CN114122051B - Display panel, manufacturing method thereof and display device - Google Patents
Display panel, manufacturing method thereof and display device Download PDFInfo
- Publication number
- CN114122051B CN114122051B CN202111299350.9A CN202111299350A CN114122051B CN 114122051 B CN114122051 B CN 114122051B CN 202111299350 A CN202111299350 A CN 202111299350A CN 114122051 B CN114122051 B CN 114122051B
- Authority
- CN
- China
- Prior art keywords
- display panel
- layer
- electrically connected
- fan
- display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000010410 layer Substances 0.000 claims abstract description 146
- 239000002346 layers by function Substances 0.000 claims abstract description 35
- 239000000758 substrate Substances 0.000 claims description 17
- 239000011229 interlayer Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 14
- 230000000694 effects Effects 0.000 abstract description 12
- 239000011810 insulating material Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- -1 silicon nitride compound Chemical class 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The embodiment of the invention discloses a display panel, a manufacturing method thereof and a display device; the display panel comprises an array layer, a light-emitting functional layer positioned on a first side of the array layer and a driving circuit layer positioned on a second side of the array layer, wherein the driving circuit layer comprises a grid driving device and an electric connecting member, the electric connecting member extends to one side far away from the light-emitting functional layer to form a fan-out wire, the electric connecting member is electrically connected with the array layer and the driving circuit layer, and the fan-out wire and the grid driving device are positioned in a display area of the display panel; according to the invention, the electric connection member is extended to one side far away from the luminous functional layer to form the fanout wiring, and the fanout wiring and the grid driving device are arranged in the display area of the display panel, so that the edge frame of the display panel is not occupied, the display panel for displaying without frame is realized, the display screen occupation ratio is improved, the display without frame for spliced display is facilitated, seamless splicing is facilitated, and the display effect is enhanced.
Description
Technical Field
The invention relates to the field of display, in particular to a display panel, a manufacturing method thereof and a display device.
Background
In recent years, display panels have been developed with a trend of displaying without frames, particularly better display as a tiled display, and are favored by users, and the display panels without frames on the market are only very narrow in the frame of the display panel, but are not completely borderless display panels in the true sense.
Therefore, a display panel, a manufacturing method thereof and a display device are needed to solve the above-mentioned problems.
Disclosure of Invention
The invention provides a display panel, a manufacturing method thereof and a display device, and the display panel can realize real borderless display.
The present invention provides a display panel, comprising:
an array layer;
a light emitting functional layer located on a first side of the array layer;
the driving circuit layer is positioned on the second side of the array layer and comprises a grid driving device and an electric connecting member, the electric connecting member extends to one side far away from the light-emitting functional layer to form a fanout wire, and the electric connecting member is electrically connected with the array layer and the driving circuit layer;
the fan-out wiring and the grid driving device are located in a display area of the display panel.
Preferably, the light emitting functional layer includes a plurality of light emitting units; the array layer comprises a plurality of first source-drain units and a plurality of first connecting units, and the first connecting units are electrically connected with the light-emitting units and the first source-drain units; the driving circuit layer comprises a plurality of second source-drain units and a plurality of second connecting units, and the second connecting units are electrically connected with the first source-drain units, the second source-drain units and the electric connecting members.
Preferably, the display panel further includes a plurality of binding terminals electrically connected with the fan-out trace and a flexible circuit board electrically connected with the binding terminals.
Preferably, the display panel further comprises an integrated circuit unit and a flexible circuit board, wherein the integrated circuit unit is electrically connected with the fan-out wiring, and the flexible circuit board is electrically connected with the fan-out wiring through the integrated circuit unit; or the display panel further comprises an integrated circuit unit, a flexible circuit board and a flip chip film, wherein the flip chip film is electrically connected with the fan-out wiring, and the flexible circuit board and the integrated circuit unit are electrically connected with the flip chip film.
Preferably, the fan-out wiring comprises a first wiring unit arranged at one end of the display panel and a second wiring unit arranged at the other end of the display panel, and the first wiring unit, the second wiring unit and the flexible circuit board are electrically connected.
Preferably, the display panel further includes a test trace disposed on the same layer as the fan-out trace, and the test trace is electrically connected with the array layer or/and the driving circuit layer.
Preferably, the driving circuit layer further includes an interlayer insulating layer between the electrical connection member and the fan-out trace; the interlayer insulating layer comprises a plurality of first through holes, and the fan-out wiring is electrically connected with the electric connection component through the first through holes.
The invention also provides a manufacturing method of the display panel, which comprises the following steps:
providing a substrate;
forming a light emitting functional layer including a plurality of light emitting cells on the substrate;
forming an array layer electrically connected with the light emitting unit on one side of the light emitting functional layer, which faces away from the light emitting unit;
forming a driving circuit layer including a gate driving device and an electrical connection member on the array layer;
forming fan-out wirings electrically connected to the electrical connection members on the driving circuit layer;
the fan-out wiring and the grid driving device are located in a display area of the display panel.
Preferably, the step of forming the fan-out wiring electrically connected to the electrical connection member on the driving circuit layer includes: forming a plurality of binding terminals on the driving circuit layer; forming fan-out traces on the drive circuit layer electrically connected to the electrical connection members and the bonding terminals; and forming a flexible circuit board electrically connected with the binding terminals on the binding terminals.
The invention also provides a display device which comprises at least two spliced screens, wherein the spliced screens comprise any display panel.
The invention has the beneficial effects that: according to the invention, the electric connection member is extended to one side far away from the luminous functional layer to form the fanout wiring, and the fanout wiring and the grid driving device are arranged in the display area of the display panel, so that the edge frame of the display panel is not occupied, the display panel for displaying without frame is realized, the display screen occupation ratio is improved, the display without frame for spliced display is facilitated, seamless splicing is facilitated, and the display effect is enhanced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a first structure of a display panel according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a second structure of a display panel according to an embodiment of the present invention;
fig. 3 is a schematic top view of a third structure of a display panel according to an embodiment of the present invention;
fig. 4 is a schematic top view of a fourth structure of a display panel according to an embodiment of the present invention;
fig. 5 is a schematic top view of a fifth structure of a display panel according to an embodiment of the present invention;
fig. 6 is a schematic top view of a sixth structure of a display panel according to an embodiment of the present invention;
fig. 7 is a schematic top view of a seventh structure of a display panel according to an embodiment of the present invention;
FIG. 8 is a flowchart illustrating steps of a method for fabricating a display panel according to an embodiment of the present invention;
fig. 9 is a schematic structural diagram of a display device according to an embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention. Furthermore, it should be understood that the detailed description is presented herein for purposes of illustration and description only, and is not intended to limit the invention. In the present invention, unless otherwise indicated, terms of orientation such as "upper" and "lower" are used to generally refer to the upper and lower positions of the device in actual use or operation, and specifically the orientation of the drawing figures; while "inner" and "outer" are for the outline of the device.
In recent years, display panels have been developed with a trend of displaying without frames, particularly better display as a tiled display, and are favored by users, and the display panels without frames on the market are only very narrow in the frame of the display panel, but are not completely borderless display panels in the true sense.
Referring to fig. 1 to 7, an embodiment of the present invention provides a display panel 100, including:
an array layer 200;
a light emitting functional layer 300 located on a first side of the array layer 200;
a driving circuit layer 400 located at a second side of the array layer 200, the driving circuit layer 400 including a gate driving device and an electrical connection member 410, the electrical connection member 410 extending to a side away from the light emitting function layer 300 to form a fanout line 420, the electrical connection member 410 being electrically connected with the array layer 200 and the driving circuit layer 400;
wherein the fanout wiring 420 and the gate driving device are located in the display area a of the display panel 100.
According to the invention, the electric connection member is extended to one side far away from the luminous functional layer to form the fanout wiring, and the fanout wiring and the grid driving device are arranged in the display area of the display panel, so that the edge frame of the display panel is not occupied, the display panel for displaying without frame is realized, the display screen occupation ratio is improved, the display without frame for spliced display is facilitated, seamless splicing is facilitated, and the display effect is enhanced.
The technical scheme of the present invention will now be described with reference to specific embodiments.
In this embodiment, referring specifically to fig. 1, the display panel 100 includes a substrate 101, a light emitting functional layer 300 disposed on the substrate 101, an array layer 200 disposed on the light emitting functional layer 300, and a driving circuit layer 400 disposed on the array layer 200.
In this embodiment, referring specifically to fig. 1, the light emitting functional layer 300 is located on the first side of the array layer 200; and a driving circuit layer 400 positioned at a second side of the array layer 200.
In some embodiments, referring to fig. 1 specifically, the light emitting functional layer 300 includes a plurality of light emitting units 310, the light emitting units 310 include a first electrode 321 and a second electrode 322, the first electrode 321 and the second electrode 322 may be a positive electrode and a negative electrode, respectively, the light emitting functional layer 300 further includes a common electrode line 330 electrically connected to the first electrode 321 or the second electrode 322, the common electrode line 330 may be a VSS electrode, and the VSS electrode may be electrically connected to the negative electrode of the light emitting unit 310.
In some embodiments, referring to fig. 1 and 2, the array layer 200 includes a plurality of first active units 240, a first gate unit 230 corresponding to the first active units 240, a first source-drain unit 210, and a first connection unit 220. The first connection unit 220 electrically connects the light emitting unit 310 with the first source/drain unit 210, and the first connection unit 220 may be connected to the positive electrode of the light emitting unit 310.
In some embodiments, referring to fig. 1 specifically, the light-emitting functional layer 300 further includes an auxiliary electrode 323 connecting the first connection unit 220 and the first electrode 321, where the second electrode 322 is electrically connected to the common electrode line 330, and the first electrode 321 is electrically connected to the first connection unit 220, which is merely an example and can be replaced correspondingly.
In some embodiments, referring to fig. 1 and 2, the driving circuit layer 400 includes a plurality of second active units 460, a second gate unit 450 corresponding to the second active units 460, a second source-drain unit 430, and a second connection unit 440. The second connection unit 440 electrically connects the first source-drain unit 210 with the second source-drain unit 430.
In some embodiments, referring specifically to fig. 1, the driving circuit layer 400 further includes a plurality of gate driving devices, where the gate driving devices are represented by a gate driving device region 401.
In some embodiments, referring to fig. 1 specifically, the driving circuit layer 400 further includes an electrical connection member 410 electrically connected to the second source-drain unit 430 and/or the second connection unit 440, the electrical connection member 410 extends to a side away from the light emitting function layer 300 to form a fanout line 420, and the electrical connection member 410 is electrically connected to the array layer 200 and the driving circuit layer 400. The fan-out trace 420 and the gate driving device are located in the display area a of the display panel 100.
In the figure, the fanout wire 420 is represented by a fanout wire area 430, the gate driving device is represented by a gate driving device area 401, and the dotted line is the light propagation direction of the light emitting unit 310. The fanout wiring 420 and the grid driving device are arranged in the display area A of the display panel 100, so that the edge frame of the display panel 100 is not occupied, the display panel 100 with real borderless display is realized, the display screen occupation ratio is improved, the borderless display with spliced display is facilitated, the seamless splicing is convenient, and the display effect is enhanced.
In some embodiments, referring specifically to fig. 3, the display panel 100 includes a display area a and a non-display area located at the periphery of the display area a, and since the fan-out wire 420 and the gate driving device are located in the display area a, the area of the non-display area can be further reduced, so as to realize a borderless display.
In some embodiments, the non-display area may be only a tolerance film layer or a film layer for blocking water and oxygen, which is only used as an example and not particularly limited herein.
In some embodiments, referring specifically to fig. 2 to 4, the display panel 100 further includes a plurality of binding terminals 510 electrically connected to the fan-out traces 420 and a flexible circuit board 500 electrically connected to the binding terminals 510. The flexible circuit board 500 may be an FPC, and the advantage of this structure is that the binding times are small, and the circuit control conduction can be achieved only by binding the flexible circuit board 500 and the binding terminals 510 once.
In some embodiments, if the fan-out wire 420 is directly bonded to the flexible circuit board 500 after being connected to the bonding terminals 510, the number of the bonding terminals 510 required may be large.
Referring to fig. 5, the display panel 100 further includes an integrated circuit unit 600 and a flexible circuit board 500, wherein the integrated circuit unit 600 is electrically connected to the fan-out trace 420, and the flexible circuit board 500 is electrically connected to the fan-out trace 420 through the integrated circuit unit 600.
The fan-out wiring 420 is directly electrically connected with the integrated circuit unit 600, the integrated circuit unit 600 (IC) is bound with the flexible circuit board 500, a large number of binding terminals 510 are not needed any more, and only two binding operations are needed, so that the fan-out wiring 420 and the flexible circuit board 500 can be bonded and conducted on the back surface of the display panel 100, circuit control and conduction can be realized, the front frame of the display panel 100 is not occupied, the display panel 100 with real frame-free display is realized, the display screen occupation ratio is improved, the frame-free display with spliced display is facilitated, seamless splicing is convenient, and the display effect is enhanced.
In some embodiments, the fan-out traces 420 directly connect with the integrated circuit unit 600 requires a more complex process due to the smaller size of the integrated circuit unit 600.
Referring to fig. 6, the display panel 100 further includes an integrated circuit unit 600, a flexible circuit board 500, and a flip chip film 700, wherein the flip chip film 700 is electrically connected to the fan-out wire 420, and the flexible circuit board 500 and the integrated circuit unit 600 are electrically connected to the flip chip film 700.
The size of the flip chip film 700 (COF) can be set more conveniently, the fan-out wiring 420 is connected with the flip chip film 700, the integrated circuit unit 600 and the flexible circuit board 500 are electrically connected with the flip chip film 700, the flip chip film 700 is used as a middle unit, so that circuit control conduction is realized conveniently, the front side frame of the display panel 100 is not occupied, the display panel 100 with real borderless display is realized, the display screen occupation ratio is improved, the borderless display with spliced display is facilitated, the seamless splicing is convenient, and the display effect is enhanced.
In some embodiments, if the fan-out wiring 420 is only disposed at one end of the display panel 100, the wiring is more complex, the difficulty of the wiring process is higher, and meanwhile, the longer the wiring, the more obvious the voltage drop on the wiring, the larger the voltage drop difference at different positions of the display panel 100, which also causes non-uniformity of the display brightness.
Referring to fig. 7, the fan-out trace 420 includes a first trace unit 421 disposed at one end of the display panel 100 and a second trace unit 422 disposed at the other end of the display panel 100, and the first trace unit 421 and the second trace unit 422 are electrically connected to the flexible circuit board 500.
The fan-out wire 420 is divided into the first wire unit 421 and the second wire unit 422, the first wire unit 421 and the second wire unit 422 are arranged at two opposite ends of the display panel 100, the wires are divided into two parts for convenience in description, wires close to the first end are connected with the first wire unit 421 by utilizing a nearby principle, wires close to the second end are connected with the second wire unit 422 to be fan-out, and the flexible circuit board 500 arranged in the middle area of the display panel 100 reduces the difficulty of a wire arranging process, and meanwhile, reduces the wire arranging length, reduces the pressure drop and improves the problem of uneven display brightness.
In some embodiments, the display panel 100 further includes a test trace disposed on the same layer as the fanout trace 420, and the test trace is electrically connected to the array layer 200 and/or the driving circuit layer 400.
The setting area of the test trace may correspond to the setting area of the fan-out trace 420, and the test trace may detect the trace in the array layer 200, may detect the trace in the driving circuit layer 400, and may detect whether the light emitting unit 310 is good or bad, which only needs to be electrically connected with different detection objects in advance when the display panel 100 is manufactured.
In some embodiments, referring specifically to fig. 1, the driving circuit layer 400 further includes an interlayer insulating layer 810 between the electrical connection member 410 and the fan-out trace 420; the interlayer insulating layer 810 includes a plurality of first vias 811, and the fan-out trace 420 is electrically connected to the electrical connection member 410 through the first vias 811.
The electrical connection member 410 may serve as a terminal for an electric wire requiring a fan-out wire, and the fan-out wire 420 may be electrically connected to the electrical connection member 410 by forming a first via 811 in the interlayer insulating layer 810, thereby fanning out the electric wire.
In some embodiments, the electrical connection member 410 may also be electrically connected to the first gate unit 230 of the array layer 200, fanning out the first gate unit 230.
In some embodiments, when the fan-out wires 420 include multiple types of wires, the fan-out wires may be categorized into a first type of wires or a second type of wires, where the first type of wires is different from the second type of wires connected to the first type of wires, and the flexible circuit board 500 includes at least a first type of circuit board unit and a second type of circuit board unit, where the first type of wires is electrically connected to the first type of circuit board unit, and the second type of wires is electrically connected to the second type of circuit board unit. The fan-out trace 420 may further include a third type of trace, a fourth type of trace, and so on, where the flexible circuit board 500 only includes a third type of circuit board unit, a fourth type of circuit board unit, and so on.
In some embodiments, referring specifically to fig. 1 and 2, the first gate unit 230 may be a single gate or a double gate, and the structure may be adapted according to different requirements.
In some embodiments, referring specifically to fig. 1 and 2, the second gate unit 450 may be a single gate or a double gate, and the structure may be adapted according to different requirements.
In some embodiments, the display panel 100 further includes a substrate 101 located at a side of the light emitting function layer 300 remote from the array layer 200, and a first organic insulating layer 821 located between the light emitting function layer 300 and the substrate 101.
In some embodiments, the substrate 101 may be a glass substrate.
In some embodiments, the light emitting functional layer 300 further includes a second organic insulating layer 822 between the light emitting cells 310 and the common electrode line 330.
In some embodiments, referring to fig. 1 and 2 specifically, the display panel 100 further includes a third organic insulating layer 823 between the light-emitting functional layer 300 and the array layer 200, a first inorganic insulating layer 831 on the third organic insulating layer 823, a fourth organic insulating layer 824 between the first source/drain unit 210 and the driving layer, and a second inorganic insulating layer 832.
In some embodiments, the materials of the first organic insulating layer 821, the second organic insulating layer 822, the third organic insulating layer 823, the fourth organic insulating layer 824, and the interlayer insulating layer 810 may be organic insulating materials, and the organic insulating materials may be polyimide, which are only examples and are not particularly limited herein.
In some embodiments, the materials of the first inorganic insulating layer 831 and the second inorganic insulating layer 832 are inorganic insulating materials, and the inorganic insulating materials may be any one or more of a silicon nitride compound, a silicon oxide compound, and a silicon oxynitride compound, which are only used as examples herein, and are not limited in particular.
In some embodiments, the light emitting unit 310 may be a Mini LED or a Micro LED.
According to the invention, the electric connection member is extended to one side far away from the luminous functional layer to form the fanout wiring, and the fanout wiring and the grid driving device are arranged in the display area of the display panel, so that the edge frame of the display panel is not occupied, the display panel for displaying without frame is realized, the display screen occupation ratio is improved, the display without frame for spliced display is facilitated, seamless splicing is facilitated, and the display effect is enhanced.
Referring to fig. 8, an embodiment of the present invention further provides a method for manufacturing a display panel 100, including:
s100, providing a substrate 101;
s200, forming a light emitting function layer 300 including a plurality of light emitting cells 310 on the substrate 101;
s300, forming an array layer 200 electrically connected with the light emitting unit 310 on the side, facing away from the light emitting side, of the light emitting functional layer 300;
s400, forming a driving circuit layer 400 including a gate driving device and an electrical connection member 410 on the array layer 200;
s500, forming fan-out traces 420 electrically connected to the electrical connection members 410 on the driving circuit layer 400;
wherein the fanout wiring 420 and the gate driving device are located in the display area a of the display panel 100.
According to the invention, the electric connection member is extended to one side far away from the luminous functional layer to form the fanout wiring, and the fanout wiring and the grid driving device are arranged in the display area of the display panel, so that the edge frame of the display panel is not occupied, the display panel for displaying without frame is realized, the display screen occupation ratio is improved, the display without frame for spliced display is facilitated, seamless splicing is facilitated, and the display effect is enhanced.
The technical scheme of the present invention will now be described with reference to specific embodiments.
S100, providing a substrate 101.
In some embodiments, the substrate 101 may be a glass substrate.
S200, a light emitting functional layer 300 including a plurality of light emitting cells 310 is formed on the substrate 101.
In some embodiments, the light emitting unit 310 may be a Mini LED or a Micro LED.
In some embodiments, step S200 includes:
s210, forming a plurality of light emitting units 310 on the substrate 101 using a bulk transfer process.
In some embodiments, the light emitting units 310 may be detected and repaired after the plurality of light emitting units 310 are formed.
S220, forming a second organic insulating layer 822 on the light emitting unit 310.
S230, forming a plurality of openings on the second organic insulating layer 822 to expose the electrodes of the light emitting units 310.
S240, a metal film layer is formed on the second organic insulating layer 822 by using a metal process to form a common electrode and an electrode for conducting the light emitting unit 310.
In some embodiments, referring to fig. 1 specifically, the light emitting functional layer 300 includes a plurality of light emitting units 310, the light emitting units 310 include a first electrode 321 and a second electrode 322, the first electrode 321 and the second electrode 322 may be a positive electrode and a negative electrode, respectively, the light emitting functional layer 300 further includes a common electrode line 330 electrically connected to the first electrode 321 or the second electrode 322, the common electrode line 330 may be a VSS electrode, and the VSS electrode may be electrically connected to the negative electrode of the light emitting unit 310.
S250, a third organic insulating layer 823 and a first inorganic insulating layer 831 are formed on the common electrode.
And S300, forming an array layer 200 electrically connected with the light emitting unit 310 on the light emitting function layer 300 side facing away from the light emitting side.
In some embodiments, step S300 includes:
s310, forming a plurality of first active units 240, a plurality of first gate units 230, a plurality of first source/drain units 210, a plurality of first connection units 220, and insulating materials between different kinds of electrical components on the first inorganic insulating layer 831.
In some embodiments, referring to fig. 1 and fig. 2 specifically, when forming the first connection unit 220, a plurality of openings are formed on the insulating material, the first inorganic insulating layer 831, and the third organic insulating layer 823, so that the positive electrode of the light emitting unit 310 is exposed, or the connection terminal of the positive electrode is exposed, and the first connection unit 220 and the first source/drain unit 210 are arranged in the same layer.
S320, a fourth organic insulating layer 824 and a second inorganic insulating layer 832 are formed on the first source/drain unit 210 and the first connection unit 220.
S400, a driving circuit layer 400 including a gate driving device and an electrical connection member 410 is formed on the array layer 200.
In some embodiments, step S400 includes:
s410, a plurality of second active units 460, a plurality of second gate units 450, a plurality of second source/drain units 430, a plurality of second connection units 440, a plurality of electrical connection members 410, and insulating materials between different kinds of electrical components are formed on the second inorganic insulating layer 832.
In some embodiments, referring specifically to fig. 1 and 2, the gate driving device includes the second source-drain unit 430, the second gate unit 450, and the second active unit 460.
In some embodiments, referring to fig. 1 and fig. 2, in forming the second connection unit 440, a plurality of openings are formed in the insulating material and the second inorganic insulating layer 832 and the fourth organic insulating layer 824, so that the first source/drain unit 210 is exposed, and the second connection unit 440 and the electrical connection member 410 are disposed on the same layer as the second source/drain unit 430.
S420, an interlayer insulating layer 810 is formed on the second connection unit 440, the electrical connection member 410, and the second source-drain unit 430.
S500, fan-out traces 420 electrically connected to the electrical connection members 410 are formed on the driving circuit layer 400.
In some embodiments, step S500 includes:
s510, forming a plurality of openings on the interlayer insulating layer 810 to expose the electrical connection member 410.
S520, a fanout line 420 is formed on the interlayer insulating layer 810.
In some embodiments, the fan-out trace 420 is electrically connected with the electrical connection member 410.
In some embodiments, the fan-out trace 420 and the gate driving device are located within the display area a of the display panel 100.
In some embodiments, step S520 may include:
s521a, a plurality of bonding terminals 510 are formed on the interlayer insulating layer 810.
S522a, a plurality of fan-out traces 420 are formed on the interlayer insulating layer 810.
S523a, a flexible circuit board 500 is formed on the binding terminal 510.
Referring to fig. 2 to 4, the display panel 100 further includes a plurality of binding terminals 510 electrically connected to the fan-out traces 420, and a flexible circuit board 500 electrically connected to the binding terminals 510. The flexible circuit board 500 may be an FPC, and the advantage of this structure is that the binding times are small, and the circuit control conduction can be achieved only by binding the flexible circuit board 500 and the binding terminals 510 once.
In some embodiments, step S520 may include:
s521b, a plurality of fan-out traces 420 are formed on the interlayer insulating layer 810.
S522b, an integrated circuit unit 600 is formed on the fanout wire 420.
S523b, a flexible circuit board 500 is formed on the integrated circuit unit 600.
In some embodiments, if the fan-out wire 420 is directly bonded to the flexible circuit board 500 after being connected to the bonding terminals 510, the number of the bonding terminals 510 required may be large.
Referring to fig. 5, the display panel 100 further includes an integrated circuit unit 600 and a flexible circuit board 500, wherein the integrated circuit unit 600 is electrically connected to the fan-out trace 420, and the flexible circuit board 500 is electrically connected to the fan-out trace 420 through the integrated circuit unit 600.
The fan-out wiring 420 is directly electrically connected with the integrated circuit unit 600, the integrated circuit unit 600 (IC) is bound with the flexible circuit board 500, a large number of binding terminals 510 are not needed any more, and only two binding operations are needed, so that the fan-out wiring 420 and the flexible circuit board 500 can be bonded and conducted on the back surface of the display panel 100, circuit control and conduction can be realized, the front frame of the display panel 100 is not occupied, the display panel 100 with real frame-free display is realized, the display screen occupation ratio is improved, the frame-free display with spliced display is facilitated, seamless splicing is convenient, and the display effect is enhanced.
In some embodiments, step S520 may include:
s521c, a plurality of fan-out traces 420 are formed on the interlayer insulating layer 810.
S522c, a flip chip film 700 is formed on the fan-out line 420.
S523c, an integrated circuit unit 600 and a flexible circuit board 500 are formed on the flip-chip film 700.
In some embodiments, the fan-out traces 420 directly connect with the integrated circuit unit 600 requires a more complex process due to the smaller size of the integrated circuit unit 600.
Referring to fig. 6, the display panel 100 further includes an integrated circuit unit 600, a flexible circuit board 500, and a flip chip film 700, wherein the flip chip film 700 is electrically connected to the fan-out wire 420, and the flexible circuit board 500 and the integrated circuit unit 600 are electrically connected to the flip chip film 700.
The size of the flip chip film 700 (COF) can be set more conveniently, the fan-out wiring 420 is connected with the flip chip film 700, the integrated circuit unit 600 and the flexible circuit board 500 are electrically connected with the flip chip film 700, the flip chip film 700 is used as a middle unit, so that circuit control conduction is realized conveniently, the front side frame of the display panel 100 is not occupied, the display panel 100 with real borderless display is realized, the display screen occupation ratio is improved, the borderless display with spliced display is facilitated, the seamless splicing is convenient, and the display effect is enhanced.
In some embodiments, the method for manufacturing the display panel 100 further includes:
in some embodiments, if the fan-out wiring 420 is only disposed at one end of the display panel 100, the wiring is more complex, the difficulty of the wiring process is higher, and meanwhile, the longer the wiring, the more obvious the voltage drop on the wiring, the larger the voltage drop difference at different positions of the display panel 100, which also causes non-uniformity of the display brightness.
Referring to fig. 7, the fan-out trace 420 includes a first trace unit 421 disposed at one end of the display panel 100 and a second trace unit 422 disposed at the other end of the display panel 100, and the first trace unit 421 and the second trace unit 422 are electrically connected to the flexible circuit board 500.
The fan-out wire 420 is divided into the first wire unit 421 and the second wire unit 422, the first wire unit 421 and the second wire unit 422 are arranged at two opposite ends of the display panel 100, the wires are divided into two parts for convenience in description, wires close to the first end are connected with the first wire unit 421 by utilizing a nearby principle, wires close to the second end are connected with the second wire unit 422 to be fan-out, and the flexible circuit board 500 arranged in the middle area of the display panel 100 reduces the difficulty of a wire arranging process, and meanwhile, reduces the wire arranging length, reduces the pressure drop and improves the problem of uneven display brightness.
In some embodiments, the display panel 100 further includes a test trace disposed on the same layer as the fanout trace 420, and the test trace is electrically connected to the array layer 200 and/or the driving circuit layer 400.
The setting area of the test trace may correspond to the setting area of the fan-out trace 420, and the test trace may detect the trace in the array layer 200, may detect the trace in the driving circuit layer 400, and may detect whether the light emitting unit 310 is good or bad, which only needs to be electrically connected with different detection objects in advance when the display panel 100 is manufactured.
According to the invention, the electric connection member is extended to one side far away from the luminous functional layer to form the fanout wiring, and the fanout wiring and the grid driving device are arranged in the display area of the display panel, so that the edge frame of the display panel is not occupied, the display panel for displaying without frame is realized, the display screen occupation ratio is improved, the display without frame for spliced display is facilitated, seamless splicing is facilitated, and the display effect is enhanced.
Referring to fig. 9, an embodiment of the present invention further provides a display apparatus 10, which includes at least two spliced screens 20, where the spliced screens 20 include a display panel 100 as any one of the above.
The specific structure of the display panel 100 is shown in fig. 1 to 7 of any of the embodiments of the display panel 100, and will not be described herein.
In this embodiment, the spliced screen 20 may further include a middle frame, a frame glue, etc., which is not limited herein.
The embodiment of the invention discloses a display panel, a manufacturing method thereof and a display device; the display panel comprises an array layer, a light-emitting functional layer positioned on a first side of the array layer and a driving circuit layer positioned on a second side of the array layer, wherein the driving circuit layer comprises a grid driving device and an electric connecting member, the electric connecting member extends to one side far away from the light-emitting functional layer to form a fan-out wire, the electric connecting member is electrically connected with the array layer and the driving circuit layer, and the fan-out wire and the grid driving device are positioned in a display area of the display panel; according to the invention, the electric connection member is extended to one side far away from the luminous functional layer to form the fanout wiring, and the fanout wiring and the grid driving device are arranged in the display area of the display panel, so that the edge frame of the display panel is not occupied, the display panel for displaying without frame is realized, the display screen occupation ratio is improved, the display without frame for spliced display is facilitated, seamless splicing is facilitated, and the display effect is enhanced.
The display panel, the manufacturing method thereof and the display device provided by the embodiment of the invention are described in detail, and specific examples are applied to the description of the principle and the implementation mode of the invention, and the description of the above examples is only used for helping to understand the method and the core idea of the invention; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present invention, the present description should not be construed as limiting the present invention.
Claims (9)
1. A display panel, comprising:
an array layer;
a light emitting functional layer located on a first side of the array layer;
the driving circuit layer is positioned on the second side of the array layer and comprises a grid driving device and an electric connecting member, the electric connecting member extends to one side far away from the light-emitting functional layer to form a fanout wire, and the electric connecting member is electrically connected with the array layer and the driving circuit layer;
the fan-out wiring and the grid driving device are positioned in a display area of the display panel; the light-emitting functional layer comprises a plurality of light-emitting units, the light-emitting units comprise first electrodes and second electrodes, the array layer comprises a plurality of first source drain units and a plurality of first connecting units, the first connecting units are electrically connected with the light-emitting units and the first source drain units, the driving circuit layer comprises a plurality of second source drain units and a plurality of second connecting units, the second connecting units are electrically connected with the first source drain units, the second source drain units and the electric connecting members, the light-emitting functional layer further comprises a public electrode wire electrically connected with the second electrodes, an auxiliary electrode connected with the first connecting units and the first electrodes, the public electrode wire and the auxiliary electrode are arranged on the same surface, and the auxiliary electrode is positioned between the first source drain units and the second source drain units.
2. The display panel of claim 1, further comprising a plurality of binding terminals electrically connected to the fan-out traces and a flexible circuit board electrically connected to the binding terminals.
3. The display panel of claim 1, further comprising an integrated circuit unit electrically connected to the fan-out trace and a flexible circuit board electrically connected to the fan-out trace through the integrated circuit unit; or alternatively
The display panel further comprises an integrated circuit unit, a flexible circuit board and a flip chip film, wherein the flip chip film is electrically connected with the fan-out wiring, and the flexible circuit board and the integrated circuit unit are electrically connected with the flip chip film.
4. A display panel according to claim 2 or 3, wherein the fan-out trace comprises a first trace unit arranged at one end of the display panel and a second trace unit arranged at the other end of the display panel, and the first trace unit and the second trace unit are electrically connected with the flexible circuit board.
5. A display panel according to claim 2 or 3, further comprising test traces arranged in a same layer as the fan-out traces, the test traces being electrically connected to the array layer or/and the drive circuit layer.
6. The display panel of claim 1, wherein the driving circuit layer further comprises an interlayer insulating layer between the electrical connection member and the fan-out trace;
the interlayer insulating layer comprises a plurality of first through holes, and the fan-out wiring is electrically connected with the electric connection component through the first through holes.
7. A method for manufacturing a display panel, wherein the display panel according to any one of claims 1 to 6 is manufactured, and the method for manufacturing the display panel comprises:
providing a substrate;
forming a light emitting functional layer including a plurality of light emitting cells on the substrate;
forming an array layer electrically connected with the light emitting unit on one side of the light emitting functional layer, which faces away from the light emitting unit;
forming a driving circuit layer including a gate driving device and an electrical connection member on the array layer;
forming fan-out wirings electrically connected to the electrical connection members on the driving circuit layer;
the fan-out wiring and the grid driving device are located in a display area of the display panel.
8. The method of manufacturing a display panel according to claim 7, wherein the step of forming the fanout wiring electrically connected to the electrical connection member on the driving circuit layer includes:
forming a plurality of binding terminals on the driving circuit layer;
forming fan-out traces on the drive circuit layer electrically connected to the electrical connection members and the bonding terminals;
and forming a flexible circuit board electrically connected with the binding terminals on the binding terminals.
9. A display device comprising at least two tiled screens, the tiled screens comprising the display panel of any of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111299350.9A CN114122051B (en) | 2021-11-04 | 2021-11-04 | Display panel, manufacturing method thereof and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111299350.9A CN114122051B (en) | 2021-11-04 | 2021-11-04 | Display panel, manufacturing method thereof and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114122051A CN114122051A (en) | 2022-03-01 |
| CN114122051B true CN114122051B (en) | 2023-07-25 |
Family
ID=80380496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111299350.9A Active CN114122051B (en) | 2021-11-04 | 2021-11-04 | Display panel, manufacturing method thereof and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114122051B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230131316A (en) * | 2022-03-03 | 2023-09-13 | 삼성디스플레이 주식회사 | Display device and tiled display device including the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107561799A (en) * | 2017-08-25 | 2018-01-09 | 厦门天马微电子有限公司 | A kind of array base palte, display panel and display device |
| CN113299218A (en) * | 2021-06-01 | 2021-08-24 | 厦门天马微电子有限公司 | Display panel and display device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN209201116U (en) * | 2018-11-29 | 2019-08-02 | 福建华佳彩有限公司 | A kind of screen structure and its electronic equipment comprehensively |
| CN110333633B (en) * | 2019-05-29 | 2022-01-25 | 重庆惠科金渝光电科技有限公司 | Array substrate and display panel |
| CN111430415B (en) * | 2020-03-31 | 2023-01-10 | 合肥京东方卓印科技有限公司 | Display panel and display device |
| CN111768700B (en) * | 2020-06-22 | 2021-10-08 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| CN112599536A (en) * | 2020-12-10 | 2021-04-02 | 深圳市华星光电半导体显示技术有限公司 | Display panel, manufacturing method thereof and spliced display panel |
| CN113193013B (en) * | 2021-04-14 | 2022-08-23 | 武汉华星光电半导体显示技术有限公司 | Array substrate, display panel and display device |
| CN113539114B (en) * | 2021-07-30 | 2023-04-21 | 惠科股份有限公司 | Flip chip film and display device |
-
2021
- 2021-11-04 CN CN202111299350.9A patent/CN114122051B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107561799A (en) * | 2017-08-25 | 2018-01-09 | 厦门天马微电子有限公司 | A kind of array base palte, display panel and display device |
| CN113299218A (en) * | 2021-06-01 | 2021-08-24 | 厦门天马微电子有限公司 | Display panel and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114122051A (en) | 2022-03-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7507592B2 (en) | Bonding pad structure for a display device and fabrication method thereof | |
| WO2019085195A1 (en) | Spliced display device | |
| CN111540294B (en) | Display panel, crack detection method thereof and display device | |
| CN111399290B (en) | Display panel and display device | |
| CN100464236C (en) | Structure of semiconductor chip and display device using the same | |
| WO2024040877A1 (en) | Splicing display panel, splicing method therefor, and display device | |
| CN112309268A (en) | Display device and preparation method thereof | |
| US20030117543A1 (en) | Structure of a display device | |
| CN109448617A (en) | Display panel and display device | |
| CN110277365A (en) | Electronic device and splicing electronic system | |
| CN109872637A (en) | A kind of display panel and preparation method thereof, display device | |
| CN114122051B (en) | Display panel, manufacturing method thereof and display device | |
| CN112366218A (en) | Display panel and manufacturing method thereof | |
| CN114284248A (en) | Display panel | |
| CN111312090A (en) | Display panel, manufacturing method thereof and display device | |
| JP2006210809A (en) | Wiring board and mounting structure, and electro-optical device and electronic equipment | |
| CN209624939U (en) | Display screen component and electronic device | |
| WO2022252112A1 (en) | Display substrate and display device | |
| KR20220122843A (en) | Electronic apparatus | |
| CN101359106A (en) | Display panel and use thereof | |
| KR100766895B1 (en) | Display apparatus | |
| CN110850618A (en) | Liquid crystal display driving panel and manufacturing method thereof | |
| CN218995843U (en) | Array substrate, display panel and display device | |
| US20240266486A1 (en) | Display panel and splicing screen including the same | |
| US20240329467A1 (en) | Display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |