CN113675165B - Display device and method for manufacturing the same - Google Patents
Display device and method for manufacturing the same Download PDFInfo
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- CN113675165B CN113675165B CN202110923402.9A CN202110923402A CN113675165B CN 113675165 B CN113675165 B CN 113675165B CN 202110923402 A CN202110923402 A CN 202110923402A CN 113675165 B CN113675165 B CN 113675165B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 title claims description 16
- 230000002093 peripheral effect Effects 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims description 6
- 238000002161 passivation Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 16
- 238000005530 etching Methods 0.000 description 10
- 238000007639 printing Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 230000008439 repair process Effects 0.000 description 5
- 239000000523 sample Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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Abstract
The invention discloses a display device and a manufacturing method thereof, wherein the display device comprises a display panel, a plurality of first conductive patterns, a plurality of first sub-pads and a plurality of second sub-pads. The display panel is provided with a display area, the peripheral area of the display area is closer to the third surface than the display area, each first main connecting pad at least partially overlaps the corresponding second main connecting pad in the normal direction of the display panel, and the first main connecting pads are arranged along a first direction. The first conductive patterns are respectively and electrically connected with the corresponding first main connecting pad and the corresponding second main connecting pad. The first sub-pads are respectively adjacent to and electrically connected with the corresponding first main pads, wherein the length of each first sub-pad is longer than that of each first main pad in a second direction perpendicular to the first direction. The second sub-pads are adjacent to each other and electrically connected to the corresponding second main pads, wherein each first sub-pad at least partially overlaps the corresponding second sub-pad in the normal direction of the display panel.
Description
Technical Field
The present invention relates to a device, and more particularly, to a display device and a method of manufacturing the same.
Background
Various manufacturing techniques and product designs are continually being developed in response to the diverse applications of display devices. In order to provide more applications, narrow-framed or borderless products have been proposed. For example, the narrow-frame or borderless products can be applied to a tiled product (e.g. a tiled display panel) in addition to a larger functional area (e.g. a display area, a touch area, etc.).
Disclosure of Invention
The invention provides a display device which can have a reduced frame width.
The invention provides a manufacturing method of a display device, which can conveniently repair a failed circuit.
The display device comprises a display panel, a plurality of first conductive patterns, a plurality of first sub-pads and a plurality of second sub-pads. The display panel is provided with a first surface, a second surface, a third surface, a display area and a peripheral area, wherein the third surface is positioned between the first surface and the second surface, the display area is positioned on the first surface, the peripheral area comprises a plurality of first main connection pads arranged in the peripheral area and a plurality of second main connection pads arranged on the second surface, the peripheral area is closer to the third surface than the display area, each first main connection pad at least partially overlaps the corresponding second main connection pad in the normal direction of the display panel, and the first main connection pads are arranged along a first direction. The first conductive patterns are respectively and electrically connected with the corresponding first main connecting pad and the corresponding second main connecting pad. The first sub-pads are respectively adjacent to and electrically connected with the corresponding first main pads, wherein the length of each first sub-pad is longer than that of each first main pad in a second direction perpendicular to the first direction. The second sub-pads are adjacent to each other and electrically connected to the corresponding second main pads, wherein each first sub-pad at least partially overlaps the corresponding second sub-pad in the normal direction of the display panel.
The invention provides a manufacturing method of a display device, which comprises providing a display panel, wherein the display panel is provided with a first surface, a second surface, a third surface positioned between the first surface and the second surface, a display area positioned on the first surface and a peripheral area, and the display panel comprises a plurality of first main connection pads arranged in the peripheral area and a plurality of second main connection pads arranged on the second surface, wherein the peripheral area is closer to the third surface than the display area, each first main connection pad at least partially overlaps the corresponding second main connection pad in the normal direction of the display panel, and the first main connection pads are arranged along a first direction. A plurality of first sub-pads are formed on the first surface, wherein the first sub-pads are respectively adjacent to and electrically connected with the corresponding first main pads, and the length of each first sub-pad is longer than that of each first main pad in a second direction perpendicular to the first direction. And forming a plurality of second sub-bonding pads on the second surface, wherein the second sub-bonding pads are respectively adjacent and electrically connected with the corresponding second main bonding pads, and each first sub-bonding pad is at least partially overlapped with the corresponding second sub-bonding pad in the normal direction of the display panel. A plurality of first conductive patterns are formed on the display panel, wherein the first conductive patterns are respectively and electrically connected with the corresponding first main connecting pads and the corresponding second main connecting pads. And detecting the resistance value between at least one of the first main connection pads and the corresponding second main connection pad to be used as a basis for judging whether the corresponding first conductive pattern fails, wherein when the corresponding first conductive pattern fails, at least one second conductive pattern is formed on the display panel and is electrically connected with the first sub connection pad and the second sub connection pad corresponding to the failed first conductive pattern.
In an embodiment of the invention, a length of each of the first main pads in the first direction is greater than a length of each of the first sub pads in the first direction.
In an embodiment of the invention, the second conductive pattern is electrically connected between the corresponding first sub-pad and the corresponding second sub-pad.
In an embodiment of the invention, a material of the second conductive pattern is different from a material of the first conductive pattern.
In an embodiment of the invention, a protection layer is further included to cover the first main pads, the first sub pads, the second main pads, the second sub pads, the first conductive patterns and at least one second conductive pattern.
In an embodiment of the invention, the at least one second conductive pattern covers the first sub-pad and the first main pad on the first surface, and covers the second sub-pad and the second main pad on the second surface.
In an embodiment of the invention, an area of each of the first main pads is smaller than an area of each of the second main pads, and an area of each of the first sub pads is smaller than an area of each of the second sub pads.
In an embodiment of the invention, each of the first sub-pads is connected to each of the first main pads through a conductive circuit, and each of the second sub-pads is connected to each of the second main pads through a conductive circuit.
In an embodiment of the present invention, in the step of detecting the resistance value between at least one of the first main pads and the corresponding second main pad, the resistance value is obtained by detecting the corresponding first sub pad and the second sub pad.
Based on the above, in the display device and the manufacturing method thereof of the present invention, the first sub-pads are respectively adjacent and electrically connected to the corresponding first main pads, and the second sub-pads are respectively adjacent and electrically connected to the corresponding second main pads. When the first conductive pattern between the first main connecting pad and the second main connecting pad fails, the second conductive pattern is added to be electrically connected with the first secondary connecting pad and the second secondary connecting pad corresponding to the failed first conductive pattern, so as to repair the bad condition between the first main connecting pad and the second main connecting pad.
Drawings
In order to make the above features and advantages of the present invention more comprehensible, embodiments accompanied with figures are described in detail below.
Fig. 1A to 5 show part of steps for manufacturing a display device according to an embodiment of the present invention.
Fig. 6A is a schematic top view of the display device of fig. 3A.
Fig. 6B is a schematic bottom view of the display device of fig. 3B.
Fig. 7A and fig. 7B are schematic top and bottom views, respectively, of a display device according to another embodiment of the invention.
Fig. 8A and 8B are schematic perspective views of a display device according to another embodiment of the invention.
Fig. 9 is a schematic perspective view of the display device and the passivation layer of fig. 8A.
Symbol description
100. 100', 100B, 100C display device
110 display panel
112 first surface
114 third surface
116 second surface
120 first main pad
130 second main pad
140 first conductive pattern
150 etch resistant layer
160 first time pad
1601 position
170 second time pad
1701 position
180. 180B, 180C second conductive pattern
190. 190C protective layer
A1 display area
E1 peripheral region
A-A, B-B line
Length of L1, L2, L3, L4
W1, W2 conductive circuit
X, Y, Z direction of
Detailed Description
The present invention will be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. As will be recognized by those skilled in the art, the described embodiments may be modified in various different ways without departing from the spirit or scope of the invention.
In the drawings, the thickness of layers, films, panels, regions, etc. are exaggerated for clarity. Like numbers refer to like elements throughout. It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connection. Furthermore, "electrically connected" or "coupled" may mean that there are additional elements between the two elements.
Moreover, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe one element's relationship to another element as illustrated. It will be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation depicted in the figures. For example, if the device in one of the figures is turned over, elements described as being on the "lower" side of other elements would then be oriented on the "upper" side of the other elements. Thus, the exemplary term "lower" may include both "lower" and "upper" orientations, depending on the particular orientation of the figure. Similarly, if the device in one of the figures is turned over, elements described as "below" or "beneath" other elements would then be oriented "above" the other elements. Thus, the exemplary terms "above" or "below" can encompass both an orientation of above and below.
As used herein, "about," "approximately," or "substantially" includes both the values and average values within an acceptable deviation of the particular values as determined by one of ordinary skill in the art, taking into account the particular number of measurements and errors associated with the measurements in question (i.e., limitations of the measurement system). For example, "about" may mean within one or more standard deviations of the values, or within ±30%, ±20%, ±10%, ±5%. Further, as used herein, "about," "approximately," or "substantially" may be used to select a more acceptable range of deviations or standard deviations depending on the optical, etching, or other properties, and may not be used with one standard deviation for all properties.
Exemplary embodiments are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments. Thus, shape variations of the illustrations as a result, for example, of manufacturing techniques and/or (and/or) tolerances are to be expected. Thus, the embodiments described herein should not be construed as limited to the particular shapes of regions as illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an area shown or described as being flat may generally have rough and/or nonlinear features. Furthermore, the acute angles shown may be rounded. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the precise shape of a region and are not intended to limit the scope of the claims.
Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present invention and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
In general, in a tiled display device, seamless tiling has been a trend. The display device can utilize a side wire (side wire) design to extend the wire on the front surface of the display panel to the back surface of the display panel through the side surface of the display panel, so that the front surface of the display panel is electrically connected to the back surface of the display panel, and a chip, an integrated circuit or a wiring and the like can be bonded on the back surface of the display panel, so that the element configuration of the peripheral area on the front surface of the display panel can be reduced, the area of the peripheral area on the front surface of the display panel is reduced, and the screen occupation ratio of the display device is further improved. The side wiring design can be obtained, for example, by sputtering copper on the display panel, then covering an etching-resistant layer on the copper, and then etching. However, when the circuit is tested to be bad, the repair is not performed directly, and the original etching-resistant layer is removed and then the conductive material is newly added on the original conductive pad of the display panel. The method for removing the etching resist layer is, for example, using a laser, but since the side wires are of a three-dimensional structure (e.g. U-shaped) distributed on the front, side and back of the display panel, the positioning and control of the laser is not easy. The present invention provides a display device and a method for manufacturing the same, which can solve the above-mentioned problems.
In the present drawing, X direction, Y direction, and Z direction are labeled to show the arrangement relationship of the members in the drawing, and the X direction, Y direction, and Z direction intersect each other, but are not limited to being orthogonal to each other. Fig. 1A to 5 show part of steps for manufacturing a display device according to an embodiment of the present invention. It should be noted that fig. 1B and fig. 3B are perspective views of fig. 1A and fig. 3A, respectively, from another perspective, the cross-sectional structure of fig. 2 may correspond to the line A-A of fig. 1, and the cross-sectional structure of fig. 4 may correspond to the line B-B of fig. 3A.
In fig. 1A, the display panel 110 has a first surface 112, a second surface 116, a third surface 114 between the first surface 112 and the second surface 116, and a display area A1 and a peripheral area E1 (the display area A1 and the peripheral area E1 are schematically distinguished by dotted lines) on the first surface 112. The peripheral region E1 is closer to the third surface 114 than the display region A1. The display panel 110 is a plate-like object having a certain mechanical strength and capable of supporting objects for disposing thereon a plurality of film layers and/or a plurality of objects.
Here, the normal direction of the third surface 114 is different from the normal direction of the first surface 112 and also from the normal direction of the second surface 116. In some embodiments, the normal direction of the first surface 112 and the normal direction of the second surface 116 may be parallel to each other, but not limited to this. For example, the first surface 112 and the second surface 116 are, for example, planes parallel to the X-Y direction, respectively, and the third surface 114 is parallel to the Y-Z direction. In other embodiments, the members disposed on the third surface 114 may be applied to other third surfaces, such as a third surface parallel to the plane of the X-Z direction. In some embodiments, a pixel circuit structure (not shown in fig. 1A) including a first main pad 120 electrically connected to the first surface 112 of the display panel 110 may also be disposed.
In fig. 1A and 1B, a plurality of first main pads 120 are formed in advance in a peripheral area E1 of the first surface 112. A plurality of second main pads 130 are preformed on the second surface 116. The first main pads 120 and the second main pads 130 are arranged along the Y direction. In addition, the first main pad 120 and the second main pad 130 may be disposed on a single side of the display panel 110 or disposed on opposite sides of the display panel 110, and the number and disposition of the first main pad 120 and the second main pad 130 may be determined according to the actual requirement, so long as the first main pad 120 and the second main pad 130 correspond to each other, which is within the scope of the present invention.
In fig. 2, the first main pads 120 at least partially overlap the corresponding second main pads 130 in the normal direction of the display panel 110. For example, the first main pads 120 at least partially overlap the corresponding second main pads 130 in the Z-direction.
With continued reference to fig. 1A and 1B, a plurality of first sub-pads 160 are formed on the first surface 112, wherein the first sub-pads 160 are respectively adjacent to and electrically connected to the corresponding first main pads 120. A plurality of second sub-pads 170 are formed on the second surface 116, wherein the second sub-pads 170 are respectively adjacent to and electrically connected to the corresponding second main pads 130.
Next, a plurality of first conductive patterns 140 are formed on the display panel 110. The first conductive patterns 140 are disposed in the peripheral area E1 of the display panel 110 and may be arranged along the Y direction. Both ends of the first conductive pattern 140 are respectively connected to the corresponding first main pad 120 and the corresponding second main pad 130. The first conductive patterns 140 may contact and directly cover the corresponding first main pads 120 and the corresponding second main pads 130 to electrically connect the corresponding first main pads 120 and the corresponding second main pads 130.
In this embodiment, the first conductive pattern 140 may continuously extend from the first surface 112 to the third surface 114 and then to the second surface 116. Here, the first conductive pattern 140 is a metal wire, and may be formed on the display panel 110 by edge sputtering, but the invention is not limited thereto. For example, the first conductive pattern 140 is formed by sputtering copper on the display panel 110. Next, an etching resist layer is covered on the copper, and then an etching process is performed to form a remaining etching resist layer 150 (fig. 2) to cover the corresponding first conductive pattern 140. This can stably control the resistance value between the corresponding first main pad 120 and the corresponding second main pad 130. It should be noted that the illustration of the etching resist layer 150 of fig. 2 is omitted in the following drawings.
In some embodiments, the first conductive pattern 140 may be electrically connected to a pixel circuit structure disposed on the display panel 110. The first main pad 120 is disposed on the first surface 112 of the display panel 110, and is used for providing an electrical channel to electrically connect the pixel circuit structure (not shown) on the display panel 110 to the second main pad 130 and to other components located on the second surface 116, such as a driving chip, an integrated circuit, and wires. In the process of fabricating the first main pad 120 on the first surface 112 of the display panel 110, the pixel circuit structure can be fabricated on the first surface 112. The so-called pixel circuit structure may include active (active) elements, capacitors, signal lines, etc. Meanwhile, the first main pad 120 may be connected to a signal line in the pixel circuit structure for transmitting an electrical signal to the pixel circuit structure. In some embodiments, the display device 100 further includes functional elements disposed on the first surface 112 to provide a desired function. For example, the functional elements may include display elements and the like. The pixel circuit structure may be used to drive functional elements, cause the display device 100 to provide a display function, and the like.
In the above configuration, the display device 100 shown in fig. 2 is obtained. In some embodiments, upper and lower probes are used to monitor the electrical properties of the side wires. Because the secondary pads are electrically connected to the corresponding primary pads, the upper and lower probes can test the resistance between the corresponding two primary pads by contacting the two secondary pads on the upper and lower surfaces of the display panel, which are corresponding to each other.
The resistance value between at least one of the first main pads 120 and the corresponding second main pad 130 is detected as a basis for determining whether the corresponding first conductive pattern 140 fails. When a circuit break or an excessively high or abnormal resistance value between at least one of the first main pads 120 and the corresponding second main pad 130 is detected, it is determined that the circuit break or the abnormal resistance value is invalid. In the step of detecting the resistance value between at least one of the first main pads 120 and the corresponding second main pad 130, the resistance value is obtained by detecting the corresponding first sub-pad 160 and the second sub-pad 170. Referring to fig. 3A and 3B, when it is determined that the corresponding first conductive pattern 140 fails, at least one second conductive pattern 180 is formed on the display panel 110. The second conductive pattern 180 is electrically connected to the first sub-pad 160 and the second sub-pad 170 corresponding to the failed first conductive pattern 140, so as to obtain a repaired display device 100'. It should be noted that, in fig. 3A and fig. 3B, only one second conductive pattern 180 is schematically illustrated, but in reality, the number of second conductive patterns 180 may depend on the number of failed first conductive patterns 140, which is not limited by the present invention.
Referring to fig. 4, in the present embodiment, each first sub-pad 160 at least partially overlaps the corresponding second sub-pad 170 in the normal direction of the display panel 110. For example, each first sub-pad 160 at least partially overlaps a corresponding second sub-pad 170 in the Z-direction. In the present embodiment, the second conductive pattern 180 covers a portion of the first sub-pad 160 and a portion of the second sub-pad 170.
That is, the defect between the first main pad 120 and the second main pad 130 is repaired by the additional second conductive pattern 180. In this way, the process of removing the etching resist layer 150 on the failed first conductive pattern 140 can be omitted, so as to achieve the effects of shortening the time and improving the process yield.
In fig. 5, a protective layer 190 may be formed on an edge of the display panel 110. The protection layer 190 covers the plurality of first main pads 120, the plurality of second main pads 130, the plurality of first conductive patterns 140, the plurality of first sub-pads 160, the plurality of second sub-pads 170, and the second conductive patterns 180 to achieve protection effects such as insulation.
In the present embodiment, the material of the second conductive pattern 180 is different from the material of the first conductive pattern 140. For example, the second conductive pattern 180 may be formed on the display panel 110 by transfer printing. The second conductive pattern 180 is, for example, silver paste. In some manufacturing processes, the second conductive pattern 180 may be coated or applied on a printing tool, and then aligned with the printing tool and pressed against the third surface 114 of the display panel 110, so that the second conductive pattern 180 on the printing tool is attached to the third surface 114 of the display panel 110. Alternatively, the printing tool may be made of an elastic material, such as rubber or the like. Therefore, when the printing tool is aligned and pressed against the third surface 114 of the display panel 110, the lightly pressed edge end causes the second conductive pattern 180 on the printing tool to be attached to the edges of the first surface 112 and the second surface 116 of the display panel 110. For example, the printing tool may be moved in the X direction toward the display panel 110 during the printing process to transfer the second conductive pattern 180 to the first surface 112, the second surface 116 and the third surface 114. In other embodiments, spraying or other suitable methods may be used to attach the second conductive pattern 180 to a suitable location on the display panel 110, which is not limited to the above.
Fig. 6A is a schematic top view of the display device of fig. 3A. Fig. 6B is a schematic bottom view of the display device of fig. 3B. Referring to fig. 6A, in the present embodiment, the first sub-pad 160 is connected to the first main pad 120 through a conductive line W1. Referring to fig. 6B, in the present embodiment, the second sub-pad 170 is connected to the second main pad 130 through a conductive line W2. In the present embodiment, the conductive lines W1 and W2 are straight lines, but in other embodiments, the conductive lines W1 and W2 may be turning lines, which is not limited thereto. In other embodiments, the first sub-pads 160 and the first main pads 120 may be directly connected, and the second sub-pads 170 and the second main pads 130 may be directly connected, which is not limited to the present invention.
Referring to fig. 6A, a length L1 of the first main pad 120 in the first direction is greater than a length L2 of the first sub-pad 160 in the first direction. In a second direction perpendicular to the first direction, the length L4 of the first sub-pad 160 is greater than the length L3 of the first main pad 120. Here, the first direction is, for example, the Y direction, and the second direction is, for example, the X direction. Accordingly, the upper probe may contact the location 1601 of FIG. 6A. Similarly, the lower probe may also contact the location 1701 of FIG. 6B to measure the resistance between the first main pad 120 and the second main pad 130. Specifically, the position 1601 in fig. 6A is a portion of the second conductive pattern 180 exposing the first pad 160, and the position 1701 in fig. 6B is a portion of the second conductive pattern 180 exposing the second pad 170. The large area of location 1601 of fig. 6A and location 1701 of fig. 6B facilitates detection. In other embodiments, the area of the location 1601 and the location 1701 may be determined according to the actual process, and is not limited thereto.
In addition, in the present embodiment, it is considered that the first surface 112 has the display area A1, the area of each first main pad 120 on the first surface 112 is smaller than the area of each second main pad 130 on the second surface 116, and the area of each first sub-pad 160 on the first surface 112 is smaller than the area of each second sub-pad 170 on the second surface 116. In other words, since the second surface 116 is not limited by the display area A1, the areas of the second main pad 130 and the second sub pad 170 can be designed to be larger for facilitating the probe contact, but the invention is not limited thereto.
Fig. 7A and fig. 7B are schematic top and bottom views, respectively, of a display device according to another embodiment of the invention. Referring to fig. 7A and 7B, in the present embodiment, the display device 100B is slightly different from the display device 100' of fig. 6A and 6B in that: coverage of the second conductive pattern 180B.
In the present embodiment, the second conductive pattern 180B covers the first sub-pad 160 and the first main pad 120 on the first surface 112, and the second conductive pattern 180B covers the second sub-pad 170 and the second main pad 130 on the second surface 116, but the invention is not limited thereto. In the present embodiment, the second conductive pattern 180B covers the conductive traces W1 and W2, but in other embodiments, one end of the second conductive pattern 180B is electrically connected to the first sub-pad 160 and the first main pad 120, and the other end is electrically connected to the second sub-pad 170 and the second main pad 130, so that the conductive traces W1 and W2 are omitted.
Fig. 8A and 8B are schematic perspective views of a display device according to another embodiment of the invention. Fig. 9 is a schematic perspective view of the display device and the passivation layer of fig. 8A. Referring to fig. 8A and 8B, in the present embodiment, the display device 100C is slightly different from the display device 100' of fig. 6A and 6B in that: a plurality of second conductive patterns 180C are formed on the display panel 110 and electrically connected between the plurality of first sub-pads 160 and the plurality of second sub-pads 170, respectively. In other words, the second conductive pattern 180C is added between each first sub-pad 160 and the corresponding second sub-pad 170. This has the advantage that the alignment time can be omitted and the simultaneous repair of multiple lines can increase the stability of the resistance value. Referring to fig. 9, finally, a passivation layer 190C may be formed on the edge of the display panel 110 to achieve protection effects such as insulation.
In summary, in the display device and the method for manufacturing the same of the present invention, the first sub-pads are respectively adjacent to and electrically connected to the corresponding first main pads, and the second sub-pads are respectively adjacent to and electrically connected to the corresponding second main pads. When the first conductive pattern between the first main contact pad and the second main contact pad fails, the second conductive pattern is added to be electrically connected with the first secondary contact pad and the second secondary contact pad corresponding to the failed first conductive pattern, so as to repair the bad condition between the first main contact pad and the second main contact pad, thereby achieving the effects of shortening the time interval and improving the process yield. In another embodiment, even if the first conductive pattern between one of the plurality of first main pads and the corresponding second main pad has not failed, the second conductive pattern is still added between the corresponding first sub-pad and the corresponding second sub-pad, so that the alignment time can be saved, and the multiple lines are repaired simultaneously, so that the stability of the resistance value can be further increased.
Although the present invention has been described with reference to the above embodiments, it should be understood by those skilled in the art that the present invention is not limited thereto, and that various changes and modifications can be made therein without departing from the spirit and scope of the present invention as defined by the appended claims.
Claims (10)
1. A display device, comprising:
the display panel is provided with a first surface, a second surface, a third surface, a display area and a peripheral area, wherein the third surface is positioned between the first surface and the second surface, the display area is positioned on the first surface, the peripheral area comprises a plurality of first main connection pads arranged on the peripheral area and a plurality of second main connection pads arranged on the second surface, the peripheral area is closer to the third surface than the display area, and each first main connection pad at least partially overlaps the corresponding second main connection pad in the normal direction of the display panel and the first main connection pads are arranged along a first direction;
a plurality of first conductive patterns respectively electrically connected to the corresponding first main pads and the corresponding second main pads;
the first primary connecting pads are respectively adjacent to and electrically connected with the corresponding first main connecting pads, wherein the length of each first primary connecting pad is longer than that of each first main connecting pad in a second direction perpendicular to the first direction; and
the first secondary pads are respectively adjacent to and electrically connected with the corresponding second main pads, and each first secondary pad at least partially overlaps with the corresponding second secondary pad in the normal direction of the display panel.
2. The display device of claim 1, wherein a length of each of the first primary pads in the first direction is greater than a length of each of the first secondary pads in the first direction.
3. The display device of claim 1, further comprising at least one second conductive pattern electrically connected between the corresponding first sub-pad and the corresponding second sub-pad.
4. A display device as claimed in claim 3, wherein the material of the second conductive pattern is different from the material of the first conductive pattern.
5. The display device of claim 3, further comprising a passivation layer covering the first main pads, the first sub pads, the second main pads, the second sub pads, the first conductive patterns and the at least one second conductive pattern.
6. The display device of claim 3, wherein the at least one second conductive pattern covers the first sub-pad and the first main pad on the first surface, and covers the second sub-pad and the second main pad on the second surface.
7. The display device of claim 1, wherein each of the first primary pads has an area smaller than an area of each of the second primary pads, and each of the first secondary pads has an area smaller than an area of each of the second secondary pads.
8. The display device of claim 1, wherein each of the first sub-pads is connected to each of the first main pads by a conductive line, and each of the second sub-pads is connected to each of the second main pads by a conductive line.
9. A method of manufacturing a display device, comprising:
providing a display panel, which is provided with a first surface, a second surface, a third surface positioned between the first surface and the second surface, a display area positioned on the first surface and a peripheral area, and comprises a plurality of first main connection pads arranged on the peripheral area and a plurality of second main connection pads arranged on the second surface, wherein the peripheral area is closer to the third surface than the display area, each first main connection pad at least partially overlaps the corresponding second main connection pad in the normal direction of the display panel, and the first main connection pads are arranged along a first direction;
forming a plurality of first sub-pads on the first surface, wherein the first sub-pads are respectively adjacent to and electrically connected with the corresponding first main pads, and the length of each first sub-pad is longer than the length of each first main pad in a second direction perpendicular to the first direction;
forming a plurality of second sub-pads on the second surface, wherein the second sub-pads are respectively adjacent to and electrically connected with the corresponding second main pads, and each first sub-pad at least partially overlaps with the corresponding second sub-pad in the normal direction of the display panel;
forming a plurality of first conductive patterns on the display panel, wherein the first conductive patterns are respectively and electrically connected with the corresponding first main connecting pad and the corresponding second main connecting pad; and
and detecting the resistance value between at least one of the first main connection pads and the corresponding second main connection pad to be used as a basis for judging whether the corresponding first conductive pattern fails, wherein when the corresponding first conductive pattern fails, at least one second conductive pattern is formed on the display panel and is electrically connected with the first sub connection pad and the second sub connection pad corresponding to the failed first conductive pattern.
10. The method of claim 9, wherein the resistance value is obtained by detecting the corresponding first sub-pad and the corresponding second sub-pad in the step of detecting the resistance value between at least one of the first main pads and the corresponding second main pad.
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US202063065641P | 2020-08-14 | 2020-08-14 | |
US63/065,641 | 2020-08-14 | ||
TW110125040 | 2021-07-07 | ||
TW110125040A TWI767785B (en) | 2020-08-14 | 2021-07-07 | Display device and manufacturing method thereof |
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CN113675165B true CN113675165B (en) | 2023-05-02 |
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CN106814484A (en) * | 2016-12-26 | 2017-06-09 | 友达光电股份有限公司 | Display device |
CN107065334A (en) * | 2017-03-09 | 2017-08-18 | 友达光电股份有限公司 | Display panel |
TW202029552A (en) * | 2019-01-30 | 2020-08-01 | 友達光電股份有限公司 | Display panel and manufacturing method thereof |
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CN106814484A (en) * | 2016-12-26 | 2017-06-09 | 友达光电股份有限公司 | Display device |
CN107065334A (en) * | 2017-03-09 | 2017-08-18 | 友达光电股份有限公司 | Display panel |
TW202029552A (en) * | 2019-01-30 | 2020-08-01 | 友達光電股份有限公司 | Display panel and manufacturing method thereof |
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