number of data lines, which is difficult to compress, and therefore, the size limitation of the conventional driving chip 400' cannot further compress the lower frame of the display module.
In order to solve the above problems, embodiments of the present invention provide a display module and a display device.
The display module comprises a display panel, a driving chip and a flexible circuit board.
The display panel comprises a substrate, wherein the substrate is divided into a display area and a non-display area, the non-display area is arranged around the display area, and the display area comprises a plurality of data lines which extend along a first direction and are arranged along a second direction; the non-display area comprises a first frame area and a second frame area, the first frame area, the display area and the second frame area are sequentially arranged along the first direction, the second frame area comprises a binding area, and the driving chip is bound to the binding area; the driving chip is rectangular and comprises a first input terminal group and a first output terminal group, the first input terminal group comprises a plurality of first input terminals, the first output terminal group comprises a plurality of first output terminals, the driving chip is divided into a first area and a second area along the central axis of the driving chip along the first direction, the second area is located in the first area and is far away from the display area, and the first input terminal group and the first output terminal group are both arranged in the second area, wherein the first direction is perpendicular to the second direction; the second frame region further comprises a fan-out region, a fan-out lead is positioned in the fan-out region and extends to the second region, one end of the fan-out lead is electrically connected with the first output terminal, and the other end of the fan-out lead is electrically connected with the data line; the first input terminal is electrically connected with the flexible circuit board.
The central axis of the driving chip is defined as: the driving chip is divided into two symmetrical straight lines along the central axis in the first direction.
According to the technical scheme of the embodiment of the invention, the size of the lower frame of the display module can be further reduced under the condition that the size of the driving chip is not changed, so that the narrower lower frame is favorably realized.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
Fig. 4 is a schematic plan view illustrating a driving chip in a display module according to an embodiment of the present invention; fig. 5 is a schematic diagram illustrating a planar structural relationship between a fan-out area and a driver chip in a display module according to an embodiment of the present invention; fig. 6 is a schematic diagram illustrating a connection relationship between a first fan-out area, a second fan-out area, and a third fan-out area of a display module according to an embodiment of the present invention and a driving chip, and fig. 7 is a schematic diagram illustrating a planar structure of a display module according to an embodiment of the present invention.
Referring to fig. 4 to 7, the display module is used for a liquid crystal display module or an organic light emitting display module, and the display module includes: the display device includes a display panel 100, a driving chip 400 and a flexible circuit board 500. The display panel 100 is divided into a display area (also referred to as AA area) 20 and a non-display area (not shown) disposed around the display area 20, the display area 20 including a plurality of data lines 21 extending in a first direction and arranged in a second direction; the non-display area includes a first frame area 10 and a second frame area 30 along a first direction, in the embodiment of the present invention, the first frame area 10 may also be referred to as an upper frame area, and the second frame area 30 may also be referred to as a lower frame area, and the first frame area 10, the display area 20, and the second frame area 30 are sequentially arranged along the first direction, wherein the first direction is perpendicular to the second direction. The second frame region 30 is provided with a fan-out region 303 and a bonding region 40, and the driving chip 400 is bonded to the bonding region 40 On the substrate 101 in a cog (chip On glass) manner; the driving chip 400 is rectangular, the driving chip 400 includes a first input terminal group 410 and a first output terminal group 420, along a first direction, the first input terminal group 410 includes at least one row of first input terminals 411, and the first output terminal group 420 includes at least one row of first output terminals 421. Each row of the first input terminals 411 includes a plurality of the first input terminals 411, and each row of the first output terminals 421 includes a plurality of the first output terminals 421. In the first direction, the driving chip 400 is divided into a first region X1 and a second region X2 along a central axis 401, where the central axis 401 refers to: the driving chip is divided into two symmetrical straight lines along the central axis in the first direction. When the driver chip 400 is bonded to the bonding region 40 on the substrate 101, the second region X2 is located on a side of the first region X1 away from the display region 20, and the first input terminal group 410 and the first output terminal group 420 are both disposed in the second region X2, that is, the first input terminal group 410 and the first output terminal group 420 are both disposed on a same side of the driver chip 400 away from the display region 20.
Alternatively, as shown in fig. 4 to 7, when the driving chip 400 is bonded on the bonding region 40 on the substrate 101, the first input terminal set 410 is located on a side of the first output terminal set 420 away from the display region 20;
specifically, the second frame region 30 further includes a fan-out region 303, the fan-out region 303 is composed of a first sub fan-out region 3031, a second sub fan-out region 3032 and a third sub fan-out region 3033 which are sequentially arranged along the second direction, the first sub fan-out region 3031 and the third sub fan-out region 3033 include a plurality of first fan-out leads 30311, the second sub fan-out region 3032 includes a plurality of second fan-out leads 30321, one end of each fan-out lead (30311, 30321) is electrically connected to the first output terminal 421, and the other end of each fan-out lead (30311, 30321) is electrically connected to the data line 21; at this time, the first input terminal 411 is electrically connected to the flexible circuit board 500 correspondingly.
Since the first output terminal group 420 and the first input terminal group 410 on the driving chip 400 are disposed on the same side of the driving chip 400 away from the display area 20, a portion of the fan-out lead (30311, 30321) needs to extend into the second region X2 of the driving chip 400 to be electrically connected to the corresponding first output terminal 421, at this time, although the width W1 of the driving chip 400 cannot be further compressed, the fan-out region 303 can at least overlap with the widths of 1/2 driving chips 400 along the first direction, and therefore, compared with the prior art, the size of the lower frame can save the width of the driving chip 400 by at least half or more, that is, the width size of W1/2 is saved at least, which is beneficial for realizing a narrow frame of a display module.
Specifically, in the first sub-fan-out region 3031 and the third sub-fan-out region 3033, the first fan-out leads 30311 are sequentially arranged along the second direction, each first fan-out lead 30311 includes at least one inflection point 3040, each first fan-out lead 30311 includes a linear portion 3041 extending along the first direction and a bending portion 3042 extending along the direction away from the second sub-fan-out region 3032, an intersection of the linear portion 3041 and the bending portion 3042 is the inflection point 3040, and when the driving chip 400 is bonded on the bonding region 40 on the substrate 101, the linear portion 3041 is located on one side of the bending portion 3042 close to the first output terminal group 420 along the first direction; the straight portion 3041 is electrically connected to the first output terminal 421 of the driving chip 400 in direct correspondence.
Further, any two first fan-out leads 30311 located in the first sub-fan-out region 3031 and the third sub-fan-out region 3033, the length of the straight portion 3041 of the first fan-out lead 30311 close to the second sub-fan-out region 3032 is greater than the length of the straight portion 3041 of the first fan-out lead 30311 far away from the second sub-fan-out region 3032, that is, in the first sub-fan-out region 3031 and the third sub-fan-out region 3033, the length of the straight portion 3041 of the first fan-out lead 30311 gradually decreases from the middle to two sides.
Preferably, in the first sub-fan-out region 3031 and the third sub-fan-out region 3033, the connection line of the inflection point 3040 of each first fan-out lead 30311 is respectively in a straight line, and the connection line and the second direction form an acute included angle a, preferably, 2 ° < a <80 °, so as to form a fan-out shape similar to a triangle, which is favorable for reasonably utilizing the space of the fan-out region 303 by the fan-out leads (30311, 30321).
Preferably, in a direction perpendicular to the plane of the substrate 101, the front projections of the driving chip 400 and the bending portions 3042 in the first sub-fan-out region 3031 and the third sub-fan-out region 3031 are overlapped, or the driving chip 400 can cover the edges of the bending portions 3042 in the first sub-fan-out region 3031 and the third sub-fan-out region 3031 as much as possible, so that all the straight portions 3041 in the first sub-fan-out region 3031 and the third sub-fan-out region 3031 fall within the area covered by the projection of the driving chip 400, so that the projection of the driving chip 400 can cover a larger area of the fan-out region 303, and optionally, the distance between the inflection point near the first output terminal group and the first output terminal group along the first direction is d3, and um0< d3<50 um. The lower frame that is favorable to realizing display module narrows to and be favorable to realizing higher screen to account for than.
Since the first region X1 is no longer used for disposing the first output terminal 421, the first region X1 is also referred to as a blank region of the driver chip 400, and although no terminal for telecommunication connection is disposed on the surface of the blank region, an internal circuit structure for driving the driver chip is disposed inside the projection region of the blank region. Therefore, there is a problem that the pressure applied to the driving chip 400 is not balanced during the bonding process. Therefore, it is preferable that a dummy terminal group 430 is provided in the first region X1 of the driving chip 400, and the dummy terminal group 430 includes a plurality of dummy terminals 431. Meanwhile, a plurality of dummy pads (not shown) are disposed on the substrate 101, and the dummy terminals 431 are correspondingly bonded to the dummy pads.
Preferably, the dummy terminals 431 are arranged in a row and side by side in the second direction.
Preferably, when the driver chip 400 is bonded on the bonding area 40 on the substrate 101, the dummy terminals 431 are located on one side edge of the driver chip 400 close to the display area 20, so as to improve the problem of unbalanced pressing pressure applied to two sides of the driver chip 400 in the bonding process.
Preferably, the dummy terminals 431, the first output terminals 421 and the first input terminals 411 have metal bumps with the same height in a direction perpendicular to the plane of the driving chip 400, so that the metal bumps of one row of the dummy terminals 431, each row of the first input terminals 411 and each row of the first output terminals 421 have the same height and are uniformly pressed; since no signal is output inside the dummy terminals 431 and the dummy terminals are floating electrodes, it is not necessary to separately coat an insulating paste for electrical signal insulation during binding.
Optionally, in the embodiment of the present invention, an Anisotropic Conductive (ACF) adhesive is coated on the whole surface of the projection area of the bonding area 40 where the driver chip 400 is located to perform bonding and pressing, conductive particles of the anisotropic conductive adhesive are broken by pressing and then electrically conducted in the vertical direction, and are electrically insulated in the horizontal direction; not only can the first region X1 (blank region) be ensured to achieve sufficient mechanical strength, but also the height of the first region X1 and the height of the second region X2 can be kept consistent during the bonding process, so as to improve the problem of unbalanced bonding pressure applied to the driver chip 400 during the bonding process.
Optionally, projections of the plurality of dummy pads are located at a gap between projections of two adjacent fan-out leads (30311, 30321) along a direction perpendicular to a plane of the substrate. So as to avoid that the fan-out leads (30311, 30321) are crushed by applying pressure during pressing and lead the adjacent fan-out leads (30311, 30321) to be conducted.
Optionally, in the first direction, a plurality of first output terminals are arranged in two rows, a plurality of first input terminals are arranged in one row, each row of first output terminals is in projection on the first direction and each row of first input terminals are in projection on the first direction do not overlap, that is, along the first direction, the first input end and the first output end are located in different rows, and a distance d2 between one row of first input terminals and one row of first output terminals adjacent to the one row of first input terminals is less than 200um, so that the distance between the first input terminals and the first output terminals is compressed under the condition that signal transmission is not interfered.
Optionally, the projection of the at least one row of first output terminals 421 and the at least one row of first input terminals 411 in the first direction overlap. Fig. 8 is a schematic plan view of another driving chip according to an embodiment of the present invention. As shown in fig. 8, taking an example of arranging the first output terminals 421 in two rows, arranging the first input terminals 411 in one row, arranging part of the first output terminals 421 and the first input terminals 411 in the same row, and arranging one end of the first output terminals 421 and the first input terminals 411 in the same row flush with each other in the first direction.
Fig. 9 is a schematic plan view of another driving chip according to an embodiment of the present invention. As shown in fig. 9, for example, two rows of the first output terminals 421 are provided, two rows of the first input terminals 411 are provided, and the first output terminals 421 and the first input terminals 411 of each row overlap in projection in the first direction, that is, the first output terminals 421 and the first input terminals 411 of each row are located in the same row, and one end of the first output terminals 421 and one end of the first input terminals 411 located in the same row are flush with each other in the first direction. Preferably, in the first direction, a distance d2 between one row of first output terminals and one row of first output terminals adjacent thereto is less than 200 um.
Preferably, in order to avoid interference of transmission signals between two adjacent fan-out lines (30311, 30321), in at least one row along the second direction, the plurality of first input terminals 411 and the plurality of first output terminals 421 are alternately arranged at intervals, so that a gap is left between two adjacent first output terminals 421, and normal electrical connection with the fan-out lines (30311, 3021) is ensured.
Fig. 10 is a schematic plan view illustrating a display module according to an embodiment of the invention, and fig. 11 is a schematic partial enlarged view illustrating a test circuit of the display module shown in fig. 10. As shown in fig. 10-11, optionally, the display panel in the embodiment of the invention further includes a detection circuit 1010, the detection circuit 1010 is located in the first frame region 10, the detection circuit 1010 includes a plurality of switching tubes T, switching buses SW and R, G, B signal lines, a control terminal of the switching tube T is connected to the switching bus SW of the detection circuit 1010, an input terminal of the switching tube T is connected to the R, G, B signal line, and an output terminal of the switching tube T is connected to the data line (S1, 21).
Based on the same inventive concept, an embodiment of the present invention provides a display device, which includes the display module described above. The display device can be a liquid crystal display, a liquid crystal display screen, a liquid crystal television and other display devices, and can also be mobile equipment such as a mobile phone, a tablet personal computer, a notebook computer and the like.
As can be seen from the above embodiments, the embodiments of the present invention have the following beneficial effects:
the display module comprises a display panel, a driving chip and a flexible circuit board, wherein the display panel comprises a display area and a non-display area surrounding the display area, the non-display area comprises a first frame area and a second frame area, the first frame area, the display area and the second frame area are sequentially arranged along a first direction, the second frame area comprises a binding area and a fan-out area, the driving chip is divided into the first area and the second area along the central axis of the driving chip, when the driving chip is bound on the binding area of a substrate, the first area is positioned at one side of the second area close to the display area, a plurality of first output terminals and a plurality of first input terminals are all arranged in the second area of the driving chip, one end of a fan-out lead positioned in the fan-out area extends to the second area to be electrically connected with the first output terminals, and the other end of the fan-out lead is electrically connected with a data line in the display area, and simultaneously, the first input terminal on the driving chip is electrically connected with the flexible circuit board. Can be under the condition of the size that does not change driver chip size for along first direction, the fan-out zone can form the overlap with 1/2 driver chip's width at least, is favorable to realizing that display module's lower frame narrows, and is favorable to realizing that higher screen accounts for than.
The foregoing description shows and describes several preferred embodiments of the present application, but as aforementioned, it is to be understood that the application is not limited to the forms disclosed herein, but is not to be construed as excluding other embodiments and is capable of use in various other combinations, modifications, and environments and is capable of changes within the scope of the inventive concept as expressed herein, commensurate with the above teachings, or the skill or knowledge of the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the application, which is to be protected by the claims appended hereto.
Claims (15)
1. A display module, comprising: the display device comprises a display panel, a driving chip and a flexible circuit board;
the display panel comprises a substrate, wherein the substrate is divided into a display area and a non-display area, the non-display area is arranged around the display area, and the display area comprises a plurality of data lines which extend along a first direction and are arranged along a second direction;
the non-display area comprises a first frame area and a second frame area, the first frame area, the display area and the second frame area are sequentially arranged along the first direction, the second frame area comprises a binding area, and the driving chip is bound to the binding area;
the driving chip is rectangular and comprises a first input terminal group and a first output terminal group, the first input terminal group comprises a plurality of first input terminals, the first output terminal group comprises a plurality of first output terminals, the driving chip is divided into a first area and a second area along the central axis of the driving chip along the first direction, the second area is positioned on one side of the first area far away from the display area, and the first input terminal group and the first output terminal group are both arranged in the second area, wherein the first direction is vertical to the second direction;
the second frame region further comprises a fan-out region, a fan-out lead is positioned in the fan-out region and extends to the second region, one end of the fan-out lead is electrically connected with the first output terminal, and the other end of the fan-out lead is electrically connected with the data line;
the first input terminal is electrically connected with the flexible circuit board.
2. The display module of claim 1, wherein the fan-out area is composed of a first sub-fan-out area, a second sub-fan-out area, and a third sub-fan-out area arranged in sequence along the second direction, the first sub-fan-out area and the third sub-fan-out area comprise a plurality of first fan-out leads, the second sub-fan-out area comprises a plurality of second fan-out leads, wherein, in the first sub-fan-out area and the third sub-fan-out area, the first fan-out leads are sequentially arranged along the second direction, each first fan-out lead comprises at least one inflection point, each first fan-out lead comprises a straight part extending along the first direction and a bending part extending along the direction far away from the second sub-fan-out area, the intersection point of the straight line part and the bent part is the inflection point, and the straight line part is positioned on one side of the bent part close to the first output terminal group along the first direction;
the first fan-out lead is positioned in any two of the first sub-fan-out area and the third sub-fan-out area, and the length of a straight line part of the first fan-out lead close to the second sub-fan-out area is larger than that of a straight line part of the first fan-out lead far away from the second sub-fan-out area.
3. The display module of claim 2, wherein a line connecting the inflection points of each of the first fan-out leads in the first sub-fan-out region and the third sub-fan-out region forms an acute included angle a with the second direction, wherein a is greater than or equal to 2 degrees and less than or equal to 80 degrees.
4. The display module according to claim 2 or 3,
in a direction perpendicular to a plane of the substrate, the driving chip overlaps with orthographic projections of bending portions located in the first sub fan-out area and the third sub fan-out area.
5. The display module of claim 4,
along the first direction, the distance between the inflection point close to the first output terminal group and the first output terminal group is d3, wherein 0um < d3 is not less than 50 um.
6. The display module of claim 1,
the driving chip further comprises a plurality of virtual terminals, the plurality of virtual terminals are arranged in the first area and located at the edge of one side, close to the display area, of the driving chip, and the plurality of virtual terminals are arranged side by side along the second direction;
the substrate is provided with a plurality of virtual pads, and the virtual terminals are correspondingly bound and connected with the virtual pads.
7. The display module of claim 6, wherein projections of the dummy pads are located at a gap between projections of two adjacent fan-out leads in a direction perpendicular to a plane of the substrate.
8. The display module of claim 1,
along the first direction, the first output terminal group includes at least one row of first output terminals, and the first input terminal group includes at least one row of first input terminals.
9. The display module of claim 8,
the projection of each row of the first output terminals in the first direction is not overlapped with the projection of each row of the first input terminals in the first direction.
10. The display module of claim 9,
along first direction, the interval between a row of first input terminal and the first output terminal of a row adjacent to it is less than 200 um.
11. The display module of claim 8,
along the first direction, at least one row of first output terminals overlaps with at least one row of first input terminals in a projection in the first direction.
12. The display module of claim 11,
along the second direction, in at least one row, the plurality of first input terminals and the plurality of first output terminals are alternately arranged at intervals.
13. The display module of claim 11,
along first direction, the interval between a row of first output terminal and the first output terminal of a row adjacent to it is less than 200 um.
14. The display module of claim 1,
the display panel further comprises a detection circuit, the detection circuit is located in the first frame area, the detection circuit comprises a plurality of switch tubes, a switch bus and R, G, B signal lines, the control ends of the switch tubes are connected with the switch bus of the detection circuit, the input ends of the switch tubes are connected with the R, G, B signal lines, and the output ends of the switch tubes are connected with the data lines.
15. A display device comprising a display module according to any one of claims 1 to 14.
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| CN201910979121.8A CN110579917B (en) | 2019-10-15 | 2019-10-15 | Display module and display device |
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Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110928080B (en) | 2019-12-20 | 2022-07-01 | 武汉天马微电子有限公司 | Display device and manufacturing method thereof |
| EP4095920A4 (en) * | 2020-01-22 | 2023-01-25 | BOE Technology Group Co., Ltd. | Display panel and display apparatus |
| CN111243486A (en) * | 2020-03-09 | 2020-06-05 | Tcl华星光电技术有限公司 | Array substrate and display panel |
| CN111354265B (en) * | 2020-04-13 | 2022-07-12 | 武汉华星光电技术有限公司 | Display panel and manufacturing method thereof |
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| CN111864108B (en) * | 2020-07-13 | 2022-01-04 | 武汉华星光电半导体显示技术有限公司 | OLED display panel |
| CN111883039B (en) * | 2020-07-31 | 2023-05-30 | 厦门天马微电子有限公司 | Driving chip and display device |
| CN111951669A (en) * | 2020-08-11 | 2020-11-17 | 武汉华星光电技术有限公司 | Display panel and display device |
| CN111933030A (en) * | 2020-08-14 | 2020-11-13 | 昆山国显光电有限公司 | Array substrate, display panel and display device |
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| CN112133201B (en) * | 2020-09-30 | 2022-08-05 | 厦门天马微电子有限公司 | Array substrate, display panel and display device |
| CN112309265A (en) * | 2020-11-09 | 2021-02-02 | 武汉华星光电技术有限公司 | Display panel and display device |
| CN113126375B (en) * | 2021-04-29 | 2022-08-30 | 厦门天马微电子有限公司 | Display module and display device |
| WO2022266830A1 (en) * | 2021-06-22 | 2022-12-29 | 京东方科技集团股份有限公司 | Display panel and display device |
| CN113360028B (en) * | 2021-07-06 | 2022-04-22 | 业成科技（成都）有限公司 | Touch module and touch device |
| CN113539101B (en) * | 2021-07-20 | 2023-05-16 | 南昌勤胜电子科技有限公司 | Array substrate, display panel and display device |
| CN113487971B (en) * | 2021-07-22 | 2023-05-30 | 武汉华星光电技术有限公司 | Display panel and display device |
| CN113823241B (en) * | 2021-09-30 | 2022-09-27 | 武汉华星光电技术有限公司 | Drive chip and display panel |
| CN114137751A (en) * | 2021-10-11 | 2022-03-04 | 信利光电股份有限公司 | Display drive IC and display module |
| CN114255658B (en) * | 2021-12-16 | 2023-03-17 | 武汉华星光电技术有限公司 | Display panel and display device |
| CN114822260B (en) * | 2022-05-09 | 2023-06-30 | 武汉华星光电技术有限公司 | Display panel and electronic equipment |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2658777Y (en) * | 2003-11-27 | 2004-11-24 | 上海广电液晶显示器有限公司 | STN liquid crystal display module |
| CN102508369A (en) * | 2011-11-16 | 2012-06-20 | 深圳市华星光电技术有限公司 | Chip-on-film structure for liquid crystal display panel |
| KR20140061815A (en) * | 2012-11-14 | 2014-05-22 | 엘지디스플레이 주식회사 | Array substrate for liquid crystal display |
| CN104576579A (en) * | 2015-01-27 | 2015-04-29 | 江阴长电先进封装有限公司 | Three-dimensional laminated packaging structure and packaging method thereof |
| CN106526995A (en) * | 2016-10-31 | 2017-03-22 | 厦门天马微电子有限公司 | Array substrate and display panel |
| CN107479276A (en) * | 2017-08-28 | 2017-12-15 | 厦门天马微电子有限公司 | Touch-control display panel and the touch control display apparatus for including it |
| CN206863388U (en) * | 2017-06-12 | 2018-01-09 | 武汉华显光电技术有限公司 | Liquid crystal display die set and mobile phone |
| CN109493745A (en) * | 2018-11-28 | 2019-03-19 | 武汉华星光电技术有限公司 | Display device and preparation method thereof |
| CN109557734A (en) * | 2018-10-31 | 2019-04-02 | 武汉华星光电技术有限公司 | Display panel and display module |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5291917B2 (en) * | 2007-11-09 | 2013-09-18 | ルネサスエレクトロニクス株式会社 | Semiconductor device and manufacturing method thereof |
| KR20170113748A (en) * | 2016-03-24 | 2017-10-13 | 삼성디스플레이 주식회사 | Display apparatus and method of manufacturing the same |
| CN106873222B (en) * | 2017-04-20 | 2020-08-04 | 武汉华星光电技术有限公司 | Display panel and display of narrow frame |
-
2019
- 2019-10-15 CN CN201910979121.8A patent/CN110579917B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2658777Y (en) * | 2003-11-27 | 2004-11-24 | 上海广电液晶显示器有限公司 | STN liquid crystal display module |
| CN102508369A (en) * | 2011-11-16 | 2012-06-20 | 深圳市华星光电技术有限公司 | Chip-on-film structure for liquid crystal display panel |
| KR20140061815A (en) * | 2012-11-14 | 2014-05-22 | 엘지디스플레이 주식회사 | Array substrate for liquid crystal display |
| CN104576579A (en) * | 2015-01-27 | 2015-04-29 | 江阴长电先进封装有限公司 | Three-dimensional laminated packaging structure and packaging method thereof |
| CN106526995A (en) * | 2016-10-31 | 2017-03-22 | 厦门天马微电子有限公司 | Array substrate and display panel |
| CN206863388U (en) * | 2017-06-12 | 2018-01-09 | 武汉华显光电技术有限公司 | Liquid crystal display die set and mobile phone |
| CN107479276A (en) * | 2017-08-28 | 2017-12-15 | 厦门天马微电子有限公司 | Touch-control display panel and the touch control display apparatus for including it |
| CN109557734A (en) * | 2018-10-31 | 2019-04-02 | 武汉华星光电技术有限公司 | Display panel and display module |
| CN109493745A (en) * | 2018-11-28 | 2019-03-19 | 武汉华星光电技术有限公司 | Display device and preparation method thereof |
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|---|---|
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