CN115019677B - Display panel and preparation method thereof, and preparation method of display device - Google Patents
Display panel and preparation method thereof, and preparation method of display device Download PDFInfo
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- CN115019677B CN115019677B CN202210768489.1A CN202210768489A CN115019677B CN 115019677 B CN115019677 B CN 115019677B CN 202210768489 A CN202210768489 A CN 202210768489A CN 115019677 B CN115019677 B CN 115019677B
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- 238000002360 preparation method Methods 0.000 title abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 146
- 238000000034 method Methods 0.000 claims abstract description 41
- 238000004519 manufacturing process Methods 0.000 claims description 27
- 238000004806 packaging method and process Methods 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 10
- 238000005538 encapsulation Methods 0.000 claims description 9
- 238000000059 patterning Methods 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 3
- 238000005452 bending Methods 0.000 abstract description 15
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- 230000008569 process Effects 0.000 description 9
- 239000011521 glass Substances 0.000 description 7
- 230000008093 supporting effect Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
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- 238000004590 computer program Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 238000010329 laser etching Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
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- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
- G09F9/335—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes being organic light emitting diodes [OLED]
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Abstract
The embodiment of the application provides a display panel, a preparation method thereof and a preparation method of a display device, wherein the display panel comprises: the electronic device comprises a first substrate, wherein an electronic device is arranged in the first substrate; the first direction is a direction parallel to the plane of the first substrate; the conductive pad is positioned on one side of the backlight surface and is electrically connected with the connecting wire and used for connecting the driving chip and/or the flexible circuit board. According to the embodiment of the application, the size of the lower frame of the display panel can be effectively reduced, the bending procedure is saved, and the yield loss caused by bending is avoided.
Description
Technical Field
The application belongs to the technical field of display, and particularly relates to a display panel, a preparation method thereof and a preparation method of a display device.
Background
With the development of full-screen technology, the demand of people for the occupation ratio of the screen size of the mobile phone is higher, and the demand of the size of the lower frame of the display panel is also higher. The method for realizing the narrow frame of the lower frame of some display panels adopts a binding area Bending (Pad Bending) structure, and the binding area is bent to the back of the display panel through designing a specific Bending area, so that the narrow frame is realized.
Disclosure of Invention
The embodiment of the application provides a display panel, a preparation method thereof and a preparation method of a display device, which can effectively reduce the size of a lower frame of the display panel.
In a first aspect, embodiments of the present application provide a display panel, including: the electronic device comprises a first substrate, wherein an electronic device is arranged in the first substrate; the first direction is a direction parallel to the plane of the first substrate; the conductive pad is positioned on one side of the backlight surface and is electrically connected with the connecting wire and used for connecting the driving chip and/or the flexible circuit board.
According to an embodiment of the first aspect of the present application, the first substrate further includes a plurality of conductive pads located on the backlight surface and arranged at intervals along the first direction, the plurality of conductive pads are electrically connected with the plurality of connection wires in a one-to-one correspondence, the conductive pads are located in front projection of the conductive pads on the first substrate, and the conductive pads are bound with the driving chip and/or the flexible circuit board through the conductive pads; the light emergent surface of the first substrate is provided with a packaging part, and the first substrate is connected with the cover plate through the packaging part; in a direction perpendicular to the plane of the first substrate, the orthographic projection of the conductive pad on the first substrate at least partially overlaps the orthographic projection of the package portion on the first substrate.
In this way, the connection strength of the connection part of the first substrate and the packaging part is strong, so that the conductive pad is arranged in the area which at least partially overlaps with the orthographic projection of the packaging part on the first substrate, and the screen body can have sufficient supporting function after the driving chip and/or the flexible circuit board are bound with the conductive pad.
According to any one of the foregoing embodiments of the first aspect of the present application, the package is located in an edge area of the light-emitting surface, and the edge area includes at least one of a left side edge, a right side edge, an upper side edge, and a lower side edge; in a direction perpendicular to the plane of the first substrate, the orthographic projection of the conductive pad on the first substrate at least partially overlaps with the orthographic projection of the encapsulation portion on the first substrate at the left side edge, the right side edge, the upper side edge and/or the lower side edge.
Therefore, the positions of the conductive pads can be flexibly adjusted in the overlapping area of the packaging part, the flexibility of the design of the display panel can be improved while the screen body is ensured to have a sufficient supporting effect, and the mechanism interference is avoided.
According to any of the foregoing embodiments of the first aspect of the present application, the conductive pad is made of a first material having conductivity anisotropy, and the conductive pad is electrically connected to the plurality of connection traces simultaneously.
Therefore, the conductive pad is prepared from the first material with the conductivity anisotropy, so that the conductive pad is integrally formed while the short circuit of a plurality of connecting wires connected with the conductive pad is avoided, the production process of the display panel is simplified, and the production efficiency is improved.
According to any of the preceding embodiments of the first aspect of the present application, the first material comprises an anisotropic conductive film.
Therefore, the conductive pad is prepared by the anisotropic conductive adhesive film, so that the conductive pad is integrally formed while a plurality of connecting wires connected with the conductive pad are prevented from being short-circuited, the production process of the display panel is simplified, and the production efficiency is improved.
According to any of the foregoing embodiments of the first aspect of the present application, the conductive pad includes a first conductive pad and a second conductive pad arranged at intervals, and the first conductive pad is electrically connected to the second conductive pad; the first conductive pad is used for connecting with the driving chip, and the second conductive pad is used for connecting with the flexible circuit board.
Therefore, the first conductive pad and the second conductive pad are arranged, the first conductive pad is used for being connected with the driving Chip, the second conductive pad is used for being connected with the flexible circuit board, and the COG (Chip On Glass) design of the backlight surface can be realized.
In a second aspect, an embodiment of the present application provides a method for manufacturing a display panel, where the display panel includes the display panel provided in the first aspect, and the method for manufacturing a display panel includes: depositing a metal layer on the light emergent surface, the first side surface and the backlight surface of the first substrate; patterning the metal layer to obtain a plurality of connecting wires which are arranged at intervals along a first direction, wherein the connecting wires are wound from the light emitting surface to the backlight surface through the first side surface; and a conductive pad is formed on one side of the backlight surface, and is electrically connected with the connecting wire and used for connecting the driving chip and/or the flexible circuit board.
According to an embodiment of the second aspect of the present application, the light-emitting surface of the first substrate is provided with a packaging part, and the first substrate is connected with the cover plate through the packaging part; forming a conductive pad on one side of the backlight surface, specifically including: arranging a conductive pad in a region where the backlight surface and the packaging part at least partially overlap in a direction perpendicular to a plane where the first substrate is located; a conductive pad is formed on a side of the conductive pad facing away from the first substrate.
In this way, the connection strength of the connection part of the first substrate and the packaging part is strong, so that the conductive pad is arranged in the area which at least partially overlaps with the orthographic projection of the packaging part on the first substrate, and the screen body can have sufficient supporting function after the driving chip and/or the flexible circuit board are bound with the conductive pad.
In a third aspect, an embodiment of the present application provides a method for manufacturing a display device, including: the method for manufacturing a display panel as provided in the second aspect; and binding the driving chip and/or the flexible circuit board on the conductive pad.
According to an embodiment of the third aspect of the present application, the bonding of the driving chip and/or the flexible circuit board on the conductive pad specifically includes: after the driving chip is bound on the flexible circuit board, binding the flexible circuit board and the conductive pad; or the conductive pad comprises a first conductive pad and a second conductive pad which are arranged at intervals, the driving chip is bound with the first conductive pad, and the flexible circuit board is bound with the second conductive pad.
In this way, the COF (Chip On FPC) design or the COG (Chip On Glass) design of the backlight surface can be realized.
The display panel, the preparation method thereof and the preparation method of the display device provided by the embodiment of the application comprise the following steps: the electronic device comprises a first substrate, wherein an electronic device is arranged in the first substrate; the first direction is a direction parallel to the plane of the first substrate; the conductive pad is positioned on one side of the backlight surface and is electrically connected with the connecting wire and used for connecting the driving chip and/or the flexible circuit board. According to the embodiment of the application, the connecting wiring connected with the electronic device in the first substrate is wound on the light emitting surface of the first substrate, or pins of the electronic device in the first substrate are led to the backlight surface of the first substrate through the connecting wiring, and then the driving chip and/or the flexible circuit board are bound with the connecting wiring of the backlight surface through the conductive pad, so that the size of the lower frame of the display panel can be effectively reduced, the bending procedure is saved, and yield loss caused by bending is avoided.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments of the present application will be briefly described, and it is possible for a person skilled in the art to obtain other drawings according to these drawings without inventive effort.
FIG. 1 is a schematic diagram of a display panel bonded to a flexible circuit board;
FIG. 2 is a schematic top view of a backlight surface of a display panel according to an embodiment of the disclosure;
FIG. 3 is a schematic cross-sectional view of a display panel according to an embodiment of the disclosure;
fig. 4 is another schematic cross-sectional view of a display panel according to an embodiment of the disclosure;
FIG. 5 is another schematic top view of a backlight surface of a display panel according to an embodiment of the disclosure;
fig. 6 is a schematic top view of the light emitting surface of the display panel according to the embodiment of the present application;
FIG. 7 is a schematic top view of a backlight surface of a display panel according to an embodiment of the disclosure;
FIG. 8 is a schematic top view of a backlight surface of a display panel according to an embodiment of the disclosure;
fig. 9 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present application;
fig. 10 is a schematic operation diagram of a method for manufacturing a display panel according to an embodiment of the present disclosure;
FIG. 11 is a schematic operation diagram of a method for manufacturing a display device according to an embodiment of the present disclosure;
fig. 12 is another operation schematic diagram of a method for manufacturing a display device according to an embodiment of the present disclosure;
fig. 13 is a schematic structural diagram of a display device according to an embodiment of the present application.
Detailed Description
Features and exemplary embodiments of various aspects of the present application are described in detail below to make the objects, technical solutions and advantages of the present application more apparent, and to further describe the present application in conjunction with the accompanying drawings and the detailed embodiments. It should be understood that the specific embodiments described herein are intended to be illustrative of the application and are not intended to be limiting. It will be apparent to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by showing examples of the present application.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises the element.
It should be understood that the term "and/or" as used herein is merely one relationship describing the association of the associated objects, meaning that there may be three relationships, e.g., a and/or B, may represent: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.
In the embodiments herein, the term "electrically connected" may refer to two components being directly electrically connected, or may refer to two components being electrically connected via one or more other components.
It will be apparent to those skilled in the art that various modifications and variations can be made in the present application without departing from the spirit or scope of the application. Accordingly, this application is intended to cover such modifications and variations of this application as fall within the scope of the appended claims (the claims) and their equivalents. The embodiments provided in the examples of the present application may be combined with each other without contradiction.
Before describing the technical solution provided by the embodiments of the present application, in order to facilitate understanding of the embodiments of the present application, the present application first specifically describes the problems existing in the related art:
currently, the bonding of a driving Chip to a Glass substrate (COG, chip On Glass) is a technology used in the current display device, but such bonding of a driving Chip (IC) directly to a Glass substrate of a display panel occupies a larger area in a lower frame of the display panel, resulting in a larger width (or size) of the lower frame of the display panel.
Fig. 1 is a schematic diagram of binding a display panel and a flexible circuit board. As shown in fig. 1, in order to reduce the width of the lower frame of the display panel, a Chip On FPC (COF) design in which a driving Chip is bound On a flexible circuit board may be adopted. That is, after the display panel 10' is bound to the flexible circuit board (Flexible Printed Circuit, FPC) 20', the driving chip 30' is bent to the back surface of the display panel 10' by the flexible circuit board 20 '. Although the COF design can reduce the width of the lower frame of the display panel 10' to some extent, the lower frame of the display panel 10' is still large in width due to various factors such as alignment accuracy, attachment tolerance, and bending radius of the flexible circuit board 20 '.
For example, when the flexible circuit board 20' and the display panel 10' are aligned and attached, the flexible circuit board 20' is inclined due to the deviation. Therefore, a certain space needs to be reserved to prevent the flexible circuit board 20 'from being unable to be placed after the alignment deviation or the attachment deviation, which may result in an increase in the size of the lower frame of the display panel 10'. Meanwhile, the larger the bending radius of the flexible circuit board 20', the larger the bending space required for bending to the backlight surface of the display panel 10', resulting in a larger width of the lower frame of the display panel 10', which is affected by the bending radius of the flexible circuit board 20'.
In view of the above-mentioned research of the inventor, the embodiment of the application provides a display panel, a preparation method thereof and a preparation method of a display device, which can solve the technical problem that the width of the lower frame of the display panel is larger in the related art.
The technical conception of the embodiment of the application is as follows: first, the connection wiring connected with the electronic device in the first substrate is wound on the backlight surface of the first substrate, or pins of the electronic device in the first substrate are led to the backlight surface of the first substrate through the connection wiring, and then the connection wiring of the driving chip and/or the flexible circuit board and the backlight surface is bound through the conductive pad. Therefore, a large space is not required to be reserved at the lower frame of the display panel to bind the driving chip and/or the flexible circuit board, so that the size of the lower frame of the display panel is effectively reduced.
The following first describes a display panel provided in an embodiment of the present application.
Fig. 2 is a schematic top view of a backlight surface of a display panel according to an embodiment of the disclosure. Fig. 3 is a schematic cross-sectional view of a display panel according to an embodiment of the disclosure. As shown in fig. 2 and 3, the display panel 20 provided in the embodiment of the present application includes: the first substrate 210, a plurality of connection traces 220 and conductive pads 230 arranged at intervals along the first direction X. The first direction X is a direction parallel to a plane (e.g., the light emitting surface a or the backlight surface b) where the first substrate is located. In the embodiment of the present application, the first substrate 210 may include, for example, a substrate, a driving device layer, a light emitting layer, and an encapsulation layer that are stacked. The substrate includes, but is not limited to, a hard substrate including, but not limited to, a glass substrate, a plastic substrate, a quartz substrate, or a sapphire substrate. Of course, in some examples, the first substrate 210 may further include a touch functional layer, that is, the first substrate 210 may be a touch display substrate. It is readily understood that the first substrate 210 has electronic devices disposed therein. The electronic device may comprise, for example, a transistor, a capacitor and/or a light emitting element.
In the embodiment of the present application, the connection trace 220 may be electrically connected with the electronic device in the first substrate 210. Specifically, the first substrate 210 may be provided therein with a scan signal line, a data signal line, a power supply voltage signal line, a reference voltage signal line, a detection signal line, and the like. The plurality of connection traces 220 may be divided into a plurality of types. The first type of connection trace 220 may be electrically connected to a gate of a transistor in the first substrate 210, for example, through a scan signal line, the second type of connection trace 220 may be electrically connected to a source or drain of a transistor in the first substrate 210, for example, through a data signal line, the third type of connection trace 220 may be electrically connected to a power supply voltage signal line in the first substrate 210 (i.e., may be understood as being indirectly connected to a transistor), the fourth type of connection trace 220 may be electrically connected to a reference voltage signal line in the first substrate 210 (i.e., may be understood as being indirectly connected to a transistor), the fifth type of connection trace 220 may be electrically connected to a detection signal line in the first substrate 210 (i.e., may be understood as being indirectly connected to a transistor), and so on.
It should be noted that the connection trace 220 may be wound from the light emitting surface a of the first substrate 210 to the backlight surface b of the first substrate 210. Specifically, for example, after the connection trace 220 is connected to the light emitting surface a of the first substrate 210, the connection trace may be wound around the backlight surface b of the first substrate 210 along a side surface (referred to as a first side surface) of the lower frame of the first substrate 210.
The conductive pad 230 is located on the side of the backlight surface b of the first substrate 210, and is electrically connected to the connection trace 220 for connecting to a driving chip and/or a flexible circuit board.
The display panel of this application embodiment, display panel includes: the electronic device comprises a first substrate, wherein an electronic device is arranged in the first substrate; the first direction is a direction parallel to the plane of the first substrate; the conductive pad is positioned on one side of the backlight surface and is electrically connected with the connecting wire and used for connecting the driving chip and/or the flexible circuit board. In the embodiment of the application, the connection wiring connected with the electronic device in the first substrate is wound on the light emitting surface of the first substrate, or the pins of the electronic device in the first substrate are led to the backlight surface of the first substrate through the connection wiring, and then the connection wiring of the driving chip and/or the flexible circuit board and the backlight surface is bound through the conductive pad. Therefore, the driving chip and/or the flexible circuit board do not need to be bound in a larger space reserved in the lower frame of the display panel, the size of the lower frame of the display panel can be effectively reduced, the bending procedure is saved, and the yield loss caused by bending is avoided.
Fig. 4 is another schematic cross-sectional view of a display panel according to an embodiment of the disclosure. Fig. 5 is another schematic top view of a backlight surface of a display panel according to an embodiment of the disclosure. As shown in connection with fig. 4 and 5, according to some embodiments of the present application, optionally, the first substrate 210 may further include a plurality of conductive pads 610 disposed on the backlight surface b and spaced apart along the first direction X, where the plurality of conductive pads 610 are electrically connected to the plurality of connection traces 220 in a one-to-one correspondence. The conductive pad 610 is positioned in the orthographic projection of the conductive pad 230 on the first substrate 210, and the conductive pad 610 may be bonded to the driving chip and/or the flexible circuit board through the conductive pad 230. The light emitting surface a of the first substrate 210 may be provided with a package portion 410, and the first substrate 210 may be connected with the cover plate 420 through the package portion 410. Illustratively, the material of the encapsulation portion 410 may be a frit (frit), which is melted under high temperature and then solidified to form the encapsulation portion 410, so as to bond the first substrate 210 and the cover plate 420. Cover 420 includes, but is not limited to, a glass cover.
In a direction Z perpendicular to the plane of the first substrate, the orthographic projection of the conductive pad 610 on the first substrate 210 at least partially overlaps the orthographic projection of the package portion 410 on the first substrate 210. In some specific examples, for example, an orthographic projection of the conductive pad 610 on the first substrate 210 and an orthographic projection of the package portion 410 on the first substrate 210 may partially overlap. In other specific examples, for example, the front projection of the conductive pad 610 on the first substrate 210 may also be entirely located in the front projection of the package portion 410 on the first substrate 210.
In this way, the connection strength of the connection part of the first substrate and the packaging part is strong, so that the conductive pad is arranged in the area which at least partially overlaps with the orthographic projection of the packaging part on the first substrate, and the screen body can have sufficient supporting function after the driving chip and/or the flexible circuit board are bound with the conductive pad.
Fig. 6 is a schematic top view of the light emitting surface of the display panel according to the embodiment of the present application. As shown in fig. 6, according to some embodiments of the present application, the encapsulation portion 410 may be optionally located at an edge region B of the light-emitting surface a of the first substrate 210, the edge region B including at least one of a left side edge 510, a right side edge 520, an upper side edge 530, and a lower side edge 540. In the embodiment shown in fig. 5, the edge region B may include, for example, both a left side edge 510, a right side edge 520, an upper side edge 530, and a lower side edge 540.
As shown in connection with fig. 3, 5 and 6, in a direction Z perpendicular to the plane of the first substrate, the orthographic projection of the conductive pad 610 on the first substrate 210 may at least partially overlap with the orthographic projection of the encapsulation 410 on the left side edge 510, the right side edge 520, the upper side edge 530 and/or the lower side edge 540 on the first substrate 210. That is, the conductive pads 610 may be disposed not only at the lower side edge 540, but also at the left side edge 510, the right side edge 520, and/or the upper side edge 530, to which the embodiments of the present application are not limited.
Therefore, the positions of the conductive pads can be flexibly adjusted in the overlapping area of the packaging part, the flexibility of the design of the display panel can be improved while the screen body is ensured to have a sufficient supporting effect, and the mechanism interference is avoided.
Alternatively, the conductive pad 230 may be made of a first material having conductivity anisotropy, and the conductive pad 230 may be electrically connected with the plurality of connection traces 220 at the same time, according to some embodiments of the present application. Wherein, the anisotropic conduction refers to conduction in the Z direction of the first material, but non-conduction in the X and Y directions. The Z direction of the first material may be a pressing direction of the first material, and the X and Y directions may be directions perpendicular to the pressing direction. That is, the conductive pad 230 may be integrally formed, and the conductive pad 230 may be electrically connected to the plurality of connection traces 220 as a whole. The conductive pad 230 is conductive in a bonding direction (e.g., a direction Z perpendicular to a plane of the first substrate), and the conductive pad 230 is non-conductive in a lateral direction (e.g., the first direction X) and a longitudinal direction Y.
Since the conductive pad 230 is not conductive in the lateral direction, a short circuit does not occur between the plurality of connection traces 220 even though the conductive pad 230 is electrically connected to the plurality of connection traces 220 at the same time.
Therefore, the conductive pad is prepared from the first material with the conductivity anisotropy, so that the conductive pad is integrally formed while the short circuit of a plurality of connecting wires connected with the conductive pad is avoided, the production process of the display panel is simplified, and the production efficiency is improved.
In some specific embodiments, optionally, the first material includes, but is not limited to, anisotropic conductive film (Anisotropic Conductive Flim, ACF).
Therefore, the conductive pad is prepared by the anisotropic conductive adhesive film, so that the conductive pad is integrally formed while a plurality of connecting wires connected with the conductive pad are prevented from being short-circuited, the production process of the display panel is simplified, and the production efficiency is improved.
Fig. 7 is a schematic top view of a backlight surface of a display panel according to an embodiment of the disclosure. As shown in connection with fig. 6 and 7, the display panel 20 may optionally include one conductive pad 230, and the conductive pad 230 may be disposed at the lower side edge 540, or at the left side edge 510, the right side edge 520, or the upper side edge 530, according to some embodiments of the present application. The front projection of the conductive pad 230 on the first substrate 210 at least partially overlaps the front projection of the package portion 410 on the first substrate 210. In practical applications, the conductive pad 230 may be bonded to the flexible circuit board 30, and the driving chip 40 is bonded to the flexible circuit board 30, so as to implement COF design of the backlight surface of the first substrate 210.
Fig. 8 is a schematic top view of a backlight surface of a display panel according to an embodiment of the disclosure. As shown in connection with fig. 6 and 8, according to other embodiments of the present application, alternatively, unlike the embodiment shown in fig. 7, the conductive pads may include first conductive pads (not shown) and second conductive pads (not shown) arranged at intervals, and the conductive pad 230 may include first conductive pads 810 and second conductive pads 820 arranged at intervals, the first conductive pads being located in front projection of the first conductive pads 810 on the first substrate, the second conductive pads being located in front projection of the second conductive pads 820 on the first substrate, and the first conductive pads 810 being electrically connected with the second conductive pads 820. The first conductive pads and the first conductive pads 810 may be disposed at the lower side edge 540, or may be disposed at the left side edge 510, the right side edge 520, or the upper side edge 530. Similarly, the second conductive pads and 820 may be disposed on the lower side edge 540, the left side edge 510, the right side edge 520, or the upper side edge 530. The first conductive pad 810 may be used to connect the driving chip 40, i.e., to be bound with the driving chip 40. The second conductive pad 820 may be used to connect the flexible circuit board 30, i.e., to bind with the flexible circuit board 30.
In this way, the first conductive pad and the second conductive pad are provided, the first conductive pad is used for connecting with the driving chip, and the second conductive pad is used for connecting with the flexible circuit board, so as to realize COG design of the backlight surface of the first substrate 210.
It should be noted that the display panel 20 provided in the embodiments of the present application includes, but is not limited to, an OLED display panel.
Based on the display panel 20 provided in the above embodiment, correspondingly, the embodiment of the application also provides a preparation method of the display panel. The method for manufacturing a display panel is used, for example, to manufacture the display panel 20 provided in the above embodiment. Please refer to the following examples.
Fig. 9 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present application. As shown in fig. 9, the method for manufacturing a display panel provided in the embodiment of the present application may include the following steps S101 to S103.
S101, depositing a metal layer on the light emergent surface, the first side surface and the backlight surface of the first substrate.
Fig. 10 is an operation schematic diagram of a method for manufacturing a display panel according to an embodiment of the present application. As shown in fig. 10, in S101, a metal layer 100 may be first deposited on a partial region of a light emitting surface a, a first side surface c, and a partial region of a backlight surface b of a first substrate 210. The material of the metal layer is not limited, and the metal layer can be flexibly adjusted according to actual conditions. The first side c may be a side of the lower frame of the first substrate 210, abbreviated as a lower side.
S102, performing patterning treatment on the metal layer to obtain a plurality of connecting wires which are arranged at intervals along a first direction, wherein the connecting wires are wound from the light emitting surface to the backlight surface through the first side surface.
As shown in fig. 10, in S102, the metal layer 100 may be subjected to a patterning process, for example, a laser etching process, to obtain a plurality of connection traces 220 arranged at intervals along the first direction X. The connection trace 220 is wound from the light emitting surface a to the backlight surface b via the first side surface c.
S103, forming a conductive pad on one side of the backlight surface, wherein the conductive pad is electrically connected with the connecting wire and used for connecting the driving chip and/or the flexible circuit board.
As shown in fig. 10, in S103, a conductive pad 230 may be formed on a side where the backlight b is located. Taking the conductive pad 230 as an ACF example, for example, a coating process may be performed to form the conductive pad 230 on the side where the backlight surface b is located. Conductive pads 230 may be electrically connected with the connection traces 220, and the conductive pads 230 may be used to connect a driver chip and/or a flexible circuit board.
According to the manufacturing method of the display panel, the connecting wires connected with the electronic devices in the first substrate are wound on the light emitting surface of the first substrate, or pins of the electronic devices in the first substrate are led to the backlight surface of the first substrate through the connecting wires, and then the driving chip and/or the flexible circuit board are/is bound with the connecting wires of the backlight surface through the conductive pad, so that the size of the lower frame of the display panel can be effectively reduced, the screen occupation ratio is increased, the bending procedure is saved, and yield loss caused by bending is avoided.
As shown in connection with fig. 4, according to some embodiments of the present application, optionally, the light emitting surface a of the first substrate 210 may be provided with a packaging part 410, and the first substrate 210 may be connected with the cover plate 420 through the packaging part 410.
Correspondingly, S103, forming a conductive pad on the side where the backlight surface is located may specifically include the following steps: arranging a conductive pad in a region where the backlight surface and the packaging part at least partially overlap in a direction perpendicular to a plane where the first substrate is located; a conductive pad is formed on a side of the conductive pad facing away from the first substrate.
Specifically, as shown in connection with fig. 5, in a direction Z perpendicular to a plane in which the first substrate is located, the conductive pads 610 may be disposed in a region where the backlight surface b of the first substrate 210 at least partially overlaps the package portion 410. Conductive pad 230 is then formed on conductive pad 610, for example, by a coating process. In some specific examples, for example, an orthographic projection of the conductive pad 610 on the first substrate 210 and an orthographic projection of the package portion 410 on the first substrate 210 may partially overlap. In other specific examples, for example, the front projection of the conductive pad 610 on the first substrate 210 may also be entirely located in the front projection of the package portion 410 on the first substrate 210.
In this way, the connection strength of the connection part of the first substrate and the packaging part is strong, so that the conductive pad is arranged in the area which at least partially overlaps with the orthographic projection of the packaging part on the first substrate, and the screen body can have sufficient supporting function after the driving chip and/or the flexible circuit board are bound with the conductive pad.
As shown in connection with fig. 3, 5 and 6, in some specific embodiments, the encapsulation portion 410 may alternatively be located at an edge region B of the light-emitting surface a of the first substrate 210, the edge region B including at least one of the left side edge 510, the right side edge 520, the upper side edge 530 and the lower side edge 540. In a direction Z perpendicular to the plane of the first substrate, the orthographic projection of the conductive pad 610 on the first substrate 210 may at least partially overlap with the orthographic projection of the package 410 on the first substrate 210 at the left side edge 510, the right side edge 520, the upper side edge 530, and/or the lower side edge 540. That is, the conductive pads 610 may be disposed not only at the lower side edge 540, but also at the left side edge 510, the right side edge 520, and/or the upper side edge 530, to which the embodiments of the present application are not limited.
Therefore, the positions of the conductive pads can be flexibly adjusted in the overlapping area of the packaging part, the flexibility of the design of the display panel can be improved while the screen body is ensured to have a sufficient supporting effect, and the mechanism interference is avoided.
According to some embodiments of the present application, optionally, S103, forming a conductive pad on a side where the backlight surface is located may specifically include the following steps: and forming a first conductive pad and a second conductive pad which are arranged at intervals on one side of the backlight surface. Specifically, as shown in fig. 5 and 8, first conductive pads 810 and second conductive pads 820 may be formed at a side of the first substrate where the backlight surface is located, the first conductive pads 810 and the second conductive pads 820 being electrically connected. The first conductive pad 810 may be disposed at the lower side edge 540, or may be disposed at the left side edge 510, the right side edge 520, or the upper side edge 530. Similarly, the second conductive pad 820 may be disposed at the lower side edge 540, or at the left side edge 510, the right side edge 520, or the upper side edge 530. The first conductive pad 810 may be used to connect the driving chip 40, i.e., to be bound with the driving chip 40. The second conductive pad 820 may be used to connect the flexible circuit board 30, i.e., to bind with the flexible circuit board 30.
In this way, the first conductive pad and the second conductive pad are provided, the first conductive pad is used for connecting with the driving chip, and the second conductive pad is used for connecting with the flexible circuit board, so as to realize COG design of the backlight surface of the first substrate 210.
Based on the preparation method of the display panel provided by the embodiment, correspondingly, the embodiment of the application also provides a preparation method of the display device. The preparation method of the display device comprises the following steps: the display panel is formed according to the manufacturing method of the display panel provided in the above embodiment, that is, S101 to S103; and S104, binding a driving chip and/or a flexible circuit board on the conductive pad of the display panel.
Fig. 11 is a schematic operation diagram of a method for manufacturing a display device according to an embodiment of the present application. As shown in fig. 11, according to some embodiments of the present application, optionally, S104, binding a driving chip and/or a flexible circuit board on a conductive pad of a display panel may specifically include the following steps: after the driving chip is bound on the flexible circuit board, the flexible circuit board is bound with the conductive pad. Specifically, the driving chip 40 may be bonded to the flexible circuit board 30, and then the flexible circuit board 30 is bonded only to the conductive pad 230, thereby implementing the COF design of the backlight surface of the first substrate 210.
Fig. 12 is another operation schematic diagram of a method for manufacturing a display device according to an embodiment of the present application. As shown in fig. 12, according to other embodiments of the present application, unlike the embodiment shown in fig. 11, S104, binding a driving chip and/or a flexible circuit board on a conductive pad may specifically include the following steps: the conductive pads comprise first conductive pads and second conductive pads which are arranged at intervals, the driving chip is bound with the first conductive pads, and the flexible circuit board is bound with the second conductive pads. Specifically, the conductive pad 230 may include a first conductive pad 810 and a second conductive pad 820 arranged at intervals, and the first conductive pad 810 is electrically connected with the second conductive pad 820. The driving chip 40 may be bonded on the first conductive pad 810 and the flexible circuit board 30 may be bonded on the second conductive pad 820, thereby implementing COG design of the backlight surface of the first substrate 210.
Based on the display panel 20 provided in the above embodiment, correspondingly, the present application also provides a display device, including the display panel provided in the present application. Referring to fig. 13, fig. 13 is a schematic structural diagram of a display device according to an embodiment of the present application. Fig. 13 provides a display device 1000 including a display panel 20 provided in any of the embodiments described above. The embodiment of fig. 13 is described with respect to the display device 1000 by taking a mobile phone as an example, and it is to be understood that the display device provided in the embodiment of the present application may be a wearable product, a computer, a television, a vehicle-mounted display device, or other display devices having a display function, which is not particularly limited in this application. The display device provided in the embodiment of the present application has the beneficial effects of the display panel 20 provided in the embodiment of the present application, and the specific description of the display panel 20 in the above embodiments may be referred to specifically, and this embodiment is not repeated here.
In some embodiments, the display device 1000 may further include a flexible circuit board and a driving chip, which may be attached to the back surface of the display panel in the COF design or COG design described above.
In some embodiments, the display device 1000 may further include the above-mentioned packaging part 410 and the cover plate 420, and the display panel 20 may be connected to the cover plate 420 through the packaging part 410, and the specific connection relationship is described in detail above, which is not repeated here.
These embodiments are not all details described in detail in accordance with the embodiments described hereinabove, nor are they intended to limit the application to the specific embodiments described. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention and various modifications as are suited to the particular use contemplated. This application is to be limited only by the claims and the full scope and equivalents thereof.
It should be clear that the present application is not limited to the particular arrangements and processes described above and illustrated in the drawings. For the sake of brevity, a detailed description of known methods is omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method processes of the present application are not limited to the specific steps described and illustrated, and those skilled in the art can make various changes, modifications, and additions, or change the order between steps, after appreciating the spirit of the present application.
It should also be noted that the exemplary embodiments mentioned in this application describe some methods or systems based on a series of steps or devices. However, the present application is not limited to the order of the above-described steps, that is, the steps may be performed in the order mentioned in the embodiments, may be different from the order in the embodiments, or several steps may be performed simultaneously.
Aspects of the present application are described above with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems) and computer program products according to embodiments of the application. It will be understood that each block of the flowchart illustrations and/or block diagrams, and combinations of blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, enable the implementation of the functions/acts specified in the flowchart and/or block diagram block or blocks. Such a processor may be, but is not limited to being, a general purpose processor, a special purpose processor, an application specific processor, or a field programmable logic circuit. It will also be understood that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware which performs the specified functions or acts, or combinations of special purpose hardware and computer instructions.
In the foregoing, only the specific embodiments of the present application are described, and it will be clearly understood by those skilled in the art that, for convenience and brevity of description, the specific working processes of the systems, modules and units described above may refer to the corresponding processes in the foregoing method embodiments, which are not repeated herein. It should be understood that the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the present application, which are intended to be included in the scope of the present application.
Claims (9)
1. A display panel, comprising:
the electronic device comprises a first substrate, a second substrate and a third substrate, wherein an electronic device is arranged in the first substrate;
the plurality of connecting wires are arranged at intervals along a first direction, the connecting wires are electrically connected with the electronic device, the light emergent surface of the first substrate is wound on the backlight surface of the first substrate, and the first direction is a direction parallel to the plane where the first substrate is positioned;
the conductive pad is positioned on one side of the backlight surface and is electrically connected with the connecting wire and used for connecting a driving chip and/or a flexible circuit board;
the first substrate further comprises a plurality of conductive pads which are positioned on the backlight surface and are arranged at intervals along the first direction, the conductive pads are electrically connected with the connecting wires in a one-to-one correspondence manner, the conductive pads are positioned in the orthographic projection of the conductive pads on the first substrate, and the conductive pads are bound with the driving chip and/or the flexible circuit board through the conductive pads;
the light emergent surface of the first substrate is provided with a packaging part, and the first substrate is connected with the cover plate through the packaging part;
in a direction perpendicular to a plane of the first substrate, at least partially overlapping an orthographic projection of the conductive pad on the first substrate and an orthographic projection of the packaging part on the first substrate;
the encapsulation portion is located in an edge area of the light-emitting surface, and the edge area comprises at least one of a left side edge, a right side edge, an upper side edge and a lower side edge.
2. The display panel according to claim 1, wherein an orthographic projection of the conductive pad on the first substrate at least partially overlaps an orthographic projection of the encapsulation portion on the first substrate at the left side edge, the right side edge, the upper side edge and/or the lower side edge in a direction perpendicular to a plane in which the first substrate is located.
3. The display panel of claim 1, wherein the conductive pad is made of a first material having a conductive anisotropy, the conductive pad being electrically connected to a plurality of the connection traces simultaneously.
4. The display panel of claim 3, wherein the first material comprises an anisotropic conductive film.
5. The display panel of claim 1, wherein the conductive pad comprises a first conductive pad and a second conductive pad arranged at intervals, the first conductive pad being electrically connected with the second conductive pad;
the first conductive pad is used for being connected with the driving chip, and the second conductive pad is used for being connected with the flexible circuit board.
6. A method of manufacturing a display panel, wherein the display panel comprises the display panel according to any one of claims 1 to 5, the method comprising:
depositing a metal layer on the light emergent surface, the first side surface and the backlight surface of the first substrate;
patterning the metal layer to obtain a plurality of connecting wires which are arranged at intervals along a first direction, wherein the connecting wires are wound to the backlight surface from the light emitting surface through the first side surface;
and the conductive pad is formed on one side of the backlight surface, and is electrically connected with the connecting wire and used for connecting a driving chip and/or a flexible circuit board.
7. The method of claim 6, wherein the light-emitting surface of the first substrate is provided with a packaging part, and the first substrate is connected with the cover plate through the packaging part;
the forming the conductive pad on the side where the backlight surface is located specifically includes:
the conductive pads are arranged in the area where the backlight surface and the packaging part at least partially overlap in the direction perpendicular to the plane where the first substrate is arranged;
and forming the conductive pad on one side of the conductive pad, which is away from the first substrate.
8. A method of manufacturing a display device, the method comprising:
forming the display panel according to the method of claim 6 or claim 7;
and binding the driving chip and/or the flexible circuit board on the conductive pad of the display panel.
9. The method according to claim 8, wherein said bonding of said driver chip and/or said flexible circuit board on said conductive pads comprises, in particular:
binding the flexible circuit board with the conductive pad after the driving chip is bound on the flexible circuit board; or,
the conductive pads comprise first conductive pads and second conductive pads which are arranged at intervals, the driving chip is bound with the first conductive pads, and the flexible circuit board is bound with the second conductive pads.
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| CN118538110A (en) * | 2023-02-23 | 2024-08-23 | 成都辰显光电有限公司 | Display panel, manufacturing method thereof and spliced screen device |
| CN116381996A (en) * | 2023-06-02 | 2023-07-04 | 惠科股份有限公司 | Display panel, manufacturing method thereof and display device |
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