CN111883039B - Driving chip and display device - Google Patents
Driving chip and display device Download PDFInfo
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- CN111883039B CN111883039B CN202010761614.7A CN202010761614A CN111883039B CN 111883039 B CN111883039 B CN 111883039B CN 202010761614 A CN202010761614 A CN 202010761614A CN 111883039 B CN111883039 B CN 111883039B
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
Abstract
The invention discloses a driving chip and a display device. The driving chip comprises a first area, a second area and a third area; in the first direction, the distance between each output terminal in the first region and the first side gradually decreases, and the distance between each output terminal in the third region and the first side gradually increases; the distance between each output terminal in the second area and the first edge is equal and smaller than the distance between the first edge of the output terminal in the first area and the second area; the distance between each input terminal and the first edge is equal; the output terminal group is positioned between the input terminal group and the first edge; the output terminal of the first region, the first side and the area surrounded by the third side, and the output terminal of the third region, the area surrounded by the first side and the fourth side are provided with a raising layer, wherein the first direction is parallel to the plane of the driving chip and the first side of the driving chip. The technical scheme provided by the embodiment of the invention improves the problem of uneven stress of the driving chip and avoids the damage of the driving chip.
Description
Technical Field
The embodiment of the invention relates to the technical field of display, in particular to a driving chip and a display device.
Background
The driving chip is used for providing various driving signals required by the normal operation of the display panel and is one of important components of the display device.
The driving chip is generally mounted on the display panel in a Chip On Glass (COG) manner, and specifically, the driving chip includes a plurality of input terminals and a plurality of output terminals, the display panel includes a plurality of input bonding pads and a plurality of output bonding pads, the input bonding pads are electrically connected to the input terminals in a one-to-one correspondence, and the output bonding pads are electrically connected to the output terminals in a one-to-one correspondence. The input terminal and the output terminal of the driving chip are of a convex structure, and have height differences with other areas, after the driving chip is in relative contact with the display panel, a gap is formed between the area, far away from the input terminal, of the output terminal in the driving chip and the display panel, so that the driving chip is stressed unevenly and is easy to damage in the binding process.
Disclosure of Invention
The invention provides a driving chip and a display device, which are used for solving the problem of uneven stress of the driving chip in the binding process and avoiding damage of the driving chip.
In a first aspect, an embodiment of the present invention provides a driving chip, including:
an output terminal group and an input terminal group; the output terminal group includes a plurality of output terminals; the input terminal group includes a plurality of input terminals;
the driving chip comprises a first edge, a second edge, a third edge and a fourth edge; the first edge and the second edge are opposite; the third side and the fourth side are opposite; the third edge is respectively connected with the first edge and the second edge; the fourth side is respectively connected with the first side and the second side; the first direction is parallel to the plane where the driving chip is located and parallel to the first edge of the driving chip;
the driving chip comprises a first area, a second area and a third area along the first direction;
in the first direction, the distance between each of the output terminals located in the first region and the first side gradually decreases, and the distance between each of the output terminals located in the third region and the first side gradually increases; the distance between each output terminal in the second region and the first edge is equal and smaller than the distance between the first edges of the output terminals in the first region and the third region; the distance between each input terminal and the first edge is equal; the output terminal set is positioned between the input terminal set and the first side;
the output terminal, the first side, and the third side of the first region surround an area, and the output terminal, the first side, and the fourth side of the third region surround an area provided with a raised layer.
In a second aspect, an embodiment of the present invention further provides a display device, including a display panel and the driving chip described in the first aspect;
the display panel comprises a display area and a non-display area surrounding the display area; the non-display area is provided with a plurality of fanout lines and a plurality of binding pads; one end of the fanout wire is electrically connected with the binding pad; the other end of the fanout wire is electrically connected with the signal wire of the display area; and each output terminal of the driving chip is electrically connected with each binding pad in a one-to-one correspondence.
The driving chip provided by the embodiment of the invention comprises a first area, a second area and a third area which are arranged along a first direction, wherein the first direction is parallel to a plane where the driving chip is positioned and a first edge of the driving chip, the distance between each output terminal and the first edge of the first area is gradually reduced along the first direction, the distance between each output terminal and the first edge of the third area is gradually increased, the distance between each output terminal and the first edge of the second area is equal and smaller than the distance between the first edge of the output terminal in the first area and the first edge of the third area, the distance between each input terminal and the first edge is equal, the output terminal group of the first area, the area surrounded by the first edge and the third edge of the first area, and the area surrounded by the first edge and the fourth edge of the third area are provided with a backing layer, so that the backing layer can play a supporting role in the binding process of the driving chip, and further the problem of uneven stress of the driving chip is avoided.
Drawings
Other features, objects and advantages of the present invention will become more apparent upon reading of the detailed description of non-limiting embodiments, made with reference to the accompanying drawings in which:
FIG. 1 is a schematic view of a partial cross-sectional structure of a display device according to the prior art;
fig. 2 is a schematic structural diagram of a driving chip according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a driving chip according to another embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view along the broken line AB of FIG. 3;
fig. 5 is a schematic view of a further cross-sectional structure along the dashed line AB in fig. 3;
fig. 6 is a schematic view of a partial cross-sectional structure of a display device according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of a driving chip according to another embodiment of the present invention;
FIG. 8 is a schematic diagram of a driving chip according to another embodiment of the present invention;
FIG. 9 is a schematic diagram of a driving chip according to another embodiment of the present invention;
fig. 10 is a schematic structural diagram of another driving chip according to an embodiment of the present invention;
fig. 11 is a schematic view of a partial structure of a display device according to an embodiment of the present invention;
FIG. 12 is a schematic view of the structure of the display panel of FIG. 11;
fig. 13 is a schematic sectional structure along the broken line CD in fig. 11.
Detailed Description
In order to further describe the technical means and effects adopted for achieving the preset aim of the present invention, the following detailed description refers to the specific implementation, structure, characteristics and effects of a driving chip and a display device according to the present invention with reference to the accompanying drawings and preferred embodiments.
The embodiment of the invention provides a driving chip, which comprises:
an output terminal group and an input terminal group; the output terminal group includes a plurality of output terminals; the input terminal group includes a plurality of input terminals;
the driving chip comprises a first edge, a second edge, a third edge and a fourth edge; the first edge and the second edge are opposite; the third side and the fourth side are opposite; the third edge is respectively connected with the first edge and the second edge; the fourth side is respectively connected with the first side and the second side; the first direction is parallel to the plane where the driving chip is located and parallel to the first edge of the driving chip;
the driving chip comprises a first area, a second area and a third area along the first direction;
in the first direction, the distance between each of the output terminals located in the first region and the first side gradually decreases, and the distance between each of the output terminals located in the third region and the first side gradually increases; the distance between each output terminal in the second region and the first edge is equal and smaller than the distance between the first edges of the output terminals in the first region and the third region; the distance between each input terminal and the first edge is equal; the output terminal set is positioned between the input terminal set and the first side;
the output terminal, the first side, and the third side of the first region surround an area, and the output terminal, the first side, and the fourth side of the third region surround an area provided with a raised layer.
The driving chip provided by the embodiment of the invention comprises a first area, a second area and a third area which are arranged along a first direction, wherein the first direction is parallel to a plane where the driving chip is positioned and a first edge of the driving chip, the distance between each output terminal and the first edge of the first area is gradually reduced along the first direction, the distance between each output terminal and the first edge of the third area is gradually increased, the distance between each output terminal and the first edge of the second area is equal and smaller than the distance between the first edge of the output terminal in the first area and the first edge of the third area, the distance between each input terminal and the first edge is equal, the output terminal group of the first area, the area surrounded by the first edge and the third edge of the first area, and the area surrounded by the first edge and the fourth edge of the third area are provided with a backing layer, so that the backing layer can play a supporting role in the binding process of the driving chip, and further the problem of uneven stress of the driving chip is avoided.
The foregoing is the core idea of the present application, and the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without making any inventive effort are intended to fall within the scope of the present invention.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other embodiments that depart from the spirit of the invention, and those skilled in the art will readily appreciate that the present invention is not limited to the specific examples disclosed below.
In the following detailed description of the embodiments of the present invention, the schematic drawings showing the structure of the device are not partially enlarged to general scale for the convenience of description, and are merely examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and height should be included in the actual fabrication.
Fig. 1 is a schematic view showing a partial cross-sectional structure of a display device according to the prior art. As shown in fig. 1, the display device includes a driving chip 100 and a display panel 200, the driving chip 100 is mounted on a bonding area 22 of the display panel 200 in COG manner, and the display panel 200 includes a display area 10 and a fan-out area 21 in addition to the bonding area 22. After the driving chip 100 is aligned with the display panel 200, a gap H is formed between the area 211 between the bonding pad 220 and the fan-out area 21 in the bonding area 22 and the driving chip 100, so that the driving chip 100 is stressed unevenly and is easy to damage in the bonding process. Especially, the problem of uneven stress during the bonding of the driving chip 100 is particularly serious when the bonding pads 220 are arranged in a display panel 200 with two sinking ends.
In order to solve the above problems, the embodiment of the invention provides a driving chip, which effectively improves the problem of uneven stress of the driving chip and avoids the damage of the driving chip by arranging a pad layer at a position opposite to the area between the output binding pad and the fan-out area in the display panel.
Specifically, fig. 2 is a schematic structural diagram of a driving chip according to an embodiment of the present invention. As shown in fig. 2, the driving chip includes an output terminal group 140 and an input terminal group 150, the output terminal group 140 including a plurality of output terminals 141, and the input terminal group 150 including a plurality of input terminals 151.
The driving chip comprises a first side 101, a second side 102, a third side 103 and a fourth side 104, the first side 101 is opposite to the second side 102, the third side 103 is opposite to the fourth side 104, the third side 103 is respectively connected with the first side 101 and the second side 102, the fourth side 104 is respectively connected with the first side 101 and the second side 102, a first direction X is parallel to a plane where the driving chip is located and is parallel to the first side 101 of the driving chip, and the driving chip comprises a first area 110, a second area 120 and a third area 130 along the first direction X.
In the first direction X, the distance k between each output terminal 141 and the first side 101 of the first region 110 gradually decreases, the distance k between each output terminal 141 and the first side 101 of the third region 130 gradually increases, the distance k between each output terminal 141 and the first side 101 of the second region 120 is equal to and smaller than the distance k between each output terminal 141 and the first side 101 of the first region 110 and the third region 130, the distance p between each input terminal 151 and the first side 101 is equal to, the output terminal group 140 is located between the input terminal group 150 and the first side 101, the region 160 surrounded by the output terminal 141, the first side 101, and the third side 103 of the first region 110, and the region 170 surrounded by the output terminal 141, the first side 101, and the fourth side 104 of the third region 130 are provided with the bump layer 300.
It should be noted that fig. 1 is only for illustration and not limitation, and the overall structure of the raised layer 300 with a triangle shape is merely an example, and in other embodiments of the present embodiment, the raised layer 300 may include a plurality of mutually independent sub-portions, and the sub-portions may have the same structure as the output terminal 141 or the input terminal 151, for example.
In the present embodiment, the plurality of output terminals 141 are arranged in one or more rows, the plurality of input terminals 151 are arranged in one or more rows, the specific arrangement of the plurality of output terminals 141 and the plurality of input terminals 151 is not limited in the present embodiment, and all the ways of satisfying the requirement that "the distance k between each output terminal 141 and the first side 101 in the first region 110 is gradually reduced and the distance k between each output terminal 141 and the first side 101 in the third region 130 is gradually increased, the distance k between each output terminal 141 and the first side 101 in the second region 120 is equal and smaller than the distance k between each output terminal 141 and the first side 101 in the first region 110 and the third region 130, and the distance p between each input terminal 151 and the first side 101 is equal" are within the protection scope of the present embodiment.
It should be further noted that, the plurality of output terminals 141 in the output terminal set 140 are arranged with two sunk ends, and the arrangement mode makes the plurality of output binding pads of the display panel corresponding to the output terminal set 140 arranged with two sunk ends when the driving chip is bound on the display panel by COG, and the bending area of the fanout line can be arranged in the binding area, so as to reduce the width of the frame where the fanout area is located in the display device, and realize the narrow frame.
In this embodiment, the area 160 surrounded by the output terminal 141, the first side 101 and the third side 103 of the first area 110, and the area 170 surrounded by the output terminal 141, the first side 101 and the fourth side 104 of the third area 130 are provided with the raised layer 300, so as to increase the heights of the area 160 and the area 170, avoid that a gap exists between the area 160 and the area 170 and the display panel after the driving chip is aligned with the display panel, and further the stress of the driving chip is more uniform in the binding process.
The driving chip provided in this embodiment includes a first area, a second area and a third area arranged along a first direction, where the first direction is parallel to a plane where the driving chip is located and a first edge of the driving chip, and along the first direction, a distance between each output terminal located in the first area and the first edge is gradually reduced, a distance between each output terminal located in the third area and the first edge is gradually increased, a distance between each output terminal located in the second area and the first edge is equal and smaller than a distance between the first area and the first edge of the output terminal in the third area, a distance between each input terminal and the first edge is equal, an output terminal set located between the input terminal set and the first edge, an area surrounded by the output terminal, the first edge and the third edge of the first area, and an area surrounded by the first edge and the fourth edge of the third area are provided with a pad layer, so that the pad layer can play a supporting role in a binding process of the driving chip, and further the problem of uneven stress of the driving chip is avoided.
Fig. 3 is a schematic structural diagram of another driving chip according to an embodiment of the present invention. As shown in fig. 3, the pad layer 300 includes a plurality of dummy terminals 310 arranged on a plane where the driving chip 100 is located.
It should be noted that, this arrangement can obtain a good supporting effect, and simultaneously reduce the material required by the raising layer 300, thereby reducing the production cost. On the other hand, the shape of the dummy terminal 310 may be the same as that of the output terminal 141 or the input terminal 151, thereby realizing the overall design and preparation of the dummy terminal 310 and the output terminal 141 or the input terminal 151 inherent in the driving chip, which is advantageous in reducing the difficulty of the design and preparation of the driving chip.
Fig. 4 is a schematic cross-sectional view of the structure along the broken line AB in fig. 3. The dummy terminal 310 may be formed in the same process as the output terminal 141, and the thickness of the dummy terminal 310 and the output terminal 141 is the same in the direction Z perpendicular to the plane of the driving chip 100.
It should be noted that, the arrangement manner is such that no dedicated film layer and process are required for the dummy terminal 310, which is beneficial to reducing the manufacturing difficulty of the driving chip.
Alternatively, fig. 5 is a schematic view of a further cross-sectional structure along the dashed line AB in fig. 3. As shown in fig. 5, the thickness of the dummy terminal 310 is smaller than the thickness of the output terminal 141 in a direction Z perpendicular to the plane in which the driving chip 100 is located.
Fig. 6 is a schematic diagram of a partial cross-sectional structure of a display device according to an embodiment of the invention. As shown in fig. 6, the driving chip 100 is bonded to the display panel 200 in COG manner, and the output terminals 141 of the driving chip 100 are in contact electrical connection with the corresponding output bonding pads 210 provided on the display panel 200.
The display panel 200 includes a display area 10, a fan-out area 21, a binding area 22, a substrate 207, and a driving circuit layer 208, a planarization layer 201, a touch routing layer 203, a common electrode layer 204, and a pixel electrode layer 205 sequentially formed on the substrate 207, wherein the touch routing layer 203 includes a plurality of touch signal lines electrically connected to touch electrodes disposed in the display area 10 for transmitting touch electrical signals. The driving circuit layer 208 includes a plurality of thin film transistors 202, the pixel electrode layer 205 includes a plurality of pixel electrodes, and the thin film transistors 202 are electrically connected to the pixel electrodes in a one-to-one correspondence. In the normal operation of the display panel 200, voltages are applied to the pixel electrode layer 205 and the common electrode layer 204, an electric field is formed therebetween, and liquid crystal molecules (not shown in fig. 6) in the display panel rotate under the control of the electric field, so that the amount of transmitted light is adjusted by the liquid crystal layer (not shown in fig. 6), and image display is further realized. In addition, the driving circuit layer 208 further includes a light shielding layer 206 to shield the light incident to the thin film transistor 202 from the substrate 207 side, so as to prevent the thin film transistor 202 from generating leakage current.
The relative positions of the common electrode layer 204 and the pixel electrode layer 205 are not limited in this embodiment, i.e., the common electrode layer 204 may be located on a side of the pixel electrode layer 205 close to the substrate 207, or may be located on a side of the pixel electrode layer 205 far from the substrate 207. The driving circuit layer 208 includes a gate metal layer and a source/drain metal layer, the gate of the thin film transistor 202 is located on the gate metal layer, the source and the drain of the thin film transistor 202 are located on the source/drain metal layer, and the gate metal layer, the source/drain metal layer and the touch wiring layer 203 can be all used as wiring layers of signal lines such as data lines in the display area 10. The touch routing layer 203 may increase or decrease according to whether the display panel has the touch function, and for a display panel without the touch function, the touch routing layer 203 may not be included.
As shown in fig. 6, the output bonding pad 210 in the display panel 200 may include three conductive structures that are sequentially stacked and electrically connected in sequence, and the three conductive structures are respectively disposed on the same layer as at least one of the gate metal layer, the source/drain metal layer, and the common electrode layer and the pixel electrode layer, and the signal lines in the gate metal layer and the source/drain metal layer may be directly electrically connected with the conductive structures on the same layer in the output bonding pad 210, for example, integrally formed, so as to simplify the electrical connection design of the signal lines and the output bonding pad 210.
Specifically, to facilitate the preparation of the output bond pad 210, the electrical performance of the output bond pad 210 is improved, while ensuring that electrical signals between adjacent metal layers within the bond region 22 do not interfere with each other, the planarization layer 201 within other regions 212 of the bond region 22 is removed except for regions 211 between the output bond pad 210 and the fan-out region 21, resulting in a greater height of the regions 211 between the output bond pad 210 and the fan-out region 21 than the other regions 212 of the bond region 22. In this embodiment, the thickness of the dummy terminal 310 is smaller than the thickness of the output terminal 141, so that after the driving chip 100 is bound, the surface of the driving chip far away from the display panel 200 is flat, and the binding stability is good.
In fig. 6, the display panel is merely an example of a liquid crystal display panel, and is not limited thereto, and in other embodiments of the present embodiment, the display panel may be an organic light emitting display panel, for example.
Fig. 7 is a schematic structural diagram of another driving chip according to an embodiment of the present invention. As shown in fig. 7, the plurality of dummy terminals 310 disposed in the region 160 surrounded by the output terminal 141, the first side 101, and the third side 103 of the first region 110 are arranged along the first side 101 and the third side 103, and the plurality of dummy terminals 310 disposed in the region 170 surrounded by the output terminal 141, the first side 101, and the fourth side 104 of the third region 130 are arranged along the first side 101 and the fourth side 104.
It should be noted that, the plurality of dummy terminals 310 are disposed at edges of the region 160 and the region 170, and during the binding process of the driving chip, the plurality of dummy terminals 310 can effectively support the region 160 and the region 170, so as to avoid damage caused by uneven stress of the driving chip. And the number of the dummy terminals 310 arranged in the region 160 and the region 170 is small while ensuring the effect, so that the design and the preparation are convenient, and the cost is low.
Fig. 8 is a schematic structural diagram of another driving chip according to an embodiment of the present invention. As shown in fig. 8, the plurality of dummy terminals 310 are uniformly arranged in the region 160 surrounded by the output terminal 141, the first side 101, and the third side 103 of the first region 110, and the plurality of dummy terminals 310 are uniformly arranged in the region 170 surrounded by the output terminal 141, the first side 101, and the fourth side 104 of the third region 130.
It should be noted that, the dummy terminals 310 are uniformly arranged in the areas 160 and 170, so that in the binding process of the driving chip, the areas 160 and 170 have balanced supporting force, and the driving chip is stressed more uniformly and is not easy to damage.
It should be noted that, in the present embodiment, the specific arrangement manner of the plurality of dummy terminals 310 is not limited, and may be a regular row-column arrangement as shown in fig. 8, or may be other uniform arrangement manners. The dummy terminals 310 may be any shape, and may be specifically and reasonably arranged according to actual needs.
Fig. 9 is a schematic structural diagram of another driving chip according to an embodiment of the present invention. As shown in fig. 9, the plurality of dummy terminals 310 are located at corners of the region 160 surrounded by the output terminal 141, the first side 101, and the third side 103 of the first region 110, and the plurality of dummy terminals 310 are located at corners of the region 170 surrounded by the output terminal 141, the first side 101, and the fourth side 104 of the third region 130.
It should be noted that, the dimensions of the area 160 and the area 170 are generally smaller, so the dummy terminals 310 disposed at the corners can effectively support the area 160 and the area 170, so as to improve the strength of the driving chip in the area, and the number of the required dummy terminals 310 is very small, so that the manufacturing is convenient and the effect of improving the stress uniformity of the driving chip is good.
Illustratively, as shown in fig. 9, four dummy terminals 310 arranged in a zigzag shape are disposed at the corners of the regions 160 and 170 near the second region 120, and eight dummy terminals 310 arranged in two rows and four columns are disposed at the corners of the regions 160 and 170 far from the second region 120. It can be understood that, according to the different conditions of the size of the driving chip, the arrangement of the output terminals 141, the size of the output terminals 141, etc., the number of the dummy terminals 310 to be disposed at the corners of the region 160 and the region 170 is different, and the number of the dummy terminals may be reasonably disposed according to the actual needs, which is not limited to the specific embodiment provided in the present embodiment.
Fig. 10 is a schematic structural diagram of another driving chip according to an embodiment of the present invention. As shown in fig. 10, the driving chip may further include a first electrostatic conductive ring 400, where the first electrostatic conductive ring 400 is grounded, and a vertical projection of the pad layer 300 on a plane where the driving chip is located in an area surrounded by a vertical projection of the first electrostatic conductive ring 400 on the plane where the driving chip is located.
In the display device using COG type bonding driving chips, static electricity is likely to be generated in the region of the pad layer 300, and thus static electricity damage is likely to occur in the components of the display panel. In order to avoid the above problem, the first electrostatic conductive ring 400 is disposed around the raised layer 300 on the driving chip, and the first electrostatic conductive ring 400 is used to conduct away the static electricity generated in the area of the raised layer 300, so as to ensure that the normal operation of the display device is not affected by the static electricity.
It should be noted that, fig. 10 only illustrates an example of the first electrostatic conductive ring 400 having a triangular structure, and in other embodiments of the present embodiment, the first electrostatic conductive ring 400 may have other shapes, and all the shapes that can completely surround the raised layer 300 are within the protection scope of the present embodiment.
The embodiment of the invention also provides a display device. Fig. 11 is a schematic partial structure of a display device according to an embodiment of the present invention. As shown in fig. 11, the display device 1 includes a display panel 200 and a driving chip 100 provided in any embodiment of the present invention.
Fig. 12 is a schematic view of the structure of the display panel in fig. 11. As shown in fig. 12, the display panel 200 includes a display area 10 and a non-display area 20 surrounding the display area 10, the non-display area 20 is provided with a plurality of fan-out lines 401 and a plurality of bonding pads 220, one ends of the fan-out lines 401 are electrically connected with the bonding pads 220, and the other ends of the fan-out lines 401 are electrically connected with signal lines 402 of the display area 10. Fig. 13 is a schematic sectional structure along the broken line CD in fig. 11. As shown in fig. 13, the output terminals 141 of the driving chip 100 are electrically connected to the bonding pads 220 in a one-to-one correspondence.
Alternatively, the bonding pads 220 may be output bonding pads, for example, and the non-display area 20 of the display panel 200 may further include input bonding pads 230 corresponding to the input terminals of the driving chip 100, as shown in fig. 12.
The display device 1 provided in the embodiment of the present invention includes the display panel 200 in any embodiment of the present invention, and has the technical features of the display panel 200 provided in any embodiment of the present invention, which has the same or corresponding beneficial effects as the display panel 200 included in the present invention, and is not described herein again.
With continued reference to fig. 12 and 13, the non-display area 20 of the display panel 200 is provided with a second electrostatic conductive ring 500, the second electrostatic conductive ring 500 is grounded, and the vertical projection of the pad layer 300 in the driving chip 100 on the plane of the driving chip 100 is located in the area surrounded by the vertical projection of the second electrostatic conductive ring 500 on the plane of the driving chip 100.
It should be noted that, the region 211 provided with the pad layer 300 is prone to generate static electricity, so as to affect the normal operation of the display panel, and the second static conductive ring 500 is capable of conducting away the static electricity generated in the region 211, so as to protect the display panel from being damaged by static electricity.
It will be appreciated that the second electrostatic conductive ring 500 and the first electrostatic conductive ring on the driving chip 100 have electrostatic conductive functions, so that static electricity generated in the region 211 where the spacer layer 300 is disposed can be prevented from damaging the display panel, and thus, the display device may include any one of the second electrostatic conductive ring 500 and the first electrostatic conductive ring, or include both the second electrostatic conductive ring 500 and the first electrostatic conductive ring, and for the latter case, the shapes of the second electrostatic conductive ring 500 and the first electrostatic conductive ring may not affect each other, and may be the same or different.
For example, in order to make the second static electricity lead-out ring 500 and the first static electricity lead-out ring have good static electricity lead-out capability, the second static electricity lead-out ring 500 and the first static electricity lead-out ring are formed of a material having a relatively high electrical conductivity, and the material may be, for example, metal.
Note that the above is only a preferred embodiment of the present invention and the technical principle applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, and that various obvious changes, rearrangements, combinations, and substitutions can be made by those skilled in the art without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, the invention is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the invention, which is set forth in the following claims.
Claims (7)
1. A driver chip, comprising:
an output terminal group and an input terminal group; the output terminal group includes a plurality of output terminals; the input terminal group includes a plurality of input terminals;
the driving chip comprises a first edge, a second edge, a third edge and a fourth edge; the first edge and the second edge are opposite; the third side and the fourth side are opposite; the third edge is respectively connected with the first edge and the second edge; the fourth side is respectively connected with the first side and the second side; the first direction is parallel to the plane where the driving chip is located and parallel to the first edge of the driving chip;
the driving chip comprises a first area, a second area and a third area along the first direction;
in the first direction, the distance between each of the output terminals located in the first region and the first side gradually decreases, and the distance between each of the output terminals located in the third region and the first side gradually increases; the distance between each output terminal in the second region and the first edge is equal and smaller than the distance between the first edges of the output terminals in the first region and the third region; the distance between each input terminal and the first edge is equal; the output terminal set is positioned between the input terminal set and the first side;
the output terminal, the first side, and the third side of the first region surround areas, and the output terminal, the first side, and the fourth side of the third region surround areas provided with a raising layer;
the pad layer comprises a plurality of dummy terminals arranged on the plane where the driving chip is located;
the thickness of the dummy terminal is smaller than that of the output terminal in the direction perpendicular to the plane of the driving chip;
the display panel comprises a display area, a fan-out area, a binding area, a substrate, a drive circuit layer, a flattening layer, a touch routing layer, a public electrode layer and a pixel electrode layer which are sequentially formed on the substrate, wherein the flattening layer in other areas of the binding area is removed except for the area between the output binding pad and the fan-out area.
2. The driver chip of claim 1, wherein the output terminals of the first region, the first side, and the third side are arranged along a plurality of dummy terminals disposed in a region surrounded by the first side and the third side;
the output terminal of the third region, the first side, and a plurality of dummy terminals disposed in a region surrounded by the fourth side are arranged along the first side and the fourth side.
3. The driving chip according to claim 1, wherein a plurality of the dummy terminals are uniformly arranged in a region surrounded by the output terminal, the first side, and the third side of the first region;
the plurality of dummy terminals are uniformly arranged in a region surrounded by the output terminal, the first side, and the fourth side of the third region.
4. The driver chip of claim 1, wherein a plurality of the dummy terminals are located at corners of an area surrounded by the output terminals, the first side, and the third side of the first region;
a plurality of the dummy terminals are located at corners of an area surrounded by the output terminals, the first side, and the fourth side of the third region.
5. The driver chip of claim 1, further comprising a first electrostatic conductive ring; the first electrostatic conducting ring is grounded, and the vertical projection of the pad layer on the plane where the driving chip is located in an area surrounded by the vertical projection of the first electrostatic conducting ring on the plane where the driving chip is located.
6. A display device comprising a display panel and the driving chip according to any one of claims 1 to 5;
the display panel comprises a display area and a non-display area surrounding the display area; the non-display area is provided with a plurality of fanout lines and a plurality of binding pads; one end of the fanout wire is electrically connected with the binding pad; the other end of the fanout wire is electrically connected with the signal wire of the display area; and each output terminal of the driving chip is electrically connected with each binding pad in a one-to-one correspondence.
7. The display device according to claim 6, wherein a non-display area of the display panel is provided with a second electrostatic conductive ring; the second electrostatic conducting ring is grounded, and the vertical projection of the pad layer on the plane where the driving chip is located in an area surrounded by the vertical projection of the second electrostatic conducting ring on the plane where the driving chip is located.
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| CN112242099A (en) * | 2020-11-09 | 2021-01-19 | 上海中航光电子有限公司 | Array substrate, display panel and display device |
| CN112860115B (en) * | 2021-03-04 | 2022-10-04 | 武汉华星光电半导体显示技术有限公司 | Display panel and test system and test method thereof |
| CN113421909B (en) * | 2021-06-24 | 2023-01-24 | 云谷（固安）科技有限公司 | Display panel and display device |
| CN113917747B (en) * | 2021-09-30 | 2022-11-01 | 武汉华星光电技术有限公司 | Display panel and display device |
| CN113823241B (en) * | 2021-09-30 | 2022-09-27 | 武汉华星光电技术有限公司 | Drive chip and display panel |
| CN114255658B (en) * | 2021-12-16 | 2023-03-17 | 武汉华星光电技术有限公司 | Display panel and display device |
| CN114373390B (en) * | 2022-01-06 | 2023-06-02 | 武汉华星光电半导体显示技术有限公司 | Display panel and driving chip |
| CN114389064B (en) * | 2022-01-07 | 2023-06-02 | 武汉华星光电半导体显示技术有限公司 | Display module |
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