TWI742642B - Electrical connection assembly with oblique guide wire type conductive film - Google Patents

Abstract

An electrical connection assembly with oblique guide-line conductive film, which includes a conductive film and an electrical connection offset compensation structure. The conductive film includes a film body and a plurality of oblique guide wires that are spaced apart in the film body and inclined in the same direction, The electrical connection displacement compensation structure is arranged on one side of the conductive film and includes a plurality of displacement compensation conduction paths distributed at intervals, and each displacement compensation conduction path is electrically connected to one end of a corresponding oblique guide wire, and each displacement compensation The conduction path includes a pair of position contacts, and the position of the position contact point of each of the position difference compensation conduction paths corresponds to the position of the other end of the oblique guide wire electrically connected along the height direction of the film body. Solve the problem of the position difference between the semiconductor component to be tested and the circuit contact of the circuit carrier board when the existing monolithic oblique guide conductive film is used in the detection system.

Description

Electrical connection assembly with oblique guide wire type conductive film

The present invention relates to an electrical connection assembly, in particular to an electrical connection assembly that can improve the electrical connection position difference of a monolithic diagonal conductive film.

At present, in the current semiconductor component inspection system, the probe assembly or conductive film is mainly used as an electrical connection device to provide a signal transmission medium during the inspection of the semiconductor component under test.

The aforementioned probe-type electrical connection device or conductive film-type electrical connection device has its own characteristics in the semiconductor component inspection system. Among them, the probe used in the probe-type electrical connection device mainly works in an upright linear type. The working principle is a straight-up and straight-down conduction path, so the contact position of each probe contacting the semiconductor component under test and the contact position of the circuit carrier board are basically opposite from top to bottom without any position difference. As for the conductive film type electrical connection device, it mainly uses a single piece of conductive film with many oblique conductors, and uses a fixture seat to install the conductive film on the circuit carrier of the semiconductor component inspection system, so that the semiconductor to be tested The component is placed on the conductive film, and the semiconductor component to be tested is pressed down, so that each contact at the bottom of the semiconductor component is electrically connected to the corresponding contact of the circuit carrier through the diagonal conductor at the corresponding position, and then the semiconductor component inspection system Perform inspection operations on semiconductor components to be tested via circuit carrier boards and conductive films.

However, the existing monolithic diagonal conductive film is used in the semiconductor component inspection system, because the conductive film makes most of the wires pressed down, each pressed wire can bend in a predetermined direction, and the amount of down force is removed Afterwards, each wire can return to the initial state, so most of the wires in the current conductive film are inclined at a predetermined angle in the same direction, and are diagonally guided. Therefore, the contact point of the semiconductor element contacts the position of the diagonally guided conductive film Due to the oblique guide line, relative to the semiconductor component inspection system The position of the contact point of the circuit carrier board produces a position difference. Therefore, the position difference of the conduction path of the monolithic oblique guide conductive film causes that the existing monolithic oblique guide conductive film cannot share the same bonding mechanism of the test sorting machine with the probe type electrical connection device, thus increasing the detection system factor Difficulties in using different forms of electrical connection devices to interchange.

The purpose of the present invention is to provide an electrical connection assembly with oblique wire-guided conductive film, which solves the problem of electrical connection position difference of a single-chip oblique wire-guided conductive film.

In order to achieve the foregoing objective, the electrical connection assembly with diagonal conductive film provided by the present invention includes: a conductive film, which includes a film body, and is distributed in the film body at intervals relative to the thickness direction of the film body A plurality of oblique guide wires inclined in the same direction; and an electrical connection level difference compensation structure, which is arranged on one side of the thickness direction of the conductive film, and the electrical connection level difference compensation structure includes a plurality of gap compensations distributed at intervals Conduction paths, the two ends of each of the displacement compensation conduction paths are respectively a wire contact part and an electrical contact part, and the wire contact part of each of the displacement compensation conduction paths can electrically contact its corresponding position One end of the oblique guide wire, the electrical contact part of each of the displacement compensation conduction paths is eccentrically located on one side of the same wire contact part with a pair of position contacts, and each of the displacement compensation conduction The position of the alignment contact of the path corresponds to the position of the other end of the oblique guide wire electrically connected to the same displacement compensation conductive path in a straight line along the thickness direction of the film body.

The invention is based on the composition of the aforementioned electrical connection components, which mainly utilizes the combination of an electrical connection level difference compensation structure and a conductive film with oblique guide lines, wherein the electrical connection level difference compensation structure is used to construct a plurality of gap compensation conductive paths distributed at intervals , Each level difference compensation conduction path is electrically connected to one end of the corresponding oblique guide wire, and the position of the alignment contact in each level difference compensation conduction path and the position of the other end of the oblique guide wire electrically connected along the film The height direction (up and down) of the main body corresponds to a straight line, so that the electrical connection components The electrical connection position of the circuit carrier board of the detection system and the position of the electrical contact of the semiconductor component under test are in a straight line up and down. This solves the problem that the existing monolithic diagonal conductive film is used in the detection system, and the semiconductor component under test is opposite. The position difference of the circuit contacts on the circuit carrier board due to the oblique conductor. Therefore, the electrical connection assembly with diagonal conductive film of the present invention overcomes the problem of electrical connection position difference, so that it can share the same bonding mechanism of the test sorting machine with the existing probe-type electrical connection device, and solve the existing detection The system is difficult to use different forms of electrical connection devices.

1A: Electrical connection components

1B: Electrical connection components

1C: Electrical connection components

10: Conductive film

11: Film body

12: Diagonal guide line

20A: Electric connection displacement compensation structure

21A: Displacement compensation conduction path

211A: Wire contact part

212A: Electrical contact

213A: Counterpoint contact

22A: Circuit diaphragm

23A: Insulating sheet body

24A: Conductor

241A: Ground path

25A: Insulation layer

20B: Electric connection displacement compensation structure

21B: Displacement compensation conduction path

211B: Wire contact part

212B: Electrical contact

213B: counterpoint contact

22B: Circuit diaphragm

23B: Insulating sheet body

24B: Conductor

241B: Ground path

25B: Insulation layer

26B: component electrical connection piece

261B: Insulating base material

262B: Electrical contact pad

263B: Power-on contact

264B: Power-off contact point

265B: Ground line

20C: Electric connection displacement compensation structure

21C: Displacement compensation conduction path

211C: Wire contact part

212C: Electrical contact

213C: counterpoint contact

22C: Circuit diaphragm

23C: Insulating sheet body

24C: Conductor

241C: Upper contact

242C: Lower contact

243C: Ground path

25C: Conductive adhesive auxiliary sheet

251C: Film substrate

252C: Inclined wire

26C: Component electrical connection piece

261C: Insulating base material

262C: Electrical contact pad

263C: Power-on contact

264C: Power-off contact point

265C: Ground line

30: Semiconductor components to be tested

31: Contact

40: circuit carrier board

41: circuit contact

FIG. 1 is a schematic plan view of the first preferred embodiment of the electrical connection assembly with diagonal conductive film of the present invention.

2 is a reference diagram of the first preferred embodiment of the electrical connection assembly with diagonal conductive film shown in FIG.

Fig. 3 is a schematic plan view of the second preferred embodiment of the electrical connection assembly with diagonal conductive film of the present invention.

4 is a reference diagram of the second preferred embodiment of the electrical connection assembly with diagonal conductive film shown in FIG.

FIG. 5 is a schematic plan view of an additional component electrical connection piece of the second preferred embodiment of the electrical connection assembly with diagonal conductive film shown in FIG. 3. FIG.

6 is a reference diagram of a preferred embodiment of the electrical connection assembly with diagonal conductive film shown in FIG. 5 applied to a circuit carrier of a semiconductor inspection system to perform semiconductor component inspection operations.

Fig. 7 is a schematic plan view of the third preferred embodiment of the electrical connection assembly with oblique wire-guided conductive film according to the present invention.

8 is a reference diagram of the third preferred embodiment of the electrical connection assembly with diagonal conductive film shown in FIG. 7 applied to a circuit carrier of a semiconductor inspection system to perform semiconductor component inspection operations.

FIG. 9 is a schematic plan view of an additional component electrical connection piece of the third preferred embodiment of the electrical connection assembly with diagonal conductive film shown in FIG. 7.

FIG. 10 is a reference diagram of a preferred embodiment of the electrical connection assembly with diagonal conductive film shown in FIG. 9 applied to a circuit carrier of a semiconductor inspection system to perform semiconductor component inspection operations.

The present invention provides a medium for the electrical connection between the circuit carrier board of the semiconductor component inspection system and the semiconductor component to be tested. The electrical connection assembly with diagonal conductive film of the present invention is based on the technical means disclosed in the foregoing content of the invention. Please refer to FIG. 1, FIG. 3, FIG. 5, FIG. 7 and FIG. 9. The electrical connection assembly 1A, 1B, 1C with diagonal conductive film mainly includes a conductive film 10 and an electrical connection position. Difference compensation structure 20A, 20B, 20C. The conductive film 10 includes a film body 11, and a plurality of oblique guide wires 12 spaced apart in the film body 11 and inclined in the same direction with respect to the thickness direction (up and down direction) of the film body 11. The electrical connection position difference compensation structure 20A, 20B, 20C are arranged on one side (upper side or lower side) of the conductive film 10, and the electrical connection displacement compensation structure 20A, 20B, 20C includes a plurality of displacement compensation conduction paths 21A, 21B, distributed at intervals, 21C, the different ends of each of the displacement compensation conductive paths 21A, 21B, 21C are respectively a wire contact portion 211A, 211B, 211C and an electrical contact portion 212A, 212B, 212C, each of the displacement compensation The wire contact portions 211A, 211B, and 211C of the conductive paths 21A, 21B, and 21C can electrically contact one end (upper end or lower end) of the diagonal guide wire 12 corresponding to their positions. Each of the displacement compensation conductive paths 21A, 21B, The electrical contact portions 212A, 212B, and 212C of 21C have a pair of position contacts 213A, 213B, and 213C laterally offset from one side of the wire contact portions 211A, 211B, and 211C, and each of the displacement compensation conductive paths 21A, 21B , 21C, the position of the alignment contacts 213A, 213B, and 213C are the same as the position compensation transmission The position of the other end of the oblique guide wire 12 electrically connected to the guide paths 21A, 21B, and 21C corresponds to a straight line along the thickness direction (up and down direction) of the film body 11.

Based on the foregoing technical means, the present invention can be implemented at least in the following specific and feasible preferred embodiments. The following is a detailed description of each preferred embodiment in conjunction with the drawings.

As shown in FIG. 1, it discloses the first preferred embodiment of the electrical connection assembly 1A of the present invention. As can be seen from the drawings, the electrical connection assembly 1A includes a conductive film 10 and a film body disposed on the conductive film 10 An electrical connection level difference compensation structure 20A on the upper side of 11, the structure of the conductive film 10 is the same as described above, which includes a film body 11, and distributed in the film body 11 and relative to the thickness direction of the film body 11 (up and down direction ) Most oblique guide wires 12 inclined in the same direction. The oblique guide wires 12 can be gold wires or other wires with electrical connection characteristics. Most of the oblique wires 12 extend obliquely in the same direction from the upper side of the film body 11. To the lower side of the film body 11.

As shown in FIG. 1, the electrical connection level difference compensation structure 20A includes a circuit diaphragm 22A. The circuit diaphragm 22A includes an insulating sheet body 23A, a plurality of electrical conductors 24A, and an insulating layer 25A. The bottom surface faces the conductive film 10, and a plurality of the conductors 24A are distributed in the insulating sheet 23A at intervals, and each of the conductors 24A extends from the upper surface of the insulating sheet 23A through the insulating sheet 23A to the insulation. The lower surface of the sheet body 23A, and each of the conductors 24A includes a wire contact portion 211A located on the lower surface of the insulating sheet body 23A and an electrical contact portion 212A located on the upper surface of the insulating sheet body 23A, so The electrical contact portion 212A has a aligning contact 213A laterally located on one side of the wire contact portion 211A, the insulating layer 25A is disposed on the upper surface of the insulating sheet 23A, and each of the conductors The alignment contacts 213A of the electrical contact portion 212A of 24A are respectively exposed on the upper surface of the insulating layer 25A. The wire contact portion 211A can respectively electrically contact the upper end of the diagonal wire 12 corresponding to the position in the conductive film 10, and each The position of the alignment contact 213A of the conductor 24A and the position of the lower end of the oblique guide wire 12 electrically connected to the conductor 24A correspond to a straight line along the height direction (up and down) of the film body 11, so that the circuit film 22A Each of the conductors 24A respectively constitutes a conduction path 21A for compensation of the displacement.

As shown in FIG. 1, in the aforementioned circuit film 22A, the thickness of the insulating layer 25A depends on the electrical contact of the conductor 24A at the corresponding position of the circuit film 22A. At the same time, the bottom surface of the semiconductor component to be tested can also be evenly pressed on the insulating sheet body 23A through the insulating layer 25A, so that each conductor 24A can respectively be used for the upper end of the diagonal guide wire 12 of the conductive film 10 Apply the following pressure.

As shown in FIG. 1, the circuit film 22A also includes a ground path 241A. The ground path 241A can electrically contact the oblique conductor 12 of the non-electrically connected conductor 24A in the conductive film 10, that is, the ground path 241A is separated from the conductor 24A and the oblique guide line 12 corresponding to the position in the conductive film 10 to which it is electrically connected, so that the ground path 241A is not connected to the position difference compensation conductive path 21A and the position in the conductive film 10 where it is connected The corresponding diagonal guide line 12.

Regarding the use of the first preferred embodiment of the electrical connection assembly 1A in semiconductor component inspection operations, as shown in FIG. 2, the electrical connection assembly 1A is mounted on the circuit carrier 40 of the semiconductor component inspection system. 40. The circuit contacts 41 on the upper surface of the electrical connection assembly 1A are in electrical contact with the lower ends of the diagonal guide wires 12 corresponding to the conductive film 10 in the lower position of the electrical connection assembly 1A, and the electrical connection position difference compensation structure 20A is used as the circuit diaphragm 22A The medium for electrical contact of the semiconductor component 30 to be tested.

In the foregoing, after the semiconductor component 30 to be tested is displaced directly above the electrical connection assembly 1A, it is vertically pressed down on the circuit film 22A. Each contact 31 on the bottom surface of the semiconductor component 30 to be tested is connected to the circuit film. The electrical contact portion 212A of the conductor 24A in the corresponding position in the sheet 22A, and the bottom surface of the semiconductor element 30 to be tested is evenly pressed on the insulating sheet 23A through the insulating layer 25A, so that each conductor 24A can be used for the conductive film 10 respectively. The upper end of the oblique wire 12 applies the following pressure, so that each contact 31 of the semiconductor component 30 to be tested is electrically connected via the conductor at the corresponding position of the circuit diaphragm 22A and the oblique wire 12 of the electrically connected conductive film The circuit carrier 40, in this way, the semiconductor component inspection system can perform the inspection operation on the semiconductor component 30 to be tested through the circuit carrier 40 and the electrical connection assembly 1A.

In the detection operation, the grounding path 241A of the circuit diaphragm 22A in the electrical connection assembly 1A and the diagonal conductor 12 of the electrically connected conductive film 10 can also be electrically connected to the grounding circuit in the circuit carrier 40 for grounding. In the foregoing, the electrical connection assembly 1A can also be arranged above the conductive film 10 by the circuit film 22A, so as to prevent the oxide film residues on the surface of the contact 31 of the semiconductor element 30 to be tested from adhering to the conductive film 10 to facilitate oxidation The film debris is removed and the durability of the conductive film 10 is improved.

As shown in FIG. 3, it discloses a second preferred embodiment of the electrical connection assembly 1B of the present invention. As can be seen from the drawings, the electrical connection assembly 1B includes a conductive film 10 and an electrical connection offset compensation structure 20B. The structure of the conductive film 10 is the same as that described above. It includes a film body 11 and a plurality of oblique guide wires 12 distributed in the film body 11 and inclined in the same direction with respect to the thickness direction of the film body 11. 12 Gold wire or other wires with electrical connection characteristics can be used. In this preferred embodiment, the opposite sides of the film body 11 in the thickness direction (up and down direction) are respectively an upper side and a lower side, and most of the oblique guide lines 12 extend from the upper side of the film body 11 to the film The bottom side of the body 11.

As shown in FIG. 3, the electrical connection level difference compensation structure 20B is arranged under the film body 11 of the conductive film 10. The electrical connection level difference compensation structure 20B has a circuit diaphragm 22B, and the circuit diaphragm 22B includes a An insulating sheet 23B, a plurality of conductive bodies 24B, and an insulating layer 25B. The upper surface of the insulating sheet 23B faces the bottom surface of the conductive film 10, and a plurality of the conductive bodies 24B are distributed in the insulating sheet 23B at intervals, Each of the conductors 24B extends from the upper surface of the insulating sheet 23B through the insulating sheet 23B to the lower surface of the insulating sheet 23B, and each of the conductors 24B includes the lower surface of the insulating sheet 23B. An electrical contact portion 212B of the electrical contact portion 212B and a wire contact portion 211B located on the upper surface of the insulating sheet body 23B, the insulating layer 25B covers the upper surface of the insulating sheet body 23B, and the wires of each of the conductors 24B contact The portion 211B is exposed on the upper surface of the insulating layer 25B, and the wire contact portion 211B electrically contacts the lower end of the diagonal wire 12 corresponding to the position in the conductive film 10, and the electrical contact portion 212B has a laterally offset from the wire contact portion One pair of contact points 213B on the side of 211B, each of the conductors 24B The position of the aligning contact 213B and the position of the upper end of the diagonal guide line 12 for electrical connection of the conductor 24B correspond to a straight line along the height direction (up and down) of the film body 11, so that each of the circuit films 22B is electrically conductive. The bodies 24B respectively constitute a one-bit difference compensation conduction path 21B.

As shown in FIG. 3, the circuit film 22B also includes a ground path 241B, and the ground path 241B can electrically contact the oblique conductor 12 of the non-electrically connected conductor 24B in the conductive film 10, that is, the ground path 241B is separated from the conductor 24B and the diagonal conductor 12 corresponding to the position in the conductive film 10 to which it is electrically connected. The ground path 241B extends from the upper surface of the insulating sheet 23B facing the conductive film 10 to the insulating sheet. The bottom surface of 23B, and the ground path 241B forms at least one ground contact on the bottom surface of the insulating sheet body 23B. The ground contact is used to connect the ground circuit of the circuit carrier.

As shown in FIG. 5, the electrical connection assembly 1B further includes a component electrical connection piece 26B. The component electrical connection piece 26B is disposed on the upper side of the film body 11 of the conductive film 10. The component electrical connection piece 26B includes an insulating base material. 261B and a plurality of electrical contact pads 262B, the plurality of electrical contact pads 262B are distributed in the insulating substrate 261B at intervals, and the electrical contact pads 262B extend from the upper side of the insulating substrate 261B through the insulating substrate 261B to the insulation The lower side surface of the substrate 261B, and each of the electrical contact pads 262B includes an upper electrical contact point 263B exposed on the upper side of the insulating substrate 261B and an electrical contact point 264B exposed under the lower side of the insulating substrate 261B, each One of the lower electrical contact points 264B is electrically connected to the position difference compensation conductive path 21B of the circuit diaphragm 22B through the diagonal conductor 12 corresponding to the position in the conductive film 10, respectively.

As shown in FIG. 5, in addition to adding a ground path 241B to the circuit diaphragm 22B as described above, the component electrical connection piece 26B also includes a ground line 265B, and the ground line 265B is connected to the electrical contact pad 262B. The diagonal conductors 12 corresponding to the positions in the conductive film 10 and the electrically connected conductive film 10 are isolated from each other. The grounding line 265B extends from the upper side of the insulating base material 261B to the lower side of the insulating base material 261B, and the grounding line 265B can pass through The diagonal conductor 12 corresponding to the position in the conductive film 10 is electrically connected to the ground path 241B of the circuit film 22B.

Regarding the use of the second preferred embodiment of the electrical connection assembly for semiconductor component inspection operations, as shown in FIGS. 4 and 5, the electrical connection assembly 1B is mounted on the circuit carrier 40 of the semiconductor component inspection system. The circuit contacts 41 on the upper surface of the carrier board 40 are in contact with the electrical connection contacts 212B of the conductor 24B at the corresponding position of the circuit diaphragm 22B in the electrical connection assembly 1B, and the conductive film 10 is used as the electrical connection of the semiconductor component 30 under test. The contact medium may be the component electrical connection sheet 26B on the conductive film 10 as the electrical contact medium of the semiconductor component 30 under test.

After the semiconductor element 30 to be tested is displaced directly above the electrical connection assembly 1B, it is vertically pressed down on the upper end of the diagonal conductor 12 corresponding to the position in the conductive film 10 to apply the following pressure to each of the semiconductor elements 30 to be tested The contacts 31 are respectively electrically connected to the corresponding circuit contacts 41 of the circuit carrier 40 via the diagonal conductor 12 corresponding to the position in the conductive film 10 and the conductor 24B corresponding to the circuit film 22B of the electrical connection. The component inspection system can perform inspection operations on the semiconductor component 30 to be tested through the circuit carrier 40 and the electrical connection assembly 1B.

Alternatively, after the semiconductor component 30 to be tested is displaced directly above the electrical connection assembly 1B, and is vertically pressed down on the circuit film 22B, each contact 31 on the bottom surface of the semiconductor component 30 to be tested is electrically connected to the component. The electrical contact pad 262B at the corresponding position in the sheet 26B is in contact, and at the same time, the electrical contact point 264B under the component electrical connection piece 26B is pressed on the conductive film 10, and then the conductive film 10 is obliquely located at the position corresponding to the lower electrical contact point 264B The upper end of the wire 12 applies the following pressure, so that each contact 31 of the semiconductor component 30 to be tested is electrically connected to the corresponding circuit contact 41 of the circuit carrier 40 via the component electrical connection piece 26B, the conductive film 10 and the circuit diaphragm 22B. In this way, the semiconductor device inspection system can perform inspection operations on the semiconductor device under test 30 through the circuit carrier 40 and the electrical connection assembly 1B.

In the detection operation, the grounding path 241B of the circuit diaphragm 22B in the electrical connection assembly 1B can also be electrically connected to the grounding circuit in the circuit carrier 40 for grounding through the diagonal conductor 12 of the electrically connected conductive film 10. Or the ground circuit 265B in the component electrical connection sheet 26B is electrically connected to the circuit carrier board through the diagonal guide wire 12 in the conductive film 10 corresponding to the position and the ground path 241B of the circuit diaphragm 22B The grounding circuit in 40 is used for grounding. In addition, the electrical connection assembly 1B can also be arranged above the conductive film 10 by means of the component electrical connection sheet 26B to prevent the oxide film residues on the surface of the contact 31 of the semiconductor component 30 to be tested from adhering to the conductive film 10 to facilitate oxidation The film debris is removed and the durability of the conductive film 10 is improved.

As shown in FIG. 7, it discloses a third preferred embodiment of the electrical connection assembly 1C of the present invention. As can be seen from the drawings, the electrical connection assembly 1C also includes a conductive film 10 and an electrical connection level difference compensation structure 20C The structure of the conductive film 10 is the same as described above, and it includes a film body 11 and a plurality of oblique guide wires 12 distributed in the film body 11 and inclined in the same direction with respect to the thickness direction (up and down direction) of the film body 11, The diagonal wire 12 can be a gold wire or other wires with electrical transmission characteristics. In this preferred embodiment, most of the oblique guide wires 12 extend obliquely from the upper side of the film body 11 to the lower side of the film body 11 in the same direction.

As shown in FIG. 7, the electrical connection level difference compensation structure 20C is disposed on the lower side of the conductive film 10. The electrical connection level difference compensation structure 20C includes a circuit film 22C and a conductive adhesive auxiliary film 25C. The circuit film The sheet 22C includes an insulating sheet body 23C and a plurality of conductors 24C. The plurality of conductors 24C are distributed in the insulating sheet body 23C at intervals, and the conductors 24C pass through the insulating sheet body from the upper surface of the insulating sheet body 23C. 23C extends to the lower surface of the insulating sheet 23C, and each of the conductors 24C includes an upper contact 241C exposed on the upper surface of the insulating sheet 23C and a lower contact 242C exposed on the lower surface of the insulating sheet 23C, In addition, the position of the upper contact 241C and the position of the lower contact 242C are in a straight line up and down, and the upper contact 241C of the circuit film 22C electrically contacts the lower end of the diagonal guide wire 12 corresponding to the position in the conductive film 10 respectively.

As shown in FIG. 7, the conductive adhesive auxiliary sheet 25C is installed on the lower side of the circuit film 22C. The conductive adhesive auxiliary sheet 25C includes a film substrate 251C, and is distributed in the film substrate 251C and is opposite to the film substrate. The thickness direction (up and down direction) of the base material 251C is a plurality of inclined wires 252C inclined in the same direction. The inclined wires 252C of the conductive adhesive sheet 25C and the diagonal wires 12 of the conductive film 10 are mutually inclined. Each conductor 24C of the diaphragm 22C is combined with the inclined wire 252C of the electrically-connected conductive adhesive sheet 25C to form a one-level difference compensation conduction path 21C, and the contacts 242C under the circuit diaphragm 22C electrically contact the conductive adhesive auxiliary sheet. The position in the sheet 25C corresponds to the upper end of the oblique guide wire 12, and the plurality of inclined wires 252C of the conductive adhesive auxiliary sheet 25C in each position difference compensation conductive path 21C are far away from the bottom end of the circuit diaphragm 22C to form a pair of position contacts 213C, And the position of the alignment contact 213C of each position difference compensation conduction path 21C and the position of the other end of the diagonal guide line 12 of the conductive film 10 electrically connected to the position difference compensation conduction path 21C are along the film body 11 The height direction (up and down direction) corresponds to a straight line.

As shown in FIG. 7, the circuit film 22C also includes a ground path 243C, and the ground path 243C is isolated from each of the conductors 24C and the diagonal conductors 12 corresponding to the positions in the conductive film 10 to which they are electrically connected, and The ground path 243C is isolated from the inclined wire 252C corresponding to the position of the conductive adhesive auxiliary sheet 25C electrically connected to each of the conductors 24C, that is, the ground path 243C faces the insulating sheet body of the conductive film 10 from the circuit film 22C The upper surface of 23C extends to the lower surface of the insulating sheet body 23C, and is isolated from the displacement compensation conductive path 21C.

As shown in FIG. 9, the electrical connection assembly 1C further includes a component electrical connection piece 26C. The component electrical connection piece 26C is disposed on the upper side of the film body 11 of the conductive film 10, and the component electrical connection piece 26C includes an insulating base material. 261C and a plurality of electrical contact pads 262C, the plurality of electrical contact pads 262C are distributed in the insulating substrate 261C at intervals, and the electrical contact pads 262C extend from the upper sides of the insulating substrates 261B and 261C through the insulating substrate 261C To the lower side of the insulating substrate 261C, and each of the electrical contact pads 262C includes an upper electrical contact point 263C exposed on the upper side of the insulating substrate 261C and a lower electrical contact exposed on the lower side of the insulating substrate 261C At point 264C, each of the lower electrical contact points 264C is electrically connected to the displacement compensation conduction path 21C through an oblique guide wire 12 corresponding to a position in the conductive film 10, respectively.

As shown in FIG. 9, the component electrical connection piece 26C also includes a ground line 265C. The ground line 265C is isolated from the electrical contact pad 262C and the diagonal guide line 12 corresponding to the position in the conductive film 10 to which it is electrically connected. The ground line 265C extends from the upper side of the insulating base material 261C to the lower side, and The grounding line 265C can be electrically connected to the grounding path 243C of the circuit film 22C and the grounding path 243C electrically connected to the conductive adhesive auxiliary sheet 25C through the inclined conductor 12 corresponding to the position in the conductive film 10. Wire 252C.

Regarding the use of the third preferred embodiment of the electrical connection assembly for semiconductor component inspection operations, as shown in FIGS. 8 and 10, the electrical connection assembly 1C is mounted on the circuit carrier 40 of the semiconductor component inspection system. The circuit contacts 41 on the upper surface of the carrier 40 are respectively in contact with the lower ends of the inclined wires 252C at the corresponding positions of the conductive adhesive auxiliary sheet 25C in the electrical connection assembly 1C, and the conductive film 10 in the upper position is used as the semiconductor component 30 to be tested. The medium for electrical contact, or the electrical connection piece 26C on the conductive film 10 is used as the medium for electrical contact of the semiconductor component 30 to be tested.

After the semiconductor element 30 to be tested is displaced directly above the electrical connection assembly 1C, it is vertically pressed down on the upper end of the diagonal conductor 12 corresponding to the position in the conductive film 10 to apply the following pressure to each of the semiconductor elements 30 to be tested The contacts 31 are respectively electrically connected to the circuit carrier 40 via the diagonal conductor 12 corresponding to the position in the conductive film 10, the conductor 24C in the corresponding position of the circuit film 22C, and the inclined wire 252C in the corresponding position of the conductive adhesive auxiliary sheet 25C. Corresponding to the circuit contact 41, in this way, the semiconductor device inspection system can perform the inspection operation on the semiconductor device 30 to be tested through the circuit carrier 40 and the electrical connection assembly 1C.

Alternatively, after the semiconductor component 30 to be tested is moved directly above the electrical connection assembly 1C, and is vertically pressed down on the circuit film 22C, each contact 31 on the bottom surface of the semiconductor component 30 to be tested is electrically connected to the component. The electrical contact pad 262C at the corresponding position in the sheet 26C is in contact, and at the same time, the electrical contact point 264C under the component electrical connector 26C is pressed on the conductive film 10, and then the conductive film 10 is obliquely located at the position of the corresponding lower electrical contact point 264C The upper end of the wire 12 applies the following pressure, so that each contact 31 of the semiconductor component 30 to be tested is electrically connected to the circuit carrier 40 via the component electrical connection sheet 26C, the conductive film 10, the circuit diaphragm 22C, and the conductive adhesive auxiliary sheet 25C. Corresponding to the circuit contact 41, in this way, the semiconductor component inspection system can perform the inspection operation on the semiconductor component 30 to be tested through the circuit carrier 40 and the electrical connection assembly 1C.

In the inspection operation, the ground path 243C of the circuit diaphragm 22C in the electrical connection assembly 1C can be combined with the diagonal conductor 12 of the electrically connected conductive film 10 and the inclined wire 252C of the conductive adhesive auxiliary film 25C to be electrically connected to the circuit carrier. The grounding circuit in 40 is used for grounding. Or the ground line 265C in the component electrical connection sheet 26C is electrically connected to the circuit carrier 40 through the diagonal guide line 12 in the conductive film 10 corresponding to the position, the inclined wire 252C of the conductive adhesive auxiliary sheet 25C, and the ground path 243C of the circuit diaphragm 22C. In the grounding circuit, used for grounding. In addition, the electrical connection assembly 1C can also be arranged above the conductive film 10 by means of the component electrical connection sheet 26C to prevent the oxide film residues on the surface of the contact 31 of the semiconductor component 30 to be tested from adhering to the conductive film 10 to facilitate oxidation. The film debris is removed and the durability of the conductive film 10 is improved.

1A: Electrical connection components

10: Conductive film

11: Film body

12: Diagonal guide line

20A: Electric connection displacement compensation structure

21A: Displacement compensation conduction path

211A: Wire contact part

212A: Electrical contact

213A: Counterpoint contact

22A: Circuit diaphragm

23A: Insulating sheet body

24A: Conductor

241A: Ground path

25A: Insulation layer

Claims (10)

An electrical connection assembly with an oblique guide line type conductive film, comprising: a conductive film, which includes a film body and a plurality of oblique guide lines spaced in the film body and inclined in the same direction; and an electrical connection position difference compensation Structure, which is arranged on one side of the conductive film and includes a plurality of displacement compensation conduction paths distributed at intervals, each of the displacement compensation conduction paths is electrically connected to one end of the corresponding oblique conductor, and each of the positions The difference compensation conduction path includes a pair of position contacts, and the position of the position contact of each of the position difference compensation conduction paths and the position of the other end of the diagonal guide line electrically connected to it is along the height direction of the film body Corresponding; wherein the opposite sides of the conductive film in the height direction of the film body are respectively an upper side and a lower side, and most of the oblique guide lines extend from the upper side of the film body to the lower side of the film body in the same direction; the electrical connection The level difference compensation structure includes a circuit diaphragm, the circuit diaphragm is arranged on the upper side of the conductive film, and the circuit diaphragm includes an insulating sheet, a plurality of conductors and an insulating layer, the lower surface of the insulating sheet faces In the conductive film, a plurality of the conductive systems are distributed in the insulating sheet at intervals, and each of the conductors extends from the upper surface of the insulating sheet through the insulating sheet to the lower surface of the insulating sheet, and Each of the electrical conductors includes a wire contact portion exposed on the lower surface of the insulating sheet body and an electrical contact portion exposed on the upper surface of the insulating sheet body, and the electrical contact portion has a laterally biased wire contact portion One of the alignment contacts on one side of the conductive film, the wire contact portion electrically contacts the upper end of the diagonal guide wire corresponding to the position in the conductive film, the lower surface of the insulating sheet faces the conductive film, and a plurality of the conductive films The system interval is distributed in the insulating sheet, and each of the conductors extends from the upper surface of the insulating sheet through the insulating sheet to the lower surface of the insulating sheet, and each of the conductors includes An electrical contact portion on the upper surface of the insulating sheet body and a wire contact portion on the lower surface of the insulating sheet body, the electrical contact portion having the alignment contact that is laterally offset from one side of the wire contact portion , The insulating layer is overlaid on The upper surface of the insulating sheet, and the alignment contacts of each of the conductors are respectively exposed on the upper surface of the insulating layer, and the wire contact portions can respectively electrically contact the diagonal conductors at the corresponding positions in the conductive film. The upper end, and the position of the alignment contact of each conductor corresponds to the position of the lower end of the oblique guide line for electrical connection of the conductor, so that each conductor of the circuit film constitutes one The position difference compensates the conduction path. According to claim 1, the electrical connection assembly with diagonal conductive film, wherein the circuit film further includes a ground path, and the ground path is connected to the conductor and the conductive film electrically connected therewith The diagonal guide lines corresponding to the positions are isolated from each other. An electrical connection assembly with an oblique guide line type conductive film, comprising: a conductive film, which includes a film body and a plurality of oblique guide lines spaced in the film body and inclined in the same direction; and an electrical connection position difference compensation Structure, which is arranged on one side of the conductive film and includes a plurality of displacement compensation conduction paths distributed at intervals, each of the displacement compensation conduction paths is electrically connected to one end of the corresponding oblique conductor, and each of the positions The difference compensation conduction path includes a pair of position contacts, and the position of the position contact of each of the position difference compensation conduction paths and the position of the other end of the diagonal guide line electrically connected to it is along the height direction of the film body Corresponding; wherein the opposite sides of the conductive film in the height direction of the film body are respectively an upper side and a lower side, and most of the oblique guide lines extend from the upper side of the film body to the lower side of the film body in the same direction; the electrical connection The level difference compensation structure includes a circuit film, the circuit film is arranged on the underside of the conductive film, the circuit film includes an insulating sheet, a plurality of conductors and an insulating layer, the upper surface of the insulating sheet faces On the bottom surface of the conductive film, a plurality of the conductive systems are distributed in the insulating sheet at intervals, and each of the conductors extends from the upper surface of the insulating sheet through the insulating sheet to the lower surface of the insulating sheet, And each of the conductors includes an electrical contact portion exposed on the lower surface of the insulating sheet body and a wire contact portion exposed on the upper surface of the insulating sheet body, and the insulating layer is covered on the insulating sheet body surface Surface, the wire contact portion of each conductor is exposed on the upper surface of the insulating layer, and the wire contact portion electrically contacts the lower end of the oblique wire corresponding to the position in the conductive film, and the electrical contact portion has a lateral deviation A pair of position contacts located on one side of the wire contact part, the position of the position contact of each conductor and the position of the upper end of the oblique guide wire for electrical connection of the conductor correspond to the upper and lower straight lines, so that the circuit film Each of the conductors of the sheet respectively constitutes a conduction path for the displacement compensation. According to claim 3, the electrical connection assembly with diagonal conductive film, wherein the circuit film further includes a grounding path, and the grounding path is connected to the conductor and the position in the conductive film electrically connected to it. The corresponding oblique wires are isolated from each other, the grounding path extends from the upper surface of the insulating sheet facing the conductive film to the lower surface of the insulating sheet, and the grounding path is formed at least on the lower surface of the insulating sheet One ground contact. According to claim 3, the electrical connection assembly with diagonal conductive film, wherein the electrical connection assembly further includes a component electrical connection piece, the component electrical connection piece is arranged on the upper side of the film body of the conductive film, the The device electrical connection sheet includes an insulating substrate and a plurality of electrical contact pads. The plurality of electrical contact pads are distributed in the insulating substrate at intervals and all extend from the upper side of the insulating substrate through the insulating substrate to the The lower side of the insulating substrate, each of the electrical contact pads includes an upper electrical contact point exposed on the upper side of the insulating substrate and an electrical contact point exposed under the lower side of the insulating substrate, each of the lower The electrical contact points are respectively electrically connected to the position difference compensation conduction path of the circuit diaphragm through oblique conductors corresponding to the positions in the conductive film. According to claim 5, the electrical connection assembly with diagonal conductive film, wherein the circuit film further includes a ground path, and the ground path is connected to the conductor and the position in the conductive film electrically connected to it The corresponding oblique conductors are isolated from each other, the grounding path extends from the upper surface of the insulating sheet facing the conductive film to the lower surface, and the grounding path forms at least one ground on the lower surface of the insulating sheet contact; The component electrical connection sheet also includes a grounding line, the grounding line is isolated from the electrical contact pad and the diagonal guide line corresponding to the position in the conductive film that is electrically connected to each other, and the grounding line extends from the upper side of the insulating substrate To the lower side of the insulating base material, and the grounding line can be electrically connected to the grounding path of the circuit diaphragm through the oblique conductor corresponding to the position in the conductive film. An electrical connection assembly with an oblique guide line type conductive film, comprising: a conductive film, which includes a film body and a plurality of oblique guide lines spaced in the film body and inclined in the same direction; and an electrical connection position difference compensation Structure, which is arranged on one side of the conductive film and includes a plurality of displacement compensation conduction paths distributed at intervals, each of the displacement compensation conduction paths is electrically connected to one end of the corresponding oblique conductor, and each of the positions The difference compensation conduction path includes a pair of position contacts, and the position of the position contact of each of the position difference compensation conduction paths and the position of the other end of the diagonal guide line electrically connected to it is along the height direction of the film body Corresponding; wherein the opposite sides of the conductive film in the height direction of the film body are respectively an upper side and a lower side, and most of the oblique guide lines extend from the upper side of the film body to the lower side of the film body in the same direction; the electrical connection The level difference compensation structure is arranged under the conductive film. The electrical connection level difference compensation structure includes a circuit film and a conductive adhesive auxiliary sheet. The circuit film includes an insulating sheet body and a plurality of conductive bodies. The conductive system is distributed in the insulating sheet at intervals, and the conductors extend from the upper surface of the insulating sheet through the insulating sheet to the lower surface of the insulating sheet, and each of the conductors includes An upper contact exposed on the upper surface of the insulating sheet body and a lower contact exposed on the lower surface of the insulating sheet body, and the position of the upper contact and the position of the lower contact are vertically opposite to each other, The contacts on the circuit film respectively electrically contact the lower ends of the diagonal guide lines corresponding to the positions in the conductive film; the conductive adhesive auxiliary sheet is arranged on the lower side of the circuit film, and the conductive adhesive auxiliary sheet includes a film base And a plurality of inclined wires distributed in the film substrate and inclined in the same direction with respect to the thickness direction of the film substrate. Circuit Each conductor of the diaphragm is combined with the inclined wire of the conductive adhesive auxiliary sheet to which it is electrically connected to form a position difference compensation conduction path, and the contacts under the circuit diaphragm respectively electrically contact the corresponding positions in the conductive adhesive auxiliary sheet The upper end of the oblique guide wire, and the bottom end of the plurality of inclined wires of the conductive adhesive sheet in each of the displacement compensation conductive paths constitute the alignment contact, and each of the displacement compensation The position of the alignment contact of the conductive path and the position of the upper end of the diagonal guide line of the conductive film that is electrically connected to it correspond to the upper and lower straight lines. According to claim 7, the electrical connection assembly with diagonal conductive film, wherein the circuit film further includes a ground path, the ground path and each of the conductors and the position in the conductive film electrically connected The corresponding oblique wires are isolated from each other, and the grounding path is isolated from the oblique wires corresponding to the positions in the conductive adhesive auxiliary sheet electrically connected to each of the conductors. According to claim 7, the electrical connection assembly with diagonal conductive film, wherein the electrical connection assembly further includes a component electrical connection piece, the component electrical connection piece is arranged on the upper side of the film body of the conductive film, the The device electrical connection sheet includes an insulating substrate and a plurality of electrical contact pads. The plurality of electrical contact pads are distributed in the insulating substrate at intervals, and the electrical contact pads pass through the insulating substrate from the upper surface of the insulating substrate. The substrate extends to the lower surface of the insulating substrate, and each of the electrical contact pads includes an upper electrical contact point exposed on the upper surface of the insulating substrate and a lower electrical contact exposed on the lower surface of the insulating substrate Each of the lower electrical contact points is electrically connected to the displacement compensation conduction path through an oblique guide wire corresponding to a position in the conductive film. According to claim 9, the electrical connection assembly with diagonal conductive film, wherein the circuit film further includes a ground path, and the ground path is connected to each of the conductors and the position in the conductive film electrically connected to them The corresponding oblique conductors are isolated from each other, and the grounding path is isolated from the oblique conductors corresponding to the position in the conductive adhesive auxiliary sheet of each of the conductors electrically connected, that is, the grounding path faces from the insulating sheet of the circuit diaphragm to the The upper surface of the insulating sheet body of the conductive film extends to the lower surface, and is isolated from the displacement compensation conduction path; The component electrical connection sheet also includes a grounding line, the grounding path is isolated from the electrical contact pad and the diagonal guide line corresponding to the position in the conductive film that is electrically connected to each other, and the grounding line is from the first side surface of the insulating substrate Extending to the second side surface of the insulating substrate, and the grounding line can be electrically connected to the grounding path of the circuit diaphragm and the conductive adhesive auxiliary sheet electrically connected to the grounding path through the oblique guide wire corresponding to the position in the conductive film The inclined wire corresponding to the middle position.

Images