CN113299218B - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
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- CN113299218B CN113299218B CN202110610727.1A CN202110610727A CN113299218B CN 113299218 B CN113299218 B CN 113299218B CN 202110610727 A CN202110610727 A CN 202110610727A CN 113299218 B CN113299218 B CN 113299218B
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- 239000002184 metal Substances 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 14
- 230000001154 acute effect Effects 0.000 claims description 5
- 230000008054 signal transmission Effects 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 24
- 238000013461 design Methods 0.000 description 11
- 230000005540 biological transmission Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 239000011295 pitch Substances 0.000 description 7
- 238000004088 simulation Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
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- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The embodiment of the invention discloses a display panel and a display device. In the display panel, the binding region includes a plurality of binding pads; the binding pad comprises an input pad group and an output pad group, and the fan-out area comprises a flexible circuit board fan-out area and a display driving fan-out area; the input bonding pad group comprises a first input bonding pad group and a second input bonding pad group, and binding bonding pads in the first input bonding pad group and the second input bonding pad group are rectangular; the extending direction of the long side of the bonding pad in the first input pad group intersects with the extending direction of the long side of the bonding pad in the second input pad group. The embodiment of the invention solves the problem of increased wiring impedance caused by limited size of the binding pads in the existing display panel, can increase the transverse size of the binding pads, reduce the impedance of the wiring, ensure the signal transmission quality and further optimize the charging capability of the display panel by changing the rotation angle of part of the binding pads.
Description
Technical Field
The embodiment of the invention relates to the technical field of display, in particular to a display panel and a display device.
Background
With the continuous development of display markets, consumers have increasingly stringent requirements on visual effects of display screens, and not only have diversified requirements on appearance designs of the display screens, but also have increasingly higher requirements on screen occupation ratios. The trend in the overall screen technology is to pursue a screen ratio of 90% or more through ultra-narrow frame or even frame-free design.
The bonding of the driver Chip (integrated circuit, IC) to the Glass (COG, chip On Glass) is a technology used in the current display module, but the bonding of the driver Chip directly to the Glass of the display panel occupies the non-display area of the display panel, and the bonding pad of the bonding driver Chip is mostly compressed to reduce the frame width. However, with the popularization of the full-screen high-frequency technology, the problem that the width is insufficient and the impedance is high occurs in the bonding pad which is too small, so that the charging capability of the IC is easily reduced, and the high-frequency driving display effect is affected.
Disclosure of Invention
The invention provides a display panel and a display device, which are used for improving the arrangement design of binding pads, reducing the impedance of the binding pads and ensuring the charging capability of a driving chip.
In a first aspect, an embodiment of the present invention provides a display panel, including a display area and a non-display area surrounding the display area, where the non-display area includes a fan-out area and a binding area, the fan-out area includes a plurality of wires, and the binding area includes a plurality of binding pads;
the binding pad comprises an input pad group and an output pad group, and the fan-out area comprises a flexible circuit board fan-out area and a display driving fan-out area; one end of at least part of wires in the fan-out area of the flexible circuit board is used for being electrically connected with corresponding pins in the flexible circuit board, and the other end of the wires is electrically connected with corresponding binding pads in the input pad group; one end of each wiring in the display driving fan-out area is electrically connected with a corresponding binding pad in the output pad group, and the other end of each wiring is electrically connected with a corresponding signal wire in the display area;
the input bonding pad group comprises a first input bonding pad group and a second input bonding pad group, and binding bonding pads in the first input bonding pad group and the second input bonding pad group are rectangular; the extending direction of the long side of the binding pad in the first input pad group is intersected with the extending direction of the long side of the binding pad in the second input pad group.
In a second aspect, an embodiment of the present invention further provides a display device, including a display panel according to any one of the first aspect.
In the embodiment of the invention, the binding pads are arranged in the binding area of the display panel, the binding pads comprise the input pad group and the output pad group, the input pad group comprises the first input pad group and the second input pad group, the binding pads of the first input pad group and the second input pad group are rectangular, the extending direction of the long sides of the binding pads in the first input pad group is intersected with the extending direction of the long sides of the binding pads in the second input pad group, and the size of part of the binding pads in the transverse direction can be changed, so that the connection area of the routing arranged in the fan-out area of the flexible circuit board and the binding pads can be increased, the width of the routing connected with the flexible circuit board can be increased appropriately, the connection impedance can be reduced, the connection yield can be improved, the impedance on the routing can be reduced, and the pressure drop of signals when the signals are transmitted on the routing and the binding pads can be reduced. The embodiment of the invention solves the problem of increased wiring impedance caused by limited size of the binding pads in the existing display panel, can increase the transverse size of the binding pads, reduce the impedance of the wiring, ensure the signal transmission quality and further optimize the charging capability of the display panel by changing the rotation angle of part of the binding pads.
Drawings
Fig. 1 is a schematic structural diagram of a conventional display module according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a binding area in the display module shown in FIG. 1;
fig. 3 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
FIG. 4 is an enlarged view of a portion of the display panel of FIG. 3 at the dashed line box;
FIG. 5 is a partial enlarged view of another display panel according to an embodiment of the present invention;
FIG. 6 is a partial enlarged view of a display panel according to still another embodiment of the present invention;
fig. 7 is a partial enlarged view of the broken line box Aa in fig. 6;
FIG. 8 is a partial enlarged view of a display panel according to still another embodiment of the present invention;
FIG. 9 is a diagram of a single bond pad and two bond pads in parallel simulation models provided by an embodiment of the present invention;
FIG. 10 is a partial enlarged view of yet another display panel according to an embodiment of the present invention;
FIG. 11 is a partial enlarged view of yet another display panel according to an embodiment of the present invention;
FIG. 12 is a schematic cross-sectional view of the display panel along AA' of FIG. 4;
fig. 13 is a schematic cross-sectional view of another display panel according to an embodiment of the invention.
Detailed Description
The invention is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present invention are shown in the drawings.
Fig. 1 is a schematic structural diagram of an existing display module provided in an embodiment of the present invention, and fig. 2 is a schematic structural diagram of a binding area in the display module shown in fig. 1, first, refer to fig. 1 and fig. 2, where COG technology directly binds a driving chip on a display panel glass, and the binding area where the driving chip or a binding pad is located will occupy a part of a non-display area of the display panel, resulting in the existence of a frame area. Illustratively, one type of prior art is to arrange the bond pads in a trapezoidal arrangement or in a sunken arrangement, i.e., the output pads 101 are arranged sequentially along the upper base and two sides of the trapezoid, and the input pads 102 are arranged sequentially along the lower base of the trapezoid. The input bonding pads 102 are used for being connected with a flexible circuit board (Flexible Printed Circuit, FPC) through wires on the panel, the output bonding pads 101 are used for being connected with various signal wires in the surface through wires on the panel, and pins of the driving chip are connected with the input and output bonding pads in a one-to-one correspondence mode to achieve binding with the binding bonding pads. In such a scenario, the arrangement space of the input pads 102 in the lateral direction may be limited, so that the pitch and size of the input pads 102 in the lateral direction are reduced. As will be appreciated by those skilled in the art, a portion of the input pads 102 function to transmit the clock signal provided by the FPC to the driver chip and then to the in-plane signal lines. Based on the existing driving display mode, the clock signal provided to the surface determines the charging state of the pixel circuit in the data writing stage to a certain extent, and the requirement on the charging capability of the display panel is higher and higher along with the popularization of the full-screen high-frequency technology. At this time, when the lateral dimension of the input pad 102 is reduced or limited, the width of the trace for transmitting the clock signal is limited, so that the impedance on the trace is increased, the delay effect of the clock signal on the trace is increased, the transmission quality of the clock signal is reduced, and the charging capability of the panel is affected.
Based on the above problems, embodiments of the present invention provide a display panel. Fig. 3 is a schematic structural view of a display panel according to an embodiment of the present invention, and fig. 4 is a partial enlarged view of a dashed line frame in the display panel shown in fig. 3, and referring to fig. 3 and 4, the display panel according to an embodiment of the present invention includes a display area 100 and a non-display area 200 surrounding the display area 100, the non-display area 200 includes a fanout area 220 and a bonding area 210, the fanout area 220 includes a plurality of traces 10, and the bonding area 210 includes a plurality of bonding pads 20; the bonding pads 20 include an input pad group 21 and an output pad group 22, and the fan-out region 220 includes a flexible circuit board fan-out region 221 and a display driving fan-out region 222; at least some of the traces 10 in the flex circuit board fan-out area 221 have one end for electrical connection with corresponding pins (not shown) in the flex circuit board and another end for electrical connection with corresponding bond pads 20 in the input pad set 21; the traces 10 in the display driving fan-out area 222 are electrically connected at one end to the corresponding bonding pads 20 in the output pad group 22 and at the other end to corresponding signal lines (not shown) in the display area 100. The input pad group 21 includes a first input pad group 211 and a second input pad group 212, and the bonding pads 20 in the first input pad group 211 and the second input pad group 212 are rectangular; the extending direction of the long sides of the bonding pads 20 in the first input pad group 211 intersects the extending direction of the long sides of the bonding pads 20 in the second input pad group 212.
The input pad group 21 and the output pad group 22 are opposite to the driving chip, the input pad group 21 is used for inputting signals provided by the flexible circuit board through the wires in the fan-out area of the flexible circuit board, such as power supply signals, gate driving signals, boosting signals, display communication interface signals, touch communication structure signals and the like, to the driving chip, and the output pad group 22 is used for outputting corresponding data signals to the surface by the driving chip, wherein the data signals comprise data signals and/or touch signals for driving display and the like. In the embodiment of the present invention, the adjustment is mainly performed for the bonding pads 20 in the input pad group 21, where the input pad group 21 is set to include the first input pad group 211 and the second input pad group 212, and the bonding pads 20 in the second input pad group 212 are rotated by a certain angle with respect to the bonding pads 20 in the first input pad group 211, so that long-side extension lines thereof intersect with long-side extension lines of the bonding pads 20 in the first input pad group 211, and the purpose is to change the size of the bonding pads 20 in the second input pad group 212 in the lateral direction. It will be appreciated that the vertical type of bond pad is minimized in the lateral direction, and the size of the bond pad 20 in the lateral direction can be effectively improved by rotating the vertical type of bond pad 20 by a certain angle. Meanwhile, based on the fact that the traces 10 in the fan-out area 221 of the flexible circuit board are arranged in sequence along the transverse direction, when the traces 10 connected with the bonding pads 20 of the second input pad group 212 are arranged on the fan-out area 221 of the flexible circuit board, the cross-sectional area of the connection part of the traces 10 and the bonding pads 20 can be increased, so that the connection impedance is reduced. Meanwhile, on the basis of increasing the transverse dimension, namely the width, of the binding pad 20, the wiring 10 connected with the binding pad can be properly widened, the impedance of the wiring 10 is reduced, the voltage drop of a signal transmitted on the wiring can be ensured to be smaller, and the delay of the signal is reduced.
In the embodiment of the invention, the binding pads are arranged in the binding area of the display panel, the binding pads comprise the input pad group and the output pad group, the input pad group comprises the first input pad group and the second input pad group, the binding pads of the first input pad group and the second input pad group are rectangular, the extending direction of the long sides of the binding pads in the first input pad group is intersected with the extending direction of the long sides of the binding pads in the second input pad group, and the size of part of the binding pads in the transverse direction can be changed, so that the connection area of the routing arranged in the fan-out area of the flexible circuit board and the binding pads can be increased, the width of the routing connected with the flexible circuit board can be increased appropriately, the connection impedance can be reduced, the connection yield can be improved, the impedance on the routing can be reduced, and the pressure drop of signals when the signals are transmitted on the routing and the binding pads can be reduced. The embodiment of the invention solves the problem of increased wiring impedance caused by limited size of the binding pads in the existing display panel, can increase the transverse size of the binding pads, reduce the impedance of the wiring, ensure the signal transmission quality and further optimize the charging capability of the display panel by changing the rotation angle of part of the binding pads.
As illustrated in fig. 4, in an embodiment of the present invention, the long edges of the bonding pads 20 in the optional second input pad group 212 extend in the first direction 1, and the long edges of the bonding pads 20 in the first input pad group 211 extend in the second direction 2; wherein the second direction 2 is perpendicular to the first direction 1.
The long edges of the bonding pads 20 in the second input pad group 212 extend in the first direction 1, which is substantially that the bonding pads 20 in the second input pad group 212 lie horizontally, and the long edges of the bonding pads 20 in the first input pad group 211 extend in the second direction 2, which is substantially that the bonding pads 20 in the first input pad group 211 stand. In comparison, the second input pad group 212 is provided with a long edge extending laterally, i.e. lying laterally, so that the lateral dimension of the bonding pad 20 can be changed to a greater extent, which is more effective for improving the routing impedance. Furthermore, the bonding pads 20 in the second input pad group 212 are arranged in a horizontal manner, and the shape and arrangement of the bonding pads are more standard and standard than those of the bonding pads 20 in an inclined state, which is helpful for layout design and alignment bonding of corresponding driving chip pins.
With continued reference to fig. 4, further, the bonding pads 20 in the first input pad group 211 and the second input pad group 212 are sequentially arranged along the first direction 1, and the bonding pads 20 in the second input pad group 212 are located at two sides of the first input pad group 211 in the first direction 1, and the bonding pads 20 in the second input pad group 212 are used for electrically connecting with timing control circuit output pins (not shown in the figure) of the driving chip.
The timing control circuit output pin CGOUT of the driving chip is used for outputting a gate driving signal including a gate clock signal, a frame start pulse signal and an enable start signal. The bonding pads 20 in the second input pad group 212 are electrically connected with the output pin CGOUT of the timing control circuit, so that the bonding pads 20 with the adjusted lateral dimensions are used to transmit the gate driving signals including the gate clock signal, the frame start pulse signal and the enable start signal, thereby reducing the voltage drop and delay of the gate clock signal and ensuring the transmission quality of the gate clock signal, so as to ensure the accuracy of the driving timing of the pixel circuit, and facilitate optimizing and improving the charging capability of the display panel.
Illustratively, the number of pins in the current driving chip is about 700 or more, and the number of output pins CGOUT of the timing control circuit is about 50 or less, based on the fact that the number of output pins CGOUT of the timing control circuit in the current driving chip is relatively small, the number of bonding pads 20 in the second input pad group 212 is smaller than the number of bonding pads 20 in the first input pad group 211 in the embodiment of the present invention. It will be understood by those skilled in the art that, for the arrangement of the bonding pads, the number of output pins CGOUT of the timing control circuit in the driving chip is designed according to the actual display panel structure and the driving control scheme thereof, and therefore, the number of bonding pads in the embodiment is not specifically limited herein.
Fig. 5 is a partial enlarged view of another display panel according to an embodiment of the present invention, referring to fig. 5, alternatively, in this embodiment, the trace 10 of the fan-out area 221 of the flexible circuit board electrically connected to the bonding pad 20 in the first input pad group 211 may be set as the first trace 11, the trace 10 of the fan-out area 221 of the flexible circuit board electrically connected to the bonding pad 20 in the second input pad group 212 is set as the second trace 12, and in the first direction 1, the width L3 of the second trace 12 is greater than the width L4 of the first trace 11.
Wherein the bonding pads 20 in the first input pad group 211 are in an upright position and the bonding pads 20 in the second input pad group 212 are in a recumbent position, it is apparent that the bonding pads 20 in the second input pad group 212 have a larger transverse dimension. Accordingly, when the trace 10 is designed to be electrically connected with the bonding pad 20 in the input pad group 21 in the flexible circuit board fan-out area 221, the width of the trace 10 may be classified according to the lateral width of the input pad 20. Specifically, since the bonding pads 20 in the second input pad group 212 have a larger lateral size, the width of the second wires 12 corresponding thereto can be set to be wider in the lateral direction. That is, the width L3 of the second trace 12 may be designed to be larger than the width L4 of the first trace 11 in the first direction 1. The width L3 of the second trace 12 is set to be greater than the width L4 of the first trace 11, which substantially increases the cross-sectional area of the second trace 12, and based on the inverse proportion of the cross-sectional area to the impedance, the embodiment further reduces the impedance of the second trace 12, which is more beneficial to the transmission of the gate driving signal as described above, and can avoid the excessive delay of the voltage drop during the transmission of the gate driving signal, thereby preventing various types of gate driving signal failure and phenomena affecting the driving process of the pixel circuit of the display panel.
On the basis of the arrangement mode of the input bonding pad group, the structural design of the output bonding pad group is not excessively limited in the embodiment of the invention. For ease of understanding, an example is provided in the embodiments of the present invention for illustration. With continued reference to fig. 4 and 5, the output pad group 22 optionally includes a first output pad group 2201, a second output pad group 2202, and a third output pad group 2203; the first output pad group 2201 is located at a middle region of the output pad group 22 and the bonding pads 20 therein are arranged in the first direction 1; the second output pad group 2202 and the third output pad group 2203 are located on both sides of the first output pad group 2201 in the first direction 1, respectively, and are symmetrical; the bonding pads 20 in the second output pad group 2202 are arranged along the third direction 3, the bonding pads 20 in the third output pad group 2203 are arranged along the fourth direction 4, and the third direction 3 and the fourth direction 4 are respectively the same as the first direction 1 in angle and are both acute angles.
The design of the output pad group 22 in fig. 4 and 5 actually adopts a trapezoidal arrangement or a sunken arrangement, in which the bonding pads 20 in the first output pad group 2201 are sequentially arranged along the upper bottom side of the trapezoid, i.e., along the first direction 1, and the bonding pads 20 in the second output pad group 2202 and the third output pad group 2203 are sequentially arranged along the two sides of the trapezoid, i.e., the third direction 3 and the fourth direction 4, respectively. It will be appreciated that, for convenience in layout and design of the bonding pad, the trapezoid is preferably a symmetrical pattern, i.e. an isosceles trapezoid, and at this time, the third direction 3 and the fourth direction 4 have the same included angle with the first direction 1 respectively and are both acute angles, and the two sides of the trapezoid have the same included angle with the lower bottom edge respectively and are both acute angles.
Fig. 6 is a partial enlarged view of still another display panel provided in an embodiment of the present invention, referring to fig. 6, in another embodiment of the present invention, the second input pad group 212 may be optionally provided to include a first sub-input pad group 2121 and a second sub-input pad group 2122, the bonding pads 20 in the first sub-input pad group 2121 and the second sub-input pad group 2122 are respectively arranged along a first direction 1, and the first sub-input pad group 2121 and the second sub-input pad group 2122 are respectively arranged along a second direction 2; wherein the second direction 2 is perpendicular to the first direction 1.
The second input pad group 212 is divided into the first sub-input pad group 2121 and the second sub-input pad group 2122 here in order to effectively use the space of the bonding region in the second direction 2, i.e., the longitudinal direction. It can be understood that, setting the bonding pads 20 in the second input pad group 212 to lie horizontally occupies a larger space in the lateral direction of the bonding area, and setting the bonding pads 20 in the second input pad group 212 in this embodiment to be arranged in two rows can effectively shorten the length occupied by the bonding pads in the lateral direction, so that the arrangement of the bonding pads is more compact, and is also beneficial to the design layout of the driving chip pins. It should be noted that, the two rows of the bonding pads 20 in the second input pad group 212 are provided as an embodiment of the present invention, and those skilled in the art may select a three-row or four-row arrangement.
With continued reference to the display panel shown in fig. 4-6, the projection of the optional second input pad group 212 along the first direction 1 is located in the projection of the first input pad group 211 along the first direction 1 in an embodiment of the present invention. At this time, the size of the second input pad group 212 in the longitudinal direction is smaller than that of the first input pad group 211 in the longitudinal direction, that is, although the present embodiment adjusts part of the input pads to a recumbent structure, it does not affect the longitudinal size of the entire bonding area, does not increase the longitudinal length of the bonding area, and can ensure realization of a narrow frame.
With continued reference to fig. 6, in this embodiment, the bond pads 20 in the first sub-input pad set 2121 and the second sub-input pad set 2122 may optionally be arranged such that the projected portions in the second direction 2 overlap. In other words, two rows of bonding pads 20 consisting of the first sub-input pad group 2121 and the second sub-input pad group 2122 may be arranged in a staggered manner. At this time, the trace 10 connected to the bonding pads 20 of the upper row may be provided to be drawn out from the space between the bonding pads 20 of the lower row, thereby avoiding overlapping connection of the trace 10 with the bonding pads 20 of the lower row. It should be noted that, in the embodiment of the present invention, when the two rows of bonding pads 20 are arranged in a vertically staggered manner, the upper and lower bonding pads 20 may be arranged in a vertically staggered manner, and the projections in the longitudinal direction may overlap. The design can lead out the wiring 10 of the binding pads 20 on the upper row, and simultaneously can avoid excessively increasing the interval size in the transverse direction, thereby being beneficial to reducing the transverse size of the binding area.
Fig. 7 is a partial enlarged view of a broken line box Aa in fig. 6, and further, referring to fig. 6 and 7, a first sub-input pad group 2121 may be disposed between a second sub-input pad group 2122 and an output pad group 22; in the first direction 1, a distance L1 of an edge of the first sub-input pad group 2121 from an edge of the display panel and a distance L2 of an edge of the second sub-input pad group 2122 from an edge of the display panel satisfy: l1 > L2.
Wherein the number of the bonding pads 20 located in the upper row in the second input pad group 212, that is, the first sub-input pad group 2121 is smaller, and the distance between the edge of the bonding pad and the edge of the display panel is larger; the number of the bonding pads 20 located at the lower row, that is, the second sub-input pad group 2122 is greater, and the edge thereof is spaced apart from the edge of the display panel by a smaller distance. At this time, both sides of the input pad group 21 arranged in the first direction 1, i.e., the row direction, are substantially stepped, i.e., the central line of the bonding pads 20 of the first sub-input pad group 2121 and the second sub-input pad group 2122 at the same side edge forms an acute angle with the first direction 1, and is preferably equal to the lower base angle of the trapezoid of the output pad group 22. At this time, the arrangement direction of the binding pads at the edge of the input pad group 21 is parallel to the arrangement direction of the binding pads at the edge of the output pad group 22, so that the binding pads in the binding region can be compactly arranged, the utilization rate of the binding region is increased, and the frame is reduced to a certain extent. It should be noted that, the arrangement of the upper and lower rows of bonding pads 20 in a staggered arrangement is only one embodiment of the present invention, and those skilled in the art may also design the upper and lower rows of bonding pads to be aligned one by one, which is not limited herein.
Fig. 8 is a partial enlarged view of still another display panel provided in an embodiment of the present invention, referring to fig. 8, in which two bonding pads 20 respectively located in the first sub-input pad group 2121 and the second sub-input pad group 2122 and overlapping in projection in the second direction 2 are optionally electrically connected to traces 10 in the same flexible circuit board fan-out area 221. At this time, the two bonding pads 20 overlapped along the vertical projection are substantially connected in parallel to the same trace 10, and the inventor researches that, in this embodiment, the two bonding pads 20 connected in parallel are utilized to simultaneously transmit the same clock control signal, so that the characteristic of impedance reduction under the parallel condition can be utilized, the transmission quality of the clock control signal is increased, the driving capability of the pixel circuit in the panel is enhanced, and the problem of insufficient charging of the panel is improved. Fig. 9 is a simulation model diagram of a single bonding pad and two bonding pads connected in parallel, provided by an embodiment of the present invention, and table 1 is a simulation result data table of the single bonding pad and the two bonding pads connected in parallel, provided by an embodiment of the present invention, and a specific simulation experiment is described below. It should be noted that, in the simulation model shown in fig. 9, when detecting the transmission clock signal of a single bonding pad, another bonding pad 20 needs to be disconnected, that is, only one bonding pad 20 is kept electrically connected to the capacitor C. As can be seen from comparison of the simulation results of fig. 9 and table 1, when the clock signal is transmitted, the two parallel bonding pads are reduced by 88ns when the clock signal level is raised, and reduced by 72ns when the level is lowered, compared with the single bonding pad. Therefore, in this embodiment, two binding pads are connected in parallel, which can effectively reduce the jump time of the clock signal and reduce the delay of the clock signal, so as to enhance the driving capability and optimize the panel charging capability.
Fig. 10 is a partial enlarged view of still another display panel provided in the embodiment of the present invention, and referring to fig. 10, alternatively, in the first direction 1, the pitches D of any adjacent two bonding pads 20 in the first input pad group 211 and the second input pad group 212 are equal. At this time, although the bonding pads 20 in the first input pad group 211 and the second input pad group 212 are different in size in the lateral direction, by setting the pitches D of the adjacent two bonding pads 20 to be equal, it is possible to ensure that the pitches between the adjacent two wirings 10 correspondingly connected to the flexible circuit board fan-out area 221 are equal.
In addition, in the embodiment of the second input pad group provided by the embodiment of the present invention, in which the first sub-input pad group and the second sub-input pad group are stacked up and down, a pitch between any two adjacent bonding pads in the first sub-input pad group, a pitch between any two adjacent bonding pads in the second sub-input pad group, and a pitch between any two adjacent bonding pads in the first input pad group may be set to be equal.
Based on the arrangement of the input pad group and the output pad group, the shape and the area of the binding pad are also discussed and studied in the embodiment of the invention. In the example of fig. 10, the width-to-length ratio and the size of the bonding pads 20 in the first input pad group 211 and the bonding pads 20 in the second input pad group 212 may be the same. At this time, although the bonding pads 20 in the first and second input pad groups 211 and 212 are in the upright and recumbent structures, respectively, the aspect ratio and the size thereof are equal. For the driving chip, the IC pins are electrically contacted with the corresponding bonding pads through the anisotropic conductive paste during bonding, and the area of the bonding pads 20 determines the number of conductive particles in the conductive paste. At the moment, the bonding pads in the two bonding pad groups are equal in area, so that the contact area of the pins and the bonding pads is consistent, the quantity of conductive particles is the same, and the conductivity between the IC pins and the bonding pads is the same.
Of course, considering that the bonding pads lying horizontally have obvious influence on the arrangement of the bonding areas, those skilled in the art can also select to change the width-to-length ratio of the bonding pads on the basis of the same area of the bonding pads, i.e. the same conductivity. Fig. 11 is a partial enlarged view of still another display panel according to an embodiment of the present invention, and referring to fig. 11, alternatively, the bonding pads 20 in the first input pad group 211 and the bonding pads 20 in the second input pad group 212 have equal areas and different width-to-length ratios. Illustratively, the arrangement of the bond pads 20 in the output pad group 22 is affected to some extent by the bond pads 20 lying in the edge position in the second input pad group 212, based on which one skilled in the art can choose the bond pads 20 in this region to increase in size in the longitudinal direction, decrease in size in the lateral direction, i.e., increase in the height of the lying bond pads, decrease in width. The area occupied by the second input pad group 212 in the lateral direction at this time can be appropriately reduced, facilitating the submerged arrangement of the bonding pads 20 in the both side areas of the output pad group 22.
Fig. 12 is a schematic cross-sectional view along AA' of the display panel shown in fig. 4, referring to fig. 4 and 12, the display panel includes an array substrate 300, the array substrate 300 includes a substrate 310 and a first metal layer 321 and a second metal layer 322 sequentially stacked on the substrate 310; the wires 10 in the fan-out area 221 of the flexible circuit board include a third wire 13, where the third wire 13 is located in the second metal layer 322, and one end of the third wire 13 is used for electrically connecting with a corresponding pin (not shown in the figure) in the flexible circuit board, and the other end is electrically connected with a corresponding binding pad 20 in the input pad group 21; the wires 10 in the fan-out area 222 of the display driver include a fourth wire 14 and a fifth wire 15, the fourth wire 14 is located in the first metal layer 321, the fifth wire 15 is located in the second metal layer 322, and the fourth wire 14 and the fifth wire 15 are electrically connected through a via hole; one end of the fifth wire 15 is electrically connected to a corresponding bonding pad 20 in the output pad group 22, and one end of the fourth wire 14 is electrically connected to a corresponding signal wire (not shown) in the display area 100.
Fig. 13 is a schematic cross-sectional view of another display panel according to an embodiment of the present invention, referring to fig. 13, alternatively, a person skilled in the art may also replace the connection relationship and the film layer of the fourth wire 14 and the fifth wire 15, that is, one end of the fourth wire 14 may be electrically connected to the corresponding bonding pad 20 in the output pad group 22, and one end of the fifth wire 15 may be electrically connected to the corresponding signal wire (not shown in the figure) in the display area 100;
as can be understood by those skilled in the art, the organic light emitting devices of the current organic light emitting display panel are formed on the array substrate 300, and the array substrate 300 is provided with pixel circuits for driving the organic light emitting devices to emit light, thereby realizing the display of pictures through the color matching process of a plurality of colors. The array substrate 300 is composed of a base substrate 310 and a polysilicon layer (not shown), a first metal layer 321, a capacitor metal layer (not shown), a second metal layer 322, and a third metal layer (not shown) sequentially stacked thereon. In order to ensure insulation between the metal layers, an interlayer insulating layer is provided therebetween for isolating the metal layers, and in order to planarize the array substrate 300 in the fabrication of the organic light emitting device, a planarization layer is further formed on the third metal layer. The pixel circuits in the array substrate 300 are composed of wirings, electrode plates, or the like provided in the above-described semiconductor layers or metal layers. Based on the existing array substrate film structure, in the embodiment of the present invention, it is considered that the wiring 10 is prepared in the non-display area fan-out area 220 simultaneously when a certain metal layer is formed. Specifically, the third trace 13 in this embodiment is actually a trace disposed in the fan-out area of the flexible circuit board, and the portion of the trace is responsible for connecting to the input pad of the bonding area. It can be understood that, since the wires in the fan-out area of the flexible circuit board are responsible for providing the power signal, the gate driving signal, the boost signal, the display communication interface signal, the touch communication structure signal, etc. to the driving chip, in order to ensure the transmission quality of the wires, the third wires 13 are synchronously prepared in the second metal layer 322 with lower surface resistance in the embodiment. For the wires arranged in the display driving fan-out area 222, the fourth wire 14 and the fifth wire 15 are arranged in the embodiment, wherein the fourth wire 14 and the fifth wire 15 are respectively arranged in the first metal layer 321 and the second metal layer 322, that is, the wire transfer is realized by the layer jump mode through the via holes, part of the wires can be arranged in the second metal layer 322 with lower surface resistance, and the transmission quality of the signals provided by the driving chip to the surface can be improved. It should be noted that, in the embodiment of the present invention, the arrangement of the wiring positions in the fan-out area 221 and the fan-out area 222 of the flexible circuit board is mainly based on the impedance and the signal transmission quality of the wiring, and in other embodiments of the present invention, those skilled in the art may design and adjust the film position of the wiring according to the angles such as the preparation conditions and the electrical conductivity of the wiring, etc., which is not limited in this embodiment too.
Based on the same inventive concept, the embodiment of the invention also provides a display device, including the display panel of any embodiment of the invention. The display device includes the display panel in the above embodiment, so the display device provided in the embodiment of the present invention also has the beneficial effects described in the above embodiment, and will not be described herein again. The display device may be, for example, an electronic device such as a mobile phone, a computer, a smart wearable device (e.g., a smart watch), and a vehicle-mounted display device, which is not limited in the embodiment of the present invention.
Note that the above is only a preferred embodiment of the present invention and the technical principle applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, and that various obvious changes, rearrangements, combinations, and substitutions can be made by those skilled in the art without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, the invention is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the invention, which is set forth in the following claims.
Claims (16)
1. A display panel, comprising a display area and a non-display area surrounding the display area, wherein the non-display area comprises a fan-out area and a binding area, the fan-out area comprises a plurality of wires, and the binding area comprises a plurality of binding pads;
the binding pad comprises an input pad group and an output pad group, and the fan-out area comprises a flexible circuit board fan-out area and a display driving fan-out area; one end of at least part of wires in the fan-out area of the flexible circuit board is used for being electrically connected with corresponding pins in the flexible circuit board, and the other end of the wires is electrically connected with corresponding binding pads in the input pad group; one end of each wiring in the display driving fan-out area is electrically connected with a corresponding binding pad in the output pad group, and the other end of each wiring is electrically connected with a corresponding signal wire in the display area;
the input bonding pad group is used for inputting signals provided by the flexible circuit board through wires in the fan-out area of the flexible circuit board into the driving chip;
the output bonding pad group is used for outputting corresponding data signals into the display area through the driving chip;
the input bonding pad group comprises a first input bonding pad group and a second input bonding pad group, and binding bonding pads in the first input bonding pad group and the second input bonding pad group are rectangular; the extending direction of the long side of the binding pad in the first input pad group is intersected with the extending direction of the long side of the binding pad in the second input pad group.
2. The display panel of claim 1, wherein the bonding pads in the first input pad group and the second input pad group are sequentially arranged along a first direction, and the bonding pads in the second input pad group are located at two sides of the first input pad group in the first direction, and the bonding pads in the second input pad group are used for electrically connecting with timing control circuit output pins of a driving chip.
3. The display panel of claim 1, wherein the long edges of the bond pads in the second input pad set extend in a first direction and the long edges of the bond pads in the first input pad set extend in a second direction; wherein the second direction is perpendicular to the first direction.
4. The display panel of claim 1, wherein the second input pad group includes a first sub-input pad group and a second sub-input pad group, binding pads in the first sub-input pad group and the second sub-input pad group being arranged along a first direction, respectively, the first sub-input pad group and the second sub-input pad group being arranged along a second direction; wherein the second direction is perpendicular to the first direction.
5. The display panel of claim 4, wherein the bond pads in the first sub-input pad group and the bond pads in the second sub-input pad group partially overlap in a projection of the second direction.
6. The display panel of claim 4, wherein the first set of sub-input pads is located between the second set of sub-input pads and the set of output pads; in the first direction, a distance L1 between an edge of the first sub-input pad group and an edge of the display panel and a distance L2 between an edge of the second sub-input pad group and an edge of the display panel satisfy: l1 > L2.
7. The display panel of claim 4, wherein two bond pads located in the first and second sub-input pad groups, respectively, and overlapping along the projection in the second direction are electrically connected with traces in the same fan-out area of the flexible circuit board.
8. The display panel of claim 1, wherein the trace of the flexible circuit board fan-out area electrically connected to the bond pad in the first input pad set is a first trace, the trace of the flexible circuit board fan-out area electrically connected to the bond pad in the second input pad set is a second trace, and a width of the second trace is greater than a width of the first trace in the first direction.
9. The display panel of claim 1, wherein a pitch of any adjacent two of the bonding pads in the first input pad group and the second input pad group is equal in a first direction.
10. The display panel of claim 1, wherein a projection of the second set of input pads in the first direction is located in a projection of the first set of input pads in the first direction.
11. The display panel of claim 1, wherein the width to length ratio and the size of the bond pads in the first input pad set and the bond pads in the second input pad set are the same.
12. The display panel of claim 1, wherein the bonding pads in the first input pad group and the bonding pads in the second input pad group are equal in area and different in aspect ratio.
13. The display panel of claim 1, wherein a number of bond pads in the second input pad set is less than a number of bond pads in the first input pad set.
14. The display panel according to claim 1, wherein the display panel comprises an array substrate including a substrate and a first metal layer and a second metal layer sequentially stacked on the substrate;
the wires in the fan-out area of the flexible circuit board comprise third wires, the third wires are located in the second metal layer, one end of each third wire is used for being electrically connected with corresponding pins in the flexible circuit board, and the other end of each third wire is electrically connected with corresponding binding pads in the input pad group;
the wires in the display driving fan-out area comprise a fourth wire and a fifth wire, the fourth wire is positioned on the first metal layer, the fifth wire is positioned on the second metal layer, and the fourth wire and the fifth wire are electrically connected through a through hole;
one end of the fourth wire is electrically connected with a corresponding binding pad in the output pad group, and one end of the fifth wire is electrically connected with a corresponding signal wire in the display area; or, one end of the fifth wire is electrically connected with a corresponding bonding pad in the output pad group, and one end of the fourth wire is electrically connected with a corresponding signal wire in the display area.
15. The display panel of claim 1, wherein the output pad group includes a first output pad group, a second output pad group, and a third output pad group; the first output bonding pad group is positioned in the middle area of the output bonding pad group, and binding bonding pads in the first output bonding pad group are arranged along a first direction;
the second output bonding pad group and the third output bonding pad group are respectively positioned at two sides of the first output bonding pad group along the first direction and are symmetrical; the binding pads in the second output pad group are arranged along a third direction, the binding pads in the third output pad group are arranged along a fourth direction, and the included angles of the third direction and the fourth direction are the same as the included angles of the first direction respectively and are all acute angles.
16. A display device comprising a display panel according to any one of claims 1-15.
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| CN113745393B (en) * | 2021-09-06 | 2023-09-29 | 合肥京东方瑞晟科技有限公司 | Display substrate, display panel and display device |
| CN114122051B (en) * | 2021-11-04 | 2023-07-25 | 武汉华星光电半导体显示技术有限公司 | Display panel, manufacturing method thereof and display device |
| CN114755856A (en) * | 2022-03-23 | 2022-07-15 | 江西科莱电子有限公司 | LCD screen structure and electronic equipment comprising same |
| WO2023184396A1 (en) * | 2022-03-31 | 2023-10-05 | 京东方科技集团股份有限公司 | Display panel and manufacturing method therefor, driving assembly, and display apparatus |
| CN114842751B (en) * | 2022-05-18 | 2024-01-02 | 广州华星光电半导体显示技术有限公司 | Display device and mobile terminal |
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