JP4264310B2 - Board inspection equipment - Google Patents

Description

  The present invention relates to a substrate inspection apparatus, and more particularly to a substrate inspection apparatus that inspects a wiring pattern by bringing a contact into contact with the wiring patterns formed on both surfaces of a substrate to be inspected. The present invention is not limited to a printed wiring board, but includes, for example, electrical wiring on various substrates such as flexible substrates, multilayer wiring substrates, electrode plates for liquid crystal displays and plasma displays, and package substrates and film carriers for semiconductor packages. In this specification, these various wiring boards are collectively referred to as “substrates”.

  FIG. 7 is a cross-sectional view for explaining the configuration of the substrate inspection apparatus 100 according to the background art. The cross-sectional view shown in FIG. 7 is a cross-section of the main part of the substrate inspection apparatus 100 as viewed from a cut surface that cuts the vicinity of the center of the substrate 101 to be inspected while the substrate 101 to be inspected is supported at the inspection position by the work holder 102. Show. A substrate inspection apparatus 100 shown in FIG. 7 includes two moving probes 103 that move in three axial directions, a jig 105 that includes a multi-needle-shaped contact 104, and a lifting mechanism that moves the jig 105 up and down. 106, a pressing plate 107 for pressing the board to be inspected 101 against the contact 104, and a lifting mechanism 108 for lifting the pressing plate 107 up and down.

  FIG. 8 is a view of the inspected substrate 101 and the pressing plate 107 as viewed from the front. An inspected substrate 101 shown in FIG. 8B is a package substrate used for an IC package such as a BGA (Ball Grid Array), and a semiconductor chip is placed in the central portion of the inspected substrate 101. Bumps for connection to are provided within the bump area 109. Further, an opening 110 larger than the bump area 109 is provided at the center of the pressing plate 107 shown in FIG.

  Then, the pressing plate 107 is lowered by the lifting mechanism 108, and the substrate 101 to be inspected held by the work holder 102 is pressed from above by the pressing plate 107. Further, when the jig 105 is raised by the lifting mechanism 106 in this state, the contact 104 is pressed against the wiring pattern formed on the lower surface of the substrate 101 to be inspected, and the wiring pattern of the substrate 101 to be inspected and the contact 104 Contact is ensured. In this case, as shown in FIG. 8A, the bump area 109 is fitted in the opening 110. The moving probe 103 is brought into contact with the bump to be inspected in the bump area 109 through the opening 110.

Thereby, the moving probe 103 is brought into contact with the wiring pattern formed on the upper surface of the substrate to be inspected 101, and the multi-needle-shaped contact 104 is simultaneously brought into contact with the plurality of wiring patterns formed on the lower surface of the substrate to be inspected 101, A wiring formed on the substrate 101 to be inspected by detecting a current flowing between each moving probe 103 or between each contact 104 or between the moving probe 103 and the contact 104 when a predetermined inspection signal is applied. A circuit board inspection apparatus for inspecting pattern continuity and short-circuiting between wiring patterns, and reducing the inspection time by using a multi-needle contact 104 that does not require the contact to be moved for each wiring pattern to be inspected. Is known (for example, see Patent Document 1).
JP 2000-338164 A

By the way, in recent years, in a package substrate such as a BGA, a pad 122 for mounting a component such as a capacitor around a bump area 121 similar to the bump area 109 on one surface of the substrate, like a substrate 120 shown in FIG. In addition, those formed with other wiring patterns are used. In addition, a wiring pattern such as a ball grid pad is provided on the other surface of the substrate 120. When inspecting such a substrate 120, the opening 110a of the pressing plate 107a is made larger than the range where the pad 122 is formed, so that the moving probe 103 can be brought into contact with the pad 122. Can be considered.

  However, if the range where the pad 122 is formed is wide, the presser plate 107a cannot sufficiently secure the presser margin that is the portion that presses the substrate 120 to be inspected. As a result, the presser plate 107a presses against the contact 104. In addition, there is a problem that the inspected substrate 120 is warped or the contact 104 cannot be sufficiently pressed against the wiring pattern formed on the other surface of the inspected substrate 120.

  The present invention has been made in view of such a problem, and can inspect a wiring pattern formed on one surface of a substrate to be inspected and press the other surface against a multi-needle contact for inspection. An object of the present invention is to provide a substrate inspection apparatus capable of performing the above.

The invention described in claim 1 is a board inspection apparatus for inspecting a wiring pattern by bringing a contact for inspection into contact with a wiring pattern formed on both surfaces of the board to be inspected, on one surface of the board to be inspected. In order to simultaneously contact the first inspection contact that contacts the first wiring pattern formed in a predetermined inspection range and the plurality of second wiring patterns formed on the other surface of the substrate to be inspected, respectively. A second inspection contact formed in a needle shape is disposed opposite to the second inspection contact via the substrate to be inspected, and the substrate to be inspected is used for the second inspection. A planar substrate pressing member in pressure contact with the contact, and the substrate pressing member is arranged on the one surface of the substrate to be inspected in the state of being pressed when the substrate to be inspected is disposed at a predetermined inspection position. Outside the inspection range With a third test contacts of the contact with the third wiring pattern formed on the location, which opening at a position opposed to the inspection range of the substrate holding member is formed, the third A contact electrode that is in electrical communication with the contact for inspection ; and the first contact for contact is configured to pass through the opening and contact the first wiring pattern, and is movable. It is characterized by being moved to contact the contact electrode .

  According to the first aspect of the present invention, each of the second wiring patterns formed on the other surface of the substrate to be inspected is simultaneously pressed against each of the second inspection contacts formed in a multi-needle shape by the substrate pressing member. Is done. At this time, the surface position outside the inspection range of the substrate to be inspected on which the third wiring pattern is formed becomes a margin for the substrate pressing member to press the substrate to be inspected against the second inspection contact. . Then, in a state where the second wiring pattern and the second inspection contact are pressed against each other by the substrate pressing member, the third inspection contact included in the substrate pressing member and the position where it is pressed. The first wiring contact is in contact with the formed third wiring pattern, and the first contact for inspection passes through the opening formed in the substrate pressing member and is formed on one surface of the substrate to be inspected. Touch the wiring pattern.

  According to a second aspect of the present invention, in the substrate inspection apparatus according to the first aspect, the third inspection contact is formed into a pin shape whose one end is in contact with the third wiring pattern and the substrate. It is characterized by being embedded in the pressing member. According to the second aspect of the present invention, the third inspection contact embedded in the substrate pressing member comes into contact with the third wiring pattern.

According to a third aspect of the invention, the substrate inspection apparatus according to claim 2, wherein the third test contacts of the substrate pressing embedded through the member Rutotomoni other end electrode the contact child It is characterized by being made. According to the third aspect of the present invention, the first inspection contact is brought into contact with the other end of the third inspection contact that is in contact with the third wiring pattern.

According to a fourth aspect of the present invention, there is provided a substrate inspection apparatus for inspecting a wiring pattern by bringing a contact for inspection into contact with a wiring pattern formed on both surfaces of the substrate to be inspected, on one surface of the substrate to be inspected. In order to simultaneously contact the first inspection contact that contacts the first wiring pattern formed in a predetermined inspection range and the plurality of second wiring patterns formed on the other surface of the substrate to be inspected, respectively. A second inspection contact formed in a needle shape is disposed opposite to the second inspection contact via the substrate to be inspected, and the substrate to be inspected is used for the second inspection. A planar substrate pressing member in pressure contact with the contact, and the substrate pressing member is arranged on the one surface of the substrate to be inspected in the state of being pressed when the substrate to be inspected is disposed at a predetermined inspection position. Outside the inspection range A third contact for contact with the third wiring pattern formed on the device, and an opening is formed at a position facing the inspection range of the substrate pressing member. The inspection contact passes through the opening and contacts the first wiring pattern, and the substrate pressing member is brought into contact with the third wiring pattern on the surface facing the substrate to be inspected. A contact substrate on which the first electrode is formed, wherein the third inspection contact is constituted by the first electrode, and the contact substrate is the substrate to be inspected. Is arranged at the inspection position, and is led out of the surface facing the substrate to be inspected, and includes a fourth wiring pattern connected to the first electrode, and the contactor substrate includes the contacted substrate. With the substrate placed at the inspection position, A fourth electrode contact for contact with the second electrode is formed by forming a second electrode connected to the fourth wiring pattern at a position outside the surface facing the substrate to be inspected. Is further provided .

According to invention of Claim 4, the 1st electrode formed in the board | substrate for contacts was contacted to the 3rd wiring pattern as a 3rd contact for a test | inspection, and was connected to the 1st electrode. The fourth wiring pattern is led out of the surface facing the substrate to be inspected. Further, the fourth wiring pattern is connected to the second electrode connected to the first electrode constituting the third inspection contact at a position outside the surface facing the substrate to be inspected. The contact is contacted.

The invention according to claim 5 is a board inspection apparatus for inspecting the wiring pattern by bringing a contact for inspection into contact with the wiring patterns formed on both surfaces of the board to be inspected, on one surface of the board to be inspected. In order to simultaneously contact the first inspection contact that contacts the first wiring pattern formed in a predetermined inspection range and the plurality of second wiring patterns formed on the other surface of the substrate to be inspected, respectively. A second inspection contact formed in a needle shape is disposed opposite to the second inspection contact via the substrate to be inspected, and the substrate to be inspected is used for the second inspection. A planar substrate pressing member in pressure contact with the contact, and the substrate pressing member is arranged on the one surface of the substrate to be inspected in the state of being pressed when the substrate to be inspected is disposed at a predetermined inspection position. Outside the inspection range A third contact for contact with the third wiring pattern formed on the device, and an opening is formed at a position facing the inspection range of the substrate pressing member. The inspection contact passes through the opening and contacts the first wiring pattern, and the substrate pressing member is brought into contact with the third wiring pattern on the surface facing the substrate to be inspected. A contact substrate on which the first electrode is formed, wherein the third inspection contact is constituted by the first electrode, and the contact substrate is the substrate to be inspected. Is arranged at the inspection position and is guided out of the surface facing the substrate to be inspected, and has a fourth wiring pattern connected to the first electrode, and the contactor substrate includes the fourth wiring pattern. The third electrode connected to the wiring pattern is shaped The third electrode is routed to a surface position of the substrate pressing member opposite to the side facing the substrate to be inspected, and the first inspection contact is the third contact It is characterized by moving to further contact the electrode .

According to the fifth aspect of the present invention, the third electrode connected to the first electrode constituting the third inspection contact by the fourth wiring pattern is the inspection target of the substrate pressing member. It is routed to the surface position opposite to the side facing the substrate. Then, the first inspection contact is brought into contact with the third electrode.

According to a sixth aspect of the present invention, in the substrate inspection apparatus according to the fourth or fifth aspect , the contactor substrate is a flexible substrate. According to the invention described in claim 6 , the contactor substrate is formed of a flexible substrate.

  In the substrate inspection apparatus having such a configuration, the substrate to be inspected is pressed against the second inspection contact by the substrate pressing member while the third inspection contact included in the substrate pressing member is brought into contact with the third wiring pattern. Therefore, the other surface can be pressed against the multi-needle contact for inspection while inspecting the wiring pattern formed on the one surface of the substrate to be inspected.

  Embodiments according to the present invention will be described below with reference to the drawings. In addition, the structure which attached | subjected the same code | symbol in each figure shows that it is the same structure, The description is abbreviate | omitted.

(First embodiment)
FIG. 1 is a cross-sectional view for explaining the configuration of a substrate inspection apparatus 1 according to the first embodiment of the present invention. The sectional view shown in FIG. 1 is a cut surface that cuts the vicinity of the center of the substrate to be inspected 120 in a state where the substrate to be inspected 120 is held at the inspection position by the work holder 2 (XX section shown in FIG. 2A). The cross section of the principal part of the board | substrate inspection apparatus 1 seen from FIG. A substrate inspection apparatus 1 shown in FIG. 1 includes two moving probes 4 that move in three axial directions each having a contact 3, a jig 6 that has a contact 5 formed in a multi-needle shape, and a jig Elevating mechanism 11 that moves up and down 6, presser plate 7 that presses substrate under test 120 against contact 5, and elevating mechanism 8 that elevates and lowers presser plate 7. The board inspection apparatus 1 also includes an unillustrated inspection control unit electrically connected to each of the contact 3 and the contact 5 by an unillustrated wiring cable or the like. The inspection control unit is configured using, for example, a microcomputer or the like, and when a predetermined inspection signal is given between each contact 3, between each contact 5, or between the contact 3 and the contact 5. By detecting the flowing current, the continuity of the wiring pattern formed on the inspected substrate 120 and the short circuit between the wiring patterns are inspected.

  FIG. 2 is a view of the inspected substrate 120 and the pressing plate 7 as viewed from the front. 2B is a package substrate used for an IC package such as a BGA (Ball Grid Array), and a semiconductor chip is covered at the center of one surface of the substrate 120 to be inspected. Bumps 123 for connection to the inspection substrate 120 are provided in the range of the bump area 121 (predetermined inspection range), and around the bump area 121, a plurality of pads 122 extends to the vicinity of the outer periphery of the inspected substrate 120. Is formed. In addition, a wiring pattern such as a ball grid pad is provided on the other surface of the substrate 120.

  Further, an opening 9 larger than the bump area 121 is provided in the center portion of the pressing plate 7 shown in FIG. Further, a substantially pin-shaped probe 10 is embedded around the opening 9 at a position facing the pad 122 when the inspected substrate 120 and the pressing plate 7 are positioned at the inspection position.

  FIG. 3 is an enlarged view of a portion surrounded by a wavy line A in FIG. In FIG. 3, a substantially pin-shaped probe 10 is embedded in the pressing plate 7 so as to penetrate the pressing plate 7. For example, a spring is incorporated in the probe 10, and the inspection contact 10 a is projected from one end of the probe 10 to the surface 7 a of the holding plate 7 facing the substrate 120 by the elasticity of the spring. Further, the other end of the probe 10 is exposed on the opposite surface 7 b of the pressing plate 7, and the exposed portion is a contact electrode surface 10 b for contacting the contact 3.

  The substrate 120 is provided with a marker 124 indicating a reference position for positioning on a surface 120 a on the side facing the pressing plate 7. The holding plate 7 is provided with a camera alignment hole 12 penetrating the holding plate 7. The substrate 120 is placed so that the marker 124 is positioned in the center of the camera alignment hole 12 using a positioning camera (not shown). By positioning, the substrate 120 is arranged at the inspection position.

  Next, the operation of the substrate inspection apparatus 1 configured as described above will be described. With reference to FIG. 4, first, the substrate 101 to be inspected is supported by the work holder 2, and the substrate 120 is positioned at the inspection position so that the marker 124 is positioned at the center of the camera alignment hole 12 using the positioning camera. Is done. Then, the pressing plate 7 is lowered by the lifting mechanism 8, and the inspected substrate 120 supported by the work holder 2 is pressed from above by the pressing plate 7.

  Next, when the jig 6 is raised by the lifting mechanism 11 in this state, the contact 5 is brought into contact with the wiring pattern formed on the surface 120b opposite to the surface 120a of the substrate 120. At this time, since the substrate 120 is held by the work holder 2 against the pressing force from the lower side by the contact 5 by the pressing plate 7, the inspection contact is applied to the pad 122 formed on the surface 120 a of the substrate 120. 10a is elastically contacted, and the wiring pattern formed on the surface 120b of the substrate 120 and the contact 5 are pressed against each other. An inspection signal is input / output via the contact 5 between the inspection control unit and the wiring pattern formed on the surface 120 b of the substrate 120. In this case, the opening 9 only needs to be larger than the bump area 121, and it is not necessary to make the opening 9 larger than the area where the pad 122 is formed. A sufficient margin for pressing is ensured, and the contact between the multi-needle contact 5 and the wiring pattern formed on the surface 120 b of the substrate 120 can be ensured without causing warpage of the substrate 120.

  Next, the contact 3 is moved by the moving probe 4 so as to be positioned on the probe 10 and is brought into contact with the contact electrode surface 10b. An inspection signal is input / output between the inspection control unit and the pad 122 via the contact 3 and the probe 10. In this case, since the probe 10 is provided so as to pass through the pressing plate 7, the pressing plate 7 presses the wiring pattern formed on the surface 120 b of the substrate 120 and the contact 5 while pressing the inspection control unit. It is possible to input and output inspection signals between the pad 122 and the pad 122.

  Furthermore, the contact 3 is moved by the moving probe 4 so as to be positioned on the bump 123 through the opening 9 provided in the holding plate 7, and the contact 3 is brought into contact with the bump 123. An inspection signal is input / output between the inspection control unit and the bump 123 via the contact 3. In this case, the moving probe 4 and the contact 3 can be used for the inspection of the pad 122 and the inspection of the bump 123.

  Then, the inspection control unit inputs / outputs inspection signals between the wiring pattern formed on the surface 120 b of the substrate 120, the pads 122, and the bumps 123, and the wiring pattern formed on the inspected substrate 120. And the short circuit between the wiring patterns are inspected.

  Although an example in which an inspection signal is input / output between the inspection control unit and the pad 122 via the contact 3 and the probe 10 is shown, for example, a wiring cable is provided between the inspection control unit and the probe 10. For example, the inspection signal may be input / output between the inspection control unit and the pad 122 without using the contact 3 by connecting them using the like.

(Second Embodiment)
Next, a substrate inspection apparatus according to a second embodiment of the present invention will be described. The substrate inspection apparatus according to the second embodiment is different from the substrate inspection apparatus 1 shown in FIG. That is, the pressing plate 71 according to the present embodiment shown in FIG. 5 includes a probe substrate 13 instead of the probe 10 included in the pressing plate 7. Since other configurations are the same as those of the substrate inspection apparatus 1 shown in FIG. 1, the characteristic points of the present embodiment will be described below.

  FIG. 5 is a view for explaining the configuration of the pressing plate 71 of the substrate inspection apparatus 1a according to the present embodiment. A substrate 13 made of, for example, a flexible substrate is attached to the surface of the pressing plate 71. Specifically, on one surface of the substrate 13, a plurality of electrodes 14 a for making contact with the pads 122 of the substrate 120, respectively, and a plurality of electrodes 14 a connected to each other by a wiring pattern (fourth wiring pattern). Electrode 14b. Further, the portion of the substrate 13 where the electrode 14 a is formed is attached to the surface 71 a of the holding plate 71 on the side facing the substrate 120 in the direction in which the electrode 14 a faces the substrate 120.

  And the board | substrate 13 is drawn around so that the pressing plate 71 may be wrapped, and the location in which the electrode 14b is formed is attached to the surface 71b on the opposite side of the surface 71a in the pressing plate 71 with the electrode 14b facing outside. ing. In addition, the plurality of electrodes 14a are arranged to correspond to the pads 122 of the substrate 120, respectively, while the electrodes 14b are arranged at a finer pitch than the pads 122 so as to minimize the amount of movement of the moving probe 4. At the same time, the arrangement order is determined to optimize the moving efficiency of the moving probe 4. Other configurations are the same as those of the substrate inspection apparatus 1 shown in FIG.

  Next, the operation of the substrate inspection apparatus 1a configured as described above will be described. First, as in the case of the substrate inspection apparatus 1 shown in FIG. 1, the pressing plate 71 is lowered by the lifting mechanism 8 and the substrate to be inspected 120 supported by the work holder 2 is pressed from the upper side by the pressing plate 7 and lifted. When the jig 6 is raised by the mechanism 11, the contact 5 is brought into contact with the wiring pattern formed on the surface 120 b of the substrate 120. Then, the electrode 14 a is brought into contact with the pad 122 of the substrate 120 by the pressing plate 71, and the wiring pattern formed on the surface 120 b of the substrate 120 and the contact 5 are pressed against each other.

  An inspection signal is input / output via the contact 5 between the inspection control unit and the wiring pattern formed on the surface 120 b of the substrate 120. In this case, the opening 91 only needs to be larger than the bump area 121, and it is not necessary to make the opening 91 larger than the area where the pad 122 is formed. A sufficient margin for pressing is ensured, and the contact between the multi-needle contact 5 and the wiring pattern formed on the surface 120 b of the substrate 120 can be ensured without causing warpage of the substrate 120.

  Next, the contact 3 is moved and brought into contact with the electrode 14b by the moving probe 4. An inspection signal is input / output between the inspection control unit and the pad 122 via the electrode 14b and the electrode 14a. Further, the contact 3 is moved by the moving probe 4 so as to be positioned on the bump 123 through the opening 91 provided in the holding plate 71, and the contact 3 is brought into contact with the bump 123. An inspection signal is input / output between the inspection control unit and the bump 123 via the contact 3. In this case, the electrodes 14b are arranged at a finer pitch than the pad 122 in order to minimize the amount of movement of the moving probe 4, and the arrangement order is determined to optimize the moving efficiency of the moving probe 4. The time for moving the moving probe 4 can be reduced.

  Then, the inspection control unit inputs / outputs inspection signals between the wiring pattern formed on the surface 120 b of the substrate 120, the pads 122, and the bumps 123, and the wiring pattern formed on the inspected substrate 120. And the short circuit between the wiring patterns are inspected.

  Although an example in which an inspection signal is input / output between the inspection control unit and the pad 122 through the contact 3, the electrode 14b, and the electrode 14a is shown, for example, between the inspection control unit and the electrode 14a May be connected using a wiring pattern or the like formed on the substrate 13 so that an inspection signal is input / output between the inspection control unit and the pad 122 without using the contact 3. In this case, since the electrode 14a for contacting the pad 122 is formed on the substrate 13, it is easy to electrically connect the inspection control unit and the electrode 14a using a wiring pattern or the like. .

(Third embodiment)
Next, a substrate inspection apparatus according to a third embodiment of the present invention will be described. The substrate inspection apparatus according to the third embodiment is different from the substrate inspection apparatus 1 shown in FIG. 1 in the configuration of the holding plate 7 and the configuration of the jig 6. That is, the pressing plate 72 according to the present embodiment shown in FIG. 6 includes a probe substrate 15 instead of the probe 10 included in the pressing plate 7. Moreover, the jig 61 according to the present embodiment further includes a contactor 62 formed in a multi-needle shape. Since other configurations are the same as those of the substrate inspection apparatus 1 shown in FIG. 1, the characteristic points of the present embodiment will be described below.

  FIG. 6 is a diagram for explaining the configuration of the holding plate 72 and the jig 61 provided in the substrate inspection apparatus 1b according to the present embodiment. In the holding plate 72, a substrate 15 made of, for example, a glass epoxy substrate or a flexible substrate is attached to a surface 72a on the side facing the substrate 120. Specifically, on one surface of the substrate 15, a plurality of electrodes 16 a for making contact with the pads 122 of the substrate 120, respectively, and a plurality of electrodes 16 a connected to each other by a wiring pattern (fourth wiring pattern). Electrode 16b. In addition, the portion of the substrate 15 where the electrode 16 a is formed is attached to the surface 72 a of the pressing plate 72 in a direction that makes the electrode 16 a face the substrate 120. A plurality of electrodes 16b are formed on the substrate 15 at positions outside the surface facing the substrate 120, and the electrodes 16a and 16b are connected to each other by a wiring pattern.

  Further, the multi-needle contact 62 is provided at a position outside the surface of the jig 61 facing the substrate 120 so as to correspond to the plurality of electrodes 16b. Each contact of the contact 62 and the inspection control unit are electrically connected by a wiring cable or the like (not shown). Other configurations are the same as those of the substrate inspection apparatus 1 shown in FIG.

  Next, the operation of the substrate inspection apparatus 1b configured as described above will be described. First, the substrate 120 is positioned at the inspection position as in the case of the substrate inspection apparatus 1 shown in FIG. Then, the pressing plate 72 is lowered by the lifting mechanism 8, and the substrate to be inspected 120 is pressed from above by the pressing plate 72. Further, the jig 61 is raised by the lifting mechanism 11, and the contact 5 is pressed against the wiring pattern formed on the surface 120 b of the substrate 120. The contact 62 is located at a position facing the electrode 16b included in the substrate 15. The pad 122 formed on the surface 120a of the substrate 120 and the electrode 16a are pressed against each other, and the electrode 16b and the contact 62 are connected to each other. Press contact.

  An inspection signal is input / output via the contact 5 between the inspection control unit and the wiring pattern formed on the surface 120 b of the substrate 120. In this case, the opening 92 only needs to be larger than the bump area 121, and it is not necessary to make the opening 92 larger than the area where the pad 122 is formed. A sufficient margin for pressing is ensured, and the contact between the multi-needle contact 5 and the wiring pattern formed on the surface 120 b of the substrate 120 can be ensured without causing warpage of the substrate 120.

  An inspection signal is input / output between the inspection control unit and the pad 122 formed on the surface 120a of the substrate 120 via the contact 62, the electrode 16b, and the electrode 16a. In this case, since the contact 62 is simultaneously contacted with the plurality of electrodes 16b, a moving time for moving the contact to each electrode 16b becomes unnecessary, and the inspection time can be reduced.

  Further, the contact 3 is moved by the moving probe 4 so as to be positioned on the bump 123 through the opening 92 provided in the holding plate 72, and the contact 3 is brought into contact with the bump 123. An inspection signal is input / output between the inspection control unit and the bump 123 via the contact 3.

  Then, the inspection control unit inputs / outputs inspection signals between the wiring pattern formed on the surface 120 b of the substrate 120, the pads 122, and the bumps 123, and the wiring pattern formed on the inspected substrate 120. And the short circuit between the wiring patterns are inspected.

  Although an example in which an inspection signal is input / output between the inspection control unit and the pad 122 via the contact 62, the electrode 16b, and the electrode 16a is shown, for example, between the inspection control unit and the electrode 16a May be connected using a wiring pattern or the like formed on the substrate 15 so that an inspection signal is input / output between the inspection control unit and the pad 122 without using the contactor 62 and the electrode 16b.

  Moreover, although the example using the moving probe 4 as the first contact for inspection has been shown, it is possible to use a contact formed in a multi-needle shape similar to the contact 5 instead of the moving probe 4.

It is sectional drawing for demonstrating the structure of the board | substrate inspection apparatus which concerns on the 1st Embodiment of this invention. FIG. 2 is a front view of a holding plate and a substrate to be inspected of the substrate inspection apparatus shown in FIG. 1. It is an enlarged view of the principal part of the board | substrate inspection apparatus shown in FIG. It is an enlarged view of the principal part of the board | substrate inspection apparatus shown in FIG. It is a figure for demonstrating the structure of the board | substrate inspection apparatus which concerns on the 2nd Embodiment of this invention. It is a figure for demonstrating the structure of the board | substrate inspection apparatus which concerns on the 3rd Embodiment of this invention. It is a figure for demonstrating the structure of the board | substrate inspection apparatus which concerns on background art. It is a figure for demonstrating the structure of the holding plate which concerns on background art. It is a figure for demonstrating the structure of the holding plate which concerns on background art.

Explanation of symbols

1, 1a, 1b Board inspection device 3 Contact (first inspection contact)
4 Moving probe 5 Contact (second inspection contact)
6, 61 Jig 7, 71, 72 Holding plate (substrate holding member)
8,11 Lifting mechanism 9, 91, 92 Opening 10 Probe (third contact for inspection)
10b Contact electrode surface 10a Inspection contact 13, 15 Substrate (contactor substrate)
14a electrode (first electrode)
14b electrode (third electrode)
16a electrode (first electrode)
16b electrode (second electrode)
62 Contact (4th contact for inspection)
120 Substrate 121 Bump area 122 Pad (third wiring pattern)
123 Bump (first wiring pattern)

Claims (6)

A board inspection apparatus for inspecting a wiring pattern by contacting an inspection contact with a wiring pattern formed on both surfaces of a substrate to be inspected,
A first contact for contact that contacts a first wiring pattern formed in a predetermined inspection range on one surface of the substrate to be inspected;
A second inspection contact formed in a multi-needle shape to simultaneously contact a plurality of second wiring patterns formed on the other surface of the substrate to be inspected;
A planar substrate pressing member that is disposed opposite to the second contact for inspection via the substrate to be inspected, and that presses the substrate to be inspected against the second contact for inspection,
When the substrate to be inspected is arranged at a predetermined inspection position, the substrate pressing member is formed on a third wiring pattern formed at a position other than the inspection range on the one surface of the substrate to be inspected in the pressure contact state. A third contact for inspection is provided, and an opening is formed at a position facing the inspection range of the substrate pressing member,
A contact electrode in electrical communication with the third test contact;
The first contact for inspection is configured to be movable while contacting the first wiring pattern through the opening, and moved so as to contact the contact electrode. Board inspection equipment.   2. The substrate according to claim 1, wherein the third contact for inspection is formed into a pin shape whose one end contacts the third wiring pattern and is embedded in the substrate pressing member. Inspection device. The third test contacts of the board inspection apparatus according to claim 2, wherein Rutotomoni other end is embedded through said substrate holding member is characterized in that it is an electrode for the contact child.   A substrate inspection apparatus for inspecting a wiring pattern by bringing a contact for inspection into contact with wiring patterns formed on both surfaces of a substrate to be inspected, wherein a first inspection surface is formed in a predetermined inspection range on one surface of the substrate to be inspected. A first inspection contact that contacts one wiring pattern and a second needle formed in a multi-needle shape to simultaneously contact a plurality of second wiring patterns formed on the other surface of the substrate to be inspected. A planar substrate that is disposed to face the inspection contact and the second inspection contact via the substrate to be inspected, and that presses the substrate to be inspected against the second inspection contact. A pressing member, and the substrate pressing member is formed at a position other than the inspection range on one surface of the substrate to be inspected when the substrate to be inspected is disposed at a predetermined inspection position. Third arrangement A third inspection contact that contacts the pattern is provided, and an opening is formed at a position facing the inspection range of the substrate pressing member. The first inspection contact includes the opening. Penetrates and contacts the first wiring pattern,
  The board pressing member includes a contact board on which a first electrode for contacting the third wiring pattern is formed on a surface facing the board to be inspected. The contact is constituted by the first electrode, and the contact substrate is guided out of a surface facing the substrate to be inspected in a state where the substrate to be inspected is arranged at the inspection position. And a fourth wiring pattern connected to the first electrode,
  The contactor substrate has a second electrode connected to the fourth wiring pattern at a position outside the surface facing the substrate to be inspected in a state where the substrate to be inspected is arranged at the inspection position. A fourth inspection contact which is formed and contacts the second electrode.
  A board inspection apparatus characterized by the above.   A substrate inspection apparatus for inspecting a wiring pattern by bringing a contact for inspection into contact with wiring patterns formed on both surfaces of a substrate to be inspected, wherein a first inspection surface is formed in a predetermined inspection range on one surface of the substrate to be inspected. A first inspection contact that contacts one wiring pattern and a second needle formed in a multi-needle shape to simultaneously contact a plurality of second wiring patterns formed on the other surface of the substrate to be inspected. A planar substrate that is disposed to face the inspection contact and the second inspection contact via the substrate to be inspected, and that presses the substrate to be inspected against the second inspection contact. A pressing member, and the substrate pressing member is formed at a position other than the inspection range on one surface of the substrate to be inspected when the substrate to be inspected is disposed at a predetermined inspection position. Third arrangement A third inspection contact that contacts the pattern is provided, and an opening is formed at a position facing the inspection range of the substrate pressing member. The first inspection contact includes the opening. Penetrates and contacts the first wiring pattern,
  The board pressing member includes a contact board on which a first electrode for contacting the third wiring pattern is formed on a surface facing the board to be inspected. The contact is constituted by the first electrode, and the contact substrate is guided out of a surface facing the substrate to be inspected in a state where the substrate to be inspected is arranged at the inspection position. And a fourth wiring pattern connected to the first electrode,
  The contact substrate is formed with a third electrode connected to the fourth wiring pattern, and a surface of the substrate pressing member opposite to the side facing the substrate to be inspected. The first test contact is moved to further contact the third electrode.
  A board inspection apparatus characterized by the above. The contactor substrate is a flexible substrate.
  The substrate inspection apparatus according to claim 4 or 5.

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