TW202029552A - Display panel and manufacturing method thereof - Google Patents

Abstract

A display panel includes a first substrate with a first surface and a second surface opposite to the first surface, and the first surface has a display region and a peripheral region outside of the display region; an active device layer disposed on the first surface; a plurality of metal pads disposed on the first surface and in the peripheral region; a driving circuit board disposed in a driving circuit region on the second surface; and a plurality of connecting structures respectively disposed on the metal pads. The metal pads electrically connect to the active device layer. The connecting structures extend from the first surface along a side surface, which is between the first surface and the second surface, to a plurality of contact pads on the driving circuit board on the second surface. The connecting structures respectively electrically connect to the metal pads in the peripheral region, and the connecting structures respectively electrically connect to the contact pads of the driving circuit board in the driving circuit region. A manufacturing method of the display panel is also provided.

Description

Display panel and manufacturing method thereof

The present invention relates to a display panel and a manufacturing method thereof, and more particularly to a display panel having a plurality of connection structures formed by three-dimensional spraying and a manufacturing method thereof.

With the development of display technology, the application range of display panels has become increasingly widespread. For example, in the early days, display panels were mostly used as screens for electronic devices (such as televisions, computers, mobile phones, etc.), but in the recent past, the application of display panels to wearable devices (such as watches, clothes, etc.) has become a trend.

In order to meet the needs of thinness, portability and narrow frame, the driving circuit (for example: flexible circuit board) is generally fabricated on the back of the display panel (relative to the display surface on the front), and then the flexible circuit is bent The board (for example: chip on film (COF)) transmits the driving signal from the back to the display surface. However, large bending of the flexible circuit board is likely to cause the signal line to break, and the connection between the display panel and the flexible circuit board requires space, so it is impossible to further reduce the frame or achieve the requirement of no frame.

The manufacturing method of the display panel of the present invention includes the following steps. A first substrate is provided, which has a first surface and a second surface opposite to the first surface, and the first surface has a display area and a peripheral area outside the display area. An active device layer is formed on the first surface. A plurality of metal pads are formed on the first surface in the peripheral area, and the metal pads are electrically connected to the active device layer. A drive circuit area on the second surface of the drive circuit board is arranged, and in a direction perpendicular to the first substrate, the drive circuit area overlaps the display area. A three-dimensional spraying process is performed to form a plurality of connecting structures respectively located on the first surface and the second surface of the first substrate. The connection structures are electrically connected to the metal pads in the peripheral area, and the connection structures are electrically connected to the drive circuit board in the drive circuit area.

The display panel of the present invention includes a first substrate having a first surface and a second surface opposite to the first surface. The first surface has a display area and a peripheral area outside the display area. The active device layer is disposed on the first surface. The metal pads are arranged on the first surface, the peripheral area, the driving circuit area where the driving circuit board is arranged on the second surface, and a plurality of connection structures are respectively arranged on the metal pads. The metal pad is electrically connected to the active device layer. In the direction perpendicular to the first substrate, the driving circuit area overlaps the display area. These connection structures respectively extend from the first surface along the side surface between the first surface and the second surface to a plurality of connection pads on the driving circuit board of the second surface. The connection structures are respectively electrically connected to the metal pads in the peripheral area, and the connection structures are respectively electrically connected to the connection pads of the drive circuit board in the drive circuit area.

The display panel of the present invention includes a first substrate having a first surface and a second surface opposite to the first surface. The first surface has a display area and a peripheral area outside the display area. The active device layer is disposed on the first surface. The metal pads are arranged on the first surface, the peripheral area, the driving circuit area where the driving circuit board is arranged on the second surface, and a plurality of connection structures are respectively arranged on the metal pads. The metal pad is electrically connected to the active device layer. In the direction perpendicular to the first substrate, the driving circuit area overlaps the display area. The connection structures are electrically connected to the metal pads in the peripheral area, and the connection structures are electrically connected to the connection pads of the drive circuit board in the drive circuit area. The first substrate has a side surface between the first surface and the second surface, and further has a first inclined surface between the first surface and the side surface. The connection structures respectively extend from the metal pads to the second surface along the first inclined surface and the side surface.

The display panel of the present invention includes a first substrate having a first surface and a second surface opposite to the first surface. The first surface has a display area and a peripheral area outside the display area. The active device layer is disposed on the first surface. The metal pads are arranged on the first surface, the peripheral area, the driving circuit area where the driving circuit board is arranged on the second surface, and a plurality of connection structures are respectively arranged on the metal pads. The metal pad is electrically connected to the active device layer. In the direction perpendicular to the first substrate, the driving circuit area overlaps the display area. The connection structures are electrically connected to the metal pads in the peripheral area, and the connection structures are electrically connected to the connection pads of the drive circuit board in the drive circuit area. The first substrate has a side surface between the first surface and the second surface, and further has a second inclined surface between the second surface and the side surface. The connection structures respectively extend from the metal pads to the second surface along the side surface and the second inclined surface.

Based on the above, in the display panel and/or its manufacturing method of an embodiment of the present invention, due to the active device layer on the first surface, it can be electrically connected to the driving circuit of the non-display surface simply through the connection structure formed by three-dimensional spraying board. Therefore, the manufacturing method of the display panel can be simplified and the cost can be reduced. In addition, the display panel does not need to bend the connection structure, and the active components and pixel units on the first surface can be electrically connected to the driving circuit board on the second surface, thereby reducing the possibility of the connection structure breaking and improving the display panel. Strength of the structure, improve the electrical characteristics of the connection structure and the performance of the display panel. In addition, the display panel does not have the space required for the bending connection structure. In this way, the size of the peripheral area can be further reduced, and the requirement of reducing the frame of the display panel can be achieved.

One of the objectives of the present invention is to reduce the size of the peripheral area.

One of the objectives of the present invention is to achieve the requirement of reducing the frame size.

One of the objectives of the present invention is to reduce the possibility of fracture of the connection structure.

One of the objectives of the present invention is to improve the structural strength of the display panel.

One of the objectives of the present invention is to improve the performance of the display panel.

One of the objectives of the present invention is to simplify the manufacturing method of the display panel.

One of the objectives of the present invention is to reduce the cost of the display panel.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings. As those skilled in the art would realize, the described embodiments may be modified in various different ways without departing from the spirit or scope of the present invention.

In the drawings, the thickness of each element and the like are exaggerated for clarity. Throughout the specification, the same reference numerals denote the same elements. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being “on”, or “connected to,” or “overlapped with, another element,” it may be directly on another element. On or connected to another element, or intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements. As used herein, "connected" can refer to physical and/or electrical connections.

It should be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers and/or parts, these elements, components, regions, and/or Or part should not be restricted by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Therefore, the “first element,” “component,” “region,” “layer,” or “portion” discussed below may be referred to as a second element, component, region, layer or portion without departing from the teachings herein.

The terminology used here is only for the purpose of describing specific embodiments and is not limiting. As used herein, unless the content clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms, including "at least one." "Or" means "and/or". As used herein, the term "and/or" includes any and all combinations of one or more of the related listed items. It should also be understood that when used in this specification, the terms "including" and/or "including" designate the presence of the features, regions, wholes, steps, operations, elements, and/or components, but do not exclude one or more The existence or addition of other features, regions as a whole, steps, operations, elements, components, and/or combinations thereof.

In addition, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship between one element and another element, as shown in the figure. It should be understood that relative terms are intended to include different orientations of the device other than those shown in the figures. For example, if the device in one figure is turned over, elements described as being on the "lower" side of other elements will be oriented on the "upper" side of the other elements. Therefore, the exemplary term "lower" may include an orientation of "lower" and "upper", depending on the specific orientation of the drawing. Similarly, if the device in one figure is turned over, elements described as "below" or "beneath" other elements will be oriented "above" the other elements. Thus, the exemplary terms "below" or "below" can include an orientation of above and below.

As used herein, "about", "substantially", "substantially", or "approximately" includes the stated value and the average value within the acceptable deviation range of the specific value determined by a person of ordinary skill in the art, taking into account all The measurement in question and the specific number of errors associated with the measurement (ie, the limitations of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of related technologies and the present invention, and will not be interpreted as idealized or excessive The formal meaning, unless explicitly defined as such in this article.

The exemplary embodiments are described herein with reference to cross-sectional views that are schematic diagrams of idealized embodiments. Therefore, a change in the shape of the diagram as a result of, for example, manufacturing technology and/or tolerance can be expected. Therefore, the embodiments described herein should not be interpreted as being limited to the specific shape of the area as shown herein, but include, for example, shape deviations caused by manufacturing. For example, areas shown or described as flat may generally have rough and/or non-linear characteristics. In addition, the acute angles shown may be rounded. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to show the precise shape of the regions, and are not intended to limit the scope of the claims.

FIG. 1A is a schematic top view of a first surface of a display panel according to an embodiment of the present invention. For the convenience of description and observation, FIG. 1A only schematically illustrates some components. FIG. 1B is a schematic top view of the second surface of the display panel according to an embodiment of the present invention. For the convenience of description and observation, FIG. 1B only schematically illustrates some components. Fig. 2 is a schematic cross-sectional view taken along the section line A-A' of Fig. 1A. 1A, 1B and FIG. 2, in this embodiment, the display panel 10 includes a first substrate 100 having a first surface 101 and a second surface 102 opposite to the first surface 101, and the first surface 101 has a display area 12 and the peripheral area 14 surrounding the display area 12, the active device layer 130 is disposed on the first surface 101, a plurality of metal pads 120 are disposed on the first surface 101, and are located in the peripheral area 14, and the driving circuit board 300 is disposed The driving circuit area 16 and the connection structures 140 on the second surface 102 are respectively disposed on the metal pads 120. These metal pads 120 are electrically connected to the active device layer 130. In addition, in the direction perpendicular to the first substrate 100, the driving circuit area 16 corresponds to the overlapping display area 12. The connection structures 140 respectively extend from the first surface 101 along the side surface 103 between the first surface 101 and the second surface 102 to the connection pads 320 on the driving circuit board 300 of the second surface 102. Specifically, the connection structures 140 are respectively electrically connected to the metal pads 120 in the peripheral area 14, and the connection structures 140 are respectively electrically connected to the connection pads 320 of the driving circuit board 300 in the driving circuit area 16. The display panel 10 further includes a second substrate 200 disposed on the first surface 101 of the first substrate 100 and located in the display area 12, and the liquid crystal layer LC is disposed between the first substrate 100 and the second substrate 200 and located on the display area. Zone 12. In this embodiment, the display panel 10 is, for example, a display panel applied to a smart watch or other wearable devices. The following uses a smart watch as an example to briefly describe the manufacturing method of the display panel 10.

Please refer to FIG. 1A and FIG. 2. First, a first substrate 100 is provided. The first substrate 100 has a first surface 101 and a second surface 102 opposite to the first surface 101. A display area 12 and a peripheral area 14 surrounding the display area 12 and located outside the display area 12 may be defined on the first surface 101. In other words, the first surface 101 can be used as the front and/or display surface of the display panel 10, and the second surface 102 is the back and/or non-display surface, but not limited to this. The material of the first substrate 100 is, for example, glass, quartz, plastic, organic polymer, opaque/reflective material (for example: conductive material, metal, wafer, ceramic, or other applicable materials) or other applicable materials material. In some embodiments, the first substrate 100 may also be a flexible substrate, the material of which includes organic polymers, such as polyimide (PI), polyethylene naphthalate (PEN) or Other suitable materials are not limited to this invention.

Next, an active device layer 130 is formed on the first surface 101 of the first substrate 100. For example, the active device layer 130 may be a pixel array disposed on the first substrate 100, so that the first substrate 100 becomes a pixel array substrate. The active device layer 130 may have a single-layer or multi-layer structure, including multiple thin-film transistors (not shown), multiple insulating layers (not shown), and multiple signal lines (not shown). For clarity of illustration and convenience of description, FIG. 2 schematically shows only one film layer. The thin film transistor is, for example, a low temperature poly-Si thin film transistor (LTPS) or an amorphous silicon thin film transistor (a-Si), but the present invention is not limited thereto. The thin film transistor includes a gate electrode, a semiconductor channel layer, and a source electrode and a drain electrode (not shown) electrically connected to the semiconductor channel layer. In this embodiment, the semiconductor channel layer includes amorphous silicon, polycrystalline silicon, microcrystalline silicon, single crystal silicon, organic semiconductor materials, oxide semiconductor materials (for example: indium zinc oxide, indium germanium zinc oxide, or other suitable (Or a combination of the above), or other suitable materials, or containing dopants in the above materials, or a combination of the above, but the present invention is not limited thereto. The gate electrode can be made of metal materials, but the present invention is not limited thereto. According to other embodiments, the gate electrode, the source electrode and the drain electrode can also be made of other suitable conductive materials. For example: alloys, nitrides of metallic materials, oxides of metallic materials, oxynitrides of metallic materials, or stacked layers of metallic materials and other conductive materials. The signal line is, for example, a scan line, a data line, a common electrode line, a power line or other suitable lines, and the present invention is not limited thereto. Generally speaking, based on the consideration of conductivity, the signal line is made of metal materials, but other suitable conductive materials can also be used. For example: alloys, nitrides of metallic materials, oxides of metallic materials, oxynitrides of metallic materials, or stacked layers of metallic materials and other conductive materials.

Then, a plurality of metal pads 120 are formed on the first surface 101 of the first substrate 100. These metal pads 120 are located in the peripheral region 14 and are electrically connected to the active device layer 130. For example, the active device layer 130 may be disposed in the display area 12 on the first surface 101 and extend to the peripheral area 14. The metal pad 120 is disposed in the peripheral region 14 and directly contacts the signal line (not shown) of the active device layer 130 in the peripheral region 14 to be electrically connected to the thin film transistor, but the invention is not limited thereto. Generally speaking, based on the consideration of conductivity, the metal pad 120 is made of a metal material, but other suitable conductive materials may also be used. For example: alloys, nitrides of metallic materials, oxides of metallic materials, oxynitrides of metallic materials, or stacked layers of metallic materials and other conductive materials. In some embodiments, the thickness of the metal pad 120 is 0.6 μm to 0.7 μm, but the invention is not limited thereto.

Please refer to FIGS. 1B and 2, and then, a driving circuit board 300 is disposed on the second surface 102 of the substrate 100. For example, a driving circuit area 16 may be defined on the second surface 102, and in a direction perpendicular to the first substrate 100, the driving circuit area 16 overlaps the display area 12. In more detail, please refer to FIGS. 1A, 1B, and 2 at the same time. The driving circuit area 16 is located on the back of the substrate 100 and can completely overlap the display area 12. In a top view, the outer edge of the driving circuit area 16 is located in the display area. Within the outer edge of 12. In other words, the driving circuit area 16 does not overlap the peripheral area 14.

In this embodiment, the driving circuit board 300 is disposed in the driving circuit area 16 without overlapping the peripheral area 14. For example, the driving circuit board 300 may completely overlap the driving circuit area 16, but the invention is not limited to this. In some embodiments, the outer edge of the orthographic projection of the driving circuit board 300 on the first substrate 100 may be within the outer edge of the orthographic projection of the driving circuit area 16 on the first substrate 100. The driving circuit board 300 is, for example, a flexible printed circuit board (flexible printed circuit board, flexible PCB) or a chip on film (COF) substrate. The driving circuit board 300 includes a flexible substrate 310 and a connection pad 320 disposed on the flexible substrate 310. In some embodiments, the wafer 330 can also be selectively disposed on the flexible substrate 310. The chip 330 may be electrically connected to the connection pad 320 to provide a driving signal, but is not limited to this.

In this embodiment, before the step of setting the driving circuit board 300, it may further include forming an adhesive layer 180 in the driving circuit area 16 on the second surface 102 first. Next, the driving circuit board 300 is disposed on the adhesive layer 180 and the driving circuit board 300 is fixed to the second surface 102 through a thermal pressing process. In this way, the driving circuit board 300 can be reduced from loosening or falling off, so as to improve the structural strength of the display panel 10.

It should be noted that a three-dimensional spraying process (not shown) is then performed to form a plurality of connecting structures 140 on the first surface 101 and the second surface 102 of the first substrate 100, respectively. For example, the steps of the three-dimensional spraying procedure include spraying a metal aerosol material (not shown) on the first surface 101, the second surface 102, and between the first surface 101 and the second surface 102 of the first substrate 100. On the side 103. The metal aerosol material directly covers the metal pad 120 and the plurality of connection pads 320 of the corresponding driving circuit 300. In this way, the connecting structure 140 can be simply formed on the two surfaces 101, 102 and the side surface 103 of the first substrate 100 to reduce the use of photomasks and save the time and cost of photolithography. Therefore, the manufacturing method of the display panel 10 can be simplified and the manufacturing cost of the display panel 10 can be reduced.

In detail, the method of spraying the metal aerosol material is, for example, spraying the metal aerosol material on the corresponding metal pad 120 and the connecting pad 320 through aerosol jet printing to form multiple linear structures. It extends from the first surface 101 to the second surface 102. In this embodiment, the material of the metal aerosol material includes silver paste, but it is not limited thereto. In some embodiments, the material of the metal aerosol material may also include other suitable conductive materials.

Next, the step of the three-dimensional spraying procedure further includes curing the metal aerosol material forming a plurality of linear structures to form a plurality of strip-shaped connecting structures 140. It is worth noting that, compared with the conventional metal material deposition method, aerosol spray printing can perform local material deposition and local curing at the same time. In this way, aerosol spray printing can achieve rapid and instant solidification in-situ curing to meet the requirements of fine printing. In this way, the connecting structure 140 can be three-dimensionally arranged on the planar first surface 101 and the second surface 102 and the non-planar junctions intersecting the surfaces 101, 102 and the side surface 103. Therefore, the connection structure 140 can be simply provided, which simplifies the manufacturing method of the display panel 10 and reduces the manufacturing cost of the display panel 10.

In addition, aerosol spray printing can also provide high-precision spraying requirements similar to the conventional lithographic etching process. For example, a three-dimensional spraying process can form a plurality of connection structures 140 separated from each other, and the connection structures 140 are electrically connected to the metal pads 120 in the peripheral region 14 respectively. The connection structures 140 are respectively electrically connected to the connection pads 320 on the driving circuit board 300 in the driving circuit area 16. In detail, the connection structure 140 can directly contact the connection pad 320 on the driving circuit board 300.

Among these connecting structures 140, the distance between two adjacent connecting structures 140 is 20 to 60 microns. In addition, the width of each connection structure 140 is 40 micrometers to 80 micrometers. Under the above settings, the three-dimensional spraying process using aerosol spray printing can meet the requirements of fine line width and fine line spacing, so as to further reduce the distance between the metal pads 120. In this way, the size of the peripheral area 14 can be reduced, and the requirement of reducing the frame of the display panel 10 can be achieved.

In short, since the three-dimensional spraying process can simply form the connecting structures 140 on the metal pads 120 on the first surface 101, and these connecting structures 140 can extend from the first surface 101 to the second surface 102 along the side surface 103. On the multiple connection pads 320 on the driving circuit board 300. Therefore, the three-dimensional spraying procedure can also simplify the manufacturing method of the display panel 10 and reduce the cost. In addition, the active device layer 130 on the first surface 101 can receive the driving circuit from the driving circuit board 300 through the connection structure 140. With the above arrangement, the display panel 10 does not need to bend the connection structure 140, and the active elements and pixel units on the display surface can be electrically connected to the driving circuit of the non-display surface, thereby reducing the possibility of the connection structure 140 being broken. The structural strength of the display panel 10 is improved, the electrical characteristics of the connection structure 140 and the performance of the display panel 10 are improved. In addition, since the high-precision connection structure 140 can be formed by three-dimensional spraying, in addition to reducing the line distance between the connection structures 140, there is no need to reserve additional space for the press-fit connection structure 140 to the first substrate 100. There will be room for bending the connecting structure 140. In this way, the size of the peripheral area 14 can be further reduced, and the requirement of reducing the frame of the display panel 10 can be achieved.

Please continue to refer to FIG. 1B and FIG. 2, the manufacturing method of the display panel 10 further includes providing a second substrate 200. The second substrate 200 is oppositely disposed on the first surface 101 of the first substrate 100 and located in the display area 12. The second substrate 200 is, for example, a cover plate of the display panel 10 or a color filter substrate, but is not limited to this. The material of the second substrate 200 is, for example, glass, quartz, plastic, organic polymer, opaque/reflective material (for example: conductive material, metal, wafer, ceramic, or other applicable materials) or other applicable materials material.

Next, a liquid crystal layer LC is provided. The liquid crystal layer LC is disposed between the first substrate 100 and the second substrate 200 and is located in the display area 12. Before the step of disposing the liquid crystal layer LC between the first substrate 100 and the second substrate 200, the method further includes disposing a sealant 160 between the first substrate 100 and the second substrate 200. The sealant 160 is located in the display area 12. The liquid crystal layer LC can be surrounded by the sealant 160 in the display area 12. In this embodiment, the liquid crystal layer LC is, for example, a display medium layer including a plurality of liquid crystal molecules (not shown), but it is not limited thereto.

Generally speaking, after the first substrate 100 and the second substrate 200 are assembled, a display motherboard (not shown) is formed. Then, the display motherboard is cut through the separation process to separate the display panel 10 from the display motherboard, but the present invention is not limited to this. The display panel 10 shown in FIG. 1A, FIG. 1B and FIG. 2 has been separated from the display motherboard and has a non-rectangular shape. For example, the first substrate 100 may have a sky lantern shape with a circular upper part and a rectangular lower part, but it is not limited to this. In other embodiments, the first substrate 100 may also be rectangular, circular, polygonal or irregular in shape according to user requirements. The second substrate 200 can be cut out through the same or different separation process as the first substrate 100. The second substrate 200 and the first substrate 100 may have the same appearance or different appearances, and the present invention is not limited thereto. In this embodiment, the method of performing the separation procedure includes laser cutting or knife cutting.

In addition, the first substrate 100 and the second substrate 200 may be separated after the step of providing the liquid crystal layer LC. In other embodiments, the separation process of the display panel 10 may be performed first, and then the liquid crystal layer LC is disposed between the first substrate 100 and the second substrate 200, and the present invention is not limited to this. So far, the production of the display panel 10 has been completed.

In short, due to the active device layer 130 on the first surface 101 (for example: the display surface), the connection structure 140 formed by three-dimensional spraying can be electrically connected to the driving circuit on the second surface 102 (for example: the non-display surface) Board 300. Therefore, the display panel 10 can reduce the size of the peripheral area 14 to achieve the requirement of reducing the frame, without bending the connection structure 140 to reduce the possibility of the connection structure 140 breaking, and improve the structural strength and performance of the display panel 10, and can also simplify The manufacturing method of the display panel 10 reduces the cost.

The following embodiments follow the component numbers and part of the content of the previous embodiments, where the same numbers are used to represent the same or similar components. For the omission of the same technical content, please refer to the aforementioned embodiments. The following embodiments will not Repeat it.

3 is a schematic partial enlarged cross-sectional view of a display panel according to another embodiment of the invention. The display panel 10A shown in this embodiment is similar to the display panel 10 shown in FIG. 2, and the main difference is that the metal pad 120 is aligned with the side surface 103 of the first substrate 100. For example, the metal pad 120 may be formed on the edge of the first substrate 100 such that the sidewall 123 of the metal pad 120 is aligned with the side surface 103 of the first substrate 100. With the above arrangement, the connection structure 140 can be further electrically connected to the metal pad 120 on the sidewall 123 of the metal pad 120, thereby increasing the contact area between the connection structure 140 and the metal pad 120. In this way, the resistance value between the connection structure 140 and the metal pad 120 can be reduced, thereby improving the electrical characteristics and performance of the display panel 10A. In addition, the display panel 10A can also achieve similar technical effects as the above-mentioned embodiments.

4A is a schematic partial enlarged cross-sectional view of a display panel according to another embodiment of the invention. The display panel 10B shown in this embodiment is similar to the display panel 10A shown in FIG. 3. The main difference is that the first substrate 100A of the display panel 10B further has a second inclined surface 104. For example, the first substrate 100A has a side surface 103 located between the first surface 101 and the second surface 102, and the second inclined surface 104 is located between the second surface 102 and the side surface 103. The connecting structure 140 extends from the metal pad 120 to the second surface 102 along the side surface 103 and the second inclined surface 104. Under the above-mentioned arrangement, compared with the vertical junction angle between the second surface 102 and the side surface 103 in FIG. 3, since the second inclined surface 104 between the second surface 102 and the side surface 103 can provide a gentler angle of rotation, The second inclined surface 104 can reduce stress concentration, further reduce the probability of the connection structure 140 breaking, and improve the structural strength and performance of the display panel 10B. In addition, the display panel 10B can also achieve similar technical effects as the above-mentioned embodiments.

4B is a schematic partial enlarged cross-sectional view of a display panel according to another embodiment of the invention. The display panel 10C shown in this embodiment is similar to the display panel 10A shown in FIG. 3. The main difference is that the first substrate 100B of the display panel 10C further has a first inclined surface 105. For example, the first inclined surface 105 of the first substrate 100A is located between the first surface 101 and the side surface 103. One end of the metal pad 120 is located at the junction of the first surface 101 and the first inclined surface 105. The connecting structure 140 extends from the metal pad 120 to the second surface 102 along the first inclined surface 105 and the side surface 103. Under the above arrangement, the first inclined surface 105 can reduce the concentration of stress, further reduce the probability of the connection structure 140 breaking, and improve the structural strength and performance of the display panel 10C. In addition, the display panel 10C can also achieve similar technical effects as the above-mentioned embodiments.

4C is a schematic partial enlarged cross-sectional view of a display panel according to still another embodiment of the invention. The display panel 10D shown in this embodiment is similar to the display panel 10A shown in FIG. 3. The main difference is that the first substrate 100B of the display panel 10D further has a first inclined surface 105 and a second inclined surface 104. For example, the first inclined surface 105 of the first substrate 100A is located between the first surface 101 and the side surface 103. The second inclined surface 104 is located between the second surface 102 and the side surface 103. One end of the metal pad 120 is located at the junction of the first surface 101 and the first inclined surface 105. The connecting structure 140 extends from the metal pad 120 to the second surface 102 along the first inclined surface 105, the side surface 103 and the second inclined surface 104. Under the above arrangement, the first inclined surface 105 and the second inclined surface 104 can reduce stress concentration, further reduce the probability of the connection structure 140 breaking, and improve the structural strength and performance of the display panel 10D. In addition, the display panel 10D can also achieve similar technical effects as the above-mentioned embodiments.

5 is a schematic partial enlarged cross-sectional view of a display panel according to another embodiment of the invention. The display panel 10E shown in this embodiment is similar to the display panel 10 shown in FIG. 2, and the main difference is that the driving circuit board 300 is directly disposed on the second surface 102 of the second substrate 200. In the direction perpendicular to the first substrate 100, the driving circuit board 300 overlaps the liquid crystal layer LC and the second substrate 200. In addition, the first substrate 100B of the display panel 10D further has a first inclined surface 105 and a second inclined surface 104. For example, the first inclined surface 105 of the first substrate 100A is located between the first surface 101 and the side surface 103. The second inclined surface 104 is located between the second surface 102 and the side surface 103. The connecting structure 140 respectively extends from the metal pad 120 to the second surface 102 along the first inclined surface 105, the side surface 103 and the second inclined surface 104. In this embodiment, the connecting structure 140 on the second surface 102 can extend to the driving circuit board 300, but does not directly contact the driving circuit board 300 and the contact pads 320 thereon. The display panel 10D further includes a wire 150 to electrically connect the connection structure 140 to the contact pad 320. The wire 150 is made of metal materials, but other suitable conductive materials can also be used, and the present invention is not limited thereto. Under the above setting, the step of setting the adhesive layer (as shown in Fig. 2) can be omitted, so as to further save the heat pressing process. Therefore, the size of the external circuit board can be reduced. In addition, since the thickness of the connection pad 320 and the flexible substrate 310 have a height difference with the second surface 102, the connection structure 140 may be damaged and broken during the process of bonding the connection structure 140 to the connection pad 320. In this way, by electrically connecting the connection structure 140 to the connection pad 320 through the wire 150, the possibility of damage to the connection structure 140 during the bonding process can be reduced, and the structural strength and performance of the display panel 10E can be improved. In addition, the display panel 10E can also achieve similar technical effects to the above-mentioned embodiments.

6A is a partially enlarged photograph of the connection structure on the first surface of the display panel according to an embodiment of the invention. 6B is a partially enlarged photograph of the connection structure on the side of the display panel according to an embodiment of the invention. 6A and 6B, the connection structure 140 formed by the three-dimensional spraying process can be electrically connected to the metal pad 120. Two adjacent connection structures 140 can meet the requirements of fine line spacing and fine line width. For example, the signal line 132 of the active device layer can be arranged between the line spacing of two adjacent connection structures 140. The signal line 132 is electrically connected to the metal pad 120. In addition, the connecting structure 140 can extend from the first surface 101 to the second surface 102 along the first inclined surface 105, the side surface 103, and the second inclined surface 104. Under the above configuration, the connection structure 140 formed by the three-dimensional spraying process has good uniformity, line width and line spacing, and the probability of the connection structure 140 being broken can be reduced. Therefore, the display panel 10F can have good structural strength and performance, and can reduce the occupied space to reduce the frame to meet the requirement of narrow frame.

In summary, in the display panel and/or its manufacturing method of an embodiment of the present invention, due to the active device layer on the first surface of the display panel, it can be electrically connected to the non-display surface simply through the connection structure formed by three-dimensional spraying. The drive circuit board. Therefore, the manufacturing method of the display panel can be simplified and the cost can be reduced. In addition, the display panel does not need to bend the connection structure, and the active components and pixel units on the first surface can be electrically connected to the driving circuit board on the second surface, thereby reducing the possibility of the connection structure breaking and improving the display panel. Strength of the structure, improve the electrical characteristics of the connection structure and the performance of the display panel. In addition, because the high-precision connection structure can be formed by three-dimensional spraying, in addition to reducing the line distance between the connection structures, there is no need to reserve additional space for the press-fit connection structure to the first substrate, and there will be no bending Connect the space of the structure. In this way, the size of the peripheral area can be further reduced, and the requirement of reducing the frame of the display panel can be achieved.

In addition, the first substrate may further have a first inclined surface located between the first surface and the side surface, and a second inclined surface located between the second surface and the side surface. In this way, the first inclined surface and/or the second inclined surface can reduce stress concentration, further reduce the probability of the connection structure breaking, and improve the structural strength and performance of the display panel. In addition, the metal pads can also be aligned with the side surface of the first substrate. In this way, the contact area between the connection structure and the metal pad can be increased to reduce the resistance value, thereby improving the electrical characteristics and performance of the display panel. In addition, the connection structure can be electrically connected to the connection pad through a wire, so as to reduce the possibility of damage to the connection structure during the bonding process, and to improve the structural strength and performance of the display panel.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be determined by the scope of the attached patent application.

10, 10A, 10B, 10C, 10D, 10E, 10F: display panel 12: Display area 14: Surrounding area 16: drive circuit area 100, 100A, 100B, 100C: first substrate 101: first surface 102: second surface 103: side 104: second slope 105: first slope 120: Metal pad 123: The side wall of the metal pad 130: active component layer 132: signal line 140: connection structure 150: wire 160: frame glue 180: Adhesive layer 200: second substrate 300: drive circuit board 310: Flexible substrate 320: connection pad 330: chip A-A’: Section line LC: liquid crystal layer

FIG. 1A is a schematic top view of a first surface of a display panel according to an embodiment of the invention. FIG. 1B is a schematic top view of the second surface of the display panel according to an embodiment of the invention. Fig. 2 is a schematic cross-sectional view taken along the section line A-A' of Fig. 1A. 3 is a schematic partial enlarged cross-sectional view of a display panel according to another embodiment of the invention. 4A is a schematic partial enlarged cross-sectional view of a display panel according to another embodiment of the invention. 4B is a schematic partial enlarged cross-sectional view of a display panel according to another embodiment of the invention. 4C is a schematic partial enlarged cross-sectional view of a display panel according to still another embodiment of the invention. 5 is a schematic partial enlarged cross-sectional view of a display panel according to another embodiment of the invention. 6A is a partially enlarged photograph of the connection structure on the first surface of the display panel according to an embodiment of the invention. 6B is a partially enlarged photograph of the connection structure on the side of the display panel according to an embodiment of the invention.

10: Display panel

12: Display area

14: Surrounding area

16: drive circuit area

100: first substrate

101: first surface

102: second surface

103: side

120: Metal pad

130: active component layer

140: connection structure

160: frame glue

180: Adhesive layer

200: second substrate

300: drive circuit board

310: Flexible substrate

320: connection pad

330: chip

A-A’: Section line

LC: liquid crystal layer

Claims (10)

A manufacturing method of a display panel includes: Providing a first substrate having a first surface and a second surface opposite to the first surface, the first surface having a display area and a peripheral area outside the display area; Forming an active device layer on the first surface; Forming a plurality of metal pads on the first surface in the peripheral area, the metal pads being electrically connected to the active device layer; Disposing a drive circuit board on a drive circuit area on the second surface, and in a direction perpendicular to the first substrate, the drive circuit area overlaps the display area; and Performing a three-dimensional spraying process to form a plurality of connecting structures on the first surface and the second surface of the first substrate, The connection structures are respectively electrically connected to the metal pads in the peripheral area, and the connection structures are respectively electrically connected to the driving circuit board in the driving circuit area. According to the manufacturing method of the display panel described in item 1 of the scope of patent application, the steps of the three-dimensional spraying procedure include: Spray a metal aerosol material on the first surface, the second surface, and the side surface between the first surface and the second surface of the first substrate, and the metal aerosol material directly covers the metal pads And corresponding multiple connection pads of the driving circuit; and The metal aerosol material is cured to form the connection structures. The manufacturing method of the display panel described in item 1 of the scope of patent application further includes: Providing a second substrate disposed on the first surface of the first substrate and located in the display area; A liquid crystal layer is provided, which is disposed between the first substrate and the second substrate, and is located in the display area. A display panel including: A first substrate has a first surface and a second surface opposite to the first surface, the first surface has a display area and a peripheral area outside the display area; An active device layer is disposed on the first surface; A plurality of metal pads are arranged on the first surface and located in the peripheral area, and the metal pads are electrically connected to the active device layer; A drive circuit board is arranged on a drive circuit area on the second surface, and in a direction perpendicular to the first substrate, the drive circuit area overlaps the display area; and A plurality of connection structures are respectively disposed on the metal pads, and the connection structures respectively extend from the first surface along a side surface between the first surface and the second surface to the driving circuit board of the second surface On multiple connection pads, The connection structures are electrically connected to the metal pads in the peripheral area, and the connection structures are electrically connected to the connection pads of the drive circuit board in the driving circuit area. According to the display panel described in claim 4, the metal pads are aligned with the side surface of the first substrate. According to the display panel described in item 4 of the scope of patent application, the distance between two adjacent connecting structures is 20 to 60 microns, and the width of each connecting structure is 40 to 80 microns. The display panel described in item 4 of the scope of patent application further includes: A second substrate is disposed on the first surface of the first substrate and located in the display area; and A liquid crystal layer is disposed between the first substrate and the second substrate, and is located in the display area, The first substrate is in the shape of a sky lantern. In the display panel described in item 4 of the scope of patent application, the connection structures directly contact the connection pads on the driving circuit board, and the driving circuit board is a flexible printed circuit board. A display panel including: A first substrate has a first surface and a second surface opposite to the first surface, the first surface has a display area and a peripheral area outside the display area; An active device layer is disposed on the first surface; A plurality of metal pads are arranged on the first surface and located in the peripheral area, and the metal pads are electrically connected to the active device layer; A drive circuit board is arranged on a drive circuit area on the second surface, and in a direction perpendicular to the first substrate, the drive circuit area overlaps the display area; and A plurality of connection structures are respectively disposed on the metal pads, the connection structures are respectively electrically connected to the metal pads in the peripheral area, and the connection structures are respectively electrically connected to the metal pads in the driving circuit area. Multiple connection pads of the drive circuit board, The first substrate has a side surface located between the first surface and the second surface, and further has a first inclined surface located between the first surface and the side surface, and the connecting structures are respectively formed from the metal pads It extends along the first inclined surface and the side surface to the second surface. A display panel including: A first substrate has a first surface and a second surface opposite to the first surface, the first surface has a display area and a peripheral area outside the display area; An active device layer is disposed on the first surface; A plurality of metal pads are arranged on the first surface and located in the peripheral area, and the metal pads are electrically connected to the active device layer; A drive circuit board is arranged on a drive circuit area on the second surface, and in a direction perpendicular to the first substrate, the drive circuit area overlaps the display area; and A plurality of connection structures are respectively disposed on the metal pads, the connection structures are respectively electrically connected to the metal pads in the peripheral area, and the connection structures are respectively electrically connected to the metal pads in the driving circuit area. Multiple connection pads of the drive circuit board, The first substrate has a side surface located between the first surface and the second surface, and further has a second inclined surface located between the second surface and the side surface. The connection structures are respectively formed from the metal pads Extending along the side surface and the second inclined surface to the second surface.

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