CN109616480B - Display panel and display device - Google Patents
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- CN109616480B CN109616480B CN201811616195.7A CN201811616195A CN109616480B CN 109616480 B CN109616480 B CN 109616480B CN 201811616195 A CN201811616195 A CN 201811616195A CN 109616480 B CN109616480 B CN 109616480B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13458—Terminal pads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
- H01L27/1244—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
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Abstract
The embodiment of the invention discloses a display panel and a display device. The display panel comprises a display area and a frame area surrounding the display area; the frame area comprises a binding conversion area and a first binding area, and the first binding area is positioned between the display area and the binding conversion area; the display area comprises a plurality of signal lines, and first ends of the signal lines extend to the binding conversion area; the frame area comprises a plurality of first wires, the first binding area comprises a plurality of first binding pads, the first ends of the first wires are located in the binding conversion area, and the second ends of the first wires are electrically connected with the first binding pads. The embodiment of the invention solves the problem of wider frame of the display panel in the prior art, can effectively reduce the width of the frame and improve the screen occupation ratio.
Description
Technical Field
The present invention relates to display technologies, and in particular, to a display panel and a display device.
Background
With the development of display technology, the requirements of people on consumer electronics have not only been limited to functionality, but also turned to aspects of design, artistry and good visual experience, such as a high-screen-ratio screen with a narrow bezel, which is more and more popular. The screen occupation ratio is the ratio of the screen area to the whole machine area, and higher screen occupation ratio can bring better visual experience to users.
For example, for a display screen of a mobile phone, the left and right frames can be designed to be narrow, but since the lower frame needs to be provided with wiring, a driving chip, and the like, it is a great difficulty how to reduce the width of the lower frame of the display panel. In the prior art, many manufacturers adopt a cof (chip on film) scheme of a lower frame of a display, reserve a bending area for a flexible substrate, and bend the flexible substrate after manufacturing structures such as wiring structures, so that the screen occupation ratio can be effectively improved. However, the traces of the flexible substrate are easily broken by bending, which results in a low yield and high cost.
Disclosure of Invention
The embodiment of the invention provides a display panel and a display device, which can effectively reduce the width of a frame and improve the screen occupation ratio.
In a first aspect, an embodiment of the present invention provides a display panel, including:
a display area and a border area surrounding the display area;
the frame area comprises a binding conversion area and a first binding area, and the first binding area is positioned between the display area and the binding conversion area;
the display area comprises a plurality of signal lines, and first ends of the signal lines extend to the binding conversion area;
the frame area comprises a plurality of first wires, the first binding area comprises a plurality of first binding pads, the first ends of the first wires are located in the binding conversion area, and the second ends of the first wires are electrically connected with the first binding pads.
In a second aspect, based on the same inventive concept, an embodiment of the present invention further provides a display device, including the display panel described above.
The display panel provided by the embodiment of the invention comprises a display area and a frame area surrounding the display area; the frame area comprises a binding conversion area and a first binding area, and the first binding area is positioned between the display area and the binding conversion area; the display area comprises a plurality of signal lines, and first ends of the signal lines extend to the binding conversion area; the frame area comprises a plurality of first wires, the first binding area comprises a plurality of first binding pads, the first ends of the first wires are located in the binding conversion area, and the second ends of the first wires are electrically connected with the first binding pads. Through set up many first wirings in the frame district, first wiring is located the display area with the signal transmission of signal line and is bound the first district that binds between the conversion district, can get rid of the bending region that display panel reserved, effectively shortens the width in display panel frame district.
Drawings
FIG. 1 is a schematic diagram of a display panel according to the prior art;
fig. 2 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view taken along line A-A' of FIG. 2;
fig. 4 is a schematic partial structure diagram of a display panel according to an embodiment of the present invention;
FIG. 5 is a schematic cross-sectional view taken along line B-B' of FIG. 4;
fig. 6 is a schematic partial structure diagram of another display panel according to an embodiment of the present invention;
FIG. 7 is a schematic cross-sectional view taken along line C-C' of FIG. 6;
fig. 8 is a schematic diagram illustrating a positional relationship between a first bonding pad and a signal line in a display panel according to an embodiment of the invention;
fig. 9 is a schematic diagram illustrating a positional relationship between a first bonding pad and a signal line in a display panel according to an embodiment of the invention;
fig. 10 is a schematic structural diagram of another display panel according to an embodiment of the present invention;
fig. 11 is a schematic structural diagram of a display device according to an embodiment of the present invention;
fig. 12 is a schematic partial structure diagram of a display device according to an embodiment of the present invention;
FIG. 13 is a schematic cross-sectional view taken along line D-D' of FIG. 12;
fig. 14 is a partial schematic structural diagram of another display device according to an embodiment of the invention;
fig. 15 is a schematic sectional view taken along line E-E' of fig. 14.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. It should be noted that the terms "upper", "lower", "left", "right", and the like used in the description of the embodiments of the present invention are used in the angle shown in the drawings, and should not be construed as limiting the embodiments of the present invention. In addition, in this context, it is also to be understood that when an element is referred to as being "on" or "under" another element, it can be directly formed on "or" under "the other element or be indirectly formed on" or "under" the other element through an intermediate element. The terms "first," "second," and the like, are used for descriptive purposes only and not for purposes of limitation, and do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The specific meanings of the above terms in the present invention can be understood in specific cases by those skilled in the art.
As the demand for the appearance of consumer electronic products increases, various "full-screen" technologies with high screen occupation ratio are becoming more popular, and fig. 1 is a schematic structural diagram of a display panel in the prior art, where the display panel employs a flexible substrate 100, the display panel includes a display area 200 and a frame area 300, and the frame area 300 includes a fog (flex on glass) or cof (chip on film) area 301. Since the flexible substrate 100 needs to have a certain curvature when bending, the frame area 300 further includes a bending reserved area 302. The frame cannot be further reduced due to the arrangement of the bending reserved area 302, and a plurality of wires are arranged on the flexible substrate 100, so that the wires may be broken when the flexible substrate 100 is bent, and the yield of products is reduced.
Fig. 2 is a schematic structural diagram of a display panel according to an embodiment of the invention, and fig. 3 is a schematic structural diagram of a cross section of fig. 2 along a cross-sectional line a-a'. Referring to fig. 2 and 3, a display panel provided by an embodiment of the present invention includes: a display area 10 and a bezel area 20 surrounding the display area 10; the frame area 20 includes a binding conversion area 21 and a first binding area 22, and the first binding area 22 is located between the display area 10 and the binding conversion area 21; the display area 10 includes a plurality of signal lines 11, first ends of the signal lines 11 extend to the binding conversion area 21; the frame area 20 includes a plurality of first traces 23, and the first bonding area 22 includes a plurality of first bonding pads 223, wherein a first end of the first trace 23 is located in the bonding transformation area 21, and a second end of the first trace 23 is electrically connected to the first bonding pads 223.
It is understood that the display area 10 includes a plurality of pixels (not shown in fig. 2) for displaying a picture to be displayed, and exemplarily, a lower frame of the frame area 20 in fig. 2 includes a binding conversion area 21 and a first binding area 22, and the display area 10 is provided with a plurality of signal lines 11, such as scan lines and data lines, extending to the binding conversion area 21. The first end of the first wire 23 is located in the binding conversion area 21, the binding conversion area 21 can be electrically connected with the signal wire 11, then the second end of the first wire 23 is electrically connected with the first binding pad 223, the flexible circuit board can be bound in the first binding area 22 after the display panel is manufactured, the setting of the bending reserved area can be cancelled, the width of a frame of the display panel can be effectively reduced, the signal wire does not need to be bent along with the flexible substrate, and the risk of signal wire breakage can be reduced.
According to the technical scheme of the embodiment of the invention, the plurality of first wires are arranged in the frame area, and the first wires transmit the signals of the signal wires to the first binding area arranged between the display area and the binding conversion area, so that the reserved bending area of the display panel can be removed, and the width of the frame area of the display panel is effectively shortened. And the signal line need not to follow flexible substrate and buckles, can reduce the cracked risk of signal line.
On the basis of the above technical solution, with continuing reference to fig. 3, optionally, the display panel further includes: the array substrate 30 and the opposite substrate 40 are oppositely arranged; the first bonding pads 223 overlap the array substrate 30 and the opposite substrate 40, respectively, in a direction perpendicular to a plane in which the display panel is located.
It is understood that an array circuit, such as a thin film transistor TFT circuit, for driving pixels in the display area 10 is disposed on the array substrate 30. Optionally, the display panel may be a liquid crystal display panel, and the opposite substrate 40 is a color film substrate; alternatively, the display panel may be an organic light emitting display panel, and the opposite substrate 40 is an encapsulation substrate.
It can be understood that, when the display panel of the embodiment of the invention is a liquid crystal display panel, the opposite substrate 40 of the display panel is a color film substrate, a liquid crystal layer is disposed between the array substrate 30 and the color film substrate, and the color film substrate includes structures such as an optical filter and a black matrix, which are not described in detail herein. For example, since the array substrate 30 needs to be provided with a driving circuit and other structures, the length of the array substrate 30 is greater than that of the color film substrate, the array substrate 30 and the color film substrate need to be bonded by frame glue to form a frame region, and the first bonding pad 223 may be arranged above the frame glue region, so as to achieve the purpose of reducing the frame of the display panel.
When the display panel provided by the embodiment of the present invention is an organic light emitting display panel, the array substrate 30 includes a TFT array, an organic light emitting device, and the like, and the opposite substrate 40 is an encapsulation substrate for protecting the organic light emitting device. The display panel provided by the embodiment of the invention can be a liquid crystal display panel or an organic light emitting display panel, and the array substrate can be a rigid substrate or a flexible substrate, which is not limited in the embodiment of the invention.
Fig. 4 is a partial structural schematic view of a display panel according to an embodiment of the invention, and fig. 5 is a sectional structural schematic view of fig. 4 along a sectional line B-B'. Referring to fig. 4 and 5, optionally, the bonding transformation area 21 includes a second bonding area 211, the second bonding area 211 includes a plurality of driver chip bonding pads 2111, and the signal line 11 and the first end of the first trace 23 are electrically connected to different driver chip bonding pads 2111, respectively.
It is understood that the array substrate of the display panel may be a rigid substrate, such as a glass substrate, and the second bonding region 211 may be provided with a driving chip for driving the TFT array on the display panel, for applying a driving signal to each pixel. In specific implementation, the driving Chip can be packaged on a rigid substrate (COG, Chip on Glass) of the display panel, so that the working stability of the display panel is improved.
Fig. 6 is a partial structural schematic view of another display panel according to an embodiment of the invention, and fig. 7 is a sectional structural schematic view of fig. 6 along a sectional line C-C'. Referring to fig. 6 and 7, alternatively, the first traces 23 and the signal lines 11 are electrically connected in a one-to-one correspondence in the bonding transformation area 21.
For example, referring to fig. 7, the signal line 11 is disposed on the surface of the array substrate 30, at least one insulating layer 31 is disposed between the first trace 23 and the signal line 11, and the first trace 23 is electrically connected to the signal line 11 through a via hole on the insulating layer 31 in a one-to-one correspondence manner.
With continued reference to fig. 7, optionally, the extending directions of the first traces 23 and the signal lines 11 are parallel.
It can be understood that, in the embodiment, except for the connection position of the first trace 23 and the signal line 11 in the binding conversion area 21, the extending directions of the first trace 23 and the signal line 11 are arranged in parallel, which is beneficial to preventing other traces (for example, a touch signal line) from interfering with signals transmitted between the first trace 23 and the signal line 11, and improving the display stability of the display panel.
Fig. 8 is a schematic diagram illustrating a positional relationship between a first bonding pad and a signal line in a display panel according to an embodiment of the invention. Referring to fig. 8, alternatively, the first bonding pad 223 is positioned between two adjacent signal lines 11 in a direction perpendicular to a plane in which the display panel is positioned.
It can be understood that the first bonding pad 223 can be electrically connected to the flexible circuit board through an anisotropic conductive adhesive, since the signal line 11 is generally a metal layer and has poor light transmittance, and the anisotropic conductive adhesive crushes the conductive particles through pressure to realize conductivity, and in order to observe the conductive particles, the first bonding pad 223 can be disposed between the adjacent signal lines 11, so that the conductive particles can be observed from the back of the display panel, and poor electrical contact can be prevented.
Fig. 9 is a schematic diagram illustrating a positional relationship between a first bonding pad and a signal line in a display panel according to an embodiment of the invention. Referring to fig. 9, alternatively, the first bonding pad 223 and the signal line 11 overlap each other in a direction perpendicular to a plane in which the display panel is positioned. It is understood that an insulating layer or a shielding metal layer (not shown in fig. 9) is disposed between the first bonding pad 223 and the signal line 11.
Alternatively, with continued reference to fig. 8 and 9, the width of the first bonding pad 223 is L1, and the line width of the signal line 11 is L2, where L1-L2 > 0. By setting L1-L2 > 0, the resistance of the first bond pad 223 can be reduced, increasing the conductivity of the first bond pad 223.
Optionally, with continued reference to fig. 9, the first bonding area further includes at least one dummy pad 224, and the dummy pad 224 is located between two adjacent signal lines 11 in a direction perpendicular to a plane in which the display panel is located.
It is understood that the dummy pads 224 are not electrically connected to the signal lines 11, for example, one dummy pad 224 is disposed between every two adjacent signal lines 11 shown in fig. 9, and the number of the dummy pads 224 is not limited in the specific implementation and may be set according to actual requirements.
It should be noted that, in a direction perpendicular to a plane of the display panel, the first bonding pad may be overlapped with the signal line, may not be overlapped with the signal line, or may partially overlap with the signal line, and the first bonding area may be disposed in a center of a frame area of the display panel, or may be disposed at an edge of the frame area.
Fig. 10 is a schematic structural diagram of another display panel according to an embodiment of the present invention. Referring to fig. 10, the display panel further includes a plurality of test terminals 24 disposed in the frame area 20, wherein the test terminals 24 are electrically connected to the first wires 23 in a one-to-one correspondence (not shown in the figure), for testing the conduction performance of the first wires 23, so as to prevent the defective display panel from entering the subsequent process and improve the yield of the display panel.
Fig. 10 exemplarily shows that the test terminals 24 are located on a lower frame of the display panel, specifically, each test terminal 24 may be located between two adjacent signal lines in a direction perpendicular to the display panel, it should be noted that the test terminals 24 may also be disposed on left and right frames or an upper frame of the display panel, and when the display panel is an organic display panel, an encapsulation layer above the test terminals 24 may be removed to facilitate the test.
Fig. 11 is a schematic structural diagram of a display device according to an embodiment of the present invention. Referring to fig. 11, a display device 2 according to an embodiment of the present invention includes any one of the display panels 1 according to the above embodiments. The display device provided by the embodiment of the invention has the effect of a narrow frame.
Fig. 12 is a partial structural schematic view of a display device according to an embodiment of the invention, and fig. 13 is a sectional structural schematic view of fig. 12 along a sectional line D-D'. Referring to fig. 12 and 13, optionally, the display device further includes a flexible circuit board 50, a first end of the flexible circuit board 50 is provided with a plurality of second binding pads 51; the second bonding pads 51 are bonded to the first bonding pads 223 in a one-to-one correspondence; the second end of the flexible circuit board 50 is bent to a side away from the light emitting side of the display panel.
With continued reference to fig. 13, optionally, the display device further includes a driving chip 60, where the driving chip 60 is disposed on a portion of the flexible circuit board 50 that is bent away from the display panel; the driving chip 60 is electrically connected to the first trace 23 through the flexible circuit board 50.
According to the technical scheme of the embodiment, the flexible circuit board 50 is bent to the side deviating from the light emitting side of the display panel, so that the frame of the display device can be effectively reduced.
Fig. 14 is a partial schematic structural diagram of another display device according to an embodiment of the invention. Referring to fig. 14, optionally, the bonding conversion region 21 includes a second bonding region 211, and the display device further includes a driving chip 60 disposed in the second bonding region 211, where the driving chip 60 is bonded to the signal line 11 and the first end of the first trace 23.
It is understood that the array substrate of the display panel may be a rigid substrate, such as a glass substrate, and the second bonding region 211 may be provided with a driving chip for driving the TFT array on the display panel, for applying a driving signal to each pixel. In specific implementation, the driving Chip can be packaged on a rigid substrate (COG, Chip on Glass) of the display panel, so that the working stability of the display panel is improved.
With continued reference to fig. 14, optionally, the flexible circuit board 50 includes a hollowed-out area 52; the vertical projection of the driving chip 60 on the plane of the display panel is located within the vertical projection of the hollow area 52 on the plane of the display panel.
By providing the hollow area 52 in the flexible circuit board 50, the signal interference of the signal transmitted in the flexible circuit board 50 to the driving chip 60 can be prevented, and the stability of the display device can be improved.
Fig. 15 is a schematic sectional structure view taken along a sectional line E-E' of fig. 14, and referring to fig. 15, the display device further includes, optionally, a step region 70 between the binding conversion region 21 and the first binding region 22, with a height difference between the binding conversion region 21 and the first binding region 22; the flexible printed circuit board further comprises a filling layer 80, which is located in the binding conversion area 21 and located between the film layer where the first trace 23 is located and the flexible printed circuit board 50.
It is understood that, since the array substrate and the opposite substrate are different in size, a step of the step region 70 is formed, and the filling layer 80 may be an encapsulant, and may serve to fix the flexible circuit board 50. In the embodiment of the present invention, the first routing 23 extends to the first bonding region 22 formed on the substrate 40 opposite to the step region 70, so that the width of the step region 70 can be effectively shortened, and a narrow frame can be realized.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious modifications, rearrangements, combinations and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (14)
1. A display device is characterized by comprising a display panel, wherein the display panel comprises a display area and a frame area surrounding the display area;
the frame area comprises a binding conversion area and a first binding area, and the first binding area is positioned between the display area and the binding conversion area;
the display area comprises a plurality of signal lines, and first ends of the signal lines extend to the binding conversion area;
the frame area comprises a plurality of first wires, the first binding area comprises a plurality of first binding pads, the first ends of the first wires are located in the binding conversion area, and the second ends of the first wires are electrically connected with the first binding pads;
the flexible circuit board is characterized by further comprising a flexible circuit board, wherein a plurality of second binding pads are arranged at the first end of the flexible circuit board;
the second binding pads are bound with the first binding pads in a one-to-one corresponding mode;
and the second end of the flexible circuit board is bent to one side deviating from the light emergent side of the display panel.
2. The display device according to claim 1, further comprising a driving chip disposed at a portion of the flexible circuit board bent away from the display panel;
the driving chip is electrically connected with the first routing through the flexible circuit board.
3. The display device according to claim 1, wherein the bonding conversion region includes a second bonding region, and the display device further includes a driver chip disposed in the second bonding region, and the driver chip is bonded to the signal line and the first end of the first trace.
4. The display device according to claim 3, wherein the flexible circuit board comprises a hollowed-out region; the vertical projection of the driving chip on the plane of the display panel is positioned in the vertical projection of the hollow area on the plane of the display panel.
5. The display device according to claim 1, further comprising a step region between the binding conversion region and the first binding region, the binding conversion region and the first binding region having a height difference therebetween;
the flexible circuit board further comprises a filling layer which is located in the binding conversion area and located between the film layer where the first wiring is located and the flexible circuit board.
6. The display device according to claim 1, wherein the display panel further comprises:
the array substrate and the opposite side substrate are oppositely arranged;
the first bonding pads are respectively overlapped with the array substrate and the opposite side substrate in a direction perpendicular to a plane of the display panel.
7. The display device according to claim 6, wherein the display panel is a liquid crystal display panel, and the opposite-side substrate is a color film substrate; alternatively, the first and second electrodes may be,
the display panel is an organic light-emitting display panel, and the opposite substrate is a packaging substrate.
8. The display device according to claim 1, wherein the bonding conversion region includes a second bonding region, the second bonding region includes a plurality of driver chip bonding pads, and the signal line and the first end of the first trace are electrically connected to different driver chip bonding pads, respectively.
9. The display device according to claim 1, wherein the first traces and the signal lines are electrically connected in a one-to-one correspondence in the bonding conversion area.
10. The display device according to claim 9, wherein the first traces and the signal lines extend in parallel.
11. The display device according to claim 1, wherein the first bonding pad is located between two adjacent signal lines in a direction perpendicular to a plane in which the display panel is located.
12. The display device according to claim 1, wherein the first bonding pad and the signal line overlap each other in a direction perpendicular to a plane in which the display panel is located.
13. The display device according to claim 11 or 12, wherein the first bonding pad has a width of L1, and the signal line has a line width of L2, where L1-L2 > 0.
14. The display device according to claim 12, wherein the first bonding area further comprises at least one dummy pad, and the dummy pad is located between two adjacent signal lines in a direction perpendicular to a plane of the display panel.
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