CN113535485B

CN113535485B - Electronic device

Info

Publication number: CN113535485B
Application number: CN202010289204.7A
Authority: CN
Inventors: 饶瑞桓; 郑德隆
Original assignee: E Ink Holdings Inc
Current assignee: E Ink Holdings Inc
Priority date: 2020-04-14
Filing date: 2020-04-14
Publication date: 2022-09-16
Anticipated expiration: 2040-04-14
Also published as: CN113535485A

Abstract

The invention discloses an electronic device which comprises a first substrate and a second substrate. The first substrate comprises a first bonding area, a first circuit, a second circuit, a third circuit and a plurality of first conductive contacts. The first line is located at a first edge of the first bonding area, the second line is located at a second edge of the first bonding area opposite to the first edge, and the third line is located between the first line and the second line. The second substrate comprises a second bonding area, a fourth circuit, a fifth circuit, a sixth circuit and a plurality of second conductive contacts which correspond to the positions of the second bonding area, the fourth circuit, the fifth circuit and the sixth circuit. When the first substrate is attached to the second substrate, the first conductive contacts and the second conductive contacts are electrically connected to the corresponding signal lines respectively. The electronic device can detect the bonding conditions of the first bonding area and the second bonding area except for the position close to the edge so as to improve the detection accuracy. In addition, the design can also avoid misjudging the products with poor fitting as meeting the standard to cause poor qualification rate of subsequent processes or final products.

Description

Electronic device

Technical Field

The invention relates to an electronic device.

Background

The bonding area of the electronic device has a detection circuit for detecting the bonding effect. However, the conventional detection line design can only detect the bonding state around the bonding region, and cannot detect the bonding effect in the middle region of the bonding region.

In view of the above, how to provide a circuit design for detecting a defective bonding in the middle region of the bonding region is still one of the approaches to be studied.

Disclosure of Invention

An aspect of the present invention is an electronic device capable of detecting a bonding condition of a first bonding region and a second bonding region except for a position near an edge to increase detection accuracy. .

In some embodiments, an electronic device includes a first substrate and a second substrate. The first substrate comprises a first bonding region, a first circuit, a second circuit, at least one third circuit and a plurality of first conductive contacts. The first circuit is located at a first edge of the first bonding area, the second circuit is located at a second edge of the first bonding area opposite to the first edge, the third circuit is located between the first circuit and the second circuit, one part of the first conductive contact is located between the first circuit and the third circuit, and the other part of the first conductive contact is located between the second circuit and the third circuit. The second substrate comprises a second bonding area corresponding to the first bonding area in position, and a fourth circuit, a fifth circuit, a sixth circuit and a plurality of second conductive contacts corresponding to the first circuit, the second circuit, the third circuit and the first conductive contacts in position respectively. When the first substrate is attached to the second substrate, the first conductive contacts and the second conductive contacts are electrically connected to the corresponding signal lines respectively.

In some embodiments, the first pasting region has a central region, the second pasting region has a central region, the third line is located in the central region of the first pasting region, and the sixth line is located in the central region of the second pasting region.

In some embodiments, the first conductive contact is electrically connected to the signal line of the active region, and the second conductive contact is electrically connected to the signal line of the printed circuit board.

In some embodiments, the first line, the second line, the third line, the fourth line, the fifth line, and the sixth line electrically insulate the signal line.

In some embodiments, the first substrate further includes an extension line electrically connecting the first line and the third line. The extension circuit is located between the first bonding region and the edge of the first substrate, and the extension circuit is located on one side of the first bonding region, which is far away from the active region.

In some embodiments, the fourth, fifth, and sixth lines of the second substrate are separated from each other.

In some embodiments, the first, second, and third lines extend outside the first pasting region, and the extension lines are located outside the first pasting region.

In some embodiments, the second substrate further includes a detection region having at least one detection contact, and the detection contacts are respectively connected to the fourth line and the fifth line.

In some embodiments, the detection region is located outside the pasting region.

In some embodiments, the second substrate further includes an extension line electrically connected to the fourth line and the sixth line, and the extension line is located in the second bonding region.

In the above embodiment, since the third circuit of the first substrate and the sixth circuit of the second substrate are respectively located between the first circuit and the second circuit and between the fourth circuit and the fifth circuit, the bonding condition of the first bonding region and the second bonding region except the position near the edge can be detected. Compared with the traditional device with the detection circuit only located at two edges of the bonding area, the design of the first bonding area and the second bonding area can increase the detection accuracy. In addition, the design can also avoid misjudging the products with poor fitting as meeting the standard to cause poor qualification rate of subsequent processes or final products. In addition, the number and distribution of the third lines and the sixth lines can be adjusted according to requirements, so as to improve the quality of the bonding detection.

Drawings

Fig. 1 is a top view of an electronic device according to an embodiment of the invention.

Fig. 2 is an enlarged view of region R in fig. 1.

Fig. 3 is a top view of the first substrate in the region R.

Fig. 4 is a plan view of the second substrate in the region R.

Fig. 5 is a top view of a first substrate according to another embodiment of the invention.

Fig. 6 is a top view of a second substrate according to another embodiment of the invention.

Fig. 7 is a top view of an electronic device according to another embodiment of the invention.

Description of the main reference numerals:

10-electronic device, 100-first substrate, 102-edge, 110-first bonding region, 112a,212 a-first edge, 112b,212 b-second edge, 112c,212 c-third edge, 114, 214-central region, 120 a-first line, 130 a-second line, 140 a-third line, 150, 250-extension line 160,160 a-first conductive contact, 200-second substrate, 210-second bonding region, 220 a-fourth line, 230 a-fifth line, 240 a-sixth line, 260 a-second conductive contact, 300-detection region, 310-detection contact, AA-active region, D1-first direction, D2-second direction, R-region, SL 1-signal line, SL 2-signal line.

Detailed Description

In the following description, numerous implementation details are set forth in order to provide a thorough understanding of the present invention. It should be understood, however, that these implementation details are not to be interpreted as limiting the invention. That is, in some embodiments of the invention, such implementation details are not necessary. In addition, some conventional structures and elements are shown in the drawings in a simplified schematic manner for the sake of simplifying the drawings. And the thickness of layers and regions in the drawings may be exaggerated for clarity, and the same reference numerals denote the same elements in the description of the drawings.

Fig. 1 is a top view of an electronic device 10 according to an embodiment of the invention. The electronic device 10 includes a first substrate 100 and a second substrate 200. The first substrate 100 includes a first bonding region 110 and an active region AA, and the second substrate 200 includes a second bonding region 210. The first bonding region 110 and the second bonding region 210 are corresponding in position and bonded to each other to electrically connect the first substrate 100 and the second substrate 200. The electronic device 10 can be applied to, for example, a mobile phone and a display panel, but the invention is not limited thereto. The first substrate 100 is, for example, a substrate having a driving array, and the second substrate 200 is, for example, a flexible printed circuit board, but the invention is not limited thereto. In other words, any device may be used as long as it needs to be electrically connected to each other through the bonding region.

Fig. 2 is an enlarged view of region R in fig. 1. Fig. 3 is a top view of the first substrate 100 in the region R. Fig. 4 is a top view of the second substrate 200 in the region R. It should be understood that the bonded first bonding region 110 and second bonding region 210 are actually opposite to each other, and thus the structures on the second substrate 200 are not located on the outermost surface. However, in order to distinguish the circuit on the first substrate 100 from the circuit on the second substrate 200, the elements on the second substrate 200 are illustrated as solid lines and the elements on the first substrate 100 are illustrated as dashed lines in fig. 2, as will be described in the foregoing. Referring to fig. 2, fig. 3 and fig. 4, the second substrate 200 is located above the first substrate 100 in fig. 2 and faces the first substrate 100. Therefore, the reference numerals of the second substrate 200 are reversed in the left and right in fig. 2 and 4, as will be described in the foregoing.

The first attachment region 110 includes a first edge 112a, a second edge 112b, and a third edge 112 c. The first edge 112a is opposite the second edge 112b, and the third edge 112c connects the first edge 112a and the second edge 112 b. As shown in fig. 3, when the first bonding region 110 corresponds to the second bonding region 210 and is bonded to each other, the third edge 112c of the first bonding region 110 is located at a side close to the edge 102 of the first substrate 100.

The first substrate 100 includes a first line 120, a second line 130, and a third line 140. The first circuit 120 is located at the first edge 112a of the first bonding region 110, the second circuit 130 is located at the second edge 112b of the first bonding region 110, the third circuit 140 is located between the first circuit 120 and the second circuit 130, and the first circuit 120, the second circuit 130, and the third circuit 140 are electrically connected to each other. For example, in the present embodiment, the second line 130 includes two parallel lines separated from each other, and the two lines are electrically connected to the first line 120 and the third line 140, respectively, but the invention is not limited thereto. The first, second, and

third wires

120, 130, and 140 of the first substrate 100 extend in the first direction D1.

The first substrate 100 further includes two extension lines 150. One of the extended circuits 150 is electrically connected to the first circuit 120 and the third circuit 140, and the other extended circuit 150 is electrically connected to the third circuit 140 and the second circuit 130. The extension line 150 is located on a side of the first bonding region 110 away from the active region AA. In other words, the extension line 150 is located between the third edge 112c of the first bonding region 110 and the edge 102 of the first substrate 100, i.e., the extension line 150 is located outside the first bonding region 110. In the present embodiment, the extension line 150 extends in the second direction D2. The second direction D2 is different from the first direction D1, and is perpendicular to each other in the embodiment, but the invention is not limited thereto.

The second border region 210 includes a first edge 212a, a second edge 212b, and a third edge 212 c. The first edge 212a is opposite to the second edge 212b, and the third edge 212c connects the first edge 212a and the second edge 212 b. As shown in fig. 2, the first edge 112a, the second edge 112b and the third edge 112c of the first pasting region 110 are located at positions corresponding to the first edge 212a, the second edge 212b and the third edge 212c of the second pasting region 210, respectively.

The second substrate 200 includes a fourth line 220, a fifth line 230, and a sixth line 240. The fourth, fifth, and

sixth lines

220, 230, and 240 are positioned to correspond to the first, second, and

third lines

120, 130, and 140 of the first substrate 100, respectively. The fourth wire 220 is located at the first edge 212a of the second pasting region 210, the fifth wire 230 is located at the second edge 212b of the second pasting region 210, and the sixth wire 240 is located between the fourth wire 220 and the fifth wire 230. The fourth, fifth, and

sixth wires

220, 230, and 240 of the second substrate 200 extend in the first direction D1. As shown in fig. 2, when the first pasting region 110 and the second pasting region 210 correspond to each other and are pasted to each other, the first line 120 overlaps the fourth line 220, the second line 130 overlaps the fifth line 230, and the third line 140 overlaps the sixth line 240. The lines overlap in another direction perpendicular to the first direction D1 and the second direction D2.

The first substrate 100 has a plurality of first conductive contacts 160 located in the first bonding region 110, the second substrate 200 has a plurality of second conductive contacts 260 located in the second bonding region 210, and the positions of the first conductive contacts 160 respectively correspond to the positions of the second conductive contacts 260. Specifically, the first conductive contact 160 is connected to the signal line SL1 of the active area AA, and the second conductive contact 260 is connected to the signal line SL2 (shown in fig. 1 and 4) of the flexible printed circuit board, but the invention is not limited thereto, and different signal lines may be connected according to the applications of the first substrate 100 and the second substrate 200.

The first circuit 120 is located between the first edge 112a and the first conductive contact 160, and the second circuit 130 is located between the second edge 112b and the first conductive contact 160. The third circuit 140 is located between two adjacent first conductive contacts 160. The fourth line 220 is located between the first edge 212a and the second conductive contact 260, and the fifth line 230 is located between the second edge 212b and the second conductive contact 260. The sixth line 240 is located between two adjacent second conductive contacts 260.

A portion of the first conductive contact 160 is located between the first line 120 and the third line 140, and another portion is located between the second line 130 and the third line 140. A portion of the second conductive contact 260 is located between the fourth line 220 and the sixth line 240, and another portion is located between the fifth line 230 and the sixth line 240. In the present embodiment, the eight first conductive contacts 160 and the eight second conductive contacts 260 are taken as an example, but the invention is not limited thereto. In addition, the third circuit 140 of the first substrate 100 is located between two adjacent first conductive contacts 160, and the sixth circuit 240 of the second substrate 200 is located between two adjacent second conductive contacts 260.

When the first bonding region 110 and the second bonding region 210 are bonded to each other, the first conductive contacts 160 are electrically connected to the second conductive contacts 260 at corresponding positions, respectively. The first circuit 120 is electrically connected to the fourth circuit 220, the second circuit 130 is electrically connected to the fifth circuit 230, and the third circuit 140 is electrically connected to the sixth circuit 240. The first circuit 120, the second circuit 130, and the third circuit 140 of the first substrate 100 are electrically connected to the fourth circuit 220, the fifth circuit 230, and the sixth circuit 240 of the second substrate 200 to form a circuit. In the present embodiment, the two parallel lines of the sixth line 240 and the third line 140 are electrically connected to each other, so that the lines are electrically connected to each other to form a loop.

In the present embodiment, the fourth, fifth and

sixth wires

220, 230 and 240 of the second substrate 200 are separated from each other. The third line 140 is electrically connected to the first line 120, the second line 130, the fourth line 220 and the fifth line 230 at the

first edges

112a,212a and the

second edges

112b,212b through the extension line 150 to form a loop. In some other embodiments, the design of the first and

second bonding regions

110 and 210 may be reversed, for example, the first, second and

fourth lines

120, 130 and 220 in the first bonding region 110 may be located on the second substrate 200, and the fourth, fifth and

sixth lines

220, 230 and 240 in the second bonding region 210 may be located on the first substrate 100. In addition, the third circuit 140 may have only a single circuit, that is, only a loop can be formed after the first bonding region 110 and the second bonding region 210 are bonded, and the impedance can be measured by the detecting contact 310.

The second substrate 200 further includes a detection region 300 located at a side close to the third edge 212c of the second bonding region 210. As shown in fig. 2, the detecting region 300 is located on a side away from the active region AA, i.e., between the edge 102 of the first substrate and the first bonding region 110. The detection area 300 has two detection contacts 310 for connecting the fourth circuit 220 and the fifth circuit 230 of the second substrate 200, respectively. After the first bonding region 110 and the second bonding region 210 are bonded to each other, the first circuit 120, the second circuit 130, and the third circuit 140 of the first substrate 100 are electrically connected to the fourth circuit 220, the fifth circuit 230, and the sixth circuit 240 of the second substrate 200, so that a loop can be formed and the bonding integrity can be known by measuring the impedance through the detection contact 310. In this way, when the first bonding region 110 and the second bonding region 210 are bonded poorly, which results in incomplete electrical connection of the circuit, the impedance abnormality measured by the detection contact 310 can be known. The detection contacts 310 may also be configured on the first substrate 100.

In addition, since the third and

sixth lines

140 and 240 are respectively located between the first and

second lines

120 and 130 and between the fourth and

fifth lines

220 and 230, the bonding condition of the first and

second bonding regions

110 and 210 except the edge positions (e.g., the

first edges

112a and 212a and the

second edges

112b and 212b) can be detected. The design of the first bonding region 110 and the second bonding region 210 can increase the detection accuracy compared to the conventional device in which the detection lines are only located at two edges of the bonding region. Therefore, the design can avoid the condition that the product with poor fitting is mistakenly judged to be in accordance with the standard, so that the subsequent process or the final product yield is not good.

In the present embodiment, the first pasting region 110 further includes a central region 114 located between the first edge 112a and the second edge 112b, and the central region 114 includes a center of the first pasting region 110. The third line 140 is located in the central region 114 of the first pasting region 110. The second conformable region 210 also includes a central region 214 located between the first edge 212a and the second edge 212b, and including the center of the second conformable region 210. The sixth line 240 is located in the central region 214 of the second bonding region 210. For example, when the lengths of the first and

second pasting regions

110 and 210 are longer, poor pasting may occur more easily in the central region 114 of the first pasting region 110 and the central region 214 of the second pasting region 210. Therefore, the accuracy of detecting the defective bonding can be increased by disposing the third line 140 in the central region 114 of the first bonding region 110 and disposing the sixth line 240 in the central region 214 of the second bonding region 210.

In the present embodiment, the first line 120, the second line 130 and the third line 140 extend out of the first bonding region 110 to connect with the extension line 150. In some embodiments, the second substrate 200 has no lines corresponding to the extension lines 150 of the first substrate 100. In other embodiments, the fourth line 220, the fifth line 230 and the sixth line 240 may also have lines corresponding to the extension lines 150, as long as the first bonding region 110 and the second bonding region 210 are bonded to form a loop, and the impedance is measured by the detecting contact 310.

Fig. 5 is a top view of a first substrate 100a according to another embodiment of the invention. Fig. 6 is a top view of a second substrate 200a according to another embodiment of the invention. Referring to fig. 5 and 6, the regions shown in fig. 5 and 6 correspond to the region R marked in fig. 1. The difference between the first substrate 100 in fig. 5 and the first substrate 100 in fig. 3 is that the third circuit 140a is multiple. The second substrate 200 in fig. 6 is different from the second substrate 200 in fig. 4 in that a plurality of sixth wires 240a are provided. The second substrate 200 further includes three extension lines 250 respectively connected to the two sixth lines 240 a. The extension lines 250 are independent of each other, and each extension line 250 connects two sixth lines 240 a. For example, in the present embodiment, two adjacent sixth wires 240a connected to the left and middle extension wires 250 of the second substrate 200 are located at positions corresponding to the third wires 140a with a larger area of the first substrate 100. When the lines are poorly bonded to each other, the impedance of at least one of the extension lines 250 is abnormal, so that whether the first bonding region 110 and the second bonding region 210 are poorly bonded can be known by detecting the impedance abnormality measured by the contact 310. In the present embodiment, the extension line 250 is located on the first substrate 100. In other embodiments, the extension line 250 may also be located on the second substrate 200. The number and distribution of the third lines 140a and the sixth lines 240a can be freely adjusted according to the requirement, so as to improve the quality of the bonding detection.

Fig. 7 is a top view of an electronic device 20 according to another embodiment of the invention. As shown in fig. 7, after the testing of the bonding quality is completed, the extension lines 150 and/or the detection regions 300 may be removed, leaving only the first, second and

third lines

120, 130 and 140 on the first substrate 100, and the fourth, fifth and

sixth lines

220, 230 and 240 on the second substrate 200.

In summary, since the third circuit of the first substrate and the sixth circuit of the second substrate are respectively located between the first circuit and the second circuit and between the fourth circuit and the fifth circuit, the bonding conditions of the first bonding region and the second bonding region except for the position near the edge can be detected. Compared with the traditional device with the detection circuit only located at two edges of the bonding area, the design of the first bonding area and the second bonding area can increase the detection accuracy. In addition, the number and distribution of the third circuit and the sixth circuit can be adjusted according to requirements, so as to improve the quality of the bonding detection. Therefore, the design can avoid the condition that the product with poor fitting is mistakenly judged to be in accordance with the standard, so that the subsequent process or the final product yield is not good.

Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.

Claims

1. An electronic device, comprising:

a first substrate including a first bonding region, a first circuit, a second circuit, a third circuit, and a plurality of first conductive contacts, wherein the first circuit is located at a first edge of the first bonding region, the second circuit is located at a second edge of the first bonding region opposite to the first edge, the third circuit is located between the first circuit and the second circuit, a portion of the first conductive contacts is located between the first circuit and the third circuit, and another portion of the first conductive contacts is located between the second circuit and the third circuit; and

the second substrate comprises a second bonding area, a fourth circuit, a fifth circuit, a sixth circuit and a plurality of second conductive contacts, wherein the second bonding area corresponds to the first bonding area in position, and the fourth circuit, the fifth circuit, the sixth circuit and the second conductive contacts correspond to the first circuit, the second circuit, the third circuit and the plurality of first conductive contacts in position respectively;

when the first substrate is attached to the second substrate, the first attachment area is attached to the second attachment area, the first conductive contacts and the second conductive contacts are electrically connected with a plurality of corresponding signal lines respectively, the first line, the second line and the third line of the first substrate are electrically connected with the fourth line, the fifth line and the sixth line of the second substrate to form a loop, and the attachment integrity is obtained by measuring impedance through the two detection contacts.

2. The electronic device of claim 1, wherein the first pasting region has a central region, the second pasting region has a central region, the third line is located in the central region of the first pasting region, and the sixth line is located in the central region of the second pasting region.

3. The electronic device of claim 1, wherein the first substrate further comprises an active area, the second substrate is a printed circuit board, the first conductive contacts are electrically connected to the signal lines of the active area, and the second conductive contacts are electrically connected to the signal lines of the printed circuit board.

4. The electronic device according to claim 1, wherein the first wiring, the second wiring, the third wiring, the fourth wiring, the fifth wiring, and the sixth wiring electrically insulate the signal wiring.

5. The electronic device of claim 1, wherein the first substrate further comprises an extension line and an active region electrically connecting the first line and the third line, the extension line is located between the first bonding region and an edge of the first substrate, and the extension line is located on a side of the first bonding region away from the active region.

6. The electronic device according to claim 1, wherein the fourth wiring, the fifth wiring, and the sixth wiring of the second substrate are separated from each other.

7. The electronic device of claim 1, wherein the first substrate further comprises an extension line, the first line, the second line, and the third line extend outside the first bonding region, and the extension line is located outside the first bonding region.

8. The electronic device of claim 1, wherein the detection region is located outside the second bonding region.

9. The electronic device of claim 1, wherein the second substrate further comprises an extension line electrically connecting the fourth line and the sixth line, and the extension line is located in the second bonding region.